CN211088308U

CN211088308U - L ED light emitting diode packaging structure

Info

Publication number: CN211088308U
Application number: CN202020048189.2U
Authority: CN
Inventors: 王伟
Original assignee: Xianen Photoelectric Suzhou Co ltd
Current assignee: Xianen Photoelectric Suzhou Co ltd
Priority date: 2020-01-08
Filing date: 2020-01-08
Publication date: 2020-07-24
Anticipated expiration: 2030-01-08

Abstract

The utility model belongs to the semiconductor field specifically discloses an L ED emitting diode packaging structure, including the base, the base middle part sets up the sleeve, and the built-in heat-radiating seat that installs of sleeve installs the L ED chip on the heat-radiating seat, inlays in the sleeve and installs radiating fin, inserts the filter screen panel in the heat-radiating seat lateral wall cavity, and the heat dissipation channel is seted up to the base side, the utility model discloses set up communicating sleeve of upper and lower opening in the base middle part, inlay the heat-radiating seat with L ED chip direct contact in the sleeve for the circulation of air on heat-radiating seat surface increases, installs radiating fin in the heat-radiating seat, further strengthens the radiating effect, sets up the heat dissipation channel with the inside intercommunication of sleeve in the base side, makes sleeve bottom surface and side be open structure, and the heat of being convenient for utilize radiating fin to distribute away the heat fast, inserts the filter screen panel in the sleeve, keeps apart sleeve bottom surface and side opening part, and dustproof effectual, the filter screen panel passes through the formula simultaneously.

Description

L ED light emitting diode packaging structure

Technical Field

The utility model relates to a semiconductor field specifically is an L ED emitting diode packaging structure.

Background

Light emitting diodes, abbreviated L ED., are made of compounds containing gallium (Ga), arsenic (As), phosphorous (P), nitrogen (N), etc. when electrons recombine with holes they emit visible light and can be used to make light emitting diodes, which are used in circuits and instruments As indicator lights or to compose text or digital displays, gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, gallium nitride diodes emit blue light, and by their chemical nature they are divided into organic light emitting diodes O L ED and inorganic light emitting diodes L ED.

After the conventional L ED LED is packaged, the heat dissipation structure is single, and the heat dissipation element is packaged in the substrate and the shell, so that the heat dissipation effect is poor, and the stability of the L ED chip is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an L ED emitting diode packaging structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the purpose, the utility model provides an L ED LED packaging structure, including the base, the base middle part is connected integrally and is provided with the communicating sleeve of upper and lower opening, the embedded radiating seat that adorns of sleeve, radiating seat longitudinal section is the "U" type structure of opening downwards, installs L ED chip on the radiating seat, inlay radiating fin in radiating seat both sides wall in the sleeve, radiating fin upper portion is fixed on the radiating seat, reserve the cavity between its side and the radiating seat lateral wall, insert the filter screen panel in this cavity, the terminal surface is provided with the sunken groove of round invagination under the sleeve, the sunken groove diapire inlays a layer of magnetic gasket, the outer edge of filter screen panel lower extreme face is installed and is inlayed in the sunken groove and with the magnetic gasket attracted location border each other, the base side just is seted up the heat dissipation channel that communicates with the sleeve inside to the position of radiating seat opening face, heat dissipation channel outer terminal surface has seted up a plurality of louvres.

Preferably, connecting wires connected with two ends of the L ED chip are embedded in the heat dissipation seat, and the two connecting wires penetrate through the base downwards and are connected with corresponding pins respectively.

Preferably, a fluorescent layer is laid on the surface of the L ED chip, a lens is covered outside the L ED chip, and pouring sealant is filled between the lens and the L ED chip.

Preferably, the top of the sleeve is fixed with a packaging shell sleeved outside the lens, and transparent epoxy resin is filled between the packaging shell and the lens.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses set up the communicating sleeve of upper and lower opening in the middle part of the base, inlay the dress in the sleeve with L ED chip direct contact's radiating seat, make the circulation of air on radiating seat surface increase, install radiating fin in the radiating seat, further strengthen the radiating effect, set up the heat dissipation passageway with the inside intercommunication of sleeve in the base side, make sleeve bottom surface and side be open structure, convenient to utilize radiating fin to distribute away the heat fast, it filters the screen panel to insert in the sleeve, keep apart sleeve bottom surface and side opening part, it is dustproof effectual, it installs on the base through magnetism formula of inhaling simultaneously to filter the screen panel, convenient to detach changes or clears up.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic view of the filter screen of the present invention;

fig. 3 is a schematic structural view of the sink groove of the sleeve end surface of the present invention;

FIG. 4 is a schematic view of the heat dissipation channel on the outer side of the base of the present invention;

fig. 5 is a schematic view of a specific structure of the heat sink of the present invention.

In the figure, the LED packaging structure comprises a base 1, a base 2, a sleeve 3, a heat dissipation seat, a 4, L ED chip, a 5, a heat dissipation fin, a 6, a filter screen cover, a 7, a positioning edge, 8, a sink groove, 9, a magnetic gasket, 10, a heat dissipation channel, 11, a connecting wire, 12, a pin, 13, a fluorescent layer, 14, a lens, 15, pouring sealant, 16, a packaging shell and 17, and transparent epoxy resin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1-5, the utility model provides a technical scheme is that an L ED light emitting diode packaging structure comprises a base 1, a sleeve 2 with upper and lower openings communicated is integrally connected and arranged in the middle of the base 1, a heat dissipation seat 3 is embedded in the sleeve 2, the longitudinal section of the heat dissipation seat 3 is a U-shaped structure with a downward opening, a L ED chip 4 is arranged on the heat dissipation seat 3, heat dissipation fins 5 are embedded in two side walls of the heat dissipation seat 3 in the sleeve 2, the upper parts of the heat dissipation fins 5 are fixed on the heat dissipation seat 3, a cavity is reserved between the side surface of the heat dissipation seat and the side wall of the heat dissipation seat 3, a filter screen cover 6 is inserted in the cavity, a circle of sunken sink groove 8 is arranged on the lower end surface of the sleeve 2, a layer of magnetic gasket 9 is embedded in the bottom wall of the sink groove 8, a positioning edge 7 which is embedded in the sink groove 8 and mutually attracted with the magnetic gasket 8 is arranged on the outer edge of the lower end surface of the filter screen cover 6, a heat dissipation channel 10 communicated.

Furthermore, connecting wires 11 respectively connected with two ends of the L ED chip 4 are embedded in the heat dissipation seat 3, and the two connecting wires 11 penetrate through the base 1 downwards and are respectively connected with corresponding pins 12.

Furthermore, a fluorescent layer 13 is laid on the surface of the L ED chip 4, a lens 14 is covered outside the L ED chip 4, and a pouring sealant 15 is filled between the lens 14 and the L ED chip 4.

Further, an encapsulation shell 16 sleeved outside the lens 14 is fixed at the top of the sleeve 2, and transparent epoxy resin 17 is filled between the encapsulation shell 16 and the lens 14.

The working principle is that a sleeve 2 with an upper opening and a lower opening communicated is arranged in the middle of a base 1, a heat dissipation seat 3 in direct contact with an L ED chip 4 is embedded in the sleeve, air circulation on the surface of the heat dissipation seat 3 is increased, a heat dissipation fin 5 is arranged in the heat dissipation seat 3, the heat dissipation seat 3 and the heat dissipation fin 5 are both made of copper materials with good heat conduction effects, the heat dissipation effect is further enhanced, a heat dissipation channel 10 communicated with the interior of the sleeve 2 is formed in the side face of the base 1, the bottom face and the side face of the sleeve 1 are both of an open structure, heat can be dissipated quickly by the aid of the heat dissipation fin 5, a filter screen cover 6 is inserted into the sleeve 2, the bottom face and the side face of the sleeve 2 are isolated, the dustproof effect is good, and meanwhile, a positioning edge 7 is arranged on the side face of the filter screen cover 6, is embedded in a sunken groove 8 formed in the bottom face of the sleeve 2 and mutually attracted.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An L ED light-emitting diode packaging structure is characterized by comprising a base (1), wherein a sleeve (2) with upper and lower openings communicated is integrally connected to the middle of the base (1), a heat dissipation seat (3) is embedded in the sleeve (2), the longitudinal section of the heat dissipation seat (3) is of a U-shaped structure with a downward opening, a L ED chip (4) is mounted on the heat dissipation seat (3), heat dissipation fins (5) are embedded in two side walls of the heat dissipation seat (3) in the sleeve (2), the upper portions of the heat dissipation fins (5) are fixed on the heat dissipation seat (3), a cavity is reserved between the side face of each heat dissipation seat (3) and the side wall of the corresponding heat dissipation seat, a filter mesh enclosure (6) is inserted into the cavity, a circle of sunken grooves (8) are formed in the lower end face of the sleeve (2), a magnetic gasket (9) is embedded in the bottom wall of each sunken groove (8), a positioning edge (7) which is embedded in each sunken groove (8) and mutually attracted with the magnetic gasket (9) is mounted on the outer edge of the lower end face of the corresponding heat dissipation hole, and a plurality of heat dissipation channels (10) are formed in positions, which are opposite to.

2. The L ED LED package structure according to claim 1, wherein the heat spreader (3) has embedded therein bonding wires (11) connected to two ends of the L ED chip (4), respectively, the bonding wires (11) extending downward through the base (1) and being connected to the corresponding leads (12), respectively.

3. The L ED LED package structure of claim 1, wherein the L ED chip (4) has a phosphor layer (13) laid on its surface, the L ED chip (4) is covered with a lens (14), and a potting compound (15) is filled between the lens (14) and the L ED chip (4).

4. The L ED LED package structure according to claim 1, wherein a package casing (16) is fixed on top of the sleeve (2) and fitted over the lens (14), and a transparent epoxy resin (17) is filled between the package casing (16) and the lens (14).