CN210576023U

CN210576023U - LED packaging structure

Info

Publication number: CN210576023U
Application number: CN201922204615.7U
Authority: CN
Inventors: 杨金泉
Original assignee: Shenzhen Hongyiguang Technology Co Ltd
Current assignee: Shenzhen Hongyiguang Technology Co Ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-05-19
Anticipated expiration: 2029-12-11

Abstract

The utility model discloses a LED (light emitting diode) packaging structure, which belongs to the technical field of electronic components and comprises a base, wherein the top of the base is respectively fixed with a shell and a heat dissipation plate, the heat dissipation plate is positioned in the shell, the top of the heat dissipation plate is respectively provided with a lens and an LED chip, both sides of the bottom of the LED chip are respectively connected with a connecting wire extending to the heat dissipation plate and the inside of the base, the bottom end of the connecting wire is connected with a pin, and the outer surface of the pin is fixed with an insulating pad; the heat dissipation structure is provided with the heat conduction columns and the heat dissipation holes, when the LED chip works to generate heat, the heat can be transmitted to the heat conduction columns through the heat dissipation plate, and the heat conduction columns are located inside the heat dissipation holes, so that the heat is transmitted into the heat dissipation holes through the heat conduction columns, and the heat is dissipated through the heat dissipation holes, so that the heat dissipation effect of the light emitting diode is improved, the problem that the heat is accumulated in the shell due to the poor heat dissipation effect is avoided, and the service life of the LED chip is prolonged.

Description

LED packaging structure

Technical Field

The utility model relates to an electronic components technical field specifically is a LED emitting diode packaging structure.

Background

The light emitting diode is abbreviated as LED; is made of a compound containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc.

When the electrons and the holes are combined, visible light can be radiated, so that the light-emitting diode can be manufactured; the LED lamp is used as an indicator light in circuits and instruments or forms character or number display; the gallium arsenide diode emits red light, the gallium phosphide diode emits green light, the silicon carbide diode emits yellow light, and the gallium nitride diode emits blue light; organic light emitting diodes OLED and inorganic light emitting diodes LED are classified by their chemical properties.

The Chinese patent with the publication number of CN208655697U discloses a LED light-emitting diode packaging structure, which comprises a base, the upper end of base is equipped with outer packaging shell, and the diapire fixedly connected with annular stopper of outer packaging shell, the up end of base is equipped with the annular spacing groove that corresponds with annular stopper, be equipped with the radiating cushion block in the outer packaging shell, and the upper end of radiating cushion block is equipped with the LED chip, the equal wire connection in bottom both sides of LED chip has the connecting wire, and the connecting wire passes the outside extension end of the inner wall of radiating cushion block and base and is connected with the pin, the outside that the upper end of radiating cushion block just is located the LED chip is equipped with lens, and the packing has the casting glue between lens and the LED chip.

The utility model has simple structure, easy operation, better air tightness of the packaging structure, reduced influence of external environment, improved luminous brightness of the light emitting diode, and wide popularization; however, in the packaging structure, the heat dissipation cushion block is positioned in the shell, so that heat generated by the LED chip is difficult to dissipate through the heat dissipation cushion block, the heat is accumulated in the shell, the LED chip is easy to damage, and the service life of the LED chip is shortened; meanwhile, the contact part of the pins in the LED and the base is easy to bend when being subjected to external pressure, and the pins are easy to damage due to breakage when the pressure is overlarge, so that the problem that the LED cannot be used is caused.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED packaging structure, solved among the above-mentioned background art current packaging structure radiating effect relatively poor with the pin easily flexible when receiving external pressure and lead to the problem of damage.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a LED light emitting diode packaging structure, includes the base, the top of base is fixed with casing and heating panel respectively, just the heating panel is located the inside of casing, lens and LED chip are installed respectively to the top of heating panel, the bottom both sides of LED chip all are connected with the connecting wire that extends to heating panel and base inside, the bottom of connecting wire is connected with the pin, the external fixed surface of pin has the insulating pad, the inside of insulating pad is provided with a plurality of first elastic blocks and second elastic block respectively, a plurality of louvres have been seted up to the inside of base, the bottom of heating panel is connected with a plurality of heat conduction posts that extend to the louvre inside.

Preferably, the heat dissipation holes are matched with the heat conduction columns, and the number of the heat dissipation holes is the same as that of the heat conduction columns.

Preferably, the top of the insulating pad is connected with the bottom of the base, and the insulating pad is made of a rubber material.

Preferably, the first elastic blocks and the second elastic blocks are distributed in the insulating pad at equal intervals, and the first elastic blocks correspond to the second elastic blocks one to one.

Preferably, the interior of the housing is filled with transparent epoxy resin, and the interior of the lens sheet is filled with potting adhesive.

Preferably, both sides of the heat radiating plate are connected with the inside of the case.

Preferably, the LED chip is located inside the lens sheet, and a phosphor layer is fixed on the top of the LED chip.

Compared with the prior art, the beneficial effects of the utility model are that: the LED packaging structure is provided with the heat conduction column and the heat dissipation holes, when the LED chip works to generate heat, the heat can be transferred to the heat conduction column through the heat dissipation plate, and the heat conduction column is positioned inside the heat dissipation holes, so that the heat is transferred into the heat dissipation holes through the heat conduction column, and the heat is dissipated through the heat dissipation holes, thereby improving the heat dissipation effect of the LED, avoiding the problem that the heat is accumulated in the shell due to poor heat dissipation effect, and prolonging the service life of the LED chip; still be provided with the insulating pad simultaneously, first elastic block and second elastic block, because of first elastic block is located the inside of insulating pad with the second elastic block, thereby the intensity of insulating pad has been improved, can prevent that the insulating pad from losing elasticity too early, and because the limiting action of insulating pad, can prevent that the pin from excessively bending, and make the pin can take place the bending of certain degree, can avoid the serious crooked condition that takes place the fracture damage of pin, thereby LED's life has been improved, this problem that current packaging structure radiating effect is relatively poor and the pin is flexible when receiving external pressure and lead to the damage has just been solved.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is an enlarged schematic view of the structure of the present invention A;

FIG. 3 is an enlarged schematic view of the structure of the present invention B;

FIG. 4 is a schematic view of a partial structure of the heat dissipation plate of the present invention;

fig. 5 is a schematic view of the local structure of the pin of the present invention.

In the figure: 1. a base; 2. a housing; 3. a transparent epoxy resin; 4. a lens sheet; 5. pouring a sealant; 6. A phosphor layer; 7. an LED chip; 8. a heat dissipation plate; 9. a heat-conducting column; 10. a pin; 11. an insulating pad; 12. A first elastic block; 13. a second elastic block; 14. heat dissipation holes; 15. and connecting the wires.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "disposed," "mounted," "connected," "fixed," "sleeved," and the like are to be construed broadly, e.g., as either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; the two elements may be connected directly or indirectly through an intermediate medium, and the two elements may be connected internally or in an interaction relationship, and a person skilled in the art can understand the specific meaning of the above terms in the present invention according to specific situations.

Referring to fig. 1-5, the present invention provides a technical solution: an LED packaging structure comprises a base 1, a shell 2, transparent epoxy resin 3, a lens 4, potting adhesive 5, a fluorescent powder layer 6, an LED chip 7, a heat dissipation plate 8, heat conduction columns 9, pins 10, an insulation pad 11, first elastic blocks 12, second elastic blocks 13, heat dissipation holes 14 and connecting wires 15, wherein the shell 2 and the heat dissipation plate 8 are respectively fixed at the top of the base 1, the heat dissipation plate 8 is positioned in the shell 2, the lens 4 and the LED chip 7 are respectively installed at the top of the heat dissipation plate 8, the connecting wires 15 extending to the heat dissipation plate 8 and the base 1 are respectively connected at two sides of the bottom of the LED chip 7, the pins 10 are connected at the bottom end of the connecting wires 15, the insulation pad 11 is fixed on the outer surface of the pins 10, the heat dissipation holes 12 and the second elastic blocks 13 are respectively arranged in the insulation pad 11, the base 1 is provided with the heat dissipation holes 14, the bottom of the heat dissipation plate 8 is connected with a plurality of heat conduction columns 9 extending to the inside of the heat dissipation holes 14.

Referring to fig. 1-5, the heat dissipation holes 14 are adapted to the heat conduction posts 9, and the number of the heat dissipation holes 14 is the same as that of the heat conduction posts 9, so that the heat transferred by the heat conduction posts 9 can be dissipated through the heat dissipation holes 14, thereby improving the heat dissipation effect of the package structure; the top of insulating pad 11 is connected with the bottom of base 1, and insulating pad 11 adopts rubber materials to make and forms to protect pin 10, prevent that pin 10 excessively bends and fracture damage.

Referring to fig. 1-2, the first elastic blocks 12 and the second elastic blocks 13 are equally spaced inside the insulating pad 11, and the first elastic blocks 12 correspond to the second elastic blocks 13 one to one, so as to improve the strength of the insulating pad 11 and prolong the service life thereof; transparent epoxy 3 is filled in the casing 2, and pouring sealant 5 is filled in the lens 4, so that the sealing performance of the packaging structure is improved, and meanwhile, the light source can be conveniently diffused through the lens 4 and the transparent epoxy 3.

Referring to fig. 1 and 4, two sides of the heat dissipation plate 8 are connected to the inside of the housing 2, so that the heat dissipation plate 8 can conduct and dissipate heat in the housing 2; the LED chip 7 is positioned inside the lens sheet 4, and the fluorescent powder layer 6 is fixed on the top of the LED chip 7, so that the light transmittance of the light source is improved.

The working principle is as follows: firstly, because the upper end surface of the LED chip 7 is provided with a layer of fluorescent powder layer 6, the luminous brightness of the LED chip 7 can be increased, meanwhile, the pouring sealant 5 is filled between the lens sheet 4 and the LED chip 7, the LED chip 7 can be primarily packaged, meanwhile, the luminous brightness of the LED is improved under the action of the lens sheet 4, when the LED works to generate heat, the heat can be absorbed by the heat dissipation plate 8 and transferred into the heat conduction column 9, and because the heat conduction column 9 is positioned inside the heat dissipation hole 14, the heat is transferred into the heat dissipation hole 14 through the heat conduction column 9, the heat is dissipated through the heat dissipation hole 14, and because the first elastic block 12 and the second elastic block 13 are positioned inside the insulating pad 11, the strength of the insulating pad 11 is improved, the premature loss of elasticity of the insulating pad 11 can be prevented, and because of the limiting function of the insulating pad 11, the excessive bending of the pin 10 can, and the pin 10 can be bent to a certain degree, so that the situation that the pin 10 is seriously bent to break and damage can be avoided.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An LED light-emitting diode packaging structure comprises a base (1), and is characterized in that: the LED lamp is characterized in that a shell (2) and a heat dissipation plate (8) are fixed to the top of the base (1) respectively, the heat dissipation plate (8) is located inside the shell (2), lens plates (4) and LED chips (7) are installed at the top of the heat dissipation plate (8) respectively, connecting wires (15) extending to the heat dissipation plate (8) and the base (1) are connected to the two sides of the bottom of the LED chips (7), pins (10) are connected to the bottom ends of the connecting wires (15), an insulation pad (11) is fixed to the outer surface of the pins (10), a plurality of first elastic blocks (12) and a plurality of second elastic blocks (13) are arranged inside the insulation pad (11) respectively, a plurality of heat dissipation holes (14) are formed inside the base (1), and a plurality of heat conduction columns (9) extending to the heat dissipation holes (14) are connected to the bottom of the heat dissipation.

2. The LED package structure of claim 1, wherein: the heat dissipation holes (14) are matched with the heat conduction columns (9), and the number of the heat dissipation holes (14) is the same as that of the heat conduction columns (9).

3. The LED package structure of claim 1, wherein: the top of the insulating pad (11) is connected with the bottom of the base (1), and the insulating pad (11) is made of rubber materials.

4. The LED package structure of claim 1, wherein: the first elastic blocks (12) and the second elastic blocks (13) are distributed in the insulating pad (11) at equal intervals, and the first elastic blocks (12) correspond to the second elastic blocks (13) one to one.

5. The LED package structure of claim 1, wherein: transparent epoxy resin (3) is filled in the shell (2), and pouring sealant (5) is filled in the lens sheet (4).

6. The LED package structure of claim 1, wherein: the two sides of the heat dissipation plate (8) are connected with the inside of the shell (2).

7. The LED package structure of claim 1, wherein: the LED chip (7) is positioned inside the lens sheet (4), and the top of the LED chip (7) is fixed with a fluorescent powder layer (6).