KR20120001189A

KR20120001189A - Light emitting diode package

Info

Publication number: KR20120001189A
Application number: KR1020100061864A
Authority: KR
Inventors: 박성수
Original assignee: 삼성엘이디 주식회사
Priority date: 2010-06-29
Filing date: 2010-06-29
Publication date: 2012-01-04

Abstract

PURPOSE: A light-emitting diode package is provided to improve heat radiating capability by exposing bottom surface except for the bent portion of a lead frame through the bottom surface of a package mold to outside. CONSTITUTION: A pair of lead frames(110) comprises a bent portion(111) which is bent upward. A pair of lead frames comprises first and second lead frames(110a,110b) which are separated each other. A package mold(120) comprises a cavity(121) which exposes a part of the upper side of the lead frame. An LED chip(130) is mounted on the lead frame which is exposed by the cavity. A molding material(140) is filled in the cavity in order to cover the LED chip and a wire.

Description

Light emitting diode package

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package having a lead frame having a curved portion bent upward.

Recently, light emitting diode (LED) devices using compound semiconductor materials such as GaAs, GaN, and AlGaInP have been developed, and thus, light sources of various colors can be realized. Factors that determine the characteristics of LED products include color, brightness and light conversion efficiency. The characteristics of such LED products are primarily determined by the compound semiconductor materials and structures thereof used in the LED devices, but are also greatly influenced by the structure of the package for mounting the LED chips as secondary elements.

In order to obtain a luminous effect according to user requirements, it is necessary to improve the structure of the LED package in addition to the primary elements such as the material or structure of the LED chip. In particular, as the use range of the LED package is extended to various fields such as indoor and outdoor lighting devices, automotive headlights, and back light units of liquid crystal displays (LCDs), high heat emission characteristics are required.

If the heat generated by the LED chip is not effectively dissipated from the LED package, the temperature of the LED chip becomes high, which deteriorates the characteristics of the LED chip and decreases its lifespan.

In addition to the heat dissipation characteristics, the LED package also requires moisture resistance. In other words, moisture that penetrates inside the LED package, especially around the LED chip, causes the performance and lifetime of the LED package to degrade.

Accordingly, in recent years, various studies have been conducted on light emitting diode packages that can improve heat dissipation and moistureproof performance to extend performance and lifespan.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to form a bent portion in the lead frame, and the bottom surface other than the bent portion of the lead frame to be exposed to the outside through the bottom surface of the package mold, And to provide a light emitting diode package excellent in moisture resistance.

The LED package according to an embodiment of the present invention for achieving the above object, a pair of lead frame having a bent upwardly curved; A package mold accommodating a portion of the lead frame therein and having a cavity for exposing a portion of an upper surface of the lead frame accommodated therein; An LED chip mounted on the lead frame exposed to the cavity; And a molding material filled in the cavity to cover the LED chip.

Here, the lead frame, the bottom surface other than the bent portion may be exposed to the outside through the bottom surface of the package mold.

In addition, the bent portion may be formed by pressing the lead frame.

In addition, the bent portion may be covered by the package mold.

As described above, according to the LED package according to the present invention, by forming a bent portion bent upwards on a portion of the lead frame, the bottom surface other than the bent portion of the lead frame is exposed to the outside through the bottom of the package mold In addition, there is an effect of improving the heat dissipation capability of the LED package and preventing moisture from penetrating into the package.

Therefore, the present invention has the effect of extending the life and improving the performance of the LED package.

1 is a cross-sectional view showing a light emitting diode package according to an embodiment of the present invention.
Figure 2 is a perspective view showing a lead frame of the LED package according to the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of the LED package. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

1 and 2 will be described in detail with respect to the light emitting diode package according to an embodiment of the present invention.

1 is a cross-sectional view showing a light emitting diode package according to an embodiment of the present invention, Figure 2 is a perspective view showing a lead frame of a light emitting diode package according to an embodiment of the present invention.

As shown in FIG. 1 and FIG. 2, the LED package according to the embodiment of the present invention includes a pair of lead frames 110 having upwardly bent portions 111 and the lead frames 110. A package mold 120 having a cavity 121 for accommodating a portion thereof and exposing a portion of the upper surface of the lead frame 110 accommodated therein, and exposed to the cavity 121 of the package mold 120. And an LED chip 130 mounted on the lead frame 110.

The pair of lead frames 110 may include first and second lead frames 110a and 110b spaced apart from each other. Currents of opposite poles may be applied to the first and second lead frames 110a and 110b, respectively.

The lead frame 110 may be made of a metal material having excellent thermal conductivity, such as Cu.

In addition, although not shown in the drawing, a silver plating layer is formed on the surface of the lead frame 110 to increase the reflectance of light generated from the LED chip 130.

A part of the lead frame 110 is accommodated in the package mold 120, and the other part of the lead frame 110 protrudes out of the package mold 120.

The LED chip 130 is mounted on the first lead frame 110a which is one of the first and second lead frames 110a and 110b constituting the pair of lead frames 110. There may be.

Here, the LED chip of the conventional method is applied to the LED chip 130, LED chips such as GaN series may be used.

The LED chip 130 and the lead frame 110 may be electrically connected by a bonding wire (not shown). The bonding wire may be made of gold (Au) material.

The package mold 120 includes a cavity 121 that exposes a portion of the upper surface of the first and second lead frames 110a and 110b at the center thereof.

The cavity 121 of the package mold 120 is filled with a molding material 140 to cover the LED chip 130 and the wire.

As such, the molding material 140 filled in the package mold 120 may protect the LED chip 130 and the wire.

The molding material 140 may be made of a light transmitting resin having excellent light transmittance, such as a silicone resin or an epoxy resin.

In addition, the molding material 140 may include a phosphor capable of converting light generated from the LED chip 130 into white light.

The package mold 120 may be formed using a polymer resin, which is easy to inject, and the polymer resin may be, for example, a polyphthal amide (PPA) or a liquid crystal polymer (LCP). A material having excellent thermal deformation at high temperatures may be used. Of course, the material is not limited thereto, and various resin materials may be used as the material.

On the upper surface of the package mold 120, a lens (not shown) for extracting light emitted from the LED chip 130 to a wide direction angle to the outside may be coupled.

The lens may be formed in various shapes in the light emitting direction, for example, a hemispherical convex structure.

In the LED package according to the embodiment of the present invention, a portion of the pair of lead frames 110 is provided with the bent portion 111 that is bent upward as described above.

The bent part 111 may be formed by pressing a portion of the lead frame 110 having a flat plate shape upward.

In the lead frame 110 having the bent part 111, the bottom surface of the lead frame 110 except for the bent part 111 is exposed to the outside through the bottom surface of the package mold 120.

The bent part 111 is covered by the package mold 120. That is, the bent part 111 is disposed outside the cavity 121 of the package mold 120 and is surrounded by the package mold 120.

Since the upper and lower surfaces of the bends 111 are covered by the package mold 120, the lead frame 110 may be easily prevented from being separated from the package mold 120.

The lead frame 110 of the LED package according to an embodiment of the present invention, as well as the power line for applying power to the LED chip 130 mounted on the upper surface, the bottom surface is exposed to the outside of the package mold 120. The heat sink may also emit heat generated when the LED chip 130 is operated to the outside.

In this case, shown by the arrow in Figure 1 shows that the heat generated from the LED chip 130 is released to the outside.

Therefore, according to the exemplary embodiment of the present invention, there is an advantage in that the heat dissipation performance of the package can be improved without installing a separate heat sink for securing the heat dissipation capability.

The light emitting diode package as described above may be manufactured in the following order.

First, the first and second lead frames 110a and 110b are disposed, and then the package mold 120 supporting the first and second lead frames 110a and 110b is formed by a mold method using a resin material. . The package mold 120 accommodates portions of the first and second lead frames 110a and 110b therein and exposes portions of the upper surfaces of the first and second lead frames 110a and 110b at the center thereof. It can be formed so as to have (121).

Then, the LED chip 130 is mounted on the first lead frame 110a exposed to the cavity 121 and a wire bonding process is performed.

Next, the molding material 140 is filled in the cavity 121 to protect the LED chip 130 and the bonding wire, and then both ends of the first and second lead frames 110a and 110b are appropriately cut. .

In this case, an interface between the lead frame 110 and the package mold 120 may be separated by loads applied to both ends thereof when the first and second lead frames 110a and 110b are cut.

However, in the LED package according to the embodiment of the present invention, since the bent part 111 covered by the package mold 120 is provided at a portion of the lead frame 110, the lead frame 110 may be formed. As the loads applied to both ends thereof during cutting are distributed by the bends 111, the movement of the lead frame 110 may be minimized.

Therefore, according to the exemplary embodiment of the present invention, when the lead frame 110 is cut, the interface between the lead frame 110 and the package mold 120 is separated to prevent gaps, thereby preventing moisture from penetrating into the LED package. can do.

In addition, even if moisture penetrates through the interface between the package mold 120 and the lead frame 110 from the outer surface of the package mold 120, the penetrated moisture is lead frame 110 wrapped in the package mold 120. It is blocked by the bent portion 111 of) can no longer penetrate around the LED chip 130.

Therefore, the LED package according to the embodiment of the present invention can improve the heat dissipation and moisture proof performance of the package to improve the performance and extend the life of the package, there is an advantage that can be applied to products requiring high output.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

110a: first lead frame
110b: second lead frame
110: lead frame
120: package mold
121: cavity
130: LED chip
140: molding material

Claims

A pair of lead frames having upwardly bent portions;
A package mold accommodating a portion of the lead frame therein and having a cavity for exposing a portion of an upper surface of the lead frame accommodated therein;
An LED chip mounted on the lead frame exposed to the cavity; And
A molding material filled in the cavity to cover the LED chip;
Light emitting diode package comprising a.

The method of claim 1,
The lead frame is a light emitting diode package in which the bottom surface except for the bent portion is exposed to the outside through the bottom surface of the package mold.

The method of claim 1,
The curved portion is a light emitting diode package formed by pressing the lead frame.

The method of claim 1,
The bent portion is covered with the package mold.