KR20100003469A

KR20100003469A - Led package

Info

Publication number: KR20100003469A
Application number: KR1020080063382A
Authority: KR
Inventors: 남정림
Original assignee: 삼성전기주식회사
Priority date: 2008-07-01
Filing date: 2008-07-01
Publication date: 2010-01-11

Abstract

PURPOSE: An LED package is provided to prevent internal structural deformation at a high or extremely low temperature by mounting one LED chip inside a cavity after forming a plurality of cavities on a heat sink comprised of double metal layer. CONSTITUTION: A heat sink(110) is comprised of a metal layer and a plurality of cavities are formed on the heat sink. A second lead frame(130) is separated from the heat sink and a first lead frame(120) extended to one side of the heat sink. A mold unit(140) fixes the heat sink, the first lead frame, and the second lead frame. A plurality of LED chips(150) are individually mounted inside the cavity. A first filler(160) is filled inside the cavity to protect the LED chip. The inner surface of the cavity is inclined. The molding unit has a larger opening than the cavity.

Description

LED package {LED package}

The present invention relates to an LED package, and more particularly, to a LED package in which a plurality of cavities are formed in a heat dissipation unit composed of two metal layers, and one LED chip is individually mounted in each cavity.

In general, a light emitting diode (LED) is a semiconductor light emitting device that emits light when a current flows, and converts electrical energy into light energy using a PN junction diode made of GaAs and GaN optical semiconductors.

The range of light from these LEDs ranges from red (630 nm to 700 nm) to blue-violet (400 nm), including blue, green and white, and the LEDs have lower power consumption and higher efficiency than conventional light sources such as incandescent bulbs and fluorescent lamps. The demand is continuously increasing because of the advantages such as long operating life.

Recently, the application range of LEDs is gradually expanded from small lights of mobile terminals to backlights for indoor and outdoor general lighting, automotive lighting, and large liquid crystal display (LCD).

In terms of application to the backlight, in order to reduce the optical thickness, the light directing angle of the package exit light should be secured. In order to minimize the package size and to realize the light directing angle, minimization of the light source size is required.

In terms of application to lighting, the lens should be used for high emission efficiency. If the size of the light source is large, the color coordinate / color temperature characteristics may be different according to the same direction as the bull's eye. Minimization of the light source size is required.

According to this trend, a light emitting diode package is mainly used in a multi-chip package in which a plurality of LED chips are embedded in a planar arrangement in a cavity, or a CIO package in which a LED chip is directly attached and encapsulated to a substrate and reduced in size. .

Among the multi-chip package, the LED chip is uniformly arranged in one cavity, and then the resin is applied after the LED chip is attached using an epoxy resin.

In this case, encapsulation is performed in silicon to maintain the optical characteristics, and the fluorescent materials and LED chips in the cavity are exposed to continuous high temperature and cryogenic environments, resulting in positional deviation, resulting in a high defect rate and a unit cost increase. This has been brought about.

Accordingly, the present invention is to solve the above disadvantages and problems, by forming a plurality of cavities in the heat dissipation portion consisting of a two-layer metal layer and one LED chip is individually mounted in each cavity, thereby attaching the LED chip It is an object of the present invention to provide a LED package that maintains the position firmly to suppress the occurrence of defects due to internal structural deformation.

LED package of the object of the present invention comprises a heat dissipation unit consisting of a metal layer and a plurality of cavities; A first lead frame extending to one side of the heat dissipation unit and a second lead frame separated from the heat dissipation unit; A mold unit fixing the heat dissipation unit, the first lead frame, and the second lead frame; A plurality of LED chips individually mounted in the cavity; And a first filler filled in the cavity to protect the LED chip.

And the heat dissipation portion may be composed of one metal plate material folded to have two or more metal layers.

In addition, the cavity may be formed on the uppermost metal layer of the metal layer constituting the heat dissipation unit.

In addition, the cavity may be processed by punching or etching.

In addition, the inner surface of the cavity may be formed as an inclined surface.

In addition, the mold part may have an opening larger than the cavity.

In addition, it may further include a second filler filled in the opening.

In addition, the lens may further include a lens coupled to the upper surface.

In addition, the LED chip may further include a wire for electrical connection between the first lead frame and the second lead frame.

As described above, in the LED package according to the present invention, a plurality of cavities are formed in a heat dissipation part composed of two layers of metal layers, and one LED chip is individually mounted in the cavity, thereby maintaining the attachment position of the LED chip firmly. Therefore, there is an effect of preventing structural deformation in the continuous high temperature and cryogenic environment.

Therefore, the occurrence of defective LED package is suppressed, thereby improving product characteristics and yield and improving productivity.

Details regarding the operational effects including the technical configuration of the LED package according to the present invention will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown.

An LED package according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2.

1 is a cross-sectional view of an LED package according to an embodiment of the present invention, Figure 2 is a perspective view of the inside of the LED package according to an embodiment of the present invention.

1 and 2, the LED package 100 according to the embodiment of the present invention includes a heat dissipation unit 110 and a heat dissipation unit 110 including the metal layers 113 and 115 and a plurality of cavities 117 formed therein. The first lead frame 120 extended to one side and the second lead frame 130 separated from the heat dissipation unit 110, the heat dissipation unit 110, the first lead frame 120 and the second lead frame It includes a mold 140 for fixing the 130 and a plurality of LED chips 150 mounted in the cavity 117.

The heat dissipation unit 110 may be composed of two or more metal layers, but the present invention is composed of two metal layers 113 and 115 as shown in FIGS. 1 and 2, and the lower surface of the upper metal layer is disposed on the upper metal layer of the lower layer. It consists of one metal sheet which is folded to be in contact.

The first lead frame 120 and the second lead frame 130 are preferably made of Cu having excellent thermal conductivity in order to effectively release heat generated from the LED chip 150.

In addition, one LED chip 150 is formed in each cavity 117 by forming a separate cavity 117 by processing a metal layer of the uppermost layer by punching or etching in the metal layers 113 and 115 constituting the heat dissipation unit 110. Let each be mounted.

This prevents the positional deviation of the LED chip 150 mounted in the cavity 117 to prevent structural deformation of the interior in high temperature and cryogenic environments, thereby improving product characteristics and yield and improving productivity.

After mounting the LED chip 150 in the cavity 117, wire bonding the LED chip 150, the first lead frame 120 and the second lead frame 130 (not shown) Can be electrically connected to each other.

In addition, the heat generated when the LED chip 150 mounted in the cavity 117 may be emitted to the outside through the heat dissipation unit 110 formed of the metal layers 113 and 115.

Therefore, the heat dissipation unit 110 is a metal having excellent thermal conductivity, for example, copper, silver, aluminum. It is preferable to consist of iron, nickel, tungsten, and the like.

The cavity 117 is filled with a first filler 160 to protect the LED chip 150.

The first filler 160 may be made of a light transmitting resin having excellent light transmittance, for example, a silicone resin or an epoxy resin.

In addition, the first filler 160 may include at least one phosphor so that the light source provided to the backlight unit appears as white light.

In this case, when the LED chip 150 emits light, the light in the R, G, and B wavelength bands generated according to the difference in the semiconductor material constituting the LED chip 150 is included in the phosphor included in the first filler 160. The light may be converted into white light and emitted from the package to provide a white light source.

In addition, the cavity 117 may have an inner surface formed as an inclined surface so as to effectively emit light generated from the LED chip 150 to the outside.

In addition, a reflection member (not shown) made of Ag or the like is further formed on a surface of the heat dissipation unit 110 including the cavity 117 to further improve reflection efficiency of light emitted from the LED chip 150. It can increase.

In this case, the reflective member may be formed on the surfaces of the first lead frame 120 and the second lead frame 130 together.

Therefore, when power is supplied to the LED chip 150, heat generated in the LED chip 150 is discharged to the outside through the first lead frame 120 and the second lead frame 130, and the heat The heat dissipation ability is improved by allowing the first lead frame 120 and the second lead frame 130 and the heat dissipation unit 110 to be discharged to the outside through the reflective member.

The mold unit 140 serves to protect a portion of the first lead frame 120 and the second lead frame 130 inside to protect the LED chip 150 and the wires therein.

At this time, the mold unit 140 is made of a resin material and is formed by a mold or an extrusion method.

In the mold unit 140, an opening 145 is provided to extract light generated from the LED chip 150 to the outside, and the opening 145 is larger than the cavity 117. It is preferable.

In this case, a second filler 165, which is a light-transmissive resin such as a silicone resin and an epoxy resin, is filled in the opening 145 of the mold unit 140.

In addition, a lens 170 is coupled to an upper surface of the mold unit 140 to extract light emitted from the LED chip 150 to a wider direct angle to the outside.

According to the LED package 100 according to the embodiment of the present invention as described above, one LED chip 150 is individually in a plurality of cavities 117 formed in the heat dissipation unit 110 composed of metal layers 113 and 115. Mounted, most of the light generated by the LED chip 150 is reflected from the inner surface of the cavity 117 of the metal material, not the mold portion 140 of the resin material is extracted to the outside.

Preferred embodiments of the present invention described above are disclosed for purposes of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. This may be possible, but such molesters, modifications, etc. should be regarded as belonging to the following claims.

1 is a cross-sectional view of an LED package according to an embodiment of the present invention.

Figure 2 is a perspective view of the inside of the LED package according to an embodiment of the present invention.

100: LED package 110: heat dissipation unit

113, 115: metal layer 117: cavity

120: first lead frame 130: second lead frame

140: mold portion 145: opening

150: LED chip 160: the first filler

165: second filler 170: lens

Claims

A heat dissipation unit composed of a metal layer and having a plurality of cavities;

A first lead frame extending to one side of the heat dissipation unit and a second lead frame separated from the heat dissipation unit;

A mold unit fixing the heat dissipation unit, the first lead frame, and the second lead frame;

A plurality of LED chips individually mounted in the cavity; And

A first filler filled in the cavity to protect the LED chip;

LED package comprising a.

The method of claim 1,

The heat dissipation unit is an LED package consisting of one metal plate material folded to have two or more metal layers.

The method of claim 2,

The cavity of the LED package is formed in the metal layer of the uppermost layer of the metal layer constituting the heat dissipation unit.

The method of claim 1,

The cavity of the LED package is processed by punching or etching.

The method of claim 1.

The LED package of the inner surface of the cavity is formed as an inclined surface.

The method of claim 1.

And the mold portion has an opening larger than the cavity.

The method of claim 6,

The LED package further comprises a second filler filled in the opening.

The method of claim 1.

The LED package further comprises a lens coupled to the upper surface of the mold portion.

The method of claim 1,

The LED package further comprises a wire for electrical connection of the LED chip and the first lead frame and the second lead frame.