KR20170067477A - Light emitting package and lighting device having thereof - Google Patents

Abstract

An embodiment relates to a light emitting device package and a lighting apparatus.
The light emitting device package of the embodiment includes a first lead frame, a second lead frame spaced apart from the first lead frame, a cavity exposing a part of the upper surface of the first and second lead frames, Wherein the first lead frame includes first and second lead portions, the first lead portion is disposed below the first projecting portion, and the second lead frame is disposed between the third lead portion and the third lead portion, the body including the first and second projecting portions, And the fourth lead portion. The third lead portion is disposed below the second projecting portion, and the side portions of the first and second lead portions are exposed from the body, so that presence or absence of defective soldering and existence of defective alignment can be visually confirmed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light emitting device package,

An embodiment relates to a light emitting device package and a lighting apparatus.

A light emitting device (light emitting device) is a type of semiconductor device that converts electrical energy into light, and has been attracting attention as a next generation light source in place of conventional fluorescent lamps and incandescent lamps.

Since the light emitting diode generates light by using a semiconductor element, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten, or a fluorescent lamp that generates ultraviolet light by impinging ultraviolet rays generated through high-pressure discharge on a phosphor .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode is increasingly used as a light source for various lamps used for indoor and outdoor use, lighting devices such as a liquid crystal display, an electric signboard, and a streetlight.

Conventional light emitting diodes may be soldered on a substrate including a driving signal wiring and used as a light source of an illumination device such as a lamp, a liquid crystal display, a display board, and a streetlight. However, in general LEDs, there is a problem that the lead portion to be soldered to the substrate is disposed on the lower surface or one surface, and it is difficult to visually identify the presence or absence of soldering defects.

The embodiment provides a light emitting device package and a lighting device having a structure in which the presence or absence of soldering defects can be easily identified.

Embodiments provide a light emitting device package and a lighting apparatus having a structure in which the presence or absence of defective alignment can be easily identified.

The embodiment provides a light emitting device package and a lighting device capable of improving yield reduction such as defective soldering or defective alignment.

The light emitting device package of the embodiment includes a first lead frame, a second lead frame spaced apart from the first lead frame, a cavity exposing a part of the upper surface of the first and second lead frames, Wherein the first lead frame includes first and second lead portions, the first lead portion is disposed below the first projecting portion, the first lead portion is disposed below the first projecting portion, The second lead frame includes third and fourth lead portions, and the third lead portions are disposed under the second lead portions to expose the side portions of the first and second lead portions from the body, so that the presence or absence of soldering defects .

The lighting device of the embodiment may include the light emitting device package.

In the light emitting device package of the embodiment, the side portions of the first and third lead portions of the first and second lead frames are exposed from protrusions protruding from the side surfaces of the body, thereby visually confirming the presence of soldering defects.

Embodiments can expose the side portions of the first and third lead portions of the first and second lead frames from projecting portions protruding from the side surfaces of the body to visually check whether there is an alignment defect between the light emitting device package and the substrate.

In addition, since the side portions of the first and third lead portions of the first and second lead frames are exposed from protrusions protruding from the side surfaces of the body to increase the soldering area between the first and second lead portions and the substrate The reliability of soldering can be improved.

Further, in the embodiment, the side portions of the first and third lead portions of the first and second lead frames are exposed from protrusions protruding from the side surfaces of the body, and a part of the exposed side portions is exposed to the cutting line As shown in FIG. Therefore, the side portions of the first and third lead portions separated from the cutting line include the conductive material having high corrosion resistance, so that the soldering reliability with the substrate and the electrical connection reliability can be improved.

Furthermore, the embodiment can easily identify the exposed sides of the first and third lead portions by the width of the first and third lead portions which is equal to the width of the projections.

1 is a perspective view showing an upper part of a light emitting device package according to an embodiment.
2 is a perspective view illustrating a bottom portion of a light emitting device package according to an embodiment.
3 is a cross-sectional view illustrating a light emitting device package taken along the line I-I 'of FIG.
4 is a perspective view illustrating an upper portion of a light emitting device package according to another embodiment.
5 is a perspective view illustrating a bottom portion of a light emitting device package according to another embodiment.
6 is a cross-sectional view showing a light emitting chip included in the light emitting device package of the embodiment.
7 is a cross-sectional view showing another example of the light emitting chip included in the light emitting device package of the embodiment.
8 is a perspective view showing a display device including the light emitting device package of the embodiment.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under" the substrate, each layer Quot; on "and" under "are intended to include both" directly "or" indirectly " do. Also, the criteria for top, bottom, or bottom of each layer will be described with reference to the drawings.

FIG. 1 is a perspective view showing an upper part of a light emitting device package according to an embodiment, FIG. 2 is a perspective view showing a lower part of a light emitting device package according to an embodiment, and FIG. 3 is a sectional view taken along line I- Sectional view showing a light emitting device package.

1 to 3, the light emitting device package 100 according to the embodiment includes a first lead frame 130, a second lead frame 140, a body 120, and a light emitting device 150 can do.

The light emitting device 150 may be disposed on the first lead frame 130. The light emitting device 150 may be disposed on the upper surface of the first lead frame 130 exposed from the body 120. Although the light emitting device 150 of the embodiment is described as being limited to a single configuration, the present invention is not limited to this configuration, and the light emitting device 150 may be constituted by a plurality of two or more, and may be configured in an array form. The light emitting device 150 may be connected through a wire, but is not limited thereto. The light emitting device 150 may be disposed at the center of the body 120, but is not limited thereto.

The body 120 may include at least one of a light transmitting material, a reflective material, and an insulating material. The body 120 may include a material having a reflectivity higher than that of the light emitted from the light emitting device 150. The body 120 may be a resin-based insulating material. For example, the body 120 is polyphthalamide (PPA: Polyphthalamide), a resin material, a silicone such as an epoxy or silicone (Si), metallic material, PSG (photo sensitive glass), sapphire (Al ₂ O _3), a printed circuit And a substrate (PCB). The body 120 may be coupled to the first and second lead frames 130 and 140. The body 120 may include a cavity 125 exposing a portion of the upper surface of the first and second lead frames 130 and 140.

The body 120 may include first to fourth outer surfaces 121 to 124, and may have a rectangular top view. However, the present invention is not limited thereto. The first and second outer surfaces 121 and 122 are symmetrical in a first direction X-X 'and in a second direction Y-Y' orthogonal to the first direction X-X ' Can be arranged side by side. The third and fourth outer sides 123 and 124 are symmetrical in the second direction Y-Y ', and in a first direction X-X' orthogonal to the second direction Y-Y ' As shown in FIG. The embodiment may include a first protrusion 127 protruding outwardly from the first outer side surface 121 and a second protrusion 128 protruding outward from the second outer side surface 122 . The first and second protrusions 127 and 128 may be overlapped with a portion of the first and second lead frames 130 and 140 exposed to the first and second outer surfaces 121 and 122. The first and second protrusions 127 and 128 may cover the first and second lead frames 130 and 140 exposed to the first and second outer surfaces 121 and 122. The first and second protrusions 127 and 128 may be disposed on the upper surfaces of the first and second lead frames 130 and 140 exposed to the first and second outer surfaces 121 and 122 . The first and second protrusions 127 and 128 may be a connection path through which the injection resin moves to adjacent unit light emitting device packages in the injection process of the body 120.

The first and second lead frames 130 and 140 may be separated from each other by a predetermined distance. The first and second lead frames 130 and 140 may be coupled to the body 120. The first and second lead frames 130 and 140 may be arranged in parallel in a second direction Y-Y '. The first and second lead frames 130 and 140 may include a conductive material. For example, the first and second lead frames 130 and 140 may include at least one of titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta) (Al), tin (Sn), silver (Ag), phosphorous (P), iron (Fe), tin . For example, the first and second lead frames 130 and 140 of the embodiment may include a first conductive material having excellent electrical characteristics such as copper (Cu), silver (Ag) having high corrosion resistance and high reflectivity on the surface of the first conductive material, The second conductive material, and the like.

The first lead frame 130 may include first and second lead portions 131 and 132. The first lead portion 131 may be exposed to the outside from the first outer surface 121 of the body 120. The first lead portion 131 may be disposed under the first protrusion 127 of the body 120. The first lead portion 131 may be exposed to the outside through the first protrusion 127 of the body 120. The first lead portion 131 may overlap with the first protrusion 127 in the vertical direction. The first lead portion 131 may be in direct contact with the lower surface 127a of the first protrusion 127. The first width W1 of the first lead portion 131 may be smaller than the second width W2 of the first protrusion 127 in the first direction X-X '.

The first lead part 131 may include first to third side parts 131a, 131b and 131c and a first lower part 131d.

The first side portion 131a may be the end surface of the first lead portion 131. The first side portion 131a may be disposed on the same plane as the end surface of the first projection 127. [ The first side 131a may be a cut surface that is cut at the same time as the first protrusion 127 in the process of separating the unit light emitting device package 100. [

The second and third side portions 131b and 131c may extend in a direction orthogonal to the first side portion 131b. The second and third side portions 131b and 131c may be exposed to the outside from the body 120. [ The second and third sides 131b and 131c may be disposed below the first protrusion 127 and may be exposed to the outside through the first protrusion 127. [ The second and third side portions 131b and 131c may increase the soldering area of the substrate (not shown) and the light emitting device package 100. [ In addition, since the second and third side portions 131b and 131c are exposed to the outside from the body 120, it is possible to visually confirm the presence or absence of soldering defects. For example, in the embodiment, the first to third side portions 131a, 131b, and 131c exposed from the first outer side surface 121 of the body 120 can visually confirm the presence or absence of defective soldering such as cold soldering. Embodiments can confirm the presence or absence of defective alignment with the naked eye by the first to third side portions 131a, 131b, and 131c exposed from the first outer side surface 121 of the body 120.

The first lower portion 131d may be disposed on the same plane as the lower surface 126 of the body 120. The first lower portion 131d may be disposed on the outer side of the lower surface 126 of the body 120.

The second lead portion 132 may extend from the first lead portion 131. The second lead portion 132 may include a flat upper surface and a lower surface, but is not limited thereto. The lower surface of the second lead portion 132 may be exposed from the lower surface of the body 120. The upper surface of the second lead part 132 may be exposed from the cavity 125 of the body 120 and the light emitting device 150 may be mounted on the exposed upper surface of the second lead part 132 . The lower surface of the second lead portion 132 may include first and second bottom portions 132a and 132b. The first and second bottom portions 132a and 132b may have different widths. For example, the width of the first bottom portion 132a may be smaller than the width of the second bottom portion 132b. The widths of the first and second bottom portions 132a and 132b may be determined by a step structure (not shown) disposed at a lower edge of the first lead frame 130, although they are not shown in detail in the drawings. For example, the edge of the first bottom portion 132a may include the stepped structure (not shown). The second lead portion 132 may include a first bending portion 132c. The first bending portion 132c may be disposed between the first and second bottom portions 132a and 132b. The first bending portion 132c may extend from the first bottom portion 132a. The first bending portion 132c may extend from the second bottom portion 132b. The width of the first bending portion 132c may gradually increase from the first bottom portion 132a to the second bottom portion 132b. The first bending portion 132c having a bending structure is limited between the first and second bottom portions 132a and 132b. However, the present invention is not limited thereto. For example, the first and second bottom portions 132a and 132b may include a straight line structure having a width that widens toward the second bottom portion 132b.

A first stepped portion 133 may be formed between the first and second lead portions 131 and 132. The first stepped portion 133 may be disposed on the lower surface of the first lead frame 130. The first stepped portion 133 may enlarge the contact area between the body 120 and the first lead frame 130. The first stepped portion 133 may improve a coupling force between the body 120 and the first lead frame 130. In addition, the first stepped portion 133 can improve moisture penetration to the outside by the stepped structure.

The second lead frame 140 may include third and fourth lead portions 141 and 142. The third lead portion 141 may be exposed to the outside from the second outer surface 122 of the body 120. The third lead portion 141 may be disposed under the second protrusion 128 of the body 120. The third lead portion 141 may be exposed to the outside from the second protrusion 128 of the body 120. The third lead portion 141 may be overlapped with the second protrusion 128 in the vertical direction. The third lead portion 141 may be in direct contact with the lower surface 128a of the second projection 128. The width of the third lead portion 141 in the first direction X-X 'may be smaller than the width of the second protrusion 128.

The third lead portion 141 may include fourth to sixth sides 141a, 141b and 141c and a second lower portion 141d.

The fourth side 141a may be the end surface of the third lead 141. The fourth side 141a may be disposed on the same plane as the end surface of the second projection 128. The fourth side 141a may be a cut surface that is cut at the same time as the second protrusion 128 in the process of separating the unit light emitting device package 100. [

The fifth and sixth sides 141b and 141c may extend in a direction orthogonal to the fourth side 141a. The fifth and sixth sides 141b and 141c may be exposed from the body 120 to the outside. The fifth and sixth sides 141b and 141c may be disposed under the second protrusion 128 and may be exposed to the outside through the second protrusion 128. [ The fifth and sixth sides 141b and 141c may enlarge the area of soldering between the substrate (not shown) and the light emitting device package 100. In addition, since the fifth and sixth sides 141b and 141c are exposed to the outside from the body 120, it is possible to visually confirm the presence of soldering defects. For example, in the embodiment, the fourth to sixth sides 141a, 141b, and 141c exposed from the second outer side surface 122 of the body 120 can visually confirm the presence or absence of defective soldering such as cold soldering. The embodiment can confirm whether there is an alignment defect by visual inspection by the fourth to sixth sides 141a, 141b, and 141c exposed from the second outer side surface 122 of the body 120. [

The second lower portion 141d may be disposed on the same plane as the lower surface 126 of the body 120. The second lower portion 141d may be disposed further outward than the lower surface 126 of the body 120.

The fourth lead portion 142 may extend from the third lead portion 141. The fourth lead portion 142 may include a flat upper surface and a lower surface, but is not limited thereto. The lower surface of the fourth lead portion 142 may be exposed to the outside from the lower surface 126 of the body 120. The upper surface of the fourth lead portion 142 may be exposed from the cavity 125 of the body 120 and a protective element (not shown) may be mounted on the exposed upper surface of the fourth lead portion 142 . Here, the protection element may be disposed on the upper surface of the second lead frame 140 exposed from the body 120. The protection element may be a zener diode, a thyristor, a TVS (Transient Voltage Suppression), or the like, but is not limited thereto. The lower surface of the fourth lead portion 142 may include third and fourth bottom portions 142a and 142b. The third and fourth bottom portions 142a and 142b may have different widths. For example, the width of the third bottom portion 142a may be smaller than the width of the fourth bottom portion 142b. The width of the third and fourth bottom portions 142a and 142b may be determined by a step structure disposed at a lower edge of the second lead frame 140, although it is not illustrated in detail in the drawings. For example, the edge of the third bottom 142a may include the stepped structure. The fourth lead portion 142 may include a second bending portion 142c. The second bending portion 142c may be disposed between the third and fourth bottom portions 142a and 142b. The second bending portion 142c may extend from the third bottom portion 142a. The second bending portion 142c may extend from the fourth bottom portion 142b. The width of the second bending portion 142c may gradually increase from the third bottom portion 142a to the fourth bottom portion 142b. In the embodiment, the second bending portion 142c having a bending structure is defined between the third and fourth bottom portions 142a and 142b, but the present invention is not limited thereto. For example, between the third and fourth bottom portions 142a and 142b, a linear structure having a width wider toward the fourth bottom portion 142b may be included.

And a second stepped portion 143 may be formed between the third and fourth lead portions 141 and 142. The second stepped portion 143 may be disposed on the lower surface of the second lead frame 140. The second stepped portion 143 may enlarge the contact area between the body 120 and the second lead frame 140. The second stepped portion 143 may improve the coupling force between the body 120 and the second lead frame 140. In addition, the second stepped portion 143 can improve moisture penetration to the outside by the stepped structure.

The embodiment includes a first lid portion 131 that includes exposed sides under the first projection 127 of the body 120 and a second lid portion 131 that includes exposed sides below the second projection 128 of the body 120 The presence or absence of defective soldering can be visually confirmed by the third lead portion 141. [

The embodiment includes a first lid portion 131 that includes exposed sides under the first projection 127 of the body 120 and a second lid portion 131 that includes exposed sides below the second projection 128 of the body 120 The presence or absence of defective alignment between the light emitting device package 100 and the substrate can be confirmed visually by the third lead portion 141. [

The embodiment also includes a first lid portion 131 that includes exposed sides under the first projection 127 of the body 120 and a second lid portion 131 that is exposed beneath the second projection 128 of the body 120 The soldering area can be increased by the third lead portion 141 including the first lead portion 141, so that the soldering reliability can be improved.

In addition, the embodiment can be such that the first and fourth sides 131a and 141a can correspond to the cutting face of the cutting process, The fifth and sixth sides 131b, 131c, 141b, and 141c may be spaced apart from the cutting line of the separation process of the unit light emitting device package 100. [ Therefore, in the second and third embodiments of the present invention, Since the fifth and sixth sides 131b, 131c, 141b, and 141c include a conductive material having high corrosion resistance, reliability of soldering with the board and reliability of electrical connection can be improved.

FIG. 4 is a perspective view illustrating an upper portion of a light emitting device package according to another embodiment, and FIG. 5 is a perspective view illustrating a lower portion of a light emitting device package according to another embodiment.

As shown in FIGS. 4 and 5, the light emitting device package 200 according to another embodiment may include the first and second protrusions 227 and 228 of the body 120, The technical features of the light emitting device package 100 according to the example can be adopted.

The first protrusion 227 may be disposed on a first outer surface 121 of the body 120 and the second protrusion 228 may be disposed on a second outer surface 122 of the body 120. . The first and second outer surfaces 121 and 122 may be symmetrical to each other in a first direction X-X 'of the body 120.

The first protrusion 227 may protrude outward from the first outer surface 121 of the body 120. The first protrusion 227 may be disposed on the first lead portion 131. The first protrusion 227 may be in direct contact with the first lead portion 131. The first protrusion 227 may be vertically overlapped with the first lead portion 131. The entire lower surface of the first projecting portion 227 may overlap the entire upper surface of the first lead portion 131. The lower surface of the first protrusion 227 may be in contact with the upper surface of the first lead portion 131. The entire lower surface of the first projecting portion 227 may be in direct contact with the entire upper surface of the first lead portion 131. The first width W1 of the first lead portion 131 is greater than the second width W2 of the first protrusion 227 in a second direction Y-Y 'orthogonal to the first direction X- (W3).

The second protrusion 228 may protrude outward from the second outer surface 122 of the body 120. The second protrusion 228 may be disposed on the third lead portion 141. The second protrusion 228 may be in direct contact with the third lead portion 141. The second protrusion 228 may be vertically overlapped with the third lead portion 141. The entire lower surface of the second protrusion 228 may overlap the entire upper surface of the third lead portion 141. The lower surface of the second protrusion 228 may be in contact with the upper surface of the third lead portion 141. The entire lower surface of the second protrusion 228 may be in direct contact with the entire upper surface of the third lead portion 141. The width of the third lead portion 141 in the second direction Y-Y 'may be equal to the width of the second protrusion 228.

In another embodiment, since the widths of the first and third lead portions 131 and 141 and the widths of the first and second protrusions 227 and 228 are the same in the second direction Y-Y ' And the exposed sides of the first and third lead portions 131, 141 from the second projections 227, 228 may be easier than the embodiment.

Another embodiment includes a first lead portion 131 that includes exposed sides under the first projection 227 of the body 120 and a second exposed portion below the second projection 228 of the body 120 The presence or absence of defective soldering can be visually confirmed by the third lead portion 141 which is formed by the third lead portion 141. [

Another embodiment includes a first lead portion 131 that includes exposed sides under the first projection 227 of the body 120 and a second exposed portion below the second projection 228 of the body 120 The presence or absence of defective alignment between the light emitting device package 100 and the substrate can be confirmed visually by the third lead portion 141. [

Another embodiment includes a first lead portion 131 that includes exposed sides under the first projection 227 of the body 120 and a second lead portion 131 that is exposed under the second projection 228 of the body 120. [ The soldering area can be increased by the third lead portion 141 including the first lead portion 141 and the second lead portion 141. Accordingly, reliability of soldering can be improved.

In another embodiment, the first and fourth sides 131a and 141a may correspond to the cutting plane of the cutting process, and the second and third sides 131a and 141a may correspond to the cutting plane of the cutting process. The fifth and sixth sides 131b, 131c, 141b, and 141c may be spaced apart from the cutting line of the separation process of the unit light emitting device package 100. [ Therefore, in the second and third embodiments of the other embodiments, Since the fifth and sixth sides 131b, 131c, 141b, and 141c include a conductive material having high corrosion resistance, reliability of soldering with the board and reliability of electrical connection can be improved.

≪ Light emitting chip &

6 is a cross-sectional view showing a light emitting chip included in the light emitting device package of the embodiment.

6, the light emitting chip includes a substrate 511, a buffer layer 512, a light emitting structure 510, a first electrode 516, and a second electrode 517. The substrate 511 may be a light-transmitting or non-light-transmitting material, and may include a conductive or insulating substrate.

The buffer layer 512 reduces the lattice constant difference between the substrate 511 and the material of the light emitting structure 510, and may be formed of a nitride semiconductor. A nitride semiconductor layer not doped with a dopant may be further formed between the buffer layer 512 and the light emitting structure 510 to improve crystal quality.

The light emitting structure 510 includes a first conductive semiconductor layer 513, an active layer 514, and a second conductive semiconductor layer 515.

For example, compound semiconductors such as Group II-IV and Group III-V. The first conductive semiconductor layer 513 may be a single layer or a multi-layer structure. The first conductive semiconductor layer 513 may be doped with a first conductive dopant. For example, when the first conductive semiconductor layer 513 is an n-type semiconductor layer, it may include an n-type dopant. For example, the n-type dopant may include but is not limited to Si, Ge, Sn, Se, and Te. The first conductive semiconductor layer 513 may include a composition formula of In _x Al _y Ga _1-xy N (0? X? 1, 0? _Y? 1, 0? _X + y? The first conductive semiconductor layer 513 may have a stacked structure of layers including at least one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. .

A first clad layer may be formed between the first conductive semiconductor layer 513 and the active layer 514. The first clad layer may be formed of a GaN-based semiconductor, and the bandgap thereof may be formed to have a bandgap or more of the active layer 514. The first clad layer may be formed of a first conductivity type and may include a function of constraining the carrier.

The active layer 514 is disposed on the first conductive semiconductor layer 513 and selectively includes a single quantum well, a multiple quantum well (MQW), a quantum wire structure, or a quantum dot structure. do. The active layer 514 includes a well layer and a barrier layer period. The well layer comprises a composition formula of _{In x Al y Ga 1-xy} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1), and wherein the barrier layer is In _x Al _y Ga _{1 -xy} N (0? x? 1, 0? y? 1, 0? x + y? 1). The period of the well layer / barrier layer may be one or more cycles using a lamination structure of, for example, InGaN / GaN, GaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, and InAlGaN / InAlGaN. The barrier layer may be formed of a semiconductor material having a band gap higher than a band gap of the well layer.

A second conductive semiconductor layer 515 is formed on the active layer 514. The second conductive semiconductor layer 515 may be formed of a semiconductor compound such as a Group II-IV and a Group III-V compound semiconductor. The second conductivity type semiconductor layer 515 may be a single layer or a multilayer. When the second conductive type semiconductor layer 515 is a p-type semiconductor layer, the second conductive type dopant may include Mg, Zn, Ca, Sr, and Ba as a p-type dopant. The second conductive semiconductor layer 515 may be doped with a second conductive dopant. The second conductive semiconductor layer 515 may include a composition formula of In _x Al _y Ga _1-xy N (0? X? 1, 0? _Y? 1, 0? _X + y? The second conductive semiconductor layer 515 may be formed of any one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP and AlGaInP.

The second conductive semiconductor layer 515 may include a superlattice structure, and the superlattice structure may include an InGaN / GaN superlattice structure or an AlGaN / GaN superlattice structure. The superlattice structure of the second conductivity type semiconductor layer 515 may protect the active layer 514 by diffusing a current contained in the voltage abnormally.

Although the first conductive semiconductor layer 513 is an n-type semiconductor layer and the second conductive semiconductor layer 515 is a p-type semiconductor layer, the first conductive semiconductor layer 513 may be a p- And the second conductivity type semiconductor layer 515 may be formed of an n-type semiconductor layer, but the present invention is not limited thereto. On the second conductive semiconductor layer 515, a semiconductor (e.g., an n-type semiconductor layer) (not shown) having a polarity opposite to that of the second conductive type may be formed. Accordingly, the light emitting structure 510 may have any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure.

A first electrode 516 is disposed on the first conductive type semiconductor layer 513 and a second electrode 517 having a current diffusion layer is disposed on the second conductive type semiconductor layer 515.

≪ Light emitting chip &

7 is a cross-sectional view showing another example of the light emitting chip included in the light emitting device package of the embodiment.

As shown in Fig. 7, the light emitting chip of another example will be described with reference to Fig. 6, and a description of the same constitution will be omitted. In another example of the light emitting chip, a contact layer 521 is disposed under the light emitting structure 510, a reflection layer 524 is disposed under the contact layer 521, and a support member 525 is formed below the reflection layer 524 And a protective layer 523 may be disposed around the reflective layer 524 and the light emitting structure 510.

The light emitting chip may include a contact layer 521 and a protective layer 523, a reflective layer 524, and a supporting member 525 under the second conductive type semiconductor layer 515.

The contact layer 521 may be in ohmic contact with the lower surface of the light emitting structure 510, for example, the second conductive type semiconductor layer 515. The contact layer 521 may be selected from a metal nitride, an insulating material, and a conductive material.

The protective layer 523 may be selected from a metal oxide or an insulating material. The protective layer 523 may be formed using a sputtering method, a deposition method, or the like.

The reflective layer 524 may include a metal. The reflective layer 524 may be formed to have a width larger than the width of the light emitting structure 510 to improve light reflection efficiency.

The support member 525 may be a base substrate made of a metal such as copper (Cu), gold (Au), nickel (Ni), molybdenum (Mo), copper-tungsten (Cu- Si, Ge, GaAs, ZnO, SiC). A bonding layer may be further formed between the support member 525 and the reflective layer 524.

<Lighting system>

8 is a perspective view showing a display device including the light emitting device package of the embodiment.

8, the display device 1000 of the embodiment includes a light guide plate 1041, a light source module 1031 for providing light to the light guide plate 1041, and a reflection member 1022 An optical sheet 1051 on the light guide plate 1041 and a display panel 1061 on the optical sheet 1051 and the light guide plate 1041 and the light source module 1031 and the reflection member 1022 But it is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050. The light guide plate 1041 may diffuse light and convert the light into plane light. The light source module 1031 includes at least one light source module 1031 and may directly or indirectly provide light from one side of the light guide plate 1041. The light source module 1031 includes a substrate 1033 and a light emitting device package 100 according to an embodiment of the present invention and the plurality of light emitting device packages 100 may be disposed on the substrate 1033 at a predetermined interval have. The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like, but is not limited thereto. The light emitting device package 100 may be disposed directly on the side surface of the bottom cover 1011 or on the heat radiation plate.

The light emitting device package 100 of the embodiment can employ the technical features of FIGS. 1 to 3. In an embodiment, the light emitting device package 100 may be soldered on the substrate 1033. The embodiment can improve the alignment defect of the light emitting device package 100 on the substrate 1033. [ The embodiment can visually confirm whether the light emitting device package 100 mounted on the substrate 1033 is defective in soldering. Therefore, the embodiment can improve the yield reduction such as alignment defect of the substrate 1033 and the light emitting device package 100, defective soldering, and the like.

The bottom cover 1011 may house the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. The bottom cover 1011 may be provided with a housing 1012 having a box shape with an opened top surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to the top cover, but is not limited thereto.

The display panel 1061 may be, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. And may include a polarizing plate disposed on at least one surface of the display panel 1061. The display panel 1061 displays information by light passing through the optical sheet 1051. The display device 1000 can be applied to various portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 may be disposed between the display panel 1061 and the light guide plate 1041. The optical sheet 1051 may include at least one light-transmitting sheet. The optical sheet 1051 may include at least one of, for example, a diffusion sheet, at least one prism sheet, and a protective sheet. The diffusion sheet may include a function of diffusing incident light. The prism sheet may include a function of condensing incident light into a display area. The protective sheet may include a function of protecting the prism sheet.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. It can be seen that the modification and application of branches are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

127, 227: first protrusion
128, 228: second projection
130: first lead frame
131: first lead portion
132: second lead portion
140: second lead frame
141: third lead portion
142: fourth lead portion
131a: first side
131b: second side
131c: third side
141a: fourth side
141b: the fifth side
141c: the sixth side

Claims (15)

A first lead frame;
A second lead frame spaced apart from the first lead frame; And
A cavity exposing a portion of a top surface of the first and second lead frames; and a body including first and second projections on an outer surface symmetrical in a first direction,
Wherein the first lead frame includes first and second lead portions, the first lead portion is disposed below the first projection,
Wherein the second lead frame includes third and fourth lead portions, and the third lead portion is disposed below the second projecting portion.
The method according to claim 1,
Wherein the first lead portion has a width smaller than or equal to a width of the first projection in a second direction orthogonal to the first direction.
The method according to claim 1,
Wherein the first lead portion includes first to third side portions exposed to the outside from the first projecting portion.
The method of claim 3,
And the first side is disposed coplanar with the end surface of the first protrusion.
The method of claim 3,
And the second and third sides extend in a direction orthogonal to the first side, and are disposed on the same plane as the edge of the first projection.
The method according to claim 1,
Wherein the first lead portion extends from the second lead portion and includes a first step portion between the first and second lead portions.
The method according to claim 1,
Wherein the second lead portion includes first and second bottom portions exposed to the outside from a lower portion of the body, and the first and second bottom portions have different widths from each other.
8. The method of claim 7,
And a first bending portion connecting the first and second bottom portions.
The method according to claim 1,
Wherein a width of the third lead portion is smaller than or equal to a width of the second projection in a second direction orthogonal to the first direction.
The method according to claim 1,
And the third lead portion includes fourth to sixth sides exposed to the outside from the second protrusion.
11. The method of claim 10,
And the fourth side is disposed on the same plane as the end surface of the second protrusion.
11. The method of claim 10,
And the fifth and sixth sides extend in a direction orthogonal to the fourth side, and are disposed on the same plane as the edge of the second projection.
The method according to claim 1,
Wherein the fourth lead portion includes third and fourth bottom portions exposed to the outside from a lower portion of the body, and the third and fourth bottom portions have different widths from each other.
14. The method of claim 13,
And a second bending portion connecting the third and fourth bottom portions.
A lighting device comprising the light emitting device package according to any one of claims 1 to 14.

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