KR101337602B1 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
KR101337602B1
KR101337602B1 KR1020070053948A KR20070053948A KR101337602B1 KR 101337602 B1 KR101337602 B1 KR 101337602B1 KR 1020070053948 A KR1020070053948 A KR 1020070053948A KR 20070053948 A KR20070053948 A KR 20070053948A KR 101337602 B1 KR101337602 B1 KR 101337602B1
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KR
South Korea
Prior art keywords
led chip
phosphor
reflective surface
housing
light
Prior art date
Application number
KR1020070053948A
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Korean (ko)
Other versions
KR20090002026A (en
Inventor
서정후
강석진
김태광
Original Assignee
서울반도체 주식회사
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Priority to KR1020070053948A priority Critical patent/KR101337602B1/en
Publication of KR20090002026A publication Critical patent/KR20090002026A/en
Application granted granted Critical
Publication of KR101337602B1 publication Critical patent/KR101337602B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and by including a phosphor on a reflecting surface formed around an LED chip, light emitted from the LED chip and light excited by the phosphor contained in the reflecting surface are mixed so that a change in color mixing rate is constant. In addition, it is a technical problem to provide a light emitting device having improved luminous efficiency.

To this end, the light emitting device according to the present invention is an LED chip; And a reflective surface provided around the LED chip, wherein the reflective surface includes a phosphor for converting a wavelength of light emitted from the LED chip. In this case, the reflecting surface includes a cavity inner surface of the housing formed to surround the LED chip, the housing is formed by molding the resin containing the phosphor.

LED Chip, Reflective Surface, Phosphor, Cavity, Lead Frame, Color Mixing, Heat Sink, Coating

Description

[0001] LIGHT EMITTING DEVICE [0002]

1 is a cross-sectional view for explaining a light emitting device according to an embodiment of the present invention.

2 is a cross-sectional view illustrating a light emitting device according to another embodiment of the present invention;

3 is a cross-sectional view illustrating a light emitting device according to another embodiment of the present invention.

DESCRIPTION OF THE REFERENCE SYMBOLS

10 housing 12 first lead

14 second lead 17 heatsink

20: LED chip 30: sealing member

41: cavity 42: inner surface

43 phosphor M1 first reflecting surface

M2: second reflective surface M3: third reflective surface

M4: fourth reflecting surface W: bonding wire

The present invention relates to a light emitting device, and more particularly, by including a phosphor on a reflecting surface formed around the LED chip, the color mixture of light emitted from the LED chip and light excited by the phosphor contained in the reflecting surface can be improved uniformly. In addition, the present invention relates to a light emitting device having improved luminous efficiency.

A light emitting diode (LED) is a device in which electrons and holes meet and emit light at a PN semiconductor junction by applying a current, and the LED emits light continuously at low voltage and low current. It has many advantages over existing light sources such as possible and low power consumption.

Such LEDs are usually manufactured in a package structure, and among them, LED packages having a structure in which an LED chip is mounted on a printed circuit board (PCB) and the LED chip is sealed with a transparent resin are known. This LED package is called a "PCB type LED package" and is configured to emit light generated from the LED chip to the outside through the encapsulant of the printed circuit board. In addition, other LED packages having a structure in which an LED chip is mounted on a lead frame supported by ceramic or polyphthalamide (PPA) resin instead of a printed circuit board may also emit light through an encapsulant and reflector formed to cover the LED chip. It is configured to.

Conventional LED packages as described above are being actively developed as a high power, high efficiency light source that can replace the backlight of the lighting device or display device.

As a method of realizing such white light, a method of applying a resin mold material containing a phosphor to an LED chip emitting a specific wavelength is used. This method causes the phosphor to absorb light emitted from the LED chip, and White light may be realized by emitting light. For example, when a resin containing a phosphor emitting yellow light is coated on an LED chip emitting blue light, white light can be emitted.

In the prior art, dopants mixed with phosphors in an encapsulant (e.g. epoxy or silicon) can be doped and cured, or applied to the LED chip as if electrolytically plated with electropolarity, or using a jig. It is used as a printing method.

However, in the prior art, since the light from the LED chip and the light excited by the phosphor contained in the encapsulant or the phosphor coated on the LED chip are mixed, the color mixing ratio is severely changed. In particular, the color mixing ratio is more severely changed depending on the content of the phosphor in the encapsulant and the degree of phosphor deposition in the encapsulant, so that it is difficult to obtain uniform luminous efficiency and color coordinates. In addition, the luminous efficiency may be degraded because the phosphor blocks the light emitted from the LED chip.

The technical problem to be achieved by the present invention is to include a phosphor on the reflecting surface formed around the LED chip, thereby not only uniformly improving the color mixing of light emitted from the LED chip and the phosphor contained in the reflecting surface, but also luminous efficiency. The present invention provides an improved light emitting device.

In order to achieve the above technical problem, a light emitting device according to an embodiment of the present invention is an LED chip; And a reflective surface provided around the LED chip, wherein the reflective surface includes a phosphor for converting a wavelength of light emitted from the LED chip.

According to the present embodiment, the reflecting surface includes a cavity inner surface of the housing formed to surround the LED chip. The housing is formed by molding a resin containing the phosphor. The reflective surface may include a surface of a lead frame to which the LED chip is attached, and may be made of a conductive metal including the phosphor on at least part of the surface of the lead frame. The reflective surface may include a surface of a heat sink to which the LED chip is attached for heat dissipation, and may be formed by coating a conductive metal including the phosphor on at least part of the surface of the heat sink. In addition, the reflective surface may include a surface of a lead to which the LED chip is attached, and may be made of a conductive metal including phosphors on at least a portion of the surface of the lead.

Further, the LED chip is attached to the surface of the lead frame installed in the housing, at least a portion of the surface of the lead frame and the inner surface of the housing defined around the LED chip may be a reflective surface containing the phosphor. In addition, the LED chip is attached to the surface of the heat sink installed in the housing, at least a portion of the surface of the heat sink and the inner surface of the housing is limited to the LED chip surrounding the reflection surface containing the phosphor. In addition, the light emitting device according to another embodiment of the present invention is characterized in that it comprises a phosphor having a uniform thickness formed on the reflective surface.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a cross-sectional view illustrating a light emitting device according to an embodiment of the present invention.

As shown in FIG. 1, the light emitting device 1 according to the present exemplary embodiment may include a first and second leads 12 and 14 formed as a lead frame and connected to external electrodes, and a housing 10 integrally formed therewith. ). The housing 10 may be formed by insert molding a resin containing the phosphor 43. In addition, the housing 10 may be made of polyphthalamide (PPA, hereinafter referred to as “PPA”) including the phosphor 43, and may variously design an internal structure of the LED package. The first and second leads 12 and 14 are disposed to face each other in close proximity, and the other ends extend in opposite directions to protrude to the outside of the housing 10.

Although the other ends of the first and second leads 12 and 14 are protruded out of the housing 10 in the drawings, the present invention is not limited thereto. 12 and 14 may be electrically connected to the external electrodes through vias (not shown) penetrating the housing 10 up and down, respectively.

The housing 10 surrounds at least a portion of the first and second leads 12 and 14 to fix the first and second leads 12 and 14. The housing 10 also has a cavity 41 exposing the first and second leads 12, 14.

The LED chip 20 is mounted on the bottom surface of the cavity 41. At this time, as shown, the LED chip 20 may be attached on the first lead 12 by a conductive adhesive. In addition, the LED chip 20 may be connected to the second lead 14 through a bonding wire (W). Accordingly, the LED chip 20 is electrically connected to the first and second leads 12 and 14.

On the other hand, the cavity 41 is filled with a sealing member 30 of a translucent resin such as epoxy or silicon. The encapsulation member 30 covers the upper portion of the LED chip 20 mounted on the bottom surface of the cavity 41. In addition, the encapsulation member 30 may cover the bonding wire (W). The upper surface of the encapsulation member 30 may be a flat surface as shown in the figure, it may have a constant curvature. In addition, the encapsulation member 30 may contain at least one phosphor 18. Accordingly, the light emitted from the LED chip 20 and the light and the sealing member 30 excited by the phosphors included in the first and second reflective surfaces M1 and M2 provided around the LED chip 20. Light excited by the contained phosphors can be mixed to create even more diverse colors.

The housing 10 has a first reflective surface M1 formed on the inner surface 42 of the cavity to reflect the light generated by the LED chip 20 to the outside. In addition, the second reflective surface M2 may be formed on the surfaces of the first and second leads 12 and 14 provided in the housing 10. In this case, a second reflective surface M2 may be selectively formed on the surface of the first lead 12 to which the LED chip 20 is attached. In addition, a second reflective surface M2 may be formed on the surfaces of the first and second leads 12 and 14 exposed by the cavity 41 of the housing 10.

The first reflecting surface M1 includes a phosphor for color converting light emitted from the LED chip 20. Furthermore, as shown in FIG. 1, when the housing 10 is injected, a mixture of phosphors 43 is injected into the injection material, for example, PPA, and thus, the cavity 41 of the housing 10 as well as the housing 10. The phosphor 43 may also be included inside and on the surface. Accordingly, the first reflective surface M1 reflects the light emitted from the LED chip 20 by the color phosphor 43.

In the present embodiment, the housing 10 and the cavity 41 are described as including both the phosphor 43 in the surface and the surface, but the present invention is not limited thereto, the cavity provided around the LED chip 20 It is also possible to implement such that a phosphor having a uniform thickness is included on the surface of 41.

In addition, the second reflecting surface M2 may be formed by coating a conductive metal including phosphor on the surfaces of the first and second leads 12 and 14. Accordingly, the second reflecting surface M2 reflects light emitted from the LED chip 20 toward the first and second leads 12 and 14 by using a phosphor.

When the first and second reflecting surfaces M1 and M2 reflect the light generated from the LED chip 20, color conversion is performed by phosphors included in the first and second reflecting surfaces M1 and M2. This is done. Therefore, a predetermined amount of light emitted from the LED chip 20 and a predetermined amount of light that is color-converted by hitting the first and second reflective surfaces M1 and M2 may be color-mixed to improve luminous efficiency.

In the present exemplary embodiment, the first reflective surface M1 and the second reflective surface M2 are described as being formed in the housing 10. However, the first reflective surface M1 or the second reflective surface M2 is formed. ) May be formed in the housing 10, and color mixture may be kept constant by the phosphor 43 of the first reflecting surface M1 or the phosphor of the second reflecting surface M2.

The light emitting device 1 according to another embodiment of the present invention shown in FIG. 2 has a light emitted from the LED chip 20 by forming a phosphor on the reflective surface for converting the wavelength of light emitted from the LED chip 20. The light emission efficiency is improved by color mixing the light excited by the phosphor of the reflective surface, which is the same as the embodiment of the present invention described above.

However, in the light emitting device according to another embodiment of the present invention, since the third reflective surface M3 is formed on the surface of the heat sink 17 provided for heat dissipation, the following description will be made. The explanation focuses on the differences.

Referring to FIG. 2, a light emitting device 1 according to another embodiment of the present invention will be described. The first reflective surface M1 formed in the housing 10 is the same as the previous embodiment, and the housing 10 The third reflecting surface M3 is formed in the. The third reflective surface M3 is formed on the surface of the heat sink 17 to which the LED chip 20 is attached, and may be formed by coating a conductive metal including phosphor on the surface of the heat sink 17. have. The heat sink 17 is attached to the LED chip 20 for heat dissipation. Accordingly, the third reflecting surface M3 reflects the light emitted from the LED chip 20 toward the heat sink 17 by color conversion using a phosphor.

The first reflecting surface M1 and the third reflecting surface M3 are included in the first to third reflecting surfaces M1, M2, and M3 when reflecting light generated from the LED chip 20. Color conversion is performed by the phosphor. Thus, a predetermined amount of light emitted from the LED chip 20 and a predetermined amount of light that is color-converted by hitting the first reflecting surface M1 and the third reflecting surface M3 may be color mixed.

Although the first reflective surface M1 and the third reflective surface M3 are formed in the housing 10 in the present embodiment, the present invention is not limited thereto, and the third reflective surface M3 may be disposed in the housing 10. Alternatively, the second reflective surface M2 and the third reflective surface M3 of the foregoing embodiment may be formed in the housing 10.

In addition, in the present embodiment, the third reflective surface M3 is described as being formed on the surface of the heat sink 17 to which the LED chip 20 is attached. However, the present invention is not limited thereto. When the adhesive for attaching the chip 20 to the heat sink 17 is not used as the transparent adhesive, the surface of the heat sink 17 except for the attaching surface of the LED chip 20 may be used as the third reflective surface ( M3).

According to the present exemplary embodiment, light emitted from the LED chip 20 and light excited by a phosphor formed on at least one of the first to third reflective surfaces M1, M2, and M3 are mixed to be mixed. I can make a color.

3 is a view for explaining a light emitting device according to another embodiment of the present invention.

Referring to FIG. 3, a light emitting device according to another embodiment of the present invention includes a housing 10, a base 11, an LED chip 20, and an encapsulation member 30. Here, the housing 10 is a reflector that reflects the light from the LED chip 20 while being attached to the base 11.

 Here, the base 11 is a printed circuit board (hereinafter, referred to as 'PCB') having first and second leads 12 and 14 electrically connected to the LED chip 20. The first and second leads 12 and 14 are spaced apart from each other. The first and second leads 12 and 14 are formed by, for example, forming a conductive thin film metal such as a copper thin film through plating, printing, or other methods.

The LED chip 20 is attached on the first lead 12 of the base 11, and the LED chip 20 is connected to the second lead 14 by a bonding wire (W). An encapsulation member 30 is formed to cover the LED chip 20. Molding process for the formation of such a sealing member 30 is a known technique and has a low direct relationship with the present invention, so a detailed description thereof will be omitted.

The housing 10 has a first reflective surface M1 formed on the inner surface 42 of the cavity 41 so as to reflect the light generated by the LED chip 20 to the outside, and is formed on the base 11. The fourth reflective surface M4 is formed on the first and second leads 12 and 14. The fourth reflecting surface M4 may be a conductive metal including phosphors in the first and second leads 12 and 14. Accordingly, the fourth reflecting surface M4 reflects light emitted from the LED chip 20 toward the first and second leads 12 and 14 by using a phosphor.

When the first and fourth reflective surfaces M1 and M4 reflect the light generated from the LED chip 20, the color conversion of the first and fourth reflective surfaces M1 and M4 is caused by the phosphors included in the first and fourth reflective surfaces M1 and M4. Is done. Therefore, a predetermined amount of light emitted from the LED chip 20 and a predetermined amount of light that is color-converted by hitting the first and fourth reflective surfaces M1 and M4 may be color-mixed to improve luminous efficiency.

In the present exemplary embodiment, the light emitted from the LED chip 20 is reflected by colliding with the first reflecting surface M1 and the fourth reflecting surface M4, but the first reflecting surface M1 or the fourth reflecting light is reflected. By hitting and reflecting off the reflective surface M4, the color mixing can be maintained constant.

According to the present exemplary embodiment, light emitted from the LED chip 20 and light excited by a phosphor formed on at least one of the first reflective surface M1 and the fourth reflective surface M4 are mixed to form various colors. You can make

According to an embodiment of the present invention, by including a phosphor on the reflecting surface formed around the LED chip, the light emitted from the LED chip and the light excited by the phosphor is mixed, so that the change in color mixing rate is constant and the luminous efficiency is improved. It works.

Claims (9)

LED chip; And Including a reflective surface provided around the LED chip, The reflective surface includes a phosphor for converting the wavelength of the light emitted from the LED chip, The reflective surface includes a surface of the lead frame to which the LED chip is attached, characterized in that made of a conductive metal containing the phosphor on at least part of the surface of the lead frame. LED chip; And Including a reflective surface provided around the LED chip, The reflective surface includes a phosphor for converting the wavelength of the light emitted from the LED chip, The reflective surface includes a surface of the heat sink to which the LED chip is attached for heat dissipation, the light emitting device characterized in that the conductive metal containing the phosphor is coated on at least part of the surface of the heat sink. LED chip; And Including a reflective surface provided around the LED chip, The reflective surface includes a phosphor for converting the wavelength of the light emitted from the LED chip, The LED chip is attached to the surface of the lead frame installed in the housing, at least a part of the surface of the lead frame and the inner surface of the housing is limited to the LED chip, characterized in that the reflective surface containing the phosphor. LED chip; And Including a reflective surface provided around the LED chip, The reflective surface includes a phosphor for converting the wavelength of the light emitted from the LED chip, The LED chip is attached to a heat sink surface installed in the housing, at least a portion of the surface of the heat sink and the inner surface of the housing is limited to the LED chip, characterized in that the reflective surface containing the phosphor. LED chip; And Including a reflective surface provided around the LED chip, The reflective surface includes a phosphor for converting the wavelength of the light emitted from the LED chip, The reflective surface includes a surface of the lead to which the LED chip is attached, the light emitting device, characterized in that made of a conductive metal containing a phosphor on at least part of the surface of the lead. The method according to any one of claims 1 to 5, The reflective surface comprises a phosphor formed to have a uniform thickness. The method according to any one of claims 1 to 5, And the reflective surface includes an inner surface of a cavity of a housing formed to surround the LED chip. delete delete
KR1020070053948A 2007-06-01 2007-06-01 Light emitting device KR101337602B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070053948A KR101337602B1 (en) 2007-06-01 2007-06-01 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070053948A KR101337602B1 (en) 2007-06-01 2007-06-01 Light emitting device

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KR20090002026A KR20090002026A (en) 2009-01-09
KR101337602B1 true KR101337602B1 (en) 2013-12-06

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013222499A (en) * 2012-04-12 2013-10-28 Sharp Corp Light source substrate unit
KR102235258B1 (en) 2014-02-04 2021-04-05 삼성디스플레이 주식회사 Light emitting diode package and back light unit comprising the same
KR102142718B1 (en) * 2014-03-20 2020-08-07 엘지이노텍 주식회사 Light emitting device and light apparatus having thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124521A (en) * 2001-10-09 2003-04-25 Rohm Co Ltd Semiconductor light emitting device with case
JP2004128393A (en) 2002-10-07 2004-04-22 Sharp Corp Led device
KR200383148Y1 (en) 2004-12-28 2005-05-03 주식회사 티씨오 Light Emitting Diode and its Method of Making With Rrflecting

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124521A (en) * 2001-10-09 2003-04-25 Rohm Co Ltd Semiconductor light emitting device with case
JP2004128393A (en) 2002-10-07 2004-04-22 Sharp Corp Led device
KR200383148Y1 (en) 2004-12-28 2005-05-03 주식회사 티씨오 Light Emitting Diode and its Method of Making With Rrflecting

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