CN207800645U - A kind of LED lamp bead of perfect heat-dissipating - Google Patents
A kind of LED lamp bead of perfect heat-dissipating Download PDFInfo
- Publication number
- CN207800645U CN207800645U CN201820234427.1U CN201820234427U CN207800645U CN 207800645 U CN207800645 U CN 207800645U CN 201820234427 U CN201820234427 U CN 201820234427U CN 207800645 U CN207800645 U CN 207800645U
- Authority
- CN
- China
- Prior art keywords
- heat sink
- heat
- led lamp
- lamp bead
- aluminum substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a kind of LED lamp beads of perfect heat-dissipating, including aluminum substrate, the bottom of the aluminum substrate is provided with heat sink, the bottom of the heat sink is provided with equally distributed heat emission hole, it is provided with heating column on the inside of the aluminum substrate, one end of the heating column is mounted on heat sink, plastic case is provided with above the aluminum substrate, the both sides of the plastic case are provided with symmetrical contact conductor.Heat sink and heat sink is connected by the way that heating column is arranged, the heat generated when LED chip can work is spread out in time, reduce the influence to LED lamp bead performance of temperature, extend the service life of LED lamp bead, and the structure of entire cooling system is simple, it is of low cost, install it is convenient and efficient, it is suitable for mass production；Fluoresent coating and gold thread are set in LED lamp bead, can effectively reinforce lighting effect and intensity of illumination of the LED lamp bead in irradiation, improve the product competitiveness of LED lamp bead.
Description
Technical field
A kind of the utility model category LED lamp bead technical field, and in particular to LED lamp bead of perfect heat-dissipating.
Background technology
Light emitting diode is referred to as LED.Compound by containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N) etc. is made.Work as electricity
Visible light can be given off when son is with hole-recombination, thus can be used for that light emitting diode is made.It is used as and refers in circuit and instrument
Show lamp, or composition word or number display.Gallium arsenide diode glows, gallium phosphide diode green light, two pole of silicon carbide
Pipe Yellow light-emitting low temperature, gallium nitride diode blue light-emitting.Because chemical property is divided into Organic Light Emitting Diode OLED and inorganic light-emitting diode
LED.LED is referred to as forth generation lighting source or green light source, has the characteristics that energy-saving and environmental protection, long lifespan, small, extensively
Applied to the fields such as various instructions, display, decoration, backlight, general lighting and urban landscape.According to the difference for using function,
It can be divided into presentation of information, signal lamp, Vehicular lamp, liquid crystal screen backlight, five major class of general illumination.China is being just at present
Gradually becoming global LED industry base.Statistical data shows, 480,000,000,000 yuan of China's illuminating industry gross output value in 2013.Wherein
Export market including 35,000,000,000 U.S. dollars and more than 2,000 hundred million yuan of domestic market.Hundred million yuan of the developing market more than 2000, in the industry
Personage thinks that there will be the market spaces of many trillion member for 30 years illumination stock markets formed of reform and opening-up.
The LED lamp bead of the prior art has the following problems：1, LED lamp bead generates in the case of long-time use
Thermal energy cannot timely be spread out mostly, and long time integration can cause centainly the performance of chip near the LED chip
Influence, or even shorten the service life of LED lamp bead, accelerate the rate that LED lamp bead alternates, use cost can increase；2、LED
The brightness of lamp bead need to be improved.
Utility model content
To solve the problems mentioned above in the background art.The utility model provides a kind of LED light of perfect heat-dissipating
Pearl has the characteristics that perfect heat-dissipating.
To achieve the above object, the utility model provides the following technical solutions：A kind of LED lamp bead of perfect heat-dissipating, packet
Aluminum substrate is included, the bottom of the aluminum substrate is provided with heat sink, and the bottom of the heat sink is provided with equally distributed heat emission hole,
Heating column is provided on the inside of the aluminum substrate, one end of the heating column is mounted on heat sink, the top of the aluminum substrate
It is provided with plastic case, the both sides of the plastic case are provided with symmetrical contact conductor, one end of the contact conductor
Mounted on the top of aluminum substrate, it is provided with heat sink on the inside of the plastic case, the heat sink bottom is provided with heat-conducting glue, institute
State the top that heat-conducting glue is mounted on aluminum substrate, it is described it is heat sink be internally provided with heating column, the heat sink top is provided with silver
Glue, the other end of the heating column are mounted on elargol, are provided with LED chip at the top of the elargol, the LED chip it is outer
Side is provided with fluorescent coating, and gold thread is connected between the LED chip and contact conductor, is set above the fluorescent coating
It is equipped with embedding silica gel, lens are provided with above the embedding silica gel, the lens are mounted in plastic case.
Preferably, the heat emission hole is an integral structure with heat sink.
Preferably, the contact conductor is mounted on the top of aluminum substrate by fastening screw.
Preferably, the heating column and heat sink connection type are embedded connection.
Preferably, the connection type of the heating column and heat sink is to be connected together.
Preferably, the connection type of the aluminum substrate and heat sink is adhesion.
Compared with prior art, the utility model has the beneficial effects that：
1, the utility model connects heat sink and heat sink, the heat generated when LED chip can work by the way that heating column is arranged
Amount is spread out in time, reduces the influence to LED lamp bead performance of temperature, extends the service life of LED lamp bead, and entire
The structure of cooling system is simple, of low cost, install it is convenient and efficient, it is suitable for mass production.
2, fluoresent coating and gold thread is arranged in the utility model in LED lamp bead, can effectively reinforce LED lamp bead irradiation when
Lighting effect and intensity of illumination improve the product competitiveness of LED lamp bead.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the vertical view of the utility model；
In figure：1, lens；2, elargol；3, fluorescent coating；4, LED chip；5, embedding silica gel；6, gold thread；7, plastic tube
Shell；8, contact conductor；9, aluminum substrate；10, heat emission hole；11, heat sink；12, heating column；13, heat-conducting glue；14, heat sink.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the utility model provides following technical scheme：A kind of LED lamp bead of perfect heat-dissipating, including aluminium
Substrate 9, the bottom of aluminum substrate 9 are provided with heat sink 14, and the connection type of aluminum substrate 9 and heat sink 14 is adhesion, heat sink 14
Bottom be provided with equally distributed heat emission hole 10, heat emission hole 10 is an integral structure with heat sink 14, and the inside of aluminum substrate 9 is set
It is equipped with heating column 12, one end of heating column 12 is mounted on heat sink 14, and the connection type of heating column 12 and heat sink 14 is card
Connection is closed, the top of aluminum substrate 9 is provided with plastic case 7, and the both sides of plastic case 7 are provided with symmetrical contact conductor 8,
One end of contact conductor 8 is mounted on the top of aluminum substrate 9, and contact conductor 8 is mounted on the top of aluminum substrate 9 by fastening screw,
The bottom that the inside of plastic case 7 is provided with heat sink 11, heat sink 11 is provided with heat-conducting glue 13, and heat-conducting glue 13 is mounted on aluminum substrate 9
Top, heat sink 11 are internally provided with heating column 12, and heating column 12 and heat sink 11 connection type are embedded connection, heat sink 11
Top be provided with elargol 2, the other end of heating column 12 is mounted on elargol 2, and the top of elargol 2 is provided with LED chip 4, LED
The outside of chip 4 is provided with fluorescent coating 3, and gold thread 6 is connected between LED chip 4 and contact conductor 8, fluorescent coating 3
Top is provided with embedding silica gel 5, and the top of embedding silica gel 5 is provided with lens 1, and lens 1 are mounted in plastic case 7.
LED chip 4 is the known technology of the extensive utilization and daily life that have disclosed in the utility model, also referred to as
LED luminescence chips, are the core component of LED light, that is, the P-N junction referred to.Its major function is:Electric energy is converted into luminous energy,
The main material of chip is monocrystalline silicon.Semiconductor wafer consists of two parts, and a part is P-type semiconductor, the hole inside it
It occupies an leading position, the other end is N-type semiconductor, is mainly electronics in this side.
The operation principle and process for using of the utility model：LED lamp bead is connected to extraneous electricity when the utility model is used
In source, certain thermal energy is will produce when LED chip 4 is worked, thermal energy diffuses in heat sink 11 as heating column 12 is another
Secondary to be transmitted in heat sink 14, heat is diffused into from the heat emission hole 10 in heat sink 14 in external environment, effectively prevents thermal energy
The setting of influence to the LED lamp bead service life, gold thread 6 and fluorescent coating 3 can effectively reinforce the radiation response and photograph of LED lamp bead
Degree.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of LED lamp bead of perfect heat-dissipating, including aluminum substrate（9）, it is characterised in that：The aluminum substrate（9）Bottom set
It is equipped with heat sink（14）, the heat sink（14）Bottom be provided with equally distributed heat emission hole（10）, the aluminum substrate（9）'s
Inside is provided with heating column（12）, the heating column（12）One end be mounted on heat sink（14）On, the aluminum substrate（9）It is upper
Side is provided with plastic case（7）, the plastic case（7）Both sides be provided with symmetrical contact conductor（8）, the electrode
Lead（8）One end be mounted on aluminum substrate（9）Top, the plastic case（7）Inside be provided with it is heat sink（11）, the heat
It is heavy（11）Bottom be provided with heat-conducting glue（13）, the heat-conducting glue（13）Mounted on aluminum substrate（9）Top, it is described heat sink（11）
Be internally provided with heating column（12）, described heat sink（11）Top be provided with elargol（2）, the heating column（12）The other end
Mounted on elargol（2）On, the elargol（2）Top be provided with LED chip（4）, the LED chip（4）Outside be provided with
Fluorescent coating（3）, the LED chip（4）With contact conductor（8）Between be connected with gold thread（6）, the fluorescent coating（3）
Top be provided with embedding silica gel（5）, the embedding silica gel（5）Top be provided with lens（1）, the lens（1）It is mounted on
Plastic case（7）It is interior.
2. a kind of LED lamp bead of perfect heat-dissipating according to claim 1, it is characterised in that：The heat emission hole（10）With
Heat sink（14）It is an integral structure.
3. a kind of LED lamp bead of perfect heat-dissipating according to claim 1, it is characterised in that：The contact conductor（8）It is logical
It crosses fastening screw and is mounted on aluminum substrate（9）Top.
4. a kind of LED lamp bead of perfect heat-dissipating according to claim 1, it is characterised in that：The heating column（12）With
It is heat sink（11）Connection type be embedded connection.
5. a kind of LED lamp bead of perfect heat-dissipating according to claim 1, it is characterised in that：The heating column（12）With
Heat sink（14）Connection type be connected together.
6. a kind of LED lamp bead of perfect heat-dissipating according to claim 1, it is characterised in that：The aluminum substrate（9）With dissipate
Hot plate（14）Connection type be adhesion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820234427.1U CN207800645U (en) | 2018-02-09 | 2018-02-09 | A kind of LED lamp bead of perfect heat-dissipating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820234427.1U CN207800645U (en) | 2018-02-09 | 2018-02-09 | A kind of LED lamp bead of perfect heat-dissipating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207800645U true CN207800645U (en) | 2018-08-31 |
Family
ID=63276264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820234427.1U Expired - Fee Related CN207800645U (en) | 2018-02-09 | 2018-02-09 | A kind of LED lamp bead of perfect heat-dissipating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207800645U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112259672A (en) * | 2020-10-22 | 2021-01-22 | 深圳市宇亮光电技术有限公司 | Low-power LED lamp bead low-thermal-resistance packaging structure and packaging process |
-
2018
- 2018-02-09 CN CN201820234427.1U patent/CN207800645U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112259672A (en) * | 2020-10-22 | 2021-01-22 | 深圳市宇亮光电技术有限公司 | Low-power LED lamp bead low-thermal-resistance packaging structure and packaging process |
| CN112259672B (en) * | 2020-10-22 | 2021-06-08 | 深圳市宇亮光电技术有限公司 | Low-power LED lamp bead low-thermal-resistance packaging structure and packaging process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI523277B (en) | White light emitting diode module with ultraviolet light | |
| CN201359210Y (en) | Lens integrated LED light source module | |
| CN203585912U (en) | 360-degree non-light-tight light source | |
| CN102927475B (en) | Light-emitting diode (LED) light source module | |
| CN203192852U (en) | Led packaging structure | |
| CN204153540U (en) | A kind of wide-angle light extracting LED bulb lamp | |
| CN207800645U (en) | A kind of LED lamp bead of perfect heat-dissipating | |
| CN202839748U (en) | White light source module based on flip LED chips | |
| CN105114847A (en) | Cambered special-shaped all-around illuminating LED bulb | |
| CN202501281U (en) | Novel LED (light emitting diode) bulb lamp | |
| CN101294660B (en) | LED lighting lamp | |
| CN203286335U (en) | LED (light-emitting diode) panel lamp | |
| CN202188416U (en) | Vehicle LED (light-emitting diode) taillight | |
| CN104654079A (en) | High-performance 360-degree LED (Light-Emitting Diode) lamp | |
| CN103606622A (en) | LED integrated-type light source | |
| CN201936915U (en) | LED (light-emitting diode) encapsulating structure and LED module thereof | |
| CN101709840B (en) | Streetlamp with application-oriented light-emitting diode module | |
| CN209045600U (en) | A kind of micro- light emitting diode | |
| CN203225277U (en) | High-power LED packaging structure | |
| CN105627166A (en) | Large-angle light-emitting lighting emitting diode (LED) bulb lamp | |
| CN201047570Y (en) | High brightness, high power and low heating LED illuminating device | |
| CN212511037U (en) | Heat radiation structure of LED lamp pearl | |
| CN204459825U (en) | High-performance 360 degree of light emitting LED lamp | |
| CN207599370U (en) | A kind of light-emitting diode light source structure | |
| CN201517709U (en) | LED lighting lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180831 Termination date: 20210209 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |