CN102569600A - LED (light emitting diode) packaging structure and reflection cup thereof - Google Patents
LED (light emitting diode) packaging structure and reflection cup thereof Download PDFInfo
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- CN102569600A CN102569600A CN2011103599444A CN201110359944A CN102569600A CN 102569600 A CN102569600 A CN 102569600A CN 2011103599444 A CN2011103599444 A CN 2011103599444A CN 201110359944 A CN201110359944 A CN 201110359944A CN 102569600 A CN102569600 A CN 102569600A
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- led
- package structure
- reflector
- diapire
- reflective layer
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Abstract
The invention relates to an LED (light emitting diode) packaging structure which comprises a reflection cup, an LED chip and a packaging body, wherein the reflection cup comprises a bottom wall and a side wall which define an accommodating groove for accommodating the LED chip and metal reflection layers are formed on the inner walls of the bottom wall and the side wall, which face the accommodating groove. The LED chip is arranged on the inner surface of the bottom wall and the packaging body is filled in the accommodating groove and covers the LED chip. The area of a metal reflection layer in the reflection cup of the LED packaging structure is large, the reflectivity of the whole reflection cup is high and therefore the light emission efficiency of the LED packing structure is improved greatly.
Description
Technical field
The present invention relates to a kind of semiconductor light-emitting elements, relate in particular to a kind of package structure for LED and reflector thereof.
Background technology
At present, light-emitting diode (Light Emitting Diode, LED) low in energy consumption because of having, the life-span is long, volume is little and characteristic such as brightness height has been widely applied to a lot of fields.
The reflector of traditional package structure for LED is many by the cup end and the polyphthalamide (Polyphthalamide that have the metal reflective layer; PPA) the reflector wall of cup of material is formed; Because the reflectivity of the luminance factor metal reflective layer of the reflector wall of cup that the PPA injection moulding forms is low; So the light that light-emitting diode chip for backlight unit is sent that can not maximal efficiency reflects away, thereby causes the light extraction efficiency of whole package structure for LED lower.
Summary of the invention
In view of this, be necessary to provide a kind of package structure for LED and reflector thereof, to solve the lower technical problem of light extraction efficiency of existing package structure for LED.
The present invention is achieved in that
A kind of reflector of package structure for LED, it comprises diapire and sidewall, and said diapire and sidewall surround an accepting groove that is used to accommodate light-emitting diode chip for backlight unit, and said diapire and side wall surface all are formed with the metal reflective layer on the inner surface of accepting groove.
And, a kind of package structure for LED, it comprises said reflector, be arranged at light-emitting diode chip for backlight unit on the inner surface of said diapire and the packaging body that is filled in covering luminousing diode chip in the said accepting groove.
The diapire of the reflector of said package structure for LED and side wall surface all are formed with the metal reflective layer on the inner surface of accepting groove; With respect to prior art; The area of the metal reflective layer in the said reflector has increased; The reflectivity of entire emission cup has improved, thereby can improve the light extraction efficiency of package structure for LED greatly.
Description of drawings
Below in conjunction with accompanying drawing embodiments of the invention are described, wherein:
Fig. 1 is the cutaway view of the package structure for LED that provides of first embodiment of the invention;
Fig. 2 is the cutaway view of the package structure for LED that provides of second embodiment of the invention;
Fig. 3 is the cutaway view of the package structure for LED that provides of third embodiment of the invention;
Fig. 4 is the cutaway view of the package structure for LED that provides of fourth embodiment of the invention; And
Fig. 5 is the cutaway view of the package structure for LED that provides of fifth embodiment of the invention.
Embodiment
Below based on accompanying drawing specific embodiment of the present invention is further elaborated.Should be appreciated that specific embodiment described herein as just embodiment, and be not used in qualification protection scope of the present invention.
See also Fig. 1, a kind of package structure for LED 100 that first embodiment of the invention provides comprises reflector 10, light-emitting diode chip for backlight unit 20 and packaging body 30.
Said reflector 10 comprises diapire 11, sidewall 12 and metal reflective layer 13.Said diapire 11 surrounds an accepting groove that is used to accommodate light-emitting diode chip for backlight unit 20 with sidewall 12, and said diapire 11 all is formed with said metal reflective layer 13 with sidewall 12 on the inner surface of accepting groove.The diapire 11 of said reflector 10 is made up of two metallic supports 101 and insulating material 102 with sidewall 12.Concrete, said entire emission cup 10 can form through injection moulding, so, can improve the adhesion between metallic support 101 and the insulating material 102.Preferably, said insulating material 102 is PPA.
In the present embodiment, said two metallic supports 101 include part that is positioned at diapire 11 and the part that extends to the inner surface of sidewall 12.Said metal reflective layer 13 can be formed at said two metallic supports 101 through electric plating method and be positioned on the part of the part of said diapire 11 and the inner surface that extends to sidewall 12.The said insulating material 102 that is positioned at diapire 11 is with two metallic support 101 electric separatings, and the said insulating material 102 that is positioned on the sidewall 12 extends to the part setting of the inner surface of sidewall 12 around said two metallic supports 101.
Said light-emitting diode chip for backlight unit 20 is arranged on the inner surface of said diapire 11, and electrically connects with said two metallic supports 101.In the present embodiment, said light-emitting diode chip for backlight unit 20 is arranged on said two metallic supports 101 on one of them, and electrically connects with said two metallic supports 101 respectively through the mode of routing.Be appreciated that the said light-emitting diode chip for backlight unit 20 and the connected mode of metallic support 101 are not limited to present embodiment, for example, said light-emitting diode chip for backlight unit 20 also can be through covering mode and metallic support 101 electric connections such as crystalline substance.Because metallic support 101 generally has good heat conductivility, through said light-emitting diode chip for backlight unit 20 is arranged on the said metallic support 101, can improve the radiating efficiency of light-emitting diode chip for backlight unit 20 greatly.
Said packaging body 30 is filled in the said accepting groove, and covering luminousing diode chip 20, thereby can protect light-emitting diode chip for backlight unit 20, prevents that light-emitting diode chip for backlight unit 20 from receiving pollutions such as steam, dust.
See also Fig. 2 and Fig. 3; The package structure for LED 200 that second embodiment of the invention and the 3rd embodiment provide and 300 and the package structure for LED 100 that provides of first embodiment of the invention basic identical; Said package structure for LED 200 and 300 and the difference of package structure for LED 100 be: in the said package structure for LED 200 and 300; A plurality of planes that faying face between insulating material 102 on the sidewall 12 and the metallic support 101 is connected for bending; So, can increase the area of the faying face between insulating material 102 and the metallic support 101, thereby increase the adhesion between insulating material 102 and the metallic support 101.
See also Fig. 4; The package structure for LED 300 that package structure for LED 400 and the third embodiment of the invention that fourth embodiment of the invention provides provides is basic identical; Said package structure for LED 400 is with the difference of package structure for LED 300: in the said package structure for LED 400, the metal reflective layer 13 that is positioned on the sidewall 12 also has part to be formed on the said insulating material 102.
See also Fig. 5; The package structure for LED 100 that package structure for LED 500 and the first embodiment of the invention that fifth embodiment of the invention provides provides is basic identical; Said package structure for LED 500 is with the difference of package structure for LED 100: in the said package structure for LED 500; Two metallic supports 101 do not extend on the sidewall 12; Said two metallic supports 101 all are positioned on the diapire 11, and said sidewall 12 is made up of insulating material 102 fully, and the metal reflective layer 13 on the said sidewall 12 is formed directly on the insulating material 102.In the present embodiment, the metal reflective layer 13 on the said sidewall 12 can be formed on through the mode of physical deposition or vacuum plating on the said insulating material 102.
The diapire 11 and the sidewall 12 of the reflector 10 of said package structure for LED all are formed with metal reflective layer 13 on the inner surface of accepting groove; With respect to prior art; The area of the metal reflective layer 13 in the said reflector 10 has increased; The reflectivity of entire emission cup 10 has improved, thereby can improve the light extraction efficiency of package structure for LED greatly.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the reflector of a package structure for LED; It is characterized in that; It comprises diapire and sidewall, and said diapire and sidewall surround an accepting groove that is used to accommodate light-emitting diode chip for backlight unit, and said diapire and side wall surface all are formed with the metal reflective layer on the inner surface of accepting groove.
2. the reflector of package structure for LED as claimed in claim 1 is characterized in that, said diapire comprises two metallic supports of electric separating, and the metal reflective layer on the said diapire is formed on said two metallic supports.
3. the reflector of package structure for LED as claimed in claim 2 is characterized in that, the metal reflective layer on the said diapire is formed on said two metallic supports through electric plating method.
4. the reflector of package structure for LED as claimed in claim 2 is characterized in that, said metallic support further extends on the said inside surface of side wall, and the metal reflective layer on the said sidewall is formed on the metallic support that is positioned at side wall inner surfaces.
5. the reflector of package structure for LED as claimed in claim 1 is characterized in that, the inside surface of side wall of said reflector is an insulating material, and the metal reflective layer on the said sidewall is formed on the said insulating material.
6. the reflector of package structure for LED as claimed in claim 5 is characterized in that, the metal reflective layer on the said sidewall is formed on the said insulating material through the mode of physical deposition or vacuum plating.
7. the reflector of package structure for LED as claimed in claim 6 is characterized in that, said insulating material is PPA.
8. the reflector of package structure for LED as claimed in claim 1 is characterized in that, said entire emission cup forms through injection moulding.
9. package structure for LED, it comprises like each described reflector of claim 1-8, is arranged at light-emitting diode chip for backlight unit on the inner surface of said diapire and the packaging body that is filled in covering luminousing diode chip in the said accepting groove.
10. package structure for LED as claimed in claim 9 is characterized in that, said light-emitting diode chip for backlight unit is attached at said two metallic supports on one of them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110359944.4A CN102569600B (en) | 2011-11-11 | 2011-11-11 | LED (light emitting diode) packaging structure and reflection cup thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110359944.4A CN102569600B (en) | 2011-11-11 | 2011-11-11 | LED (light emitting diode) packaging structure and reflection cup thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102569600A true CN102569600A (en) | 2012-07-11 |
| CN102569600B CN102569600B (en) | 2014-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110359944.4A Expired - Fee Related CN102569600B (en) | 2011-11-11 | 2011-11-11 | LED (light emitting diode) packaging structure and reflection cup thereof |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105164822A (en) * | 2013-02-07 | 2015-12-16 | 普因特工程有限公司 | Optical device and method for manufacturing same |
| CN105185893A (en) * | 2015-09-29 | 2015-12-23 | 广东长盈精密技术有限公司 | Light-emitting diode (LED) package structure |
| CN108899406A (en) * | 2018-07-02 | 2018-11-27 | 江西科技师范大学 | A kind of highly reliable large power ultraviolet LED integrated encapsulation method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040070338A1 (en) * | 2002-10-07 | 2004-04-15 | Citizen Electronics Co., Ltd. | White light emitting device |
| CN1612369A (en) * | 2003-10-30 | 2005-05-04 | 京瓷株式会社 | Light-emitting element reception package, light-emitting device and lighting device |
| CN1700481A (en) * | 2004-05-18 | 2005-11-23 | 亿光电子工业股份有限公司 | Packaging structure and method of LED |
| CN1971957A (en) * | 2005-11-22 | 2007-05-30 | 夏普株式会社 | Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof |
-
2011
- 2011-11-11 CN CN201110359944.4A patent/CN102569600B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040070338A1 (en) * | 2002-10-07 | 2004-04-15 | Citizen Electronics Co., Ltd. | White light emitting device |
| CN1612369A (en) * | 2003-10-30 | 2005-05-04 | 京瓷株式会社 | Light-emitting element reception package, light-emitting device and lighting device |
| CN1700481A (en) * | 2004-05-18 | 2005-11-23 | 亿光电子工业股份有限公司 | Packaging structure and method of LED |
| CN1971957A (en) * | 2005-11-22 | 2007-05-30 | 夏普株式会社 | Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105164822A (en) * | 2013-02-07 | 2015-12-16 | 普因特工程有限公司 | Optical device and method for manufacturing same |
| CN105185893A (en) * | 2015-09-29 | 2015-12-23 | 广东长盈精密技术有限公司 | Light-emitting diode (LED) package structure |
| CN105185893B (en) * | 2015-09-29 | 2018-02-06 | 东莞智昊光电科技有限公司 | LED encapsulation structure |
| CN108899406A (en) * | 2018-07-02 | 2018-11-27 | 江西科技师范大学 | A kind of highly reliable large power ultraviolet LED integrated encapsulation method |
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| Publication number | Publication date |
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| CN102569600B (en) | 2014-12-10 |
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Granted publication date: 20141210 Termination date: 20201111 |