CN202024287U - Packaging structure of airtight multilayered array light-emitting diode - Google Patents
Packaging structure of airtight multilayered array light-emitting diode Download PDFInfo
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- CN202024287U CN202024287U CN2010205851125U CN201020585112U CN202024287U CN 202024287 U CN202024287 U CN 202024287U CN 2010205851125 U CN2010205851125 U CN 2010205851125U CN 201020585112 U CN201020585112 U CN 201020585112U CN 202024287 U CN202024287 U CN 202024287U
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Abstract
The utility model discloses a packaging structure of an airtight multilayered array light-emitting diode, which mainly comprises a metal baseplate with an airtight metal frame body, the airtight metal frame body and the metal baseplate are integrally formed; an airtight sealing frame groove is formed at the top surface of the airtight metal frame body; two groups of sealing hole pairs are arranged at the airtight metal frame body in a penetrating way; lead frames can be arranged in the sealing hole pairs in a penetrating way; packaging materials or optical elements or the like can be arranged in the airtight metal frame body; the sealing holes are sealed by glass or ceramic materials; a silica gel layer is formed on a fluorescent layer; the fluorescent layer also can be arranged in a silica glass cover; the silica glass cover is placed on the top surface of the airtight metal frame body and is seamed with the sealing frame in a sealing way; the space between the silica glass cover and the fluorescent layer is filled with nitrogen; therefore, water and steam can be prevented from entering the airtight metal frame body and a grain protecting layer, and the closed LED packaging structure is formed; and the LED packaging structure is suitable for extreme or dangerous surroundings.
Description
Technical field
The utility model relates to a kind of encapsulating structure of multiple field array type light emitting diode, especially a kind ofly blocks fully that aqueous vapor enters, the encapsulating structure of a kind of high strength airproof multiple field array type light emitting diode of sturdy and durable and long term maintenance optical module usefulness.
Background technology
Press, the principle of luminosity of LED is to utilize the semiconductor inherent characteristic, the discharge of the incandescent lamp tube that it is different from the past, heating principle of luminosity, but just can emit beam when electric current forward flowed into semi-conductive PN and connect face, so LED is called as cold light source (cold light).Because LED has that high-durability, life-span are long, light and handy, power consumption is low and does not contain the advantage of harmful substance such as mercury etc., so can be widely used in the lighting apparatus industry, and it is applied in commercial fields such as electronic bill-board, traffic signals usually with the led array packaged type.
Seeing also notification number is the novel patent of TaiWan, China of M387375, it is the encapsulating structure about a kind of multiple field array type light emitting diode, consist predominantly of a metal substrate, one package module, one lead frame and a cover body, this metal substrate is located at the orlop of this encapsulating structure, this package module is in order to respectively with this metal substrate and this lead frame sealing and form one, the LED crystal particle and the metal substrate of the promising arrayed of installing are metal material on this metal substrate, light emitting diode and this lead frame also form to electrically connect, this cover body then cover cap among this package module.
Yet existing skill point is to be long-term used in water, the environment that moisture content is high, and as the deep-sea, the environment that space or military affairs etc. are dangerous, it is because each layer structure is not by sealed engagement positively in the encapsulating structure, so then cause air-tightness deterioration gradually, the inner moisture amount increases the weight of, cause each assembly of encapsulating structure to be separated from each other even to burn, therefore can't be used in wet environment, moreover also can cause structural strength also worse and worse, can predict the LED that has just set just must change between short-term again, if yet in rugged environment like this, often must carry out the maintenance and installation operation, not only take time and effort, more cause greatest threat to personal safety, therefore must be improved this, provide a kind of aqueous vapor that blocks fully to enter, and a kind of package structure for LED sturdy and durable and long term maintenance optical module usefulness.
The utility model content
Main purpose of the present utility model is to provide a kind of encapsulating structure of airproof multiple field array type light emitting diode, its bond strength height and air-tightness excellence, can be used in as humid environment such as marine, and metal substrate of the present utility model is with one-body molded, allow the bulk strength pleasure trip on foot to deal with in the various extreme environmental conditions, help to prolong the service life of optical module, and make the usefulness of optical module be difficult for degenerating.
For reaching above-mentioned purpose; concrete technological means of the present utility model comprises a metal substrate and two lead frames; be formed with an airtight metal framework on this metal substrate with an accommodation space; this accommodation space is perfused with a nitrogen; be formed with an airtight involution frame groove on this airtight framework end face; and the outer rim of this airtight metal framework end face has up vertically extended an involution framework; it is right that this airtight metal framework has provided two groups of involution holes in addition; and each lead frame by a plate and a guide rod to forming; the involution hole of each group is to supplying each guide rod to wearing; the medial extremity that this guide rod is right and this connecting plate are connected; the right outboard end of this guide rod then is connected to power supply; the space in each involution hole also utilizes an involution material to be sealed; be pasted with a plurality of LED crystal grain again on the bottom surface of this accommodation space; described LED intergranule engages for the phase routing and constitutes electric connection by a plurality of leads and this connecting plate; be formed with a crystal grain protective layer on the described LED crystal grain; be formed with a fluorescence coating again on this crystal grain protective layer; form a layer of silica gel on this fluorescence coating; this this fluorescence coating of layer of silica gel covering protection; wherein all get up with an involution material packing in right space, these two groups of involution holes; be placed with a silex glass cover on this airtight metal framework end face; this silex glass cover also engages sealing with this involution framework, and the space between this silex glass cover and this fluorescence coating is full of this nitrogen.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the encapsulating structure of airproof multiple field array type light emitting diode of the present utility model.
Fig. 2 is the generalized section of the encapsulating structure of airproof multiple field array type light emitting diode of the present utility model.
Fig. 3 is the generalized section of first embodiment of the present utility model.
Fig. 4 is the decomposing schematic representation of second embodiment of the present utility model.
Fig. 5 is the generalized section of second embodiment of the present utility model.
Fig. 6 is the generalized section of the 3rd embodiment of the present utility model.
The specific embodiment
Those skilled in the art below cooperate Figure of description that embodiment of the present utility model is done more detailed description, so that can implement after studying this specification carefully according to this.
The application of LED has now expanded every field to, comprised in the environment of deep-sea purposes, space applications, abominable industrial use or military use even, LED as desire to be used in above-mentioned high pressure, in the environment of mal-condition such as impulsive force is big, amount of moisture is big or variations in temperature is rapid, must promote the adaptation of encapsulating structure, in the hope of stable in above-mentioned environment and permanent running, multiple field array type light emitting diode provided by the utility model is a kind of multiple field array type light emitting diode of airproof encapsulating structure.
Consult Fig. 1,, consult Fig. 2, be the generalized section of the encapsulating structure of airproof multiple field array type light emitting diode of the present utility model for the three-dimensional exploded view of the encapsulating structure of airproof multiple field array type light emitting diode of the present utility model.The utility model is the encapsulating structure of relevant a kind of airproof multiple field array type light emitting diode, it includes a metal substrate 1, two lead frames 3, a plurality of LED (light emitting diode) crystal grain 5, be formed with an airtight metal framework 11 on this metal substrate 1 with an accommodation space 111, this metal substrate 1 is formed in one with this airtight metal framework 11, and has nitrogen 90 in the accommodation space 111 of this airtight metal framework 11, these airtight metal framework 11 inside can be packaged with a plurality of optical units, optical component or encapsulation are with material etc., wherein this metal substrate 1 can be made by metal casting (Casting) or machine die process technologies such as (Tooling), the material of this metal substrate 1 can be as aluminium, copper, copper alloy or other heat conductivity good metal material use fast and effeciently allowing thermal energy dissipation go out.
Can plate a reflective protective layer (drawing does not show) on the internal face of this airtight metal framework 11 again; use promoting it to reflectivity of light and to the crushing resistance of environment, the material of this reflective protective layer can be silver (Ag), nickel (Ni) or the metal material with good reflective.
This airtight metal framework 11 has provided two groups of involution holes to 13, these airtight metal framework 11 bottoms can be formed with a light output groove 15, the side wall surface of this light output groove 15 all is a reflective inclined-plane, the bottom surface of this reflective inclined-plane and this light output groove 15 has an angle of cut, but be noted that, though these two groups of involution holes are arranged in the two opposite side walls of this airtight metal framework 11 respectively to 13 in the present embodiment, but decide on actual needs 11 allocation position in the involution hole, at this only is the example of explanation usefulness, is not in order to limit scope of the present utility model.
Be formed with an airtight involution frame groove 17 on these airtight metal framework 11 end faces, and the outer rim at these airtight metal framework 11 end faces has up vertically extended an involution framework 19, wherein on the side wall surface of this light output groove 15 one first reflection shield 100 that has been sticked can be set further, this first reflection shield 100 is in order to reflect away its light that receives again, in this airtight metal framework 11 and can further be provided with second reflection shield 200 with reflective luffer boards 201, the outside of this second reflection shield 200 is affixed by the internal face of this airtight metal framework 11, reflective luffer boards 201 usefulness of this second reflection shield 200 so that its received light reflect away again.
Each lead frame 3 is made up of 33 an a plate 31 and a guide rod, the involution hole of each group wears 33 for each guide rod 13, this guide rod is connected to 33 medial extremity and this connecting plate 31, this guide rod then is connected to power supply to 33 outboard end, wherein all get up with an involution material 4 complete packings to 13 space in these two groups of involution holes, infiltrate in interior 13 through these two groups of involution holes to block moisture content, wherein this involution material 4 can be a glass, one pottery, one glass ceramics or other suitable material, this involution material 4 is filled out this involution hole of envelope to 13 under hot environment, can complete involution behind cooling curing and do not stay any pipeline that allows aqueous vapor be entered.
Described LED crystal grain 5 is attached on the bottom surface of this accommodation space 111, or described as shown in this embodiment LED crystal grain 5 also can be attached on the bottom surface of this light output groove 15, therefore when described LED crystal grain 5 is luminous, the light that sends can reflect away by first reflection shield 100 and second reflection shield 200 again, effectively increase luminous efficiency, described LED crystal grain 5 preferably disposes the arrangement mode that kenel is an array type, the phase routing engages and electrically connects to form a circuit by a plurality of leads 6 and connecting plate 31 formations between the wherein said LED crystal grain 5, and guide rod then is connected to power supply to 33 outboard end.
Then be formed with a crystal grain protective layer 7 on the described LED crystal grain 5; this crystal grain protective layer 7 coats described LED crystal grain 5 of protection and described lead 6; be formed with a fluorescence coating 8 on this crystal grain protective layer 7; the material of this fluorescence coating 8 is a phosphor or other suitable material; on this fluorescence coating 8 and be formed with a layer of silica gel 9; this layer of silica gel 9 is in order to protecting this fluorescence coating 8, and this layer of silica gel 9 is covered on this fluorescence coating 8 with injection molding method, and perhaps direct injection is on this crystal grain protective layer 7.
Airtight metal framework 11 end faces are provided with a silex glass cover 10, this silex glass cover 10 also engages with this involution framework 19, wherein can see through a laser beam juncture, heat-sealing juncture, a solder joints mode, a welding juncture or other suitable mode this silex glass cover 10 is bonded with each other with this involution framework 19, wherein this silex glass cover 10 can be one plane a, concave shape and a convex-shaped form at least one of them.
Since should be airtight accommodation spaces in metal framework 11 be perfused with nitrogen 90, so last only retention the in the space between this silex glass cover 10 and the layer of silica gel 9 have nitrogen 90, LED crystal grain 5 like this, this crystal grain protective layer 7 and fluorescence coating 8 all are sealed in the drying nitrogen 90.
The aqueous vapor of environment can't penetrate among the silex glass cover 10 and airtight metal framework of driving fit outside; and inner nitrogen with drying can be avoided temperature shock and generate aqueous vapor; therefore can prevent effectively that this fluorescence coating 8, crystal grain protective layer 7 and LED crystal grain 5 are because of aqueous vapor influence deterioration; therefore be applicable to as in the deep-sea or under the humidity industrial environment heavily; and this airtight metal framework 11 is formed in one with this metal substrate 1; this encapsulating structure intensity is more strengthened, also can be satisfied various as in the space or in the environment of military first-class high impact forces extremely high pressure.
Consult Fig. 3, be the generalized section of first embodiment of the present utility model.It consists predominantly of a metal substrate 500; one package module 600 and a lead frame 700; this package module 600 is in order to be packaged into one with this metal substrate 500 with this lead frame 700; the LED crystal grain 5 of the promising arrayed of installing on this metal substrate 500; LED crystal grain 5 is with this lead frame 700 and form electric connection; be formed with crystal grain protective layer 7 and fluorescence coating 8 on the described LED crystal grain 5 in regular turn; fluorescence coating 8 tops are formed with can protect fluorescence coating 8 to avoid the aqueous vapor influence and rotten layer of silica gel 9; wherein these package module 600 internal faces are provided with airtight involution frame groove 6001; be placed with silex glass cover 10 on package module 600 internal faces; this silex glass cover 10 also engages with this package module 600; layer of silica gel 9 is with silex glass cover 10 and be perfused with nitrogen 90; seeing through first embodiment can confirm; the utility model can be applicable on other encapsulating structure; help originally can't to prevent that encapsulating structure that aqueous vapor is infiltrated is transformed into can use under the humid environment of water; avoid the aqueous vapor influence and cause the rotten or assembly deterioration problem of short-circuit of material, and then each optical unit is operated efficiently.
Consult Fig. 4 to Fig. 6, in first embodiment of the present utility model, these two groups of involution holes are to 13 both sides that provide the base of these accommodation space 111 belows respectively, these two lead frames 3 mat guide rod separately respectively are arranged in these two groups of involution holes among 13 to 33 with vertical direction, these two groups of involution holes are shut to the space in 13 and with an involution material 4, as shown in Figure 6, wherein this fluorescence coating 8 also can directly default in this silex glass cover 10.
Be filled with nitrogen 90 in the encapsulating structure of the present utility model, so that inside keeps bone dry and prevents bubble or the generation of moisture, and in this encapsulating structure, it all forms the seal cavity of total closed type respectively at inside and outside layer, form a kind of fully airtight and have a high strength structure, so aqueous vapor can't be invaded, and is durable in use and make optical module can bring into play its best efficiency, is highly suitable under the harsh environmental condition.
The above only is in order to explain preferred embodiment of the present utility model; be not that attempt is done any pro forma restriction to the utility model according to this; therefore; all have in that identical creation spirit is following do relevant any modification of the present utility model or change, all must be included in the category of the utility model intention protection.
Claims (11)
1. the encapsulating structure of an airproof multiple field array type light emitting diode; it is characterized in that; at least comprise a metal substrate and two lead frames; be formed with an airtight metal framework on this metal substrate with an accommodation space; has a nitrogen in this accommodation space; be formed with an airtight involution frame groove on this airtight framework end face; and the outer rim of this airtight metal framework end face has up vertically extended an involution framework; it is right that this airtight metal framework has provided two groups of involution holes in addition; and each lead frame by a plate and a guide rod to forming; the involution hole of each group is to supplying each guide rod to wearing; the medial extremity that this guide rod is right and this connecting plate are connected; the right outboard end of this guide rod then is connected to power supply; be pasted with a plurality of LED crystal grain again on the bottom surface of this accommodation space; described LED intergranule engages for the phase routing and constitutes electric connection by a plurality of leads and this connecting plate; be formed with a crystal grain protective layer on the described LED crystal grain; be formed with a fluorescence coating again on this crystal grain protective layer; form a layer of silica gel on this fluorescence coating; this this fluorescence coating of layer of silica gel covering protection; wherein all get up with an involution material packing in right space, these two groups of involution holes; be placed with a silex glass cover on this airtight metal framework end face; this silex glass cover also engages sealing with this involution framework, and wherein the space between this silex glass cover and this fluorescence coating is full of this nitrogen.
2. the encapsulating structure of airproof multiple field array type light emitting diode as claimed in claim 1 is characterized in that, this metal substrate is formed in one with this airtight metal framework.
3. the encapsulating structure of airproof multiple field array type light emitting diode as claimed in claim 1 is characterized in that the material of this metal substrate is aluminium, copper or copper alloy.
4. the encapsulating structure of airproof multiple field array type light emitting diode as claimed in claim 1 is characterized in that, further plates a reflective protective layer on the internal face of this airtight metal framework, and the material of this reflective protective layer is silver or nickel.
5. the encapsulating structure of airproof multiple field array type light emitting diode as claimed in claim 1 is characterized in that this involution material is glass, pottery or glass ceramics.
6. the encapsulating structure of airproof multiple field array type light emitting diode as claimed in claim 1, it is characterized in that, this airtight metal framework bottom is formed with a light output groove, described LED crystal grain is attached on the bottom surface of this light output groove, and further is provided with one first reflection shield on the side wall surface of this light output groove.
7. the encapsulating structure of airproof multiple field array type light emitting diode as claimed in claim 1, it is characterized in that, further be provided with second reflection shield with reflective luffer boards in this airtight metal framework, the outside of this second reflection shield is affixed by the internal face of this airtight metal framework, and the reflective luffer boards of this second reflection shield reflect away in order to make its received light again.
8. the encapsulating structure of airproof multiple field array type light emitting diode as claimed in claim 1 is characterized in that, that this silex glass cover is is plane, the form of concave shape and a convex-shaped at least one of them.
9. the encapsulating structure of airproof multiple field array type light emitting diode as claimed in claim 1, it is characterized in that, see through a laser beam juncture, heat-sealing juncture, a solder joints mode or a welding juncture at least one of them so that this silex glass cover and this involution framework be bonded with each other.
10. the encapsulating structure of airproof multiple field array type light emitting diode as claimed in claim 1 is characterized in that this fluorescence coating directly defaults in this silex glass cover.
11. the encapsulating structure of airproof multiple field array type light emitting diode as claimed in claim 1 is characterized in that the material of this fluorescence coating is a phosphor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205851125U CN202024287U (en) | 2010-11-01 | 2010-11-01 | Packaging structure of airtight multilayered array light-emitting diode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205851125U CN202024287U (en) | 2010-11-01 | 2010-11-01 | Packaging structure of airtight multilayered array light-emitting diode |
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| CN202024287U true CN202024287U (en) | 2011-11-02 |
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| CN2010205851125U Expired - Fee Related CN202024287U (en) | 2010-11-01 | 2010-11-01 | Packaging structure of airtight multilayered array light-emitting diode |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103423609A (en) * | 2012-05-15 | 2013-12-04 | 盈胜科技股份有限公司 | Production method of integrated multilayer lighting set |
| CN105355339A (en) * | 2015-10-23 | 2016-02-24 | 中国电子科技集团公司第五十五研究所 | Ceramic insulator |
| CN109545945A (en) * | 2018-11-28 | 2019-03-29 | 上海应用技术大学 | A kind of preparation method of white light LEDs interlayer fluorescent glass |
| TWI798104B (en) * | 2022-06-08 | 2023-04-01 | 隆達電子股份有限公司 | Light source module |
-
2010
- 2010-11-01 CN CN2010205851125U patent/CN202024287U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103423609A (en) * | 2012-05-15 | 2013-12-04 | 盈胜科技股份有限公司 | Production method of integrated multilayer lighting set |
| CN105355339A (en) * | 2015-10-23 | 2016-02-24 | 中国电子科技集团公司第五十五研究所 | Ceramic insulator |
| CN109545945A (en) * | 2018-11-28 | 2019-03-29 | 上海应用技术大学 | A kind of preparation method of white light LEDs interlayer fluorescent glass |
| TWI798104B (en) * | 2022-06-08 | 2023-04-01 | 隆達電子股份有限公司 | Light source module |
| US12038156B2 (en) | 2022-06-08 | 2024-07-16 | Lextar Electronics Corporation | Light source module |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YINGSHENG PHOTOELECTRIC TECHNOLOGY (SHANGHAI) CO., Free format text: FORMER OWNER: YINGSHENG TECHNOLOGY CO.,LTD. Effective date: 20141211 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 200438 YANGPU, SHANGHAI |
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| TR01 | Transfer of patent right |
Effective date of registration: 20141211 Address after: 200438 Shanghai city Yangpu District Hengren Road No. 350 Building 1 room 110-4 Patentee after: Ying Guang photoelectric technology (Shanghai) Co., Ltd. Address before: Hsinchu County, Taiwan, China Patentee before: Ying Sheng Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111102 Termination date: 20181101 |
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| CF01 | Termination of patent right due to non-payment of annual fee |