CN103579210A - Connection method of LED unit and heat dissipation substrate - Google Patents
Connection method of LED unit and heat dissipation substrate Download PDFInfo
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- CN103579210A CN103579210A CN201210267079.5A CN201210267079A CN103579210A CN 103579210 A CN103579210 A CN 103579210A CN 201210267079 A CN201210267079 A CN 201210267079A CN 103579210 A CN103579210 A CN 103579210A
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- pattern area
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- tube core
- led tube
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The invention relates to the technology of semiconductor lighting, in particular to a connection method of an LED unit and a heat dissipation substrate, an LED light-emitting module based on the method, and a method for manufacturing the LED light-emitting module. According to the embodiment of the invention, the LED light-emitting module comprises a metal supporting plate (110) which comprises a plurality of pattern areas (111, 112, 113 and 114) which are not communicated with one another, at least one LED pipe core (120A, or 120B or 120C) which comprise electrodes arranged at the bottoms of the LED pipe cores and located on different pattern areas, and a frame (130) made of insulation materials. The electrodes are connected to one of the different pattern areas, and the frame (130) and the pattern areas are fixed together.
Description
Technical field
the present invention relates to semiconductor lighting technology, the particularly method of attachment of light-emitting diode (LED) unit and heat-radiating substrate, the LED light emitting module based on the method and the method for manufacturing this LED light emitting module.
Background technology
the light-emitting diode (LED) that is used as at present light source in lighting device is a kind of solid-state semiconductor device, and its basic structure generally comprises the support of band lead-in wire, the encapsulating material (for example silica gel or epoxy resin) that is arranged on the semiconductor wafer on support and this wafer surrounding is sealed.Above-mentioned semiconductor wafer includes P-N structure, and when electric current passes through, electronics is pushed to electronics in ， P district, P district and, with hole-recombination, then with the form of photon, sends energy, and light wavelength is to be determined by the material that forms P-N structure.Compare with conventional light source, LED light source has the not available series of advantages of other light source, such as pollution-free, the life-span is long, energy consumption is low, vibration resistance, control convenient and be convenient to light modulation etc.
feature be at the high heat of minimum volume generation, and the thermal capacity of himself is very little, therefore must the heat of generation be sent out with fast as far as possible speed, otherwise will cause junction temperature to raise, and affects performance and the life-span of LED.For great power LED, heat dissipation problem is particularly outstanding.Can say, heat dissipation problem has become the technical bottleneck of current semiconductor lighting technical development.For this reason, industry is each aspect from chip, circuit board to system, has proposed various optimal design, to obtain best radiating effect for heat dissipation problem.
with regard to chip level, generally can improve heat-sinking capability by increasing chip size and changing material structure.For example, in order to improve the heat radiation of substrate, company of section sharp (Cree) adopts silicon carbide substrates, and its heat conductivility is higher nearly 20 times than sapphire.
in circuit board aspect, in current many LED light fixtures, all adopt aluminium base as printed circuit board (PCB), this substrate is sandwich construction, and intermediate layer is used has the insulating layer material of high thermal conductivity, thereby makes the heat energy of LED chip see through the aluminium sheet rapid diffusion of lower floor and pass.
for system level, conventional heat radiation strategy is to be LED light fixture configuration radiating subassembly (for example fin, heat pipe, temperature-uniforming plate, loop hot-pipe and piezoelectric fan), thereby is dispersed in surrounding environment rapidly by its heat that heat-sinking capability produces LED fast.
therefore the caloric requirement that LED chip produces could finally be delivered in environment and go through multiple interface (such as the interface between the interface between the interface between wafer and support, packaged chip and circuit board and circuit board and radiating subassembly etc.).Therefore how to reduce thermal resistance, it is very important problem in LED lighting device heat dissipation design that heat can be transmitted efficiently.
Summary of the invention
the object of this invention is to provide a kind of LED luminous module, it has advantages of the good and low cost of manufacture of radiating effect.
above-mentioned purpose of the present invention can realize by following technical proposal:
(LED) light emitting module, comprising:
metal support plate, it comprises a plurality of mutual disconnected pattern area;
at least one LED tube core, it comprises the electrode bottom being formed at and is arranged in different described pattern area, and wherein, described electrode is connected respectively in one of them of different pattern area; And
the framework of being made by insulating material, itself and described pattern area are fixed together.
preferably, in the LED light emitting module according to one embodiment of the invention, by flip chip technique, described LED tube core is arranged in different pattern area.
preferably, in the LED light emitting module according to one embodiment of the invention, at least two regions that comprise as the pin of described LED light emitting module in described pattern area.
preferably, in the LED light emitting module according to one embodiment of the invention, the quantity of described LED tube core is at least two, and they are realized and be connected in series, be connected in parallel or series-parallel connection connection by described pattern area.
preferably, in the LED light emitting module according to one embodiment of the invention, described framework surrounds described LED tube core.
preferably, in the LED light emitting module according to one embodiment of the invention, on described LED tube core, cover the transparent silica gel that is mixed with fluorescent material.
preferably, in the LED light emitting module according to one embodiment of the invention, on described LED tube core, cover successively fluorescent material and transparent silica gel.
of the present invention also have an object to be to provide a kind of method of manufacturing above-mentioned LED luminous module, and it has advantages of low cost of manufacture.
above-mentioned purpose of the present invention can realize by following technical proposal:
a method of manufacturing above-mentioned LED light emitting module, comprises the following steps:
lED support is provided, it comprises metal form and a plurality of framework of being made by insulating material, described metal form comprises public area and a plurality of pattern unit, and wherein, described in each, pattern unit is fixed together with framework described in one of them and comprises the pattern area that a plurality of and described public area is connected;
for pattern unit described in each, a plurality of LED tube cores are arranged in different pattern area, wherein, the electrode that is positioned at described LED die bottom is connected respectively in one of them of different pattern area; And
pattern unit described in each is cut down from described public area, so that described pattern area is not communicated with mutually.
preferably, according to the method for one embodiment of the invention, by flip chip technique, described LED tube core is arranged in different pattern area.
preferably, according to the method for one embodiment of the invention, by noting compression technology, pattern unit described in each and described framework are fixed together.
preferably, in according to the method for one embodiment of the invention, between the step that a plurality of LED tube cores is arranged on to the step in different pattern area and pattern unit described in each is cut down from described public area, further comprise the following steps: to cover the transparent silica gel that is mixed with fluorescent material on described LED tube core.
preferably, in according to the method for one embodiment of the invention, between the step that a plurality of LED tube cores is arranged on to the step in different pattern area and pattern unit described in each is cut down from described public area, further comprise the following steps: to cover successively fluorescent material and transparent silica gel on described LED tube core.
of the present invention also have an object to be to provide a kind of method that light-emitting diode is set on insulating heat-conductive substrate, and it has advantages of that radiating effect is good and it is low to realize cost.
above-mentioned purpose of the present invention can realize by following technical proposal:
the method that light-emitting diode (LED) is set on insulating heat-conductive substrate, comprises the following steps:
lED light emitting module is provided, this LED module comprises the framework of being made by insulating material, a plurality of mutual disconnected metal pattern area and at least one LED tube core, described metal pattern area and described framework are fixed together, described LED tube core is arranged on different metal pattern area, wherein, the electrode that is positioned at described LED die bottom is connected respectively in one of them of different metal pattern area, and at least two regions that comprise as the external pin of described LED tube core in described metal pattern area; And
described metal pattern area is fixed on to the surface of described insulating heat-conductive substrate, wherein, described insulating heat-conductive substrate surface is formed with the wiring layer being electrically connected with the described region that is used as the external pin of LED tube core.
preferably, according to the method for one embodiment of the invention, by electric slurry, described metal pattern area is fixed on to the surface of described insulating heat-conductive substrate.
above-mentioned purpose of the present invention also can realize by following technical proposal:
the method that light-emitting diode (LED) is set on nonisulated heat-radiating substrate, comprises the following steps:
lED light emitting module is provided, this LED light emitting module comprises framework, at least one pair of first metal pattern area, the second metal pattern area and at least one LED tube core, described the first and second metal pattern area are not communicated with mutually and are fixed together with described framework, wherein, described the first metal pattern area is as electrode district, described LED tube core is arranged on described the second metal pattern area, and by lead-in wire, described LED tube core and described the first metal pattern area is electrically connected together; And
described the second metal pattern area is welded on to the surface of described nonisulated heat-radiating substrate, and makes described the first metal pattern area be positioned at inside or the top of the through hole on described nonisulated heat-radiating substrate.
preferably, according to the method for one embodiment of the invention, when described LED tube core and described the first metal pattern area being electrically connected together by lead-in wire, also by going between, described LED tube core is linked together.
preferably, according to the method for one embodiment of the invention, described nonisulated heat-radiating substrate consists of metal or electric uninsulated heat-conducting plastic.
preferably, according to the method for one embodiment of the invention, described nonisulated heat-radiating substrate surface-coated infrared radiant material.
preferably, according to the method for one embodiment of the invention, by noting compression technology, described the first and second metal pattern area and described framework are fixed together.
Accompanying drawing explanation
above-mentioned and/or other side of the present invention and advantage become the description of the various aspects by below in conjunction with accompanying drawing more clear and are easier to understand, and in accompanying drawing, same or analogous unit adopts identical label to represent, accompanying drawing comprises:
fig. 1 is the schematic diagram of light-emitting diode (LED) light emitting module according to one embodiment of the invention.
fig. 2 is according to the schematic diagram of the method that LED light emitting module is installed on heat-radiating substrate of one embodiment of the invention.
fig. 3 is according to the flow chart of the manufacture LED light emitting module of one embodiment of the invention.
fig. 4 A-4C is the schematic diagram of the manufacture method of LED light emitting module shown in Fig. 3.
fig. 5 A and 5B are the schematic diagram of light-emitting diode (LED) light emitting module according to another embodiment of the present invention, and wherein, Fig. 5 A is the vertical view of LED light emitting module, and Fig. 5 B is the floor map of the metal support plate in Fig. 5 A.
fig. 6 is the schematic diagram of light-emitting diode (LED) light emitting module according to another embodiment of the present invention.
fig. 7 is for also having the schematic diagram of the method that LED light emitting module is installed on heat-radiating substrate of an embodiment according to the present invention.
reference list:
10 LED light emitting modules
110 metal support plates
111,112,113,114 pattern area
111A, 114A pin
120A, 120B, 120C LED core
130 frameworks
20 heat-radiating substrates
210 wirings
30 LED support templates
40 metal forms
410 pattern units
411,412,413,414 pattern area
420 public areas
421 frames
422 bonding pads
50 LED light emitting modules
510 metal support plates
511,512,513,514 pattern area
520A, 520B, 520C LED tube core
530 frameworks
60 LED light emitting modules
610 metal support plates
620 LED tube cores
630 frameworks
611,612 first pattern area
613 second pattern area
611A, 612A pin
640 lead-in wires
70 heat-radiating substrates of being made by the heat-conducting plastic of metal or non-electric insulation
710A, 710B through hole.
Embodiment
below with reference to the accompanying drawing that wherein illustrates illustrative examples of the present invention, the present invention is described more all sidedly.But the present invention can realize by multi-form, and should not be read as each embodiment that only limits to provide herein.The various embodiments described above that provide are intended to make disclosure herein comprehensively complete, convey to more all sidedly those skilled in the art's protection scope of the present invention.
in this manual, unless stated otherwise, term " semiconductor crystal wafer " refers at the upper a plurality of independently single circuit that form of semi-conducting material (such as silicon, GaAs etc.), " semiconductor wafer " or " wafer (die) " refers to this single circuit, and " packaged chip " refers to the physical structure of semiconductor wafer after encapsulation, in typical this physical structure, semiconductor wafer is for example installed on support and with encapsulant and encapsulates.
term " light emitting diode " refers to the unit that comprises electroluminescent material, and the example of this unit includes but not limited to P-N knot inorganic semiconductor light-emitting diode and Organic Light Emitting Diode (OLED and polymer LED (PLED)).
knot inorganic semiconductor light-emitting diode can have different version, for example, include but not limited to LED core and light-emitting diode monomer.Wherein, " LED core " refers to and includes semiconductor wafer P-N structure, that have electroluminescence ability, and " light-emitting diode monomer " refers to the physical structure forming after die package, in typical this physical structure, tube core is for example installed on support and with encapsulant and encapsulates.
term " wiring ", " wiring pattern " and " wiring layer " refer to the conductive pattern for being electrically connected between components and parts of arranging on insulating surface, include but not limited to cabling (trace) and hole (as pad, component hole, fastener hole and plated-through hole etc.).
term " thermal radiation " refer to object owing to thering is temperature the phenomenon of radiated electromagnetic wave.
term " heat conduction " refers to heat and in solid, from the higher part of temperature, is sent to the transfer mode of the part that temperature is lower.
term " ceramic material " general reference needs the non-metal inorganic material of high-temperature process or densification, includes but not limited to silicate, oxide, carbide, nitride, sulfide, boride etc.
term " Insulating Thermal Conductive Polymer Composites " refers to such macromolecular material, by filling metal or inorganic filler portion's formation within it heat conduction network chain of high-termal conductivity, thereby possesses high conductive coefficient.Insulating Thermal Conductive Polymer Composites is such as including but not limited to add the polypropylene material of aluminium oxide, the Merlon that adds aluminium oxide, carborundum and bismuth oxide and acrylonitrile-butadiene-styrene terpolymer etc.The specific descriptions of relevant Insulating Thermal Conductive Polymer Composites can be referring to the people's such as Li Li paper " research of Merlon and polycarbonate alloy insulating heat-conductive macromolecular material " (< < material heat treatment journal > > in August, 2007, Vol. 28, No.4, pp51-54) and the people's such as Li Bing paper " application of aluminium oxide in Insulating Thermal Conductive Polymer Composites " (< < plastic additive > > the 3rd phase in 2008, pp14-16), the mode that these documents are quoted in full comprises in this manual.
term " infrared radiant material " refers to and in engineering, can absorb heat and launch a large amount of ultrared materials, and it has higher emissivity.Further, can adopt in an embodiment of the present invention graphite or normal temperature infrared ceramic radiation material as covering the infrared radiant material of spreader surface or the infrared radiant material of formation radiator.Normal temperature infrared ceramic radiation material for example includes but not limited at least one in following material: magnesium oxide, aluminium oxide, calcium oxide, titanium oxide, silica, chromium oxide, iron oxide, manganese oxide, zirconia, barium monoxide, cordierite, mullite, boron carbide, carborundum, titanium carbide, molybdenum carbide, tungsten carbide, zirconium carbide, ramet, boron nitride, aluminium nitride, silicon nitride, zirconium nitride, titanium nitride, titanium silicide, molybdenum silicide, tungsten silicide, titanium boride, zirconium boride and chromium boride.About the detailed description of normal temperature infrared ceramic radiation material can be referring to the people's such as Li Hong great waves and Liu Jianxue paper " present Research of high efficiency infrared radiation ceramic and application " (< < modern technologies pottery > > the 2nd phase in 2005 (total the 104th phase), pp24-26) and Wang Qian equality people's paper " progress of high radiated infrared ceramic material and application " (< < pottery journal > > the 3rd phase in 2011), the mode that these documents are quoted in full comprises in this manual.
in the present invention, reasonable is using transfers between divisions as one of them Consideration of selecting infrared radiant material: for example, below the P-N junction temperature of the light emitting diode of setting (50-80 degree Celsius within the scope of a temperature value), infrared radiant material still has higher emissivity (being for example more than or equal to 70%).
term " metal " refers to the material with electropositive element, and two or more are with the mixture of the material of electropositive element.
" electrical connection " should be understood to be included in the situation that directly transmits electric flux or the signal of telecommunication between two unit, or through one or more Unit the 3rd, indirectly transmits the situation of electric flux or the signal of telecommunication.
term such as " comprising " and " comprising " represent except have in specification and claims, have directly and the unit and step of clearly statement, technical scheme of the present invention is not got rid of yet and is had not by directly or other unit of clearly explaining and the situation of step.
term such as " first ", " second ", " the 3rd " and " the 4th " does not represent that unit is to be only used as to distinguish each unit in the order of the aspects such as time, space, size.
in order to improve radiating effect, LED unit and heat-radiating substrate can link together by following manner: first prepare heat-radiating substrate (for example being made by the insulating heat-conduction material such as pottery and Insulating Thermal Conductive Polymer Composites), then utilize eutectic or cover brilliant technique LED tube core is arranged on heat-radiating substrate.When by LED tube core with heat-radiating substrate with eutectic or when covering brilliant mode and being connected, owing to having reduced hot interface, therefore increased substantially radiating efficiency.
but it is to be noted, the connected mode of above-mentioned LED unit and heat-radiating substrate requires very high for the wiring precision of heat-radiating substrate and the evenness on circuit surface, this make thick film and low-temperature co-fired ceramic substrate because precision be subject to technique half tone throw the net problem and sintering shrinkage ratio problems impact and be difficult to use.
according to one embodiment of the present of invention, in order to address the above problem, consider to adopt metal support plate as the transition medium between LED tube core and heat-radiating substrate.Particularly, first LED tube core is set on metal support plate to form LED light emitting module, wherein, metal support plate is designed to have certain pattern, and it comprises a plurality of mutual disconnected pattern area, and LED tube core is arranged in pattern area.In these pattern area, some is as the bearing area of LED tube core, and other pattern area can be specially as the electrode district (being called below " pin ") of LED light emitting module or also double as the bearing area of LED tube core simultaneously.For example by the mode of welding, LED light emitting module is fixed on to the assigned address of heat-radiating substrate subsequently, and makes pin and the electrical connection of the wiring layer on heat-radiating substrate on metal support plate, realized thus machinery and the electrical connection of LED tube core and heat-radiating substrate.For example, because metal (copper or aluminium) and LED tube core and heat-radiating substrate all have good binding ability, and between metal support plate and heat-radiating substrate for face contacts, so reduced when LED unit is set the wiring precision of heat-radiating substrate and the requirement of evenness.
in the above-described embodiments, the setting example of LED tube core on metal support plate is as realized by COB packaging technology.Particularly, can first LED tube core be fixed on to the pattern area of metal support plate by eutectic solder technology, then for example by lead key closing process realize interconnection between LED tube core and with being connected of the first pattern area as electrode district.Finally with encapsulant, thereby LED tube core and lead-in wire are encapsulated to formation LED light emitting module.Alternatively, when the P of LED tube core type electrode and N-type electrode are all positioned at the lower surface of tube core, also can LED tube core be arranged on metal support plate by flip chip technique.
according to an alternative embodiment of the invention, when heat-radiating substrate for example, consists of the electric conducting material of metal or electric uninsulated heat-conducting plastic (the Stanyl TC 501 type heat-conducting plastics of being produced by dutch royal DSM group) and so on, also adopt metal support plate as the transition medium between LED tube core and heat-radiating substrate.Particularly, first LED tube core is set on the metal support plate that comprises a plurality of mutual disconnected pattern area to form LED light emitting module.In these pattern area, some is as the bearing area of LED tube core, other pattern area can be specially as the electrode district of LED light emitting module.For example the mode by welding is welded on the pattern area that is not used as electrode district on heat-radiating substrate subsequently, and makes pattern area as electrode district be positioned the inside of the through hole on heat dissipation metal substrate or top with the electrical connection with external circuit.Because metal support plate and LED tube core and heat dissipation metal substrate all have good binding ability, and between metal support plate and heat dissipation metal substrate for face contacts, therefore reduced when LED unit is set the wiring precision of heat-radiating substrate and the requirement of evenness.
fig. 1 is the schematic diagram of light-emitting diode (LED) light emitting module according to one embodiment of the invention.
as shown in Figure 1, LED light emitting module 10 comprises metal support plate 110, a plurality of LED tube core 120A-120C and framework 130.Metal support plate 110 comprises pattern area 111,112,113 and 114, and wherein, pattern area 111 and 114 comprises respectively the region 111A of an elongation and the pair of pins that 114A is electrically connected to be used as LED light emitting module and external circuit.In the present embodiment, between pattern area 111-114, be not communicated with mutually, they are for example fixed together with the framework 130 of for example, being made by insulating material (plastics) by noting compression technology, thereby make their relative position relation keep fixing.P type electrode and the N-type electrode of LED tube core 120A-120C are all arranged on lower surface, and as shown in Figure 1, each LED tube core is separately positioned in a pair of adjacent pattern area.Particularly, LED tube core 120A is positioned in pattern area 111 and pattern area 112 simultaneously, and its P type electrode and N-type electrode are respectively welded to pattern area 111 and pattern area 112.Similarly, LED tube core 120B is positioned on pattern area 112 and 113 simultaneously, and its P type electrode and N-type electrode are welded to respectively pattern area 112 and 113.LED tube core 120C is positioned in pattern area 113 and pattern area 114 simultaneously, and its P type electrode and N-type electrode are welded to respectively pattern area 113 and pattern area 114.Thus, LED tube core is without being connected in series between pin 111A and 114A by lead-in wire.
due to the good heat conductivility of metal, the thermal resistance between LED tube core and pattern area is close to zero, so the heat that the former produces can pass to light emitting module 10 heat-radiating substrate below efficiently.In addition, in the present embodiment, when LED tube core is set on metal support plate, can complete the electrical connection of LED tube core, therefore simplify manufacture craft.Preferably, can utilize flip chip technique to complete setting and the electrical connection of LED tube core on metal support plate.
when the emission wavelength of LED tube core and the illuminating ray color of actual needs have deviation, can utilize the luminescence generated by light effect of fluorescent material to realize the change of wavelength.Particularly, can for example, with the silica gel of mixed fluorescent powder (yttrium-aluminium-garnet (YAG) fluorescent material), cover or surround LED tube core.Alternatively, can be first at the surface-coated fluorescent material of each LED tube core, and then cover or wrap independent LED tube core or with silica gel, cover the whole region being surrounded by framework 130 with silica gel.As shown in Figure 1, due to the setting of framework 130, mobile being restricted of silica gel and be only distributed in LED tube core around.
it is pointed out that in the present embodiment, the connected mode between LED tube core is not limited to being connected in series shown in Fig. 1, and it also can adopt other type of attachment such as parallel connection or crossed array.For example can save pattern area 112 in Fig. 1 and 113 and LED tube core 120A-120C is arranged on to pattern area 111 and pattern area 114 simultaneously, the P type electrode of each LED tube core and N-type electrode are respectively welded to pattern area 111 and pattern area 114, have realized thus being connected in parallel between LED tube core.Moreover it is example that the present embodiment be take a plurality of LED tube cores, is also feasible yet adopt single led tube core as light-emitting component.
fig. 2 is according to the schematic diagram of the method that LED light emitting module is installed on heat-radiating substrate of one embodiment of the invention.In the present embodiment, the LED light emitting module shown in Fig. 1 of take is described the method for attachment of LED unit and heat-radiating substrate as example, and heat-radiating substrate is made by the heat-conducting insulation material such as pottery.But will recognize that, method described herein is also suitable for for the LED light emitting module of other structure.
visible in conjunction with Fig. 1 and 2; pin 111A and the 114A of LED light emitting module 10; they from framework 130 extend out and with lip-deep wiring 210 electrical connection of substrate 20, and connect up, 210 can be connected to the (not shown)s such as electrostatic discharge protective circuit, drive circuit and control and compensation circuit that are integrated on substrate 20.
for LED light emitting module 10 is arranged on substrate 20, the pattern can be first for example, forming at the surface printing electric slurry (copper slurry or silver slurry) of substrate 20, this pattern is corresponding to wiring 210 and the region (being called again below contact zone) that contacts with pattern area 111-114.Then by high temperature sintering, at substrate surface, form wiring 210 and contact zone.Finally the pattern area 111-114 of metal support plate 110 is fixed to the contact zone on substrate 20 surfaces by the mode of heat fused.In the present embodiment, metal support plate 110 can adopt the materials such as copper, aluminium and alloy thereof to make, and preferably, forms metal or alloy layer that one deck fusing point is lower to be conducive to heat fused on the surface that can contact with substrate 20 at pattern area 111-114.
fig. 3 is according to the flow chart of the manufacture LED light emitting module of one embodiment of the invention.Fig. 4 A-4C is the schematic diagram of the manufacturing process of LED light emitting module shown in Fig. 3.The manufacture method of the present embodiment be take the LED light emitting module shown in Fig. 1 and is described as example.
in step S310, first make or provide LED support template.Fig. 4 A is the schematic diagram of an exemplary LED support.LED support template 30 shown in Fig. 4 A comprises metal form and a plurality of framework 130.
fig. 4 B is the schematic diagram of the metal form in LED support template shown in Fig. 4 A.Referring to Fig. 4 B, this metal form 40 comprises a plurality of pattern units 410 and the public area 420 being connected with pattern unit 410 of arranging according to matrix form.In the present embodiment, each pattern unit 410 comprises pattern area 411-414, wherein, pattern area 411 and 414 thinks that by electrode district or pin as LED light emitting module LED tube core provides and outside electric interfaces, and pattern area 412 and 413 is between pattern area 411 and 414.Public area 420 comprises frame 421 and a plurality of bonding pad 422, wherein, frame 421 surrounds pattern unit 410 wherein, the two ends of each bonding pad 422 are connected to frame 421, middle part comprises a plurality of edges perpendicular to the long and narrow region of direction extension longitudinally, the pattern area 411 and 414 of these long and narrow regions and pattern unit 410 is joined, thereby two adjacent row pattern units are linked together indirectly by bonding pad 422.Meanwhile, the pattern area 412 that is positioned at two adjacent patterns unit of same a line links together or is connected to frame 421, and the pattern area 413 that is positioned at two adjacent patterns unit of same a line also links together or is connected to frame frame 421.In the metal form shown in Fig. 4 B, the pattern area 411-414 of each pattern unit 410 is disconnected mutually, that is to say, the two does not directly link together.But because pattern area 411-414 is connected with public area 420, so their relative position is fixed.
in the embodiment shown in fig. 1, P type electrode and the N-type electrode of LED tube core are all positioned at lower surface, and each LED tube core is separately positioned in a pair of adjacent pattern area.For this reason, in step S420, for each pattern unit 410, for example can be by flip chip technique, by LED tube core 120A-120C with layout setting as shown in Figure 1 in adjacent pattern area, each LED tube core is fixed in adjacent pattern area, and wherein, P type electrode and N-type electrode are welded on respectively in adjacent pattern area.
then enter step S330, to the interior injection transparent silica gel of framework 130 so that LED tube core 120A-120C is encapsulated, thereby complete the making of LED light emitting module.In order to change the color of the light that LED light emitting module sends, in the present embodiment, the transparent silica gel mixed fluorescent powder that can inject.But in order to save the consumption of fluorescent material, in step S330, can first cover fluorescent material on each LED tube core, and then to the interior injection transparent silica gel of framework 130.
subsequently, in step S340, the chain-dotted line in Fig. 4 B cuts metal form 40, so that pattern unit 410 is separated with public area 420, thereby obtains LED light emitting module.Fig. 4 C is the schematic diagram of one of them LED light emitting module of cutting down.In this LED light emitting module, pattern area 411-414 is not communicated with mutually, but because pattern area is all fixed together with framework 130, so their relative position is fixed.Owing to injecting transparent silica gel, so the internal structure of not shown LED light emitting module in Fig. 4 C.
in the present embodiment, due to being connected all without realizing by lead-in wire of the interconnection between LED tube core and they and pattern area, therefore can saving Bonding step, thereby reduce manufacturing cost.
fig. 5 A and 5B are the schematic diagram of light-emitting diode (LED) light emitting module according to another embodiment of the present invention, and wherein, Fig. 5 A is the vertical view of LED light emitting module, and Fig. 5 B is the floor map of the metal support plate in Fig. 5 A.Compare by the embodiment described in Fig. 1 with above-mentioned, the main difference part of the present embodiment is the pattern form of metal support plate, below this is further described.For other side, the present embodiment can adopt the various features of previous embodiment, therefore no longer describes in detail.
lED light emitting module 50 shown in Fig. 5 A also comprises metal support plate 510, a plurality of LED tube core 520A-520C and framework 530.Metal support plate 510 comprises mutual disconnected pattern area 511,512,513 and 514, as shown in Figure 5 B, metal pattern area is according to the arranged in form of 2 * 2 matrixes, wherein, pattern area 511 and 514 pair of pins as LED light emitting module and external circuit electrical connection, pattern area 512 and 513 is as bridge areas as there.The P type electrode of LED tube core 520A-520C and N-type electrode are also all arranged on lower surface, and by flip chip technique, each LED tube core are separately positioned in different pattern area.Particularly, LED tube core 520A is positioned in pattern area 511 and pattern area 512 simultaneously, and its P type electrode and N-type electrode are respectively welded to pattern area 511 and pattern area 512.Similarly, LED tube core 520B is positioned on pattern area 512 and 513 simultaneously, and its P type electrode and N-type electrode are welded to respectively pattern area 512 and 513.LED tube core 520C is positioned in pattern area 513 and pattern area 514 simultaneously, and its P type electrode and N-type electrode are welded to respectively pattern area 513 and pattern area 514.Thus, LED tube core is without being connected in series between pin 511 and 514 by lead-in wire.
in the present embodiment, pattern area 511-514 is for example fixed together with the framework 530 of for example, being made by insulating material (plastics) by noting compression technology, thereby keeps certain relative position relation.
in the present embodiment, the transparent silica gel by being mixed with fluorescent material to the interior injection of framework 530 is to be encapsulated LED tube core and lead-in wire.Alternatively, the coating of fluorescent material and transparent silica gel also can separate execution.
fig. 6 is the schematic diagram of light-emitting diode (LED) light emitting module according to another embodiment of the present invention.Compare with the embodiment described in 5 by Fig. 1 with above-mentioned, the main difference part of the present embodiment is the pattern form of metal support plate and the connected mode of LED tube core etc., below this is further described.For other side, the present embodiment can adopt the various features of previous embodiment, therefore no longer describes in detail.
as shown in Figure 6, LED light emitting module 60 comprises metal support plate 610, a plurality of LED tube core 620 and framework 630.Metal support plate 610 comprises a pair of the first pattern area 611,612 and the second pattern area 613 between the first pattern area, wherein, the first pattern area 611 and each region 611A that comprises elongation of 612 and 612A are as the pair of pins of LED light emitting module, and LED tube core 620 is for example fixed in the second pattern area 613 by eutectic solder technology.In the present embodiment, P type electrode and the N-type electrode of LED tube core 620 are arranged on upper surface, and LED tube core are linked together and be connected with 612 with the first pattern area 611 by lead-in wire 640.In the present embodiment, the second pattern area 613 is except carrying LED tube core 620, also for LED tube core provides electrical connection.Particularly, in Fig. 6, for the LED tube core that is arranged in the figure lower left corner and the upper right corner, one of them electrode of each tube core is electrically connected to the second pattern area 613 by lead-in wire 640.Because the second pattern area 613 is regions of a connection, therefore between the LED in the lower left corner and upper right corner tube core, realized electrical connection, thus whole LED tube cores are connected in series between pin 611A and 612A successively.The framework 630 of for example, being made by insulating material (plastics) is for example by noting compression technology and the first and second pattern area are fixed together and by 620 encirclements of LED tube core wherein.When the first and second pattern area are all fixed on framework 630, the relative position relation between their threes is fixed.For fear of LED tube core 620 and lead-in wire 640, be directly exposed in air, can be in the interior injection transparent silica gel of framework 630 so that they be encapsulated.Equally, the transparent silica gel of injecting can mixed fluorescent powder to change the color of the light that LED light emitting module sends.Alternatively, the coating of fluorescent material and transparent silica gel can separate execution,, first on each LED tube core 620, covers fluorescent material and then to the interior injection transparent silica gel of framework 630 that is.
it is worthy of note, although the LED tube core here adopts series system to link together, also can adopt parallel way.For example two electrodes of each the LED tube core in Fig. 6 can directly be connected between pin 611A and 612A, thereby form, are connected in parallel.
fig. 7 is according to the schematic diagram of the method that LED light emitting module is installed on heat-radiating substrate of another embodiment of the present invention.In the present embodiment, the LED light emitting module shown in Fig. 6 of take is described the method for attachment of LED unit and heat-radiating substrate as example, and heat-radiating substrate is made by metal or electric uninsulated heat-conducting plastic.But will recognize that, method described herein is also suitable for for the LED light emitting module of other structure.
light emitting module 60 is arranged on heat-radiating substrate 70, and wherein, the second pattern area 613 and heat-radiating substrate 70 are passed to heat-radiating substrate 70 for the heat that face contacts so that LED tube core is produced.Meanwhile, region corresponding with the first pattern area 611,612 on heat-radiating substrate 70 offers through hole 710A and 710B, within the first pattern area 611 and 612 can be positioned at through hole thus or top, thus avoid contacting with the direct of heat-radiating substrate 70.In Fig. 7, owing to being injected into silica gel in framework 630, so the internal structure of not shown LED light emitting module.Referring to Fig. 7, within pin 611A and 612A extend out and lay respectively at through hole 710A and 710B from framework 640.
on the other hand; external circuit (not shown) such as electrostatic discharge protective circuit, LED driving power and control and compensation circuit can be arranged on to the below of heat-radiating substrate 70, their output pin can pass through hole 710A and 710B from bottom to top and be electrically connected with pin 611A and the 612A of LED light emitting module.
for LED light emitting module 60 is arranged on heat dissipation metal substrate, can be first in the surface of substrate and region corresponding to the second pattern area of LED light emitting module, apply metal level or the alloy-layer of one deck low melting point, then by heat fused, make the second pattern area realize face with heat dissipation metal substrate and contact.
in addition, in the present embodiment, can consider that surface-coated infrared radiant material at heat-radiating substrate 70 is further to strengthen heat-sinking capability.
although represented and aspects more of the present invention be discussed, but those skilled in the art are to be appreciated that and can change aspect above-mentioned under the condition that does not deviate from the principle of the invention and spirit, therefore scope of the present invention will be limited by claim and the content that is equal to.
Claims (10)
1. light-emitting diode (LED) light emitting module, comprising:
Metal support plate, it comprises a plurality of mutual disconnected pattern area;
At least one LED tube core, it comprises the electrode bottom being formed at and is arranged in different described pattern area, and wherein, described electrode is connected respectively in one of them of different pattern area; And
The framework of being made by insulating material, itself and described pattern area are fixed together.
2. LED light emitting module as claimed in claim 1, described framework surrounds described LED tube core.
3. LED light emitting module as claimed in claim 1 or 2, wherein, covers the transparent silica gel that is mixed with fluorescent material on described LED tube core.
4. LED light emitting module as claimed in claim 1 or 2, wherein, covers fluorescent material and transparent silica gel on described LED tube core successively.
5. manufacture a method for LED light emitting module as claimed in claim 1, comprise the following steps:
LED support is provided, it comprises metal form and a plurality of framework of being made by insulating material, described metal form comprises public area and a plurality of pattern unit, and wherein, described in each, pattern unit is fixed together with framework described in one of them and comprises the pattern area that a plurality of and described public area is connected;
For pattern unit described in each, a plurality of LED tube cores are arranged in different pattern area, wherein, the electrode that is positioned at described LED die bottom is connected respectively in one of them of different pattern area; And
Pattern unit described in each is cut down from described public area, so that described pattern area is not communicated with mutually.
6. method as claimed in claim 5, wherein, is arranged on described LED tube core in different pattern area by flip chip technique.
7. method as claimed in claim 5, wherein, is fixed together pattern unit described in each and described framework by noting compression technology.
8. a method of light-emitting diode (LED) is set on insulating heat-conductive substrate, comprises the following steps:
LED light emitting module is provided, this LED module comprises the framework of being made by insulating material, a plurality of mutual disconnected metal pattern area and at least one LED tube core, described metal pattern area and described framework are fixed together, described LED tube core is arranged on different metal pattern area, wherein, the electrode that is positioned at described LED die bottom is connected respectively in one of them of different metal pattern area, and at least two regions that comprise as the external pin of described LED tube core in described metal pattern area; And
Described metal pattern area is fixed on to the surface of described insulating heat-conductive substrate, wherein, described insulating heat-conductive substrate surface is formed with the wiring layer being electrically connected with the described region that is used as the external pin of LED tube core.
9. a method of light-emitting diode (LED) is set on nonisulated heat-radiating substrate, comprises the following steps:
LED light emitting module is provided, this LED light emitting module comprises framework, at least one pair of first metal pattern area, the second metal pattern area and at least one LED tube core, described the first and second metal pattern area are not communicated with mutually and are fixed together with described framework, wherein, described the first metal pattern area is as electrode district, described LED tube core is arranged on described the second metal pattern area, and by lead-in wire, described LED tube core and described the first metal pattern area is electrically connected together; And
Described the second metal pattern area is welded on to the surface of described nonisulated heat-radiating substrate, and makes described the first metal pattern area be positioned at inside or the top of the through hole on described nonisulated heat-radiating substrate.
10. method as claimed in claim 9, wherein, described nonisulated heat-radiating substrate is made by metal or electric uninsulated heat-conducting plastic.
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