CN106287496A

CN106287496A - LED light source component, LED photovoltaic integration module and LED spotlight

Info

Publication number: CN106287496A
Application number: CN201510255535.8A
Authority: CN
Inventors: 赵依军
Original assignee: Individual
Current assignee: Individual
Priority date: 2015-05-19
Filing date: 2015-05-19
Publication date: 2017-01-04
Also published as: WO2016184372A3; WO2016184372A2

Abstract

The present invention relates to semiconductor illumination technique, particularly to light emitting diode (LED) light source assembly, LED photovoltaic integration module and the LED spotlight comprising this LED photovoltaic integration module.According to one aspect of the present invention, a kind of LED light source component includes: heat dissipation metal dish, insulating barrier and metal pattern layer is sequentially formed on its bottom interior surface, described metal pattern layer includes the most disconnected first metal pattern area and the second metal pattern area, the bottom of described heat dissipation metal dish is further opened with being suitable to the through hole that the output pin of LED drive power module passes through, so that described output pin and described first metal pattern area electrical connection；And light source, it comprises one or more LED die being arranged on described second metal pattern area, and described LED die comprises and is formed at the electrode at top and is electrically connected by pin interconnection with described first metal pattern area.

Description

LED light source component, LED photovoltaic integration module and LED spotlight

Technical field

The present invention relates to semiconductor illumination technique, particularly to light emitting diode (LED) light source Assembly, LED photovoltaic integration module and the LED comprising this LED photovoltaic integration module penetrate Lamp.

Background technology

LED attracts worldwide attention as a kind of novel lighting engineering, its application prospect, is described as 21 Century most worthy lighting source.As a kind of solid-state semiconductor device, the basic knot of LED Structure generally comprises the support of band lead-in wire, the semiconductor wafer being arranged on support and by this wafer The encapsulating material (such as fluorescence silica gel or epoxy resin) that surrounding seals.Above-mentioned quasiconductor Wafer includes P-N junction structure, and when an electric current passes through it, electronics is pushed to P district, electricity in P district Son, with hole-recombination, then sends energy with the form of photon, and the wavelength of light is then by being formed The material of P-N junction structure determines.

Such as multiaspect reflection Lamp cup (MR) lamp and handkerchief lamp dishes shape aluminum reflection (PAR) lamp etc Produce directional beam illuminator be currently widely used for market, KTV, show window commodity exhibition Show and house decoration, therefore use LED to have very well as light source in this kind of illuminator Commercial promise.But being developed by technology and limited, LED the most still has quite A part of electric energy is converted into heat energy.When heat energy is trapped in lamp interior, will unavoidably lead Cause LED temperature raises, thus causes light source performance degradation and inefficacy.At MR lamp and PAR In lamp, owing to heat density is higher, the most efficiently the heat that LED produces is dispersed into Problem outside illuminator seems especially prominent.

At present industry have been proposed for multiple using LED as the MR lamp of light source and PAR lamp. United States Patent (USP) No.6,787,999 of such as Tomislav J.Stimac et al. discloses a kind of base In the Assembled lamp of LED, it is included in this explanation as a reference in entirety by reference In book.LED-based Assembled lamp disclosed in this United States Patent (USP) includes optical module and electronics Module, wherein, optical module includes multiple setting LED on a printed circuit and radiator (heat sink), the printed circuit board (PCB) being provided with LED is bonded to the surface of radiator；Electricity Submodule is suitable to power to LED, and its one end is connected with radiator, and the other end arranges electric connector Part is to receive external electric energy.

It is pointed out that the LED light device of existing generation directional beam the most relatively For complexity, and limited by heat-sinking capability, it is difficult in high-power lower work.

Summary of the invention

It is an object of the invention to provide a kind of for LED light source component, its have simple in construction, The advantage such as compact and easily manufactured.

According to one aspect of the present invention, a kind of LED light source component includes:

Heat dissipation metal dish, its bottom interior surface sequentially forms insulating barrier and metal pattern layer, institute State metal pattern layer and include the most disconnected first metal pattern area and the second metal pattern area, institute State the bottom of heat dissipation metal dish to be further opened with being suitable to the output pin of LED drive power module and pass through Through hole so that described output pin with described first metal pattern area electrical connection；And

Light source, it comprises one or more LED die being arranged on described second metal pattern area, Described LED die comprise be formed at top electrode and by pin interconnection and with described first gold medal Metal patterns district is electrically connected.

Preferably, in above-mentioned LED light source component, utilize COB technique by described LED pipe Core is arranged at described second metal pattern area.

Preferably, in above-mentioned LED light source component, described first metal pattern area comprises two Mutual disconnected region is as the input electrode of described light source.

Preferably, in above-mentioned LED light source component, described second surface, metal pattern area is tool There is the surface of high reflectance.

Preferably, in above-mentioned LED light source component, the inner surface of described heat dissipation metal dish is constituted Concave mirror, described light source is positioned at the near focal point of described concave mirror.

Preferably, in above-mentioned LED light source component, farther including lens, it is arranged on institute State the bottom interior surface of heat dissipation metal dish and surround described LED die.

Preferably, in above-mentioned LED light source component, utilize the envelope encapsulating described LED die Package material forms described lens.

Preferably, in above-mentioned LED light source component, described lens are bowl body shape and tip upside down on Described LED die to be accommodated wherein on described heat dissipation metal dish, and the coating of its inner surface is glimmering Light powder.

Preferably, in above-mentioned LED light source component, the bottom surface of described lens is the most smooth And be bonded in described LED die encapsulated on encapsulating material therein.

Preferably, in above-mentioned LED light source component, described encapsulating material is mixed with fluorescent material.

Preferably, in above-mentioned LED light source component, shape on the inner surface of described heat dissipation metal dish Reticulate the projection of pattern.

It is a further object to provide a kind of LED photovoltaic integration module, it has knot The advantages such as structure is simple, compact and easily manufactured.

According to another aspect of the present invention, a kind of LED photovoltaic integration module includes:

Heat dissipation metal dish, its bottom interior surface sequentially forms insulating barrier and metal pattern layer, institute State metal pattern layer and include the most disconnected first metal pattern area and the second metal pattern area, institute The bottom stating heat dissipation metal dish is further opened with through hole；

Light source, it comprises one or more LED die being arranged on described second metal pattern area, Described LED die comprise be formed at top electrode and by pin interconnection and with described first gold medal Metal patterns district is electrically connected；And

Being arranged on the LED drive power module below described heat dissipation metal dish, its output pin is worn The most described through hole is also soldered to described first pattern district, thus realizes described LED simultaneously and drive electricity Electrical connection between source module and described first metal pattern area and being rigidly connected.

The present invention's it is also an object that provides a kind of LED spotlight, its have simple in construction, The advantage such as compact and easily manufactured.

According to another aspect of the present invention, a kind of LED spotlight includes:

Glass lamp cup；

The LED photovoltaic integration module being arranged in described glass lamp cup, including:

Being shaped to and described glass of heat dissipation metal dish, its whole side or a part of side Glass Lamp cup inner surface fits tightly, and sequentially form on its bottom interior surface insulating barrier and Metal pattern layer, described metal pattern layer include the most disconnected first metal pattern area and Second metal pattern area, the bottom of described heat dissipation metal dish is further opened with through hole；

Light source, it comprises one or more LED being arranged on described second metal pattern area Tube core, described LED die comprise be formed at top electrode and by pin interconnection and With described first metal pattern area electrical connection；And

Being arranged on the LED drive power module below described heat dissipation metal dish, its output is drawn Wear the most described through hole and be soldered to described first pattern district, thus realizing described simultaneously Electrical connection between LED drive power module and described first metal pattern area and just Property connect.

Preferably, in above-mentioned LED spotlight, farther including lens, it is arranged at described glass The opening part of glass Lamp cup and in the face of described LED die, with send described LED die Light conversion is the directional beam of required form.

Preferably, in above-mentioned LED spotlight, via is offered in the lower end of described glass lamp cup, institute State LED drive power module to comprise a pair and extend to outside described glass lamp cup through described via Input pin.

Preferably, in above-mentioned LED spotlight, the inner surface of described glass lamp cup and/or described Coated with thermally conductive glue or silicone grease on the outer surface of heat dissipation metal dish.

Preferably, in above-mentioned LED spotlight, farther including a pair pin, it is attached at institute Stating the bottom of glass lamp cup, described LED drive power module comprises a pair input pin, its point Do not insert respective pin.

Accompanying drawing explanation

Above-mentioned and/or the other side of the present invention and advantage are by by each side below in conjunction with accompanying drawing The description in face becomes more fully apparent and is easier to understand, and in accompanying drawing, same or analogous unit uses Identical label represents, and for the sake of making signal apparent, the unit in accompanying drawing is also Not necessarily according to actual scale.Accompanying drawing includes:

Fig. 1 is the schematic diagram of the LED light source component according to one embodiment of the invention.

Fig. 2 is the generalized section of LED light source component shown in Fig. 1.

Fig. 3 show in the LED light source component shown in Fig. 1 use encapsulating material make saturating The schematic diagram of mirror.

Figure 4 and 5 show two kinds of lens that can use in the LED light source component shown in Fig. 1 Schematic diagram.

Fig. 6 is that the decomposition of the LED photovoltaic integration module according to another embodiment of the present invention is shown It is intended to.

Fig. 7 is the decomposing schematic representation of the LED spotlight according to another embodiment of the present invention.

Fig. 8 is the generalized section after the LED spotlight assembling shown in Fig. 7.

List of parts

1 LED spotlight

10 LED photovoltaic integration modules

110 LED light source component

111 heat dissipation metal dishes

1111A, 1111B through hole

112 light sources

1121 LED die

1122 lead-in wires

1123 encapsulating materials

113 insulating barriers

114 metal pattern layer

1141A, 1141B first metal pattern area

1142 second metal pattern area

115 lens

116 fluorescence coatings

120 LED drive power modules

121 circuit boards

122A, 122B input electrode

123A, 123B output electrode

20 glass lamp cups

210A, 201B pin

30 cover plates

Detailed description of the invention

More fully illustrate referring to the accompanying drawing which illustrates illustrative examples of the present invention The present invention.But the present invention can be realized by multi-form, and it is not construed as being only limitted to herein The each embodiment be given.The various embodiments described above be given are intended to make disclosure herein comprehensively complete, Protection scope of the present invention more fully to be conveyed to those skilled in the art.

In this manual, term " shot-light " should be broadly interpreted as providing directional beam Various illuminators, include but not limited to multiaspect reflection Lamp cup (MR) lamp and handkerchief lamp dishes shape Aluminum reflection (PAR) lamp etc..

In this manual, unless stated otherwise, term " semiconductor crystal wafer " refers to partly leading The upper multiple independent single circuit formed of body material (such as silicon, GaAs etc.), " quasiconductor Wafer " or " wafer (die) " refer to this single circuit, and " encapsulation chip " refers to partly lead Body wafer physical arrangement after encapsulation, in typical this physical arrangement, semiconductor die Sheet for example, be mounted on support and encapsulates with encapsulant.

Term " light emitting diode " refers to comprise the unit of electroluminescent material, this list The example of unit includes but not limited to P-N junction inorganic semiconductor light emitting diode and organic light-emitting diodes Pipe (OLED and polymer LED (PLED)).

P-N junction inorganic semiconductor light emitting diode can have different version, such as, wrap Include but be not limited to LED core and light emitting diode monomer.Wherein, " light emitting diode pipe Core " refer to semiconductor wafer that include P-N junction structure, that there is electroluminescent ability, and " send out Optical diode monomer " refer to the physical arrangement that will be formed after die package, at typical this thing In reason structure, tube core for example, be mounted on support and encapsulates with encapsulant.

Term " connects up ", " wiring pattern " and " wiring layer " refers to layout on insulating surface For between components and parts, the conductive pattern of electrical connection, includes but not limited to cabling (trace) and hole (such as pad, component hole, fastener hole and plated through-hole etc.).

" it is electrically connected " to should be understood to be included in and between two unit, directly transmits electric flux or electricity The situation of signal, or indirectly transmit electric flux or the signal of telecommunication through one or more Unit the 3rd Situation.

" driving power supply " or " LED drive power " refer to the exchange being connected to outside illuminator Or direct current (DC) power supply the and as " Electronic Control between the light emitting diode of light source (AC) Device ", curtage (the such as constant current, perseverance needed for providing for light emitting diode Determine voltage or firm power etc.).In particular embodiments, driving power supply can be with modularity Structure realize, such as it comprises printed circuit board (PCB) and one or more is arranged on printed circuit board (PCB) The components and parts gone up and be electrically connected together by wiring, the example of these components and parts include but not It is limited to LED and drives controller chip, rectification chip, resistor, capacitor, inducer and change Depressor etc..

Such as " comprise " and the term of " including " etc represents and wants in description and right except having Asking beyond the unit and step having in book directly and clearly state, technical scheme is the most not Get rid of and there is other unit and the situation of step directly or clearly do not stated.

The such as term of " first " and " second " etc is not offered as unit in time, space, big The order of the aspect such as little and only make to distinguish each unit and be used.

The term of such as surface of object B " the object A be arranged on " etc should be broadly interpreted as Object A is directly placed at the surface of object B, or object A is placed on has with object B The surface of other object of contact.

Below by accompanying drawing, embodiments of the invention are described.

Fig. 1 is the schematic diagram of the LED light source component according to one embodiment of the invention.Fig. 2 is The generalized section of LED light source component shown in Fig. 1.

See Fig. 1 and 2, include heat dissipation metal according to the LED light source component 110 of the present embodiment Dish 111 and light source 112, wherein, light source 112 comprises multiple being arranged on heat dissipation metal dish LED die 1121.Hereinafter above-mentioned unit is further described.

Heat dissipation metal dish 111 such as can use simple metal (such as aluminum and copper) or alloy material Make.Preferably, heat dissipation metal checks and regulates a shape of side or the shape of surface and LED The inner surface configuration coupling of the Lamp cup (not shown) of shot-light, when being assembled in Lamp cup, Together with the former whole side or surface fit tightly with the inner surface of the latter, this is notable Improve capacity of heat transmission so that the heat that light source 112 produces can conduct in time to Lamp cup.

Preferably, the inner surface of heat dissipation metal dish 111 constitutes concave mirror, and light source 112 base It is positioned at the near focal point of this concave mirror in basis, thus produces preferable spotlight effect.Preferably, The projection also forming net-like pattern on the inner surface of heat dissipation metal dish 111 (is such as similar to common Netted or the squamous pattern projection of the Lamp cup inner surface of shot-light) so that going out from heat dissipation metal dish 111 The light penetrated is more uniformly distributed.As described further below, in order to optimize light beam further Distribution and raising light extraction efficiency, can arrange lens on LED die 1121, particularly, The encapsulating material that can utilize encapsulating LED die forms such lens.

Alternatively, heat dissipation metal dish 111 can be to use the form of non-concave mirror, in this situation Under, for the light beam that light conversion is required form that light source 112 is launched, can be at metal The opening part of heat dissipation plate 111 arranges lens.

As it is shown in figure 1, the bottom of heat dissipation metal dish 111 is further opened with through hole 1111A and 1111B To allow the output pin of LED drive power module (not shown) pass through and be electrically connected to Light source 112, below will be further described.

Profile shown in Fig. 2 is connected between through hole 1111A and 1111B along being parallel to Straight line takes.As in figure 2 it is shown, sequentially form on inner surface bottom heat dissipation metal dish 111 Insulating barrier 113 and metal pattern layer 114.

Such as by coating process, insulating barrier 113 is covered in heat dissipation metal dish as shown in Figure 2 The whole region of 111 bottom interior surfaces.In the present embodiment, insulating barrier 113 uses such as low grade fever Resistance insulant, such as, include but not limited to the inorganic filler of resin etc.Preferably, may be used To add sapphire powder or other metal-oxide in resin.Preferably, at heat dissipation metal dish Anode oxide film or diamond film is formed as insulating barrier on the bottom interior surface of 111.It may be noted that It is, although in the present embodiment that shown insulating barrier 113 covers heat dissipation metal tray bottom inner surface Whole region, but alternatively, it can also only cover the subregion (example of bottom interior surface Such as middle section) on.

It is positioned at metal pattern layer 114 on insulating barrier 113 by the excellent metal system of heat conductivility Becoming, it can be such as simple metal material (such as aluminum and copper) or alloy material.By etching Technique, can form the metal pattern layer 114 of the desired style on insulating barrier 113.In conjunction with figure 1-3 is visible, and metal pattern layer 114 includes first metal pattern area 1141A, 1141B and is positioned at The second metal pattern area 1142 between first metal pattern area 1141A, 1141B, wherein, First metal pattern area 1141A, 1141B is as the input electrode of light source 112, and the second gold medal Metal patterns layer 1142 is then used for carrying light source 112.Particularly, the two of LED drive power module Individual output pin can pass through through hole 1111A and 1111B respectively and be soldered to the first metal pattern area 1141A、1141B.Preferably, the surface of the second metal pattern area 1142 is treated to have The surface of high reflectance (such as by the metal of the high reflectance such as electroplate, stannum or it Alloy and form minute surface) so that LED die launch light in travel downward point Amount is substantially wholly reflected back, and which thereby enhances luminous efficiency.Additionally, silver, stannum it The coating of class also further increases the conduction of heat energy between light source 112 and heat dissipation metal dish 111 Power.As illustrated in fig. 1 and 2, first metal pattern area 1141A, 1141B each other and Do not connect with between the second metal pattern area 1142.

It is pointed out that the quantity of the first and second metal pattern area shown in figure and it Position relationship between is merely exemplary, other arrangement form is also feasible.Example As when light source 112 multiple LED die need packet control time, it may be necessary to configure three or More input electrodes, can increase the quantity of the first metal pattern area for this；And for example, can be by LED die is divided into some groups, and these LED die groups are respectively set at two or more Second metal pattern area；Furthermore, the second metal pattern area is between the first metal pattern area Layout is not necessarily required to, such as, the first metal pattern area can also be arranged in the second metal pattern The same side in district.

Seeing Fig. 1 and 2, light source 112 comprises multiple second metal pattern area 1142 of being arranged at LED die 1121.In the present embodiment, the P-type electrode of each LED die 1121 and N Type electrode is all disposed within the upper surface of tube core, and its lower surface is then fixed on the second gold medal by heat-conducting glue Metal patterns district 1142.The heat that LED die 1121 produces is through heat-conducting glue, the second metal pattern District 1142 and insulating barrier 113 are efficiently transfer to heat dissipation metal dish 111.As illustrated in fig. 1 and 2, LED die 1121 by lead-in wire 1122 realize interconnection between them and with the first pattern district The connection of 1141A, 1141B, lead-in wire such as can be made up of gold, copper, aluminum or alloy material. The LED die fixing and wire bonding on the second metal pattern area such as can utilize COB technique realizes.

In the present embodiment, LED die 1121 is connected to the first pattern district in series-parallel connection mode Between 1141A, 1141B.It is pointed out that and can also use such as between LED die Other type of attachment of series, parallel or crossed array etc.Furthermore, shown in Fig. 1 and 2 Embodiment is as a example by multiple LED die, but uses single led tube core as light-emitting component Also it is feasible.

In order to avoid LED die 1121 and lead-in wire 1122 are directly exposed in air, Ke Yiyong They are encapsulated by the encapsulating material of transparent silica gel etc.Alternatively, permissible in encapsulating material Mixed fluorescent powder (such as includes but not limited to yttrium-aluminium-garnet (YAG) fluorescent material, nitride Fluorescent material, silicate fluorescent powder and sulphide fluorescent material etc.).

As it has been described above, the encapsulating material of encapsulating LED die 1121 and lead-in wire 1122 can make Become and have effigurate lens, thus also act as optimization irradiating light beam while protection light source Distribution and the effect of raising light extraction efficiency.Fig. 3 shows in the LED light source component shown in Fig. 1 The schematic diagram of the lens that middle employing encapsulating material is made.As it is shown on figure 3, encapsulating material 1123 quilt Be arranged on the bottom interior surface of heat dissipation metal dish 111, thus by LED die 1121 and In lead-in wire 1122 is all wrapped in, and the outer surface of this encapsulating material has required shape (example As having the curved surface setting curvature) to constitute lens.Preferably, the encapsulating material of lens is made In can be with mixed fluorescent powder.The equipment that can utilize such as LED mould top machine etc is this to make The lens being made up of encapsulating material.

Furthermore, it is also possible in LED light source component, configure special lens carry out optimization irradiating light beam Distribution and raising light extraction efficiency.Figure 4 and 5 show two kinds can be at the LED light source shown in Fig. 1 The schematic diagram of the lens used in assembly.As shown in Figure 4, lens 115 in bowl body shape, its quilt Tip upside down on the bottom interior surface of heat dissipation metal dish 111, so that LED die 1121 and lead-in wire 1122 accommodate wherein.Preferably, layer of fluorescent powder 116 can be coated on the inner surface of lens 115 To obtain the light of required colour temperature.Owing to LED die and lead-in wire are all surrounded wherein by lens 115, It can be considered to save the encapsulating material as protection material.Compared with Fig. 4, shown in Fig. 5 The bottom of lens 115 be substantially smooth, it is fixed on LED die 1121. Preferably, first relatively flat one layer can be formed in LED die 1121 and lead-in wire 1122 Encapsulating material 1123, is then bonded in the bottom surface of lens 115 on this layer of encapsulating material.Make The material of above two lens includes but not limited to glass, polymethyl methacrylate and poly-carbonic acid Ester etc..

See Fig. 6, include being integrated in one according to the LED photovoltaic integration module 10 of the present embodiment The LED light source component 110 risen and LED drive power module 120.Below to each list above-mentioned Unit is further described.

In the present embodiment, LED light source component 110 such as can use the structure shown in Fig. 1-5, LED drive power module 120 uses modular structure, and it comprises printed circuit board (PCB) 121 He First device that one or more installations on a printed circuit and are electrically connected together by wiring Part.

As shown in Figure 6, LED drive power module 120 is arranged on heat dissipation metal dish 111 Lower section, it comprises a pair input pin 122A, 122B and a pair output pin 123A, 123B. This is adapted for insertion into the lamp socket (not shown) of LED spotlight to input pin 122A, 122B, from And between external power source (not shown) and LED drive power module 120, set up electrical connection. See Fig. 6, output pin 123A and 123B to be each passed through and offer on heat dissipation metal dish 111 Through hole 1111A and 1111B and respectively with the first metal being arranged on bottom heat dissipation metal dish 111 Pattern district 1141A and 1141B is electrically connected.Particularly, in the present embodiment, output pin 123A and 123B is bent downwardly after passing through hole 1111A and 1111B, thus respectively with The first metal pattern area 1141A and 1141B as the input electrode of LED light source component 110 Weld together, realize LED light source component 110 and LED drive power module the most simultaneously 120 electrical connections therebetween and being rigidly connected.

According to the mode of externally fed, LED drive power module 120 can use various topology frame The circuit of structure, such as, include but not limited to that non-isolated voltage-dropping type topological circuit structure, inverse-excitation type are opened up Flutter circuit structure and half-bridge LLC topological circuit structure etc..Drive circuit can be with multiple type of drive Modes such as () such as constant voltage power, constant current-supplying and constant pressure and flow are powered is to LED light source component 110 provide suitable curtage.About driving the detailed description of power circuit to can be found in the people Post and telecommunications publishing house in May, 2011 " LED illumination drives power supply and Design of Luminaires " of the 1st edition Book, this publication way of reference in full comprises in this manual.

Fig. 7 is the decomposing schematic representation of the LED spotlight according to another embodiment of the present invention.Fig. 8 Generalized section after assembling for the LED spotlight shown in Fig. 7.

See Fig. 7 and 8, include LED photovoltaic integration according to the LED spotlight 1 of the present embodiment Module 10, glass lamp cup 20 and glass cover-plate 30.Hereinafter above-mentioned unit is made further Description.

Glass lamp cup 20 is in funnel-form, but this is not necessarily.Glass lamp cup 20 can also Use other shape, such as straight tube shape and prismatic etc..It is made up of material that is transparent and that insulate Cover plate 30 cover the upper opening at glass lamp cup 20.LED photovoltaic integration module 10 It is positioned in the inner chamber limited by glass lamp cup 20 and cover plate 30.In the present embodiment, LED light Electrical integrated module 10 such as can use the structure shown in Fig. 1-6, the LED light in this module The heat that source component and LED drive power module produce is transferred to glass lamp cup with heat exchange pattern 20, and in glass lamp cup is dispersed into environment.Owing to glass has higher saturating for infra-red radiation Penetrating rate, therefore heat can distribute through Lamp cup in thermal-radiating mode.

Profile shown in Fig. 8 is along the circuit board being perpendicular to LED drive power module 120 The plane of 121 takes.See Fig. 8, in the LED spotlight 1 after having assembled, LED Optoelectronic integration module 10 is arranged in the inner chamber of glass lamp cup 20, heat dissipation metal dish 111 External surface shape mate with the inner surface configuration of glass lamp cup 20, therefore the former whole side Or together with surface fits tightly with the inner surface of the latter, thus eliminate or reduce the two it Between space, significantly improve capacity of heat transmission.Preferably, in order to improve Glass lamp further Thermal conduction effect between cup 20 and heat dissipation metal dish 111, can be in glass lamp cup 20 Coated with thermally conductive glue or silicone grease on the outer surface of surface and/or heat dissipation metal dish 111.

As shown in Figure 8, LED drive power module 120 is arranged on heat dissipation metal dish 111 Lower section and be positioned at the inner chamber of glass lamp cup 20.It is alternatively possible in LED drive power Filling thermal plastic insulation between module 120 and glass lamp cup 20 inwall, on the one hand it contribute to making The heat of LED drive power module 120 is transferred to glass lamp cup 20, on the other hand also makes LED The position driving power module 120 is the most firm.

See Fig. 8, a pair input pin 122A, 122B of LED drive power module 200 Passing from the bottom of glass lamp cup 20, it inserts lamp socket (not shown), thus at external power source Electrical connection is set up between (not shown) and LED drive power module.Alternatively, at glass The bottom of Lamp cup 20 can be attached a pair pin 210A, 210B, correspondingly, LED drive power The pin that input pin 122A and 122B of module 120 inserts attachment respectively is interior to realize LED Drive the electrical connection of power supply 120 and external power source.

On the other hand, a pair output pin 123A, 123B of LED drive power module 120 It is each passed through on heat dissipation metal dish 111 through hole 1111A and 1111B offered and is respectively welded to The first metal pattern area 1141A and 1141B bottom heat dissipation metal dish 111, thus the most real Now electrical connection and rigidity between LED light source component 110 and LED drive power module connect Connect.

Although represented and discussed some aspects of the present invention, but the technology in this area Personnel are it is appreciated that can be to above-mentioned side under conditions of without departing substantially from the principle of the invention and spirit Face is changed, and therefore the scope of the present invention will be limited by the content of claim and equivalent.

Claims

1. a LED light source component, it is characterised in that including:

2. LED light source component as claimed in claim 1, wherein, described first metal figure Case district comprises two mutual disconnected regions input electrode as described light source.

3. LED light source component as claimed in claim 1, wherein, described heat dissipation metal dish Inner surface constitute concave mirror, described light source is positioned at the near focal point of described concave mirror.

4. LED light source component as claimed in claim 3, wherein, farther includes lens, It is arranged on the bottom interior surface of described heat dissipation metal dish and surrounds described LED die.

5. LED light source component as claimed in claim 4, wherein, utilizes and encapsulates described LED The encapsulating material of tube core forms described lens.

6. LED light source component as claimed in claim 4, wherein, described lens are bowl body Shape and tip upside down on described heat dissipation metal dish with by described LED die accommodate wherein, and its Inner surface coating fluorescent material.

7. LED light source component as claimed in claim 4, wherein, the bottom surface of described lens Substantially the most smooth and be bonded in described LED die is encapsulated encapsulating material therein On.

8. a LED photovoltaic integration module, it is characterised in that including:

9. a LED spotlight, it is characterised in that including:

Glass lamp cup；

10. LED spotlight as claimed in claim 9, wherein, the interior table of described glass lamp cup Coated with thermally conductive glue or silicone grease on the outer surface of face and/or described heat dissipation metal dish.