CN101079415A - LED encapsulation structure - Google Patents
LED encapsulation structure Download PDFInfo
- Publication number
- CN101079415A CN101079415A CN 200610079808 CN200610079808A CN101079415A CN 101079415 A CN101079415 A CN 101079415A CN 200610079808 CN200610079808 CN 200610079808 CN 200610079808 A CN200610079808 A CN 200610079808A CN 101079415 A CN101079415 A CN 101079415A
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- CN
- China
- Prior art keywords
- led
- flash
- conductor region
- light
- package structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Abstract
The invention discloses a luminous diode packing structure, which comprises the following parts: circuit board, conductive layer, automatical focusing component, flash component, reflecting component and mould component, wherein the automatical focusing component and flash component are set on the conductive layer; the reflecting component is set at the rim of circuit board; the mould component is filled in the reflecting component, which packs the automatical focusing component and flash component.
Description
Technical field
The present invention relates to a kind of light-emitting diode (light emitting diode; LED) encapsulating structure is particularly about a kind of encapsulating structure with two light-emitting diode chip for backlight unit.
Background technology
Light-emitting diode is a kind of joint diode, mainly by being constituted at semiconductor suprabasil p type epitaxial layer and n type epitaxial layer.After forming epitaxial structure, chip then is fixed on the panel through cutting, passes through routing then, encapsulates at last again, forms the lumination of light emitting diode bulb.Generally speaking, the encapsulating material that uses of light-emitting diode is epoxy resin (Epoxy).
Light-emitting diode is of a great variety, of many uses, becomes one of important tool indispensable in the modern life already.General light-emitting diode is mainly used in illumination or caution, for example is applied to the indicator light of household electrical appliances, sound equipment and instrument; The light source of facsimile machine, bar code reader and optical mouse; And the automatic focusing light source or the photoflash lamp of camera.
Generally in camera, if in the time of need possessing automatic focusing light source with flash of light source function simultaneously, its manufacture then is encapsulated in these two led chips respectively on two circuit boards, to finish the preparation of multifunction camera for making two kinds of dissimilar led chips respectively earlier again.That is to say that the led chip of the light source that is used for focusing automatically and the led chip that is used for photoflash lamp are to be finished by different encapsulation processs respectively.Yet because photovoltaic constantly weeds out the old and bring forth the new, and camera increases day by day to light, thin, short, little demand, therefore how two kinds of dissimilar led chips is encapsulated in simultaneously on a slice panel with the saving space, is one of project of present important consideration.Yet,, for example be used for the chip in the source of focusing automatically and the chip in conduct flash of light source if direct with these two kinds of dissimilar led chips on same panel, be packaged together, then can make the led chip brightness in automatic focusing source not enough, its brightness is about 5 candle lights, thereby reduces the usability of product.
Therefore, be necessary to provide a kind of new package structure for LED, to address the above problem.
Summary of the invention
Purpose of the present invention just provides a kind of package structure for LED, to improve the usability in space.
Another object of the present invention provides a kind of package structure for LED, to reduce material cost and cost of manufacture.
According to above-mentioned purpose of the present invention, a kind of package structure for LED is proposed.This package structure for LED comprises circuit board, conductor layer, at least one automatic focusing LED, at least one flash of light LED, reflecting member and molded structure.Wherein, conductor layer is arranged on the circuit board, and the LED that focuses automatically is arranged on the conductor layer with flash of light LED.Reflecting member is located on the circuit board outer rim, and LED is packaged in the reflecting member with flash of light LED focusing automatically.Above-mentioned molded structure fills in the reflecting member, to encapsulate automatic focusing LED and flash of light LED.
In another preferred embodiment of the present invention, can also use to have different chip structures, on circuit board, adjust the configuration mode of focus automatically LED and flash of light LED.Moreover, can also increase the quantity of flash of light LED on demand, to improve flash of light LED brightness.
Therefore, by the preferred embodiment of the invention described above as can be known, LED is arranged at on a slice circuit board simultaneously with flash of light LED because the present invention will focus automatically, thus not only can save the space, and can make the brightness of automatic focusing LED improve 50%.Moreover, use the cost that method of the present invention can also reduce material and manufacturing, its total cost approximately can reduce by 20%.In addition, not only can on single circuit board, obtain multi-functional illumination effect, can also increase the usage quantity of chip, to improve brightness.
Description of drawings
Fig. 1-2 is respectively the schematic diagram of two kinds of dissimilar led chip structures.
Fig. 3 is a kind of cross-sectional view of package structure for LED.
Fig. 4 is the schematic top plan view of Fig. 3 package structure for LED, but does not illustrate reflecting member and molded structure among Fig. 3.
Fig. 5 is the schematic top plan view according to a kind of package structure for LED of a preferred embodiment of the present invention.
Fig. 6 is the schematic top plan view according to a kind of package structure for LED of a preferred embodiment of the present invention.
Description of reference numerals
102：LED
104,208:N type electrode
106,206:P type electrode
202: substrate
204：LED
300,400,500: package structure for LED
302,402,502: circuit board
304a, 404a, 504a: first conductor region
304b, 404b, 504b: second conductor region
304c, 404c, 504c: the 3rd conductor region
304d, 504d: the 4th conductor region
306,406,506: LED automatically focuses
308,408: flash of light LED
310,312,410,412,414 leads
314: reflecting member
316: molded structure
318: hemispherical structure
508a: the first flash of light LED
508b: the second flash of light LED
508c: the 3rd flash of light LED
510a～510g: lead
Embodiment
The invention provides a kind of encapsulating structure of light-emitting diode, to improve the usability in space.In preferred embodiment of the present invention, can use dissimilar LED to carry out encapsulation procedure on demand.
Please, be respectively two kinds of dissimilar chip structures earlier with reference to Fig. 1-2.In Fig. 1, P type electrode 106 and N type electrode 104 lay respectively at last plane and the lower plane of LED 102.Another kind of LED structure as shown in Figure 2, it comprises substrate 202, LED 204, P type electrode 206 and N type electrode 208.Wherein, P type electrode 206 is positioned on the same plane of LED 204 with N type electrode 208.
Below will be described in detail at three preferred embodiments of the present invention respectively, three preferred embodiments are configuration mode inequality, but are not used for limiting scope of the present invention.
Embodiment one
In this preferred embodiment, focus automatically LED and flash of light LED use LED structure as shown in Figure 1.Please refer to Fig. 3, be a kind of cross-sectional view of package structure for LED.Package structure for LED 300 comprises circuit board 302, conductor layer 304, focus LED 306, flash of light LED 308, lead 310/312, reflecting member 314 and molded structure 316 automatically.Wherein, conductor layer 304 is arranged at the top of circuit board 302.In this preferred embodiment of the present invention, conductor layer (304a, 304b, 304c, 304d) is respectively the first conductor region 304a, the second conductor region 304b, the 3rd conductor region 304c and the 4th conductor region 304d, and does not join mutually between each conductor region.In this preferred embodiment of the present invention, the first, second, third and the 4th conductor region 304a, 304b, 304c, 304d's electrically is negative pole, positive pole, negative pole and positive pole in regular turn.Wherein, the material of above-mentioned conductor layer is preferably gold, silver, copper, platinum, aluminium, tin or magnesium.
Please be simultaneously with reference to Fig. 4, it is the overlooking surface schematic diagram of Fig. 3 package structure for LED, but does not illustrate reflecting member 314 and molded structure 316 among the 3rd figure.In other words, Fig. 3 is the generalized section along Fig. 4 middle conductor A-A '.In Fig. 4, the LED306 that focuses automatically is preferable to be arranged on the first conductor region 304a, and its N type electrode (not illustrating) directly is connected with the first conductor region 304a, and P type electrode 306a system sees through lead 310 and electrically connects the second conductor region 304b.Flash of light LED 308 preferable being arranged on the 3rd conductor region 304c, and its N type electrode (not illustrating) directly is connected with the 3rd conductor region 304c, and P type electrode 308a is through lead 312 electric connections the 4th conductor region 304d.Wherein, the LED 306 that focuses automatically, flash of light LED 308 are that the P type electrode of chip and anodal conductor region join with the mode that conductor region 304a, 304b, 304c, 304d electrically connect, and the N type electrode of chip and the conductor region of negative pole join.
In another preferred embodiment of the present invention, can also utilize dissimilar led chip structures, for example use LED structure shown in Figure 1 as the LED that focuses automatically, and use LED structure shown in Figure 2 as flash of light LED, and utilize the mode of above-mentioned electric connection, automatic focusing LED and flash of light LED are set, to drive focusing LED and flash of light LED automatically respectively on conductor region.
In a preferred embodiment of the present invention, focus automatically LED 306 and the flash of light LED 308 preferable centers that are arranged near circuit board 302 are to improve its brightness.
In Fig. 3, reflecting member 314 is preferably a reflecting plate, and it is located on the outer rim place of circuit board 302, and the LED 306 that will focus automatically is packaged in the reflecting member 314 with flash of light LED 308, in order to reflecting the light that automatic focusing LED 306 and flash of light LED 308 are sent, and then improve brightness.Then,, in reflecting member 314, insert molded structure 316, to encapsulate automatic focusing LED 306 and flash of light LED 308 by the mode of encapsulating.Wherein, the material of molded structure 316 is preferably epoxy resin (Epoxy), acryl or silica gel.
In another preferred embodiment of the present invention, can also in molded structure 316, add fluorescent material, make the flash of light LED 308 that sends blue light can carry out mixed light with the light that fluorescent material is sent and send white light.Perhaps, can also on molded structure 316, paste the hemispherical structure 318 of a translucidus and entity and improve brightness, and the material of the hemispherical structure 318 of this translucidus needs identical with molded structure 316.
Therefore, in a preferred embodiment of the present invention, the LED 306 that will focus automatically is arranged at on a slice circuit board 302 with flash of light LED308, not only can save the space, can also make automatic focusing LED 306 brightness increase by 50%.
Embodiment two
In another preferred embodiment of the present invention, can also use different chip structures, on conductor layer, adjust the configuration mode of focus automatically LED and flash of light LED.In this preferred embodiment, the LED that focuses automatically uses the LED structure among Fig. 1, and flash of light LED uses the LED structure among Fig. 2.Please refer to Fig. 5, be overlooking surface schematic diagram according to a kind of package structure for LED of a preferred embodiment of the present invention.In Fig. 5, a conductor layer (404a, 404b, 404c) is set on circuit board 402.Wherein, conductor layer is divided into the first conductor region 404a, the second conductor region 404b and the 3rd conductor region 404c, and each conductor region does not join each other mutually.In a preferred embodiment of the present invention, first, second and the 3rd conductor region 404a, the electrical preferable of 404b, 404c are negative pole, positive pole and negative pole in regular turn, but are not limited to this.Wherein, the material of above-mentioned conductor layer is preferably gold, silver, copper, platinum, aluminium, tin or magnesium.
Because flash of light LED 408 adopts the LED structure of Fig. 2, so the LED406 that focuses automatically can be arranged in the same conductor district with flash of light LED 408.In a preferred embodiment of the present invention, the LED 406 that focuses automatically is arranged on the first conductor region 404a with flash of light LED 408.
In a preferred embodiment of the present invention, the N type electrode (not illustrating) of the LED 406 that focuses automatically directly is connected with the first conductor region 404a, and its P type electrode 406a sees through the lead 410 electric connections second conductor region 404b.The P type electrode 408a of flash of light LED 408 sees through lead 412 and electrically connects the second conductor region 404b, and its N type electrode 408b sees through lead 414 and electrically connects the 3rd conductor region 404c.
In a preferred embodiment of the present invention, focus automatically LED 406 and the flash of light LED 408 preferable centers that are positioned near circuit board 402 are to improve brightness.
Then, reflecting member (not illustrating) and molded structure (not illustrating) are set in regular turn on circuit board 402, to encapsulate automatic focusing LED 406 and flash of light LED 408.Because the set-up mode of reflecting member and molded structure is as embodiment one, so do not add to give unnecessary details at this.
Embodiment three
In another preferred embodiment of the present invention, the quantity that can also increase flash of light LED on demand is to improve brightness.In this preferred embodiment, two electrode direction of the flash of light LED and the LED that focuses automatically are as embodiment two, so do not add to give unnecessary details at this.Please refer to Fig. 6, be overlooking surface schematic diagram according to a kind of package structure for LED of a preferred embodiment of the present invention.In Fig. 6, a conductor layer (504a, 504b, 504c, 504d) is set on circuit board 502.Wherein, conductor layer is preferable divides into the first conductor region 504a, the second conductor region 504b, the 3rd conductor region 504c and the 4th conductor region 504d, and each conductor region does not join each other mutually.In a preferred embodiment of the present invention, the first, second, third and the 4th conductor region 504a, 504b, 504c, 504d's electrically is negative pole, negative pole, anodal and positive pole in regular turn.Wherein, the material of above-mentioned conductor layer is preferably gold, silver, copper, platinum, aluminium, tin or magnesium.
Automatic focusing LED 506 preferable being arranged on the first conductor region 504a.First, second and the 3rd flash of light LED 508a, 508b, 508c are arranged at respectively on second, third and the 4th conductor region 504b, 504c, the 504d.In a preferred embodiment of the present invention, the LED 506 that focuses automatically, first, second and the 3rd flash of light LED 508a, the preferable center that is arranged near circuit board 502 of 508b, 508c are to improve brightness.
Then, according to automatic focusing LED 506, first, second is electrical with the 3rd flash of light LED 508a, 508b, 508c and the first, second, third and the 4th conductor region 504a, 504b, 504c, 504d's, see through lead 510a～510g will focus automatically respectively LED 506, first, second electrically connects the first, second, third and the 4th conductor region 504a, 504b, 504c, 504d with the 3rd flash of light LED 508a, 508b, 508c, to drive the focusing LED and the LED that glistens automatically respectively.Because above-mentioned automatic focusing LED and flash of light LED are all described as embodiment one with the mode that conductor region electrically connects respectively, so do not add to give unnecessary details at this.In another preferred embodiment of the present invention, the configuration mode of above-mentioned electric connection and chip also can be adjusted on demand, is not limited to this.
Then, reflecting member (not illustrating) and molded structure (not illustrating) are set in regular turn above circuit board 502, to encapsulate automatic focusing LED 506 and first, second and the 3rd glisten LED 508a, 508b, 508c.Because the set-up mode of reflecting member and molded structure is as embodiment one, so do not add to give unnecessary details at this.
Compared to embodiment one and embodiment two, because embodiment three has increased the quantity of flash of light LED, that is uses 3 flash of light LED, so the brightness in flash of light source can improve 200% approximately.
Therefore, by the preferred embodiment of the invention described above as can be known, LED is arranged at on a slice circuit board simultaneously with flash of light LED because the present invention will focus automatically, thus not only can save the space, and can make the brightness of automatic focusing LED improve 50%.Moreover, use the cost that method of the present invention can also reduce material and manufacturing, its total cost approximately can reduce by 20%.In addition, not only can on single circuit board, obtain multi-functional illumination effect, can also increase the usage quantity of flash of light LED, to improve brightness.
Though the present invention discloses preferred embodiment as above; right its is not in order to limiting the present invention, anyly has the knack of this skill person, without departing from the spirit and scope of the present invention; when can doing various changes and retouching, so protection scope of the present invention should be as the criterion with the claim scope of applying for a patent.
Claims (10)
1. a light-emitting diode (LED) encapsulating structure is characterized in that, comprises:
One circuit board;
One conductor layer is arranged on the circuit board;
At least one automatic focusing LED is arranged on the conductor layer, with the bonding conductor layer;
At least one flash of light LED is arranged on the conductor layer, with the bonding conductor layer;
One reflecting member is located on the circuit board outer rim; And
One molded structure is inserted in the reflecting member, to encapsulate automatic focusing LED and flash of light LED.
2. package structure for LED as claimed in claim 1 is characterized in that, this conductor layer is made up of one first, 1 second, 1 the 3rd and 1 the 4th conductor region.
3. package structure for LED as claimed in claim 2 is characterized in that, the positive pole of this conductor region is connected with the P type electrode of the LED that focuses automatically, flash of light LED, and the negative pole of conductor region is connected with the N type electrode of the LED that focuses automatically, flash of light LED;
4. package structure for LED as claimed in claim 1 is characterized in that, the material of this conductor region be selected from gold, silver, copper, platinum, aluminium, tin, magnesium with and the group that formed of combination in any.
5. package structure for LED as claimed in claim 1 is characterized in that, this molded structure be selected from epoxy resin, acryl, silica gel with and the group that formed of combination in any.
6. package structure for LED as claimed in claim 1 is characterized in that this package structure for LED also comprises the semiglobe of a translucidus, is arranged on the molded structure.
7. a package structure for LED is characterized in that, comprises:
One circuit board;
One first, 1 second and 1 the 3rd conductor region is arranged on this circuit board;
At least one automatic focusing LED is arranged on first conductor region, and connects first conductor region and second conductor region;
At least one flash of light LED is arranged on first conductor region, and connects first conductor region and the second and the 3rd conductor region, and the LED that wherein focuses automatically is connected with the positive pole of conductor region with the P type electrode of flash of light LED, and N type electrode is connected with the negative pole of conductor region;
One reflecting member is located on board edge; And
One molded structure is inserted in the reflecting member, to encapsulate automatic focusing LED and flash of light LED.
8. package structure for LED as claimed in claim 7 is characterized in that, this molded structure be selected from epoxy resin, acryl, silica gel with and the group that formed of combination in any.
9. package structure for LED as claimed in claim 7 is characterized in that, the material of this conductor region be selected from gold, silver, copper, platinum, aluminium, tin, magnesium with and the group that formed of combination in any.
10. package structure for LED as claimed in claim 7 is characterized in that this package structure for LED also comprises the semiglobe of a light transmission, is arranged on the molded structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610079808 CN100555629C (en) | 2006-05-08 | 2006-05-08 | Package structure for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610079808 CN100555629C (en) | 2006-05-08 | 2006-05-08 | Package structure for LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101079415A true CN101079415A (en) | 2007-11-28 |
| CN100555629C CN100555629C (en) | 2009-10-28 |
Family
ID=38906771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610079808 Expired - Fee Related CN100555629C (en) | 2006-05-08 | 2006-05-08 | Package structure for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100555629C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103579210A (en) * | 2012-07-31 | 2014-02-12 | 赵依军 | Connection method of LED unit and heat dissipation substrate |
| CN104752579A (en) * | 2013-12-25 | 2015-07-01 | 常州欧密格光电科技有限公司 | Ultrathin high-effect Flash light emitting diode (LED) element and preparation method thereof |
-
2006
- 2006-05-08 CN CN 200610079808 patent/CN100555629C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103579210A (en) * | 2012-07-31 | 2014-02-12 | 赵依军 | Connection method of LED unit and heat dissipation substrate |
| CN104752579A (en) * | 2013-12-25 | 2015-07-01 | 常州欧密格光电科技有限公司 | Ultrathin high-effect Flash light emitting diode (LED) element and preparation method thereof |
| WO2015096181A1 (en) * | 2013-12-25 | 2015-07-02 | 常州欧密格光电科技有限公司 | Ultrathin high-efficacy flash led element and preparation process therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100555629C (en) | 2009-10-28 |
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Granted publication date: 20091028 Termination date: 20110508 |