CN1521863A - Light-emitting diode packaging device - Google Patents
Light-emitting diode packaging device Download PDFInfo
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- CN1521863A CN1521863A CNA031023649A CN03102364A CN1521863A CN 1521863 A CN1521863 A CN 1521863A CN A031023649 A CNA031023649 A CN A031023649A CN 03102364 A CN03102364 A CN 03102364A CN 1521863 A CN1521863 A CN 1521863A
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Abstract
A packaging apparatus for light-emitting diodes comprises an insulation bearing seat with a groove or a through hole formed thereon, the groove or through hole has two stepped portions for providing two median surfaces, two flat sheet metal are formed on the two median surfaces separately from each other, and are connected to the two metal pads arranged outside the groove of the through hole, two matching lines are connected to the two electrodes and two flat metal sheet of the light-emitting diode, the groove and the through hole are filled by resin so as to seal the light-emitting diode and the two matching lines.
Description
Technical field
The present invention relates to a kind of packaging system of light-emitting diode.The invention particularly relates to a kind of packaging system that strengthens the luminous efficiency of light-emitting diode, have the advantage of the packaging technology of simplifying light-emitting diode, and then boost productivity and reduce production costs.
Background technology
In the application of commercial and industry, light-emitting diode provides than incandescent lamp and fluorescent lamp is more efficient and cost is lower light source.In recent years, various packaging systems and method have been developed, for example SMD LED surface-mount device LED packaging system and flip chip type packaging system at light-emitting diode.
Fig. 1 shows the profile of an example of packaging system of the light-emitting diode of prior art.With reference to Fig. 1, a light-emitting diode 10 is installed on the encapsulation base 20 in the mode of flip-chip.Light-emitting diode 10 has a substrate 11, one first conductive-type semiconductor layer 12, is formed at substrate 11 tops, and one second conductive-type semiconductor layer 13, is formed at first conductive-type semiconductor layer, 12 tops.In addition, on a predetermined zone of first conductive-type semiconductor layer 12, be formed with one first electrode 14, and on a predetermined zone of second conductive-type semiconductor layer 13, be formed with one second electrode 15.The manufacture method of light-emitting diode 10 and mode of operation are all as everyone knows, so this paper repeats no more.
In the packaging system of prior art shown in Figure 1, two metal soldered balls 16 and 17 are formed at respectively on first electrode 14 and second electrode 15 of light-emitting diode 10.Then in the mode of flip-chip, two metal soldered balls 16 aim at respectively and are engaged in that formed first pad 21 and second fills up on 22 on the encapsulation base 20 with 17.At last, use a transparent resin 18 sealed light emitting diodes 10, use the encapsulation of the light-emitting diode of finishing prior art.When power supply was supplied to light-emitting diode 10 via first pad, 21 and second pad 22, the light that light-emitting diode 10 produced can inject to the external world with transparent resin 18 via substrate 11, and was indicated as the arrow among Fig. 1.
The packaging system of prior art shown in Figure 1 has following shortcoming.At first, metal soldered ball 16 may contact each other with 17 and cause first electrode 14 and 15 short circuits of second electrode.Moreover, when light-emitting diode 10 is installed on the encapsulation base 20 in the mode of flip-chip, must guarantee that metal soldered ball 16 and 17 accurately aims at first pad, 21 and second pad 22 respectively, cause making difficult more and the increase production cost.
In addition, expectation can provide a kind of packaging system than prior art shown in Figure 1 to have the packaging system of the luminous efficiency of better light-emitting diode, uses and reduces the heat that is produced in the operation, and then increase the useful life and the reliability of light-emitting diode.
Summary of the invention
In order to overcome weak point of the prior art, the object of the present invention is to provide a kind of packaging system of light-emitting diode, in order to the packaging technology of simplification light-emitting diode, and then boost productivity and reduce production costs.
The present invention also aims to provide a kind of packaging system of light-emitting diode, have the luminous efficiency of better light-emitting diode, use and reduce the heat that is produced in the operation, and then increase the useful life and the reliability of light-emitting diode.
In order to finish purpose of the present invention, the invention provides a kind of packaging system, have a light-emitting diode of a substrate and two electrodes in order to encapsulation, it is characterized in that: this packaging system comprises:
One transparent insulation load bearing seat is formed with a groove, and this groove has a bottom surface, and wherein this bottom surface is in order to supporting this substrate, and the degree of depth of this groove is enough in order to hold this light-emitting diode fully;
At least one planar metal layer is formed on the zone that is positioned in the surface of this transparent insulation load bearing seat beyond this groove,
At least one distribution is in order to connect in one deck in this at least one planar metal layer and this two electrode; And
One resin fills up this groove and covers the part of this at least one planar metal layer, so as to sealing this light-emitting diode and this at least one distribution.
The present invention also provides a kind of packaging system, has a light-emitting diode of a substrate and two electrodes in order to encapsulation, and it is characterized in that: this packaging system comprises:
One transparent insulation load bearing seat, be formed with a groove, this groove has a bottom surface and at least one end difference that is connected in this bottom surface, this at least one end difference has side wall surface, be connected in this bottom surface, table top in the middle of, with a upside wall, wherein this bottom surface is in order to supporting this substrate, and the degree of depth of this groove is enough in order to hold this light-emitting diode fully;
At least one planar metal layer is formed on this centre table top and this upside wall of this at least one end difference,
At least one metal gasket is formed on the zone that is positioned in the surface of this transparent insulation load bearing seat beyond this groove, and is connected in this at least one planar metal layer.
At least one distribution is in order to connect the part that is arranged in this centre table top in this at least one planar metal layer and this two electrode one; And
One resin fills up this groove, so as to sealing this light-emitting diode and this at least one distribution.
The present invention provides a kind of packaging system again, has a light-emitting diode of a substrate and two electrodes in order to encapsulation, and it is characterized in that: this packaging system comprises:
One insulation load bearing seat is formed with a through hole, and this through hole has a under shed and a upper shed, and wherein this substrate is towards this under shed, and the degree of depth of this through hole is enough in order to hold this light-emitting diode fully;
At least one planar metal layer is formed on the zone that is positioned in the surface of this insulation load bearing seat beyond this through hole,
At least one distribution is in order to connect in one deck in this at least one planar metal layer and this two electrode; And
One resin fills up this through hole and covers the part of this at least one planar metal layer, so as to sealing this light-emitting diode and this at least one distribution.
The present invention provides a kind of packaging system again, has a light-emitting diode of a substrate and two electrodes in order to encapsulation, and it is characterized in that: this packaging system comprises:
One insulation load bearing seat, be formed with a through hole, this through hole has a under shed, a upper shed, and is connected at least one end difference between this under shed and upper shed, this at least one end difference has side wall surface, be connected in this under shed, table top in the middle of, with a upside wall, be connected in this upper shed, wherein this substrate is towards this under shed, and the degree of depth of this through hole is enough in order to hold this light-emitting diode fully;
At least one planar metal layer is formed on this centre table top and this upside wall of this at least one end difference,
At least one metal gasket is formed on the zone that is positioned in the surface of this insulation load bearing seat beyond this through hole, and is connected in this at least one planar metal layer.
At least one distribution is in order to connect the part that is arranged in this centre table top in this at least one planar metal layer and this two electrode one; And
One resin fills up this through hole, so as to sealing this light-emitting diode and this at least one distribution.
In other words,, provide a kind of packaging system of light-emitting diode, comprise a transparent insulation load bearing seat that is formed with a groove according to an aspect of of the present present invention.The bottom surface of groove is in order to support the substrate of light-emitting diode.The degree of depth of groove is enough in order to hold light-emitting diode fully.At least one planar metal layer is formed on the zone that is positioned in the surface of transparent insulation load bearing seat beyond the groove.At least one distribution connects in two electrodes of one deck at least one planar metal layer and light-emitting diode.One resin fills up groove and covers the part of at least one planar metal layer, so as to sealed light emitting diode and at least one distribution.
According to another aspect of the present invention, groove can have at least one end difference, in order at least one middle table top to be provided.At least one planar metal layer is formed at least one middle table top and is connected to and is positioned at groove at least one metal gasket in addition.At least one distribution connects in two electrodes of one deck at least one planar metal layer and light-emitting diode.One resin fills up groove, so as to sealed light emitting diode and at least one distribution.
Provide a kind of packaging system of light-emitting diode again on the other hand according to of the present invention, comprise an insulation load bearing seat that is formed with a through hole.The substrate of light-emitting diode is towards the under shed of through hole.The degree of depth of through hole is enough in order to hold light-emitting diode fully.At least one planar metal layer is formed on the zone that is positioned in the surface of transparent insulation load bearing seat beyond the through hole.At least one distribution connects in two electrodes of one deck at least one planar metal layer and light-emitting diode.One resin fills up through hole and covers the part of at least one planar metal layer, so as to sealed light emitting diode and at least one distribution.
Foundation is of the present invention, and through hole can have at least one end difference more on the other hand, in order at least one middle table top to be provided.At least one planar metal layer is formed at least one middle table top and is connected to and is positioned at through hole at least one metal gasket in addition.At least one distribution connects in two electrodes of at least one planar metal layer and light-emitting diode.One resin fills up through hole, so as to sealed light emitting diode and at least one distribution.
As mentioned above, packaging system provided by the invention has been simplified the seal apparatus technology of light-emitting diode, and then improved productivity ratio and reduced production cost, this packaging system also has the luminous efficiency of better light-emitting diode, the heat that can reduce in the operation to be produced, and then increase the useful life and the reliability of light-emitting diode.
Description of drawings
Fig. 1 shows the profile of an example of packaging system of the light-emitting diode of prior art;
Fig. 2 (a) shows the vertical view according to the transparent insulation load bearing seat of first embodiment of the invention;
Fig. 2 (b) shows the profile according to the packaging system of the light-emitting diode of the first embodiment of the invention line A-A ' in Fig. 2 (a);
Fig. 3 (a) shows the vertical view according to the transparent insulation load bearing seat 40 of second embodiment of the invention;
Fig. 3 (b) shows the profile according to the packaging system of the light-emitting diode of the second embodiment of the invention line B-B ' in Fig. 3 (a);
Fig. 4 shows the profile according to the packaging system of the light-emitting diode of third embodiment of the invention;
Fig. 5 shows the profile according to the packaging system of the light-emitting diode of fourth embodiment of the invention;
Fig. 6 shows the profile according to the packaging system of the light-emitting diode of fifth embodiment of the invention; And
Fig. 7 shows the profile according to the packaging system of the light-emitting diode of sixth embodiment of the invention.
Embodiment
Explanation hereinafter and accompanying drawing will make aforementioned and other purpose of the present invention, feature, more obvious with advantage.
Describe in detail according to preferred embodiment of the present invention hereinafter with reference to icon.
Fig. 2 (a) shows the vertical view according to the transparent insulation load bearing seat 30 of first embodiment of the invention, and Fig. 2 (b) shows the profile according to the packaging system of the light-emitting diode of the first embodiment of the invention line A-A ' in Fig. 2 (a).
With reference to Fig. 2 (a), in the zone of about central authorities, be formed with a groove 31 according to the transparent insulation load bearing seat 30 of first embodiment of the invention.Groove 31 has a bottom surface 32 and two side wall surface 33a and 33b.For example, transparent insulation load bearing seat 30 is formed by glass.On the surface of transparent insulation load bearing seat 30, in the zone beyond groove 31, be formed with two planar metal layer 34a and 34b separated from one another.In addition, two metal gasket 35a and 35b are formed at respectively on planar metal layer 34a and the 34b, are positioned on the neighboring area of transparent insulation load bearing seat 30.
With reference to Fig. 2 (b), light-emitting diode 10 is put into groove 31 and is made that the substrate 11 of light-emitting diode 10 is supported by the bottom surface 32 of groove 31.For example, the substrate 11 of light-emitting diode 10 can be fixed on the bottom surface 32 by transparent binder, to make things convenient for the carrying out of subsequent technique.Should notice that in the present invention light-emitting diode 10 is not limited to shown particular material type of icon or structure, and can be any materials type or structure.For example, the material type of light-emitting diode 10 can be persons like that such as AlGaInP type, aluminum indium gallium nitride type, InGaN type, aluminum gallium arsenide type or carborundum type.The configuration of light-emitting diode 10 can for two electrodes in the same side and have a configuration of transparency carrier.Moreover light-emitting diode 10 can be designed to positive luminous or back side illuminated.In addition, light-emitting diode also 10 can include a reflector and a transparency conducting layer.
Have enough degree of depth according to groove 31 of the present invention and make light-emitting diode 10 can be contained in fully in the groove 31, can not expose from the opening of groove 31.For example, the degree of depth of groove 31 is less than 10mm.Distribution 36a is in order to connecting first electrode 14 and planar metal layer 34a, and distribution 36b is in order to connect second electrode 15 and planar metal layer 34b.Resin 37 fills up groove 31 and covers the part of exposing groove 31 among distribution 36a and the 36b, makes light-emitting diode 10 and distribution 36a and 36b be sealed in the resin 37.For example, resin 37 can be formed by epoxy resin.Can add material in the resin 37, to strengthen the heat dispersion of packaging system with high-termal conductivity.And, can add material in the resin 37 with highly reflective, the part towards resin 37 is reflected to improve luminous efficiency.In addition, in order to improve luminous efficiency more, a reflector (not icon) can be coated on the resin 37, in order to the light that produced of reflection light-emitting diode 10 towards the bottom surface 32.
When power supply was supplied to light-emitting diode 10 via outstanding metal gasket 35a and 35b, the light that light-emitting diode 10 produced can inject to the external world with transparent insulation load bearing seat 30 via substrate 11, and was indicated as the arrow among Fig. 2 (b).Compare with the packaging system of prior art shown in Figure 1,, can finish, need not use the fine registration technology, and then boost productivity and reduce production costs by simple package technology according to the packaging system of light-emitting diode of the present invention.
Fig. 3 (a) shows the vertical view according to the transparent insulation load bearing seat 40 of second embodiment of the invention, and Fig. 3 (b) shows the profile according to the packaging system of the light-emitting diode of the second embodiment of the invention line B-B ' in Fig. 3 (a).Only illustrate that hereinafter second embodiment is different from the first embodiment part.
With reference to Fig. 3 (a) and 3 (b), be different from according to the first embodiment of the invention part according to second embodiment of the invention and be to be formed with two end differences in the groove 41 according to second embodiment of the invention.Particularly, downside wall 43a, middle table top 44a, with upside wall 45a constitute an end difference, downside wall 43b, middle table top 44b, with upside wall 45b then constitute another end difference.Moreover on table top 44a and the upside wall 45a, planar metal layer 46b then was formed on middle table top 44b and the upside wall 45b in the middle of planar metal layer 46a was formed at.On the surface of transparent insulation load bearing seat 30, in the zone beyond groove 31, be formed with two metal gasket 47a and 47b separated from one another.Metal gasket 47a is connected in planar metal layer 46a, and metal gasket 47b then is connected in planar metal layer 46b.
Light-emitting diode 10 is put into groove 41 and is made that the substrate 11 of light-emitting diode 10 is supported by the bottom surface 42 of groove 41.Distribution 48a is in order to connecting the part that is positioned among first electrode 14 and the planar metal layer 46a on the way station face 44a, and distribution 48b is in order to connect the part that is positioned among second electrode 15 and the planar metal layer 46b on the way station face 44b.Have the design of the groove 41 of two end differences by this kind, distribution 48a and 48b can be contained in the groove 41 fully.At last, resin 49 fills up groove 41 and covers distribution 48a and 48b, makes light-emitting diode 10 and distribution 48a and 48b be sealed in the resin 49.For example, resin 49 can be formed by epoxy resin.Can add material in the resin 49, to strengthen the heat dispersion of packaging system with high-termal conductivity.Moreover, can add material in the resin 49, the part towards resin 49 is reflected to improve luminous efficiency with highly reflective.In addition, in order to improve luminous efficiency more, a reflector (not icon) can be coated on the resin 49, in order to the light that produced of reflection light-emitting diode 10 towards the bottom surface 42.
From Fig. 2 (b) and Fig. 3 (b) more as can be known because distribution 48a and 48b can be positioned at groove 41 fully, the packaging system of the light-emitting diode of second embodiment has the size less than first embodiment.
Fig. 4 shows the profile according to the packaging system of the light-emitting diode of third embodiment of the invention.Only illustrate that hereinafter the 3rd embodiment is different from the first embodiment part.
With reference to Fig. 4, be different from according to third embodiment of the invention that be according to the first embodiment of the invention part need not be for transparent and be formed with a through hole 51 in the location of about central authorities according to the insulation load bearing seat 50 of third embodiment of the invention.Through hole 51 passes insulation load bearing seat 50, and forms under shed 52a and upper shed 52b.Should note in the present invention, the aperture size of under shed 52a can greater than, equal or, be not limited to example shown in Figure 4 less than the aperture size of upper shed 52b.
Under the situation of sealing under shed 52a, inject transparent resin 53a in through hole 51 from upper shed 52b, make through hole 51 only partly be filled up.Then, put into light-emitting diode 10 in through hole 51, make that the substrate 11 of light-emitting diode 10 is supported by transparent resin 53a via upper shed 52b.Through baking processing and after hardening, light-emitting diode 10 promptly is bonded on the transparent resin 53a in the through hole 51 at transparent resin 53a.At last, carry out distribution and connect technology and use transparent resin 53b to fill up the part of exposing through hole 51 among through hole 51 and covering distribution 36a and the 36b, make light-emitting diode 10 and distribution 36a and 36b be sealed in transparent resin 53a and the 53b.
When power supply was supplied to light-emitting diode 10 via outstanding metal gasket 35a and 35b, the light that light-emitting diode 10 produced can inject to the external world with transparent resin 53a via substrate 11, and was indicated as the arrow among Fig. 4.Since light does not need to inject to the external world via insulation load bearing seat 50, so according to the insulation load bearing seat 50 of third embodiment of the invention be not limited to by transparent material for example glass formed, and also can be formed by for example combination of pottery, AlN, SiC, plastics, resin or printed circuit board (PCB) and previous materials.In addition, insulation load bearing seat 50 can also be combined by a plurality of member, for example forms by using an insulating material adventitia to coat a metallic core body.
Fig. 5 shows the profile according to the packaging system of the light-emitting diode of fourth embodiment of the invention.Only illustrate that hereinafter the 4th embodiment is different from the second embodiment part.
With reference to Fig. 5, be different from according to fourth embodiment of the invention that be according to the second embodiment of the invention part need not be for transparent and be formed with a through hole 61 in the location of about central authorities according to the insulation load bearing seat 60 of fourth embodiment of the invention.Through hole 61 passes insulation load bearing seat 60, and forms under shed 62a and upper shed 62b.Should note in the present invention, the aperture size of under shed 62a can greater than, equal or, be not limited to example shown in Figure 5 less than the aperture size of upper shed 62b.
As the groove 41 of second embodiment, also be formed with two end differences in the through hole 61.By being similar to the manufacture method of the 3rd embodiment, the substrate 11 of light-emitting diode 10 is supported by transparent resin 63a, transparent resin 63b fills up through hole 61 and covers distribution 48a and 48b then, makes light-emitting diode 10 and distribution 48a and 48b be sealed in transparent resin 63a and the 63b.Insulation load bearing seat 60 be not limited to by transparent material for example glass formed, and also can be formed by for example combination of pottery, AlN, SiC, plastics, resin or printed circuit board (PCB) and previous materials.In addition, insulation load bearing seat 60 can also be combined by a plurality of member, for example forms by using an insulating material adventitia to coat a metallic core body.
From Fig. 4 and Fig. 5 more as can be known because distribution 48a and 48b can be positioned at through hole 61 fully, the packaging system of the light-emitting diode of the 4th embodiment has the size less than the 3rd embodiment.
Fig. 6 shows the profile according to the packaging system of the light-emitting diode of fifth embodiment of the invention.Only illustrate that hereinafter the 5th embodiment is different from the 3rd embodiment part.
In the 5th embodiment, formed by following resin portion 73a and last resin portion 73b in order to sealed light emitting diode 10 and the resin of distribution 36a and 36b.Following resin portion 73a is formed by material transparent, in order to penetrate passage as light.The preferably forms down resin portion 73a for selecting for the high material of the refractive index match degree of substrate 11, can reduce the interface of light between substrate 11 and following resin portion 73a total reflection takes place.Last resin portion 73b can be formed by reflexive material of tool or the resin that is doped with the highly reflective material, in order to reflection ray towards resin portion 73a down.In addition, in order to improve luminous efficiency more, a reflector (not icon) can be coated on the resin 73b, in order to the light that produced of reflection light-emitting diode 10 towards under shed 52a.Moreover dioptric lens 74 can be arranged at the under shed 52a place of through hole 51, use the light of control from the packaging system ejaculation of light-emitting diode.
Fig. 7 shows the profile according to the packaging system of the light-emitting diode of sixth embodiment of the invention.Only illustrate that hereinafter the 6th embodiment is different from the 4th embodiment part.
In the 6th embodiment, formed by following resin portion 83a and last resin portion 83b in order to sealed light emitting diode 10 and the resin of distribution 48a and 48b.Following resin portion 83a is formed by material transparent, in order to penetrate passage as light.The preferably forms down resin portion 83a for selecting for the high material of the refractive index match degree of substrate 11, can reduce the interface of light between substrate 11 and following resin portion 83a total reflection takes place.Last resin portion 83b can be formed by reflexive material of tool or the resin that is doped with the highly reflective material, in order to reflection ray towards resin portion 83a down.In addition, for example phosphor or a fluorescent layer 84 are coated the under shed 62a place of through hole 61 can be doped with a fluorescent material among the following resin portion 83a.Based on the porosity and the coating thickness of fluorescent substance, the wavelength of the light that penetrates from the packaging system of light-emitting diode is changed, and using provides the light with desired color.
Though the present invention was illustrated as illustration by preferred embodiment already, be interpreted as: the invention is not restricted to the embodiment that this is disclosed.On the contrary, this invention is intended to contain is tangible various modification and similar configuration to those skilled in the art.Therefore, the scope of claim should be according to the widest annotation, and this type of is revised and similar configuration to contain all.For example, be limited to rectangle and can be according to the upper shed of insulation load bearing seat of the present invention, groove and through hole and the plane kenel of under shed are neither for Any shape is for example circular, ellipse or polygon.
Claims (50)
1. packaging system has a light-emitting diode of a substrate and two electrodes in order to encapsulation, and it is characterized in that: this packaging system comprises:
One transparent insulation load bearing seat is formed with a groove, and this groove has a bottom surface, and wherein this bottom surface is in order to supporting this substrate, and the degree of depth of this groove is enough in order to hold this light-emitting diode fully;
At least one planar metal layer is formed on the zone that is positioned in the surface of this transparent insulation load bearing seat beyond this groove,
At least one distribution is in order to connect in one deck in this at least one planar metal layer and this two electrode; And
One resin fills up this groove and covers the part of this at least one planar metal layer, so as to sealing this light-emitting diode and this at least one distribution.
2. packaging system as claimed in claim 1 is characterized in that: also comprise:
At least one metal gasket, be formed at this at least one planar metal layer not by on the part that this resin covered.
3. packaging system as claimed in claim 1 is characterized in that: this transparent insulation load bearing seat is formed by glass.
4. packaging system as claimed in claim 1 is characterized in that: this degree of depth of this groove is less than 10mm.
5. packaging system as claimed in claim 1 is characterized in that: this groove shaped is formed in the zone of about central authorities of this transparent insulation load bearing seat.
6. packaging system as claimed in claim 1 is characterized in that: this underrun one transparent binder fixes this substrate.
7. packaging system as claimed in claim 1 is characterized in that: this resin is formed by epoxy resin.
8. packaging system as claimed in claim 1 is characterized in that: be added with the material with high-termal conductivity in this resin, in order to strengthen the heat dispersion of this packaging system.
9. packaging system as claimed in claim 1 is characterized in that: be added with the material with highly reflective in this resin, in order to reflect the light that this light-emitting diode produces.
10. packaging system as claimed in claim 1 is characterized in that: the material type of this light-emitting diode is AlGaInP type, aluminum indium gallium nitride type, InGaN type, aluminum gallium arsenide type or carborundum type.
11. packaging system as claimed in claim 1 is characterized in that: also comprise a reflector, coat on this resin, in order to reflect the light that this light-emitting diode produces.
12. a packaging system has a light-emitting diode of a substrate and two electrodes in order to encapsulation, it is characterized in that: this packaging system comprises:
One transparent insulation load bearing seat, be formed with a groove, this groove has a bottom surface and at least one end difference that is connected in this bottom surface, this at least one end difference has side wall surface, be connected in this bottom surface, table top in the middle of, with a upside wall, wherein this bottom surface is in order to supporting this substrate, and the degree of depth of this groove is enough in order to hold this light-emitting diode fully;
At least one planar metal layer is formed on this centre table top and this upside wall of this at least one end difference,
At least one metal gasket is formed on the zone that is positioned in the surface of this transparent insulation load bearing seat beyond this groove, and is connected in this at least one planar metal layer.
At least one distribution is in order to connect the part that is arranged in this centre table top in this at least one planar metal layer and this two electrode one; And
One resin fills up this groove, so as to sealing this light-emitting diode and this at least one distribution.
13. packaging system as claimed in claim 12 is characterized in that: this transparent insulation load bearing seat is formed by glass.
14. packaging system as claimed in claim 12 is characterized in that: this degree of depth of this groove is less than 10mm.
15. packaging system as claimed in claim 12 is characterized in that: this groove shaped is formed in the zone of about central authorities of this transparent insulation load bearing seat.
16. packaging system as claimed in claim 12 is characterized in that: this underrun one transparent adhesive fixes this substrate.
17. packaging system as claimed in claim 12 is characterized in that: this resin is formed by epoxy resin.
18. packaging system as claimed in claim 12 is characterized in that: be added with material in this resin, in order to strengthen the heat dispersion of this packaging system with high-termal conductivity.
19. packaging system as claimed in claim 12 is characterized in that: be added with material in this resin, in order to reflect the light that this light-emitting diode produces with highly reflective.
20. packaging system as claimed in claim 12 is characterized in that: the material type of this light-emitting diode is AlGaInP type, aluminum indium gallium nitride type, InGaN type, aluminum gallium arsenide type or carborundum type.
21. packaging system as claimed in claim 12 is characterized in that: also comprise a reflector, coat on this resin, in order to reflect the light that this light-emitting diode produces.
22. a packaging system has a light-emitting diode of a substrate and two electrodes in order to encapsulation, it is characterized in that: this packaging system comprises:
One insulation load bearing seat is formed with a through hole, and this through hole has a under shed and a upper shed, and wherein this substrate is towards this under shed, and the degree of depth of this through hole is enough in order to hold this light-emitting diode fully;
At least one planar metal layer is formed on the zone that is positioned in the surface of this insulation load bearing seat beyond this through hole,
At least one distribution is in order to connect in one deck in this at least one planar metal layer and this two electrode; And
One resin fills up this through hole and covers the part of this at least one planar metal layer, so as to sealing this light-emitting diode and this at least one distribution.
23. packaging system as claimed in claim 22 is characterized in that: also comprise:
At least one metal gasket, be formed at this at least one metal level not by on the part that this resin covered.
24. packaging system as claimed in claim 22 is characterized in that: this insulation load bearing seat is made of glass, pottery, AlN, SiC, plastics, resin or printed circuit board (PCB) and their combination.
25. packaging system as claimed in claim 22 is characterized in that: this insulation load bearing seat forms by using an insulating material adventitia to coat a metallic core body.
26. packaging system as claimed in claim 22 is characterized in that: this degree of depth of this through hole is less than 10mm.
27. packaging system as claimed in claim 22 is characterized in that: this through hole is formed in the zone of about central authorities of this insulation load bearing seat.
28. packaging system as claimed in claim 22 is characterized in that: this resin is formed by epoxy resin.
29. packaging system as claimed in claim 22 is characterized in that: be added with material in this resin, in order to strengthen the heat dispersion of this packaging system with high-termal conductivity.
30. packaging system as claimed in claim 22, it is characterized in that: the part that is positioned in this resin between this light-emitting diode and this under shed is formed by having for the high material of the refractive index match degree of this substrate, the total reflection that takes place in order to the place, interface that reduces this substrate and this interlaminar resin.
31. packaging system as claimed in claim 22 is characterized in that: the part that is positioned in this resin between this upper shed and this light-emitting diode is added with the material with highly reflective, in order to reflect the light that this light-emitting diode produces.
32. packaging system as claimed in claim 22 is characterized in that: also comprise a reflector, coat on this resin, in order to reflect the light that this light-emitting diode produces.
33. packaging system as claimed in claim 22 is characterized in that: also comprise dioptric lens, be arranged at this lower opening of this through hole.
34. packaging system as claimed in claim 22 is characterized in that: also comprise a fluorescent layer, coat this lower opening of this through hole, in order to the light with desired color to be provided.
35. packaging system as claimed in claim 22 is characterized in that: the part that is positioned in this resin between this light-emitting diode and this under shed is doped with a fluorescent material, in order to the light with desired color to be provided.
36. packaging system as claimed in claim 22 is characterized in that: the material type of this light-emitting diode is AlGaInP type, aluminum indium gallium nitride type, InGaN type, aluminum gallium arsenide type or carborundum type.
37. a packaging system has a light-emitting diode of a substrate and two electrodes in order to encapsulation, it is characterized in that: this packaging system comprises:
One insulation load bearing seat, be formed with a through hole, this through hole has a under shed, a upper shed, and is connected at least one end difference between this under shed and upper shed, this at least one end difference has side wall surface, be connected in this under shed, table top in the middle of, with a upside wall, be connected in this upper shed, wherein this substrate is towards this under shed, and the degree of depth of this through hole is enough in order to hold this light-emitting diode fully;
At least one planar metal layer is formed on this centre table top and this upside wall of this at least one end difference,
At least one metal gasket is formed on the zone that is positioned in the surface of this insulation load bearing seat beyond this through hole, and is connected in this at least one planar metal layer.
At least one distribution is in order to connect the part that is arranged in this centre table top in this at least one planar metal layer and this two electrode one; And
One resin fills up this through hole, so as to sealing this light-emitting diode and this at least one distribution.
38. packaging system as claimed in claim 37 is characterized in that: this insulation load bearing seat is made of glass, pottery, AlN, SiC, plastics, resin or printed circuit board (PCB) and their combination.
39. packaging system as claimed in claim 37 is characterized in that: this insulation load bearing seat forms by using an insulating material adventitia to coat a metallic core body.
40. packaging system as claimed in claim 37 is characterized in that: this degree of depth of this through hole is less than 10mm.
41. packaging system as claimed in claim 37 is characterized in that: this through hole is formed in the zone of about central authorities of this insulation load bearing seat.
42. packaging system as claimed in claim 37 is characterized in that: this resin is formed by epoxy resin.
43. packaging system as claimed in claim 37 is characterized in that: be added with material in this resin, in order to strengthen the heat dispersion of this packaging system with high-termal conductivity.
44. packaging system as claimed in claim 37, it is characterized in that: the part that is positioned in this resin between this light-emitting diode and this under shed is formed by having for the high material of the refractive index match degree of this substrate, the total reflection that takes place in order to the place, interface that reduces this substrate and this interlaminar resin.
45. packaging system as claimed in claim 37 is characterized in that: the part that is positioned in this resin between this upper shed and this light-emitting diode is added with the material with highly reflective, in order to reflect the light that this light-emitting diode produces.
46. packaging system as claimed in claim 37 is characterized in that: also comprise a reflector, coat on this resin, in order to reflect the light that this light-emitting diode produces.
47. packaging system as claimed in claim 37 is characterized in that: also comprise dioptric lens, be arranged at this lower opening of this through hole.
48. packaging system as claimed in claim 37 is characterized in that: also comprise a fluorescent layer, coat this lower opening of this through hole, in order to the light with desired color to be provided.
49. packaging system as claimed in claim 37 is characterized in that: the part that is positioned in this resin between this light-emitting diode and this under shed is doped with a fluorescent material, in order to the light with desired color to be provided.
50. packaging system as claimed in claim 37 is characterized in that: the material type of this light-emitting diode is AlGaInP type, aluminum indium gallium nitride type, InGaN type, aluminum gallium arsenide type or carborundum type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031023649A CN1521863A (en) | 2003-02-10 | 2003-02-10 | Light-emitting diode packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031023649A CN1521863A (en) | 2003-02-10 | 2003-02-10 | Light-emitting diode packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1521863A true CN1521863A (en) | 2004-08-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031023649A Pending CN1521863A (en) | 2003-02-10 | 2003-02-10 | Light-emitting diode packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1521863A (en) |
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| CN1750280B (en) * | 2004-09-15 | 2010-05-05 | 晶元光电股份有限公司 | Light emitting element and its producing method |
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