CN1750280B - Light emitting element and its producing method - Google Patents
Light emitting element and its producing method Download PDFInfo
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- CN1750280B CN1750280B CN200410078593A CN200410078593A CN1750280B CN 1750280 B CN1750280 B CN 1750280B CN 200410078593 A CN200410078593 A CN 200410078593A CN 200410078593 A CN200410078593 A CN 200410078593A CN 1750280 B CN1750280 B CN 1750280B
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- light
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- transparent base
- emitting component
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Abstract
This invention relates to a light emitting element and its manufacturing method, in which, the element includes: a transparent backing containing a top surface and a bottom surface and a recess prolonging to the bottom surface from the top, an open-end part of the recess is set at the side of the top surface, a LED in the recess, among which, a first and a second electrodes of the LED are facing the open-end part of the recess, the LED emits its light from the bottom surface of the backing and a protection layer covering the open-end part of the recess, which can be used in the crystal-clad orwhite light emitting elements.
Description
Technical field
The present invention relates to a kind of light-emitting component and manufacture method thereof.
The application of light-emitting diode is rather extensive, for example, can be applicable to optical display, laser diode, traffic signals sign, data memory device, communication device, lighting device and medical treatment device.In this technology, at present how technical staff's important topic is for improving emitting component, dwindling component size and simplify working process.
Background technology
The profile of Fig. 1 is another light-emitting diode structure that shows prior art.In Fig. 1, inverted LED crystal particle 31 is bonded in respectively on the lead frame 40,43 with scolder 41,42.Also promptly, LED crystal particle 31 is by connection gasket 9 and Ohmic electrode 10, is electrically connected on respectively on the base portion 43a of the base portion 40a of conductive frame 40 and conductive frame 43.
Above-mentioned LED crystal particle 31, owing to do not need any connecting line, and do not cover opaque Ohmic electrode or connection gasket on the light-emitting area 31a, so the unlikely minimizing of light-emitting area.But because in manufacture process, need carry out welding,, be easy to directly be sent to LED crystal particle 31, cause LED crystal particle 31 to be damaged via scolder when external force has when inhomogeneous slightly by external force.LED crystal particle is when being inverted bonding in addition, need program through accurate aligning, the connection gasket of luminous lamination can be engaged with scolder accurately with Ohmic electrode, and need keep the level of luminous lamination, its degree of difficulty is quite high, though thereby the light-emitting diode of this prior art is in there being product on the market, yet productivity ratio and qualification rate are on the low side, so that manufacturing cost is higher.
Summary of the invention
When how this case inventor solves the above problems in thinking, produce a kind of conception of light-emitting component, this light-emitting component is to comprise a transparent base, wherein this transparent base comprises a upper surface and lower surface, this transparent base has one by the downward groove that extends of upper surface, and an opening of this groove is in the upper surface side of this transparent base; One places the light-emitting diode of this groove, and wherein one first electrode of this light-emitting diode and one second electrode are towards the peristome of groove; An and protective layer that covers the part peristome be formed at this groove.
A kind of light-emitting component of the present invention wherein can form first conductive film that is electrically connected with this first electrode in this transparent base upper surface side.One second conductive film that is electrically connected with this second electrode.
A kind of light-emitting component of the present invention, wherein the upper surface of this transparent base can form a plurality of grooves, inserts a light-emitting diode respectively in these a plurality of grooves.
The manufacture method of a kind of light-emitting component of the present invention, comprise: a transparent base is provided, wherein this transparent base comprises a upper surface and lower surface, and this base material has one by the downward groove that extends of upper surface, and an opening of this groove is in the upper surface side of this transparent base; Place a light-emitting diode in this groove, wherein one first electrode of this light-emitting diode and one second electrode are towards the peristome of groove; Form the part peristome that a protective layer is covered in this groove; And be electrically connected this first electrode and this second electrode.
First conductive film and second conductive film form with the method that galvanoplastic, print process, metal mask (metal mask) vapour deposition method or other figures limit in the light-emitting component of the present invention.
In the light-emitting component of the present invention, utilize ejection formation or other molding modes that transparent base is made groove in advance, place light-emitting diode again in groove.
Light-emitting component of the present invention, wherein this protective layer is to be covered in fully behind this groove again via etching, etches away protective layer, exposed portions serve first electrode and part second electrode of first electrode and second electrode top.
Light-emitting component of the present invention, wherein this protective layer is to be covered in this part groove with a photosensitive material, and exposed portions serve first electrode and part second electrode.
According to an aspect of the present invention, a kind of light-emitting component is provided, has comprised: a transparent base, wherein this transparent base comprises a upper surface and lower surface, this transparent base has one by the downward groove that extends of upper surface, and an opening of this groove is in the upper surface side of this transparent base; One places the light-emitting diode of this groove, and wherein one first electrode of this light-emitting diode and one second electrode be towards the peristome of groove, and the light of being launched by light-emitting diode penetrates via the lower face side of transparent base; One covers the part peristome and the part that are formed at this groove exposes first electrode of this light-emitting diode and the protective layer of second electrode; First conductive film that a part covers this first electrode and is electrically connected with it; And a part covers second conductive film that this second electrode also is electrically connected with it.
According to another aspect of the present invention, a kind of manufacture method of light-emitting component is provided, comprise: a transparent base is provided, wherein this transparent base comprises a upper surface and lower surface, this base material has one by the downward groove that extends of upper surface, and an opening of this groove is in the upper surface side of this transparent base; Place a light-emitting diode in this groove, wherein one first electrode of this light-emitting diode and one second electrode be towards the peristome of groove, and the light of being launched by light-emitting diode penetrates via the lower face side of transparent base; Form a part peristome and a part that is covered in this groove and expose first electrode of this light-emitting diode and the protective layer of second electrode; And a part of the first film lead that covers this first electrode and be electrically connected with it of formation and a part of second film wire that covers this second electrode and be electrically connected with it.
Description of drawings
Fig. 1 is a schematic diagram, shows the crystal-coated light-emitting element of a known technology.
Fig. 2 A-2C is the manufacturing process of the light-emitting component of demonstration preferred embodiment, and wherein Fig. 2 C shows a kind of light-emitting component according to a preferred embodiment of the present invention.
Symbol description:
1 light-emitting component, 10 transparent bases
11 grooves, 12 light-emitting diodes
13 first electrodes, 14 second electrodes
15 protective layers, 16 first conductive films
17 second conductive films
Embodiment
Consult Fig. 2 C, a kind of light-emitting component 1 according to a preferred embodiment of the present invention comprises a transparent base 10, wherein this transparent base 10 comprises a upper surface and lower surface, transparent base 10 has one by the downward groove 11 that extends of upper surface, and an opening of groove 11 is in the upper surface side of this transparent base 10; One light-emitting diode 12 places groove 11, and wherein one first electrode 13 of light-emitting diode 12 and one second electrode 14 are towards the peristome of groove 10; One protective layer 15 covers the part peristome that is formed at groove 10; Form one first conductive film 16 and second conductive film 17 and be electrically connected this first electrode 13 and second electrode 14 respectively.
The manufacture method of the light-emitting component 1 of preferred embodiment of the present invention, its flow chart is shown in Fig. 2 A-2C, comprise: a transparent base 10 is provided, wherein this transparent base 10 comprises a upper surface and lower surface, this transparent base has one by the downward groove 11 that extends of upper surface, and an opening of this groove 11 is in the upper surface side of this transparent base 10; Place a light-emitting diode 12 in this groove, wherein one first electrode 13 of this light-emitting diode and one second electrode 14 are towards the peristome of groove; On this groove, form a protective layer 15; Utilize etching method, etch away the protective layer of first electrode 13 and second electrode, 14 tops, exposed portions serve first electrode and second electrode; Utilize galvanoplastic to form one first conductive film 16 and second conductive film 17, be electrically connected this first electrode and second electrode respectively.
Also can on this transparent base, form a plurality of grooves in above-mentioned light-emitting component 1 and the method for making thereof; in these a plurality of grooves, insert a light-emitting diode respectively; follow protective mulch; again via the etching part protective layer; exposed portions serve first electrode and part second electrode; utilize galvanoplastic to form first conductive film and second conductive film respectively at last, be electrically connected this first electrode and second electrode respectively, make it become a light-emitting device array of a plurality of light-emitting components.
And the method for making of above-mentioned light-emitting component 1 also can be added a segmentation procedure at last in above-mentioned light-emitting device array recipe step, and a plurality of light-emitting components on the light-emitting device array are partitioned into independently light-emitting component.
Light-emitting diode in the above-mentioned light-emitting device array in these a plurality of grooves can send the light of different colour systems respectively, behind mixed light, can send colour mixture light such as white light.
Above-mentioned light-emitting device array also can be applicable in the back light of flat-panel screens, so can reduce the complexity of single light-emitting component on assembly program.
First conductive film and second conductive film be except forming with galvanoplastic in the above-mentioned light-emitting component, also can print process, the method that limits of metal mask vapour deposition method or other figures forms.
Above-mentioned light-emitting component, after wherein this protective layer also can a photosensitive material be covered in this part groove, directly exposed portions serve first electrode and second electrode.
Above-mentioned light-emitting component, wherein this transparent base is to comprise being selected from acryl (Polymethymathacrylate, PMMA), Merlon (Polycarbonate, PC), the cyclic olefin co-polymer (Cyclo Olefin Copolymer, COC), at least a material or other alternative materials in glass and the composite material institute constituent material cohort.
Though light-emitting component of the present invention is disclosed in each preferred embodiment, yet scope of the present invention is not limited to above-mentioned preferred embodiment, and for example substrate can replace it by transparent conductive substrate; Should be defined with following claim and be as the criterion.Therefore any those skilled in the art, the neither disengaging of various changes spirit of the present invention and scope that these preferred embodiments are done.
Claims (13)
1. light-emitting component comprises:
One transparent base, wherein this transparent base comprises a upper surface and lower surface, and this transparent base has one by the downward groove that extends of upper surface, and an opening of this groove is in the upper surface side of this transparent base;
One places the light-emitting diode of this groove, and wherein one first electrode of this light-emitting diode and one second electrode be towards the peristome of groove, and the light of being launched by light-emitting diode penetrates via the lower face side of transparent base;
One covers the part peristome and the part that are formed at this groove exposes first electrode of this light-emitting diode and the protective layer of second electrode;
First conductive film that a part covers this first electrode and is electrically connected with it; And
Second conductive film that a part covers this second electrode and is electrically connected with it.
2. a kind of light-emitting component as claimed in claim 1 is characterized in that: also form one second groove that is extended by upper surface on this upper surface of this transparent base downwards, one second light-emitting diode places second groove.
3. a kind of light-emitting component as claimed in claim 1 is characterized in that: the upper surface at this transparent base also forms a plurality of grooves that extended by upper surface downwards, wherein in each groove a light-emitting diode is set.
4. a kind of light-emitting component as claimed in claim 3 is characterized in that: these a plurality of light-emitting diodes send the light of different colour systems respectively.
5. a kind of light-emitting component as claimed in claim 1 is characterized in that: this transparent base comprises at least a material that is selected from acryl, Merlon, cyclic olefin co-polymer, glass and the composite material institute constituent material cohort.
6. the manufacture method of a light-emitting component comprises:
One transparent base is provided, and wherein this transparent base comprises a upper surface and lower surface, and this base material has one by the downward groove that extends of upper surface, and an opening of this groove is in the upper surface side of this transparent base;
Place a light-emitting diode in this groove, wherein one first electrode of this light-emitting diode and one second electrode be towards the peristome of groove, and the light of being launched by light-emitting diode penetrates via the lower face side of transparent base;
Form a part peristome and a part that is covered in this groove and expose first electrode of this light-emitting diode and the protective layer of second electrode; And
Form a part and cover second film wire that this first electrode and the first film lead that is electrically connected with it and a part cover this second electrode and be electrically connected with it.
7. the manufacture method of a kind of light-emitting component as claimed in claim 6 is characterized in that: also be included in upper surface formation one downward second groove that extends of this transparent base, place one second light-emitting diode in this second groove.
8. the manufacture method of a kind of light-emitting component as claimed in claim 7 is characterized in that: also comprise a segmentation procedure, this is positioned over the light-emitting diode in the groove and second light-emitting diode that is positioned in second groove is separated into independently light-emitting component.
9. the manufacture method of a kind of light-emitting component as claimed in claim 6, it is characterized in that: the upper surface that also is included in this transparent base forms the groove of a plurality of downward extensions, places a plurality of light-emitting diodes respectively in a plurality of grooves.
10. the manufacture method of a kind of light-emitting component as claimed in claim 6, it is characterized in that: the formation method of this first film lead is to comprise galvanoplastic, print process, figure vapour deposition method.
11. the manufacture method of a kind of light-emitting component as claimed in claim 6 is characterized in that: the formation method of this second film wire comprises galvanoplastic, print process, figure vapour deposition method.
12. the manufacture method of a kind of light-emitting component as claimed in claim 6 is characterized in that: this protective layer is covered in behind this groove fully again via etching, and remaining at last protective layer is covered in the groove part peristome, exposed portions serve first electrode and second electrode.
13. the manufacture method of a kind of light-emitting component as claimed in claim 6 is characterized in that: this protective layer is covered in this part groove with a photosensitive material, and exposed portions serve first electrode and second electrode.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200410078593A CN1750280B (en) | 2004-09-15 | 2004-09-15 | Light emitting element and its producing method |
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| CN200410078593A CN1750280B (en) | 2004-09-15 | 2004-09-15 | Light emitting element and its producing method |
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| CN1750280A CN1750280A (en) | 2006-03-22 |
| CN1750280B true CN1750280B (en) | 2010-05-05 |
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| CN200410078593A Active CN1750280B (en) | 2004-09-15 | 2004-09-15 | Light emitting element and its producing method |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10686106B2 (en) | 2003-07-04 | 2020-06-16 | Epistar Corporation | Optoelectronic element |
| US9142740B2 (en) | 2003-07-04 | 2015-09-22 | Epistar Corporation | Optoelectronic element and manufacturing method thereof |
| US9000461B2 (en) * | 2003-07-04 | 2015-04-07 | Epistar Corporation | Optoelectronic element and manufacturing method thereof |
| US9356070B2 (en) | 2012-08-15 | 2016-05-31 | Epistar Corporation | Light-emitting device |
| CN103594600B (en) * | 2012-08-15 | 2018-05-15 | 晶元光电股份有限公司 | Light-emitting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1521863A (en) * | 2003-02-10 | 2004-08-18 | 光磊科技股份有限公司 | Light-emitting diode packaging device |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1521863A (en) * | 2003-02-10 | 2004-08-18 | 光磊科技股份有限公司 | Light-emitting diode packaging device |
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| Title |
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| JP特开-114604A 2000.04.21 |
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| CN1750280A (en) | 2006-03-22 |
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