CN215527753U - LED display module and LED display screen - Google Patents
LED display module and LED display screen Download PDFInfo
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- CN215527753U CN215527753U CN202122409206.8U CN202122409206U CN215527753U CN 215527753 U CN215527753 U CN 215527753U CN 202122409206 U CN202122409206 U CN 202122409206U CN 215527753 U CN215527753 U CN 215527753U
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Abstract
The utility model relates to an LED display module and an LED display screen, which comprise a first packaging adhesive layer (3), a second packaging adhesive layer (4), a substrate (1) and a plurality of LED chips (2) arranged in a display area (101) arranged on the front surface (104) of the substrate (1), wherein the first packaging adhesive layer (3) is arranged on the front surface of the substrate (1) and covers the LED chips (2); second encapsulation glue film (4) cover first encapsulation glue film (3) to back (105) extension to base plate (1), and at least some cover in lateral surface (103) of base plate (1), avoid steam direct from the first encapsulation glue film (3) and the combination department of base plate (1) get into inside the LED reality module, form better protection to the LED chip, improved display module's reliability.
Description
Technical Field
The utility model relates to the field of LED display, in particular to an LED display module and an LED display screen.
Background
With the innovation and development of the LED display screen technology, LED display screen products gradually enter various fields of our lives. The LED display screen comprises at least one LED display module, and the LED display module includes MINI LED display module and MICRO LED's display module, and the Mini LED is between traditional LED and MICRO LED. At present, the packaging mode of the LED display module has a variety of ways, wherein COB (chip-on-board, i.e. chip-on-board packaging) can directly package a plurality of chips on the metal matrix printed circuit board MCPCB substrate, the image is displayed by the array formed by the LED light emitting chips, the substrate can directly dissipate heat, not only can reduce the manufacturing process steps and the cost, but also has the advantage of heat dissipation of reducing the thermal resistance, for the MINI COB display screen, it can display higher definition images and videos, and can achieve arbitrary splicing.
Referring to fig. 1, in the COB packaging, a flip chip 802 is soldered to the front surface of a PCB substrate 801, and then an encapsulating adhesive layer 803 is formed on the front surfaces of the flip chip 802 and the PCB substrate 801 by molding. Because the edge of flip chip 802 distance PCB base plate 801 is very near, and encapsulation glue film 803 only covers PCB base plate 801's front, inside steam entered into the display module through the junction between encapsulation glue film 803 and PCB base plate 801 very easily to lead to flip chip 802 to become invalid, reduced display module's reliability.
SUMMERY OF THE UTILITY MODEL
In view of the above deficiencies of the related art, an object of the present application is to provide an LED display module and an LED display screen, which aims to solve the technical problem that water vapor enters the inside of the display module through the joint between the packaging adhesive layer and the substrate.
In order to solve the technical problem, the present application provides an LED display module, which includes a plurality of LED chips 2, a first encapsulation adhesive layer 3, a second encapsulation adhesive layer 4 and a substrate 1, where the substrate 1 includes a front surface 104, a back surface 105 opposite to the front surface 104, and an outer side surface 103 disposed between the front surface 104 and the back surface 105, the LED chips 2 are mounted in a display area 101 disposed on the front surface 104, and the first encapsulation adhesive layer 3 is disposed on the front surface 104 and covers the LED chips 2; the second packaging adhesive layer 4 covers the first packaging adhesive layer 3, extends towards the back surface 105, and at least partially covers the outer side surface 103 of the substrate 1.
The LED display module is provided with two packaging glue layers, wherein a first packaging glue layer 3 is arranged on the front surface of a substrate 1 and covers an LED chip 2, a second packaging glue layer 4 covers the first packaging glue layer 3 and extends to the outer side surface of the substrate 1 below the first packaging glue layer 3, and at least part of the second packaging glue layer covers the outer side surface of the substrate 1, namely the second packaging glue layer 4 at least covers the joint of the first packaging glue layer 3 and the substrate 1, so that water vapor is prevented from directly entering the LED display module from the joint of the first packaging glue layer 3 and the substrate 1; in addition, water vapor needs to pass through the bonding area between the outer side surfaces of the second packaging adhesive layer 4 and the substrate 1 and then can extend to the bonding position between the first packaging adhesive layer 3 and the substrate 1, so that the path of water vapor invading the inside of the display module can be prolonged, the LED chip 2 can be further protected better, and the reliability of the display module is improved.
Optionally, the second encapsulant layer 4 covers the entire outer side surface 103 of the substrate 1.
Optionally, a concave portion 7 is disposed on the front surface 104 of the substrate 1 and located at the periphery of the display area 101, and the first encapsulant layer 3 covers the concave portion 7.
Optionally, the recess 7 is a groove or a depression.
Optionally, a boss is disposed on the front surface 104 of the substrate 1 and located at the periphery of the display area 101, and the first encapsulation glue layer 3 covers the boss.
Optionally, the boss is not higher than a light emitting top surface of the LED chip (2);
optionally, the second encapsulant layer 4 extends along the side surface 103 of the substrate 1 to the back surface 105 of the substrate 1.
Optionally, the refractive index of the first encapsulant layer 3 is greater than or equal to the refractive index of the second encapsulant layer 4.
Optionally, at least one of the first encapsulating glue layer 3 and the second encapsulating glue layer 4 comprises: at least one of a phosphor and diffusion particles.
Based on same utility model conceive, this application still provides a LED display screen, include as above LED display module assembly.
The display module assembly of the LED display screen is not prone to invasion of water vapor, the display module assembly is not prone to failure, good display effect of the display screen is guaranteed, and the service life of the display screen is prolonged.
Drawings
Fig. 1 is a schematic structural diagram of a conventional display module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an LED display module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a back surface of an LED display module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an LED display module according to an embodiment of the present invention, wherein the LED display module is provided with a first encapsulation adhesive layer and a second encapsulation adhesive layer;
FIG. 5 is a schematic diagram of the unformed second encapsulant layer of FIG. 4 before being cut according to an embodiment of the present invention;
fig. 6 is another schematic structural diagram of an LED display module according to an embodiment of the present invention, in which a first encapsulation adhesive layer and a second encapsulation adhesive layer are disposed;
FIG. 7 is a schematic diagram illustrating the unformed second encapsulant layer of FIG. 6 before being cut according to an embodiment of the present invention;
fig. 8 is a schematic structural view of the first and second encapsulating adhesive layers when the groove is formed according to the embodiment of the utility model;
FIG. 9 is a schematic view of the unformed second encapsulant layer of FIG. 8 before being cut according to an embodiment of the present invention;
fig. 10 is another schematic structural view of the first and second encapsulating adhesive layers when the groove is formed according to the embodiment of the utility model;
FIG. 11 is a schematic view of the unformed second encapsulant layer of FIG. 10 before being cut according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of an LED display screen according to an embodiment of the present invention;
the display module comprises a substrate 1, a display area 101, a circuit function area 102, an outer side surface 103, a front surface 104, a back surface 105, an LED chip 2, a first packaging adhesive layer 3, a second packaging adhesive layer 4, a driving electronic element 5, a process cutting surface 6, a concave part 7, an existing display module 8, a PCB substrate 801, a flip chip 802 and a packaging adhesive layer 803.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Among present display module assembly, the LED chip is very close apart from display module assembly's border, and inside steam entered into display module assembly through the joint department between encapsulation glue film on the display module assembly border and the base plate very easily to lead to the LED chip to become invalid, reduced display module assembly's reliable performance.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
As shown in fig. 2-4, the present embodiment provides an LED display module, which may be but is not limited to a MINI LED display module, for example, a MICRO LED display module, which may be a special-shaped LED display module or a non-special-shaped LED display module, and the present embodiment is not limited in particular. The display module can be used in the fields of household display, medical display, decorative display, traffic display, advertisement display and the like. The applications are only a few applications exemplified by the present embodiment, and it should be understood that the application of the LED display module in the present embodiment is not limited to the fields exemplified above.
The display module comprises a substrate 1 and a plurality of LED chips 2, wherein the LED chips 2 are all arranged in a display area 101 arranged on the front surface 104 of the substrate 1. The display area 101 on the front surface of the substrate 1 in this embodiment is an area where the LED chips 2 are electrically connected to drive and control the lighting of the LED chips 2 for displaying, and the area is also used for carrying the LED chips 2. As shown by the above analysis, the LED chip 2 in this embodiment may be a MINI LED chip, a MICRO LED chip, a forward LED chip, a flip LED chip, or a vertical LED chip, and may be flexibly configured according to the application requirements. The substrate 1 in this embodiment may be, but is not limited to, a PCB substrate or a glass substrate, the back surface 105 of the substrate 1 is provided with a circuit functional area 102, the circuit functional area 102 is mounted with a driving electronic component 5, and the driving electronic component 5 can light up the whole screen and achieve the display effect. It is understood that the front surface 104 of the substrate 1 and the back surface 105 of the substrate 1 are vertically opposite. The first packaging adhesive layer 3 covering all the LED chips 2 is formed on the display area 101 of the front surface 104 of the substrate 1. The LED display module in this embodiment further includes a second encapsulation adhesive layer 4, the second encapsulation adhesive layer 4 covers the first encapsulation adhesive layer 3, extends toward the back 105 of the substrate 1, and at least partially covers the outer side 103 of the substrate 1, that is, the second encapsulation adhesive layer 4 also covers at least a portion of the outer side 103 of the substrate 1, so as to cover the joint between the first encapsulation adhesive layer 3 and the substrate 1, as shown in fig. 4. Wherein figure 4 is a cross-sectional view a-a of figure 2. Therefore, the second packaging adhesive layer 4 at least covers the joint of the first packaging adhesive layer 3 and the substrate 1, and water vapor is prevented from directly entering the LED display module from the joint of the first packaging adhesive layer 3 and the substrate 1; in addition, water vapor needs to pass through the bonding area between the second packaging adhesive layer 4 and the outer side surface 103 of the substrate 1 to extend to the bonding position between the first packaging adhesive layer 3 and the substrate 1, so that the path of water vapor invading the inside of the display module can be prolonged, the LED chip 2 can be further protected better, and the reliability of the display module is improved. It should be understood that, in the embodiment, the specific area covered by the second encapsulation adhesive layer 4 on the outer side surface 103 of the substrate 1 may be flexibly set according to application requirements, for example, the second encapsulation adhesive layer 4 may only cover a part of the outer side surface 103 of the substrate 1, and the second encapsulation adhesive layer 4 may also cover the entire outer side surface of the substrate 1, so as to further extend the path through which water vapor invades the inside of the display module, and improve the reliability of the display module.
It should be understood that, in the present embodiment, the specific formation manner of the first encapsulant layer 3 and the second encapsulant layer 4 can be flexibly adopted, and for example, the specific formation manner can be realized by, but not limited to, molding, printing, potting, and the like. In this embodiment, the first encapsulant layer 3 and the second encapsulant layer 4 may be made of the same material or different materials. In addition, the first encapsulant layer 3 and the second encapsulant layer 4 in this embodiment are both transparent layers, for example, both of them may be transparent layers, or may also be other non-transparent but light-transmitting layer structures. And the first encapsulating adhesive layer 3 and the second encapsulating adhesive layer 4 can both be of a single-layer structure, and at least one of them can also be of a composite layer structure formed by at least two sub-layers.
In some examples of the present embodiment, at least one of the light conversion particles and the diffusion particles may be provided in at least one of the first encapsulating adhesive layer 3 and the second encapsulating adhesive layer 4 as needed. For example, in an application scenario, light conversion particles may be disposed in the first encapsulant layer 3 to realize light color conversion, and diffusion particles may be disposed in the second encapsulant layer 4 to further improve light extraction efficiency.
In some examples of this embodiment, the LED chip 2 may be disposed in the display area 101 on the front surface 104 of the substrate 1, and then the first encapsulation adhesive layer 3 is formed on the front surface 104 of the substrate 1, and the formed first encapsulation adhesive layer 3 may cover the whole front surface 104 of the substrate 1, for example, as shown in fig. 4, where the first encapsulation adhesive layer 3 covers the whole front surface 104 of the substrate 1, and in manufacturing, as shown in fig. 5, after the LED chip 2 is disposed in the display area 101 on the front surface 104 of the substrate 1, the first encapsulation adhesive layer 3 is formed on the front surface 104 of the substrate 1, and the first encapsulation adhesive layer 3 covers the whole front surface 104 of the substrate 1, and then the substrate 1 and the first encapsulation adhesive layer 3 are cut along the process cutting surface 6, so as to obtain the substrate 1 in fig. 4 and the first encapsulation adhesive layer 3 on the substrate 1.
In other examples of the present embodiment, the first encapsulant layer 3 may partially cover the front surface 104 of the substrate 1, for example, as shown in fig. 6, wherein the first encapsulant layer 3 only covers the display area 101 of the front surface 104 of the substrate 1 and the LED chip 2 in the display area 101, and the second encapsulant layer 4 covers the area of the front surface 104 of the substrate 1 exposed by the first encapsulant layer 3. During manufacturing, referring to fig. 7, after the LED chip 2 is disposed in the display area 101 on the front surface 104 of the substrate 1, the first encapsulation adhesive layer 3 is formed on the front surface 104 of the substrate 1, the first encapsulation adhesive layer 3 does not cover the whole front surface 104 of the substrate 1, and then the substrate 1 and the first encapsulation adhesive layer 3 are cut along the process cutting surface 6, so as to obtain the substrate 1 and the first encapsulation adhesive layer 3 on the substrate 1 in fig. 6.
Of course, it should be understood that the area of the first encapsulant layer 3 covering the substrate 1 in this embodiment may be flexibly configured according to application requirements, and is not limited to the above example, and is not described herein again. In the above example of this embodiment, after the first encapsulation adhesive layer 3 and the substrate 1 are cut, the second encapsulation adhesive layer 4 is formed, the LED chip 2 can be protected by the first encapsulation adhesive layer, dust and the like can be prevented from affecting the LED chip 2 during cutting, and the reliability of the manufactured display module can be further improved.
After cutting the substrate 1 and the first packaging adhesive layer 3 along the predetermined process cutting surface 6 of the substrate 1, forming a second packaging adhesive layer 4 on the substrate 1, wherein the second packaging adhesive layer 4 extends towards the outer side surface 103 of the substrate 1 and completely covers the outer side surface 103 of the substrate 1 and the outer side surface of the first packaging adhesive layer 3. It should be understood that the above-mentioned complete covering, i.e. the outer side 103 of the substrate 1, is covered by the second encapsulating glue 4 and there is no leaking part. First encapsulation glue film 3 has formed the protection to LED chip 2, second encapsulation glue film 4 then forms the protection to first encapsulation glue film 3 and LED chip 2, and make steam need pass through the interface between second encapsulation glue film 4 and the lateral surface 103 of base plate 1 and the interface between the front 104 of first encapsulation glue film 3 and base plate 1, just can get into display module's display area 101, the inside route of steam invasion display module has been prolonged, protection to LED chip 2 is better, LED chip 2 is the trouble more difficult, display module's reliability has been improved.
In one example, the first encapsulant layer 3 and the second encapsulant layer 4 can be formed by, but not limited to, molding, or can also be formed by potting; it should be understood that, in the embodiment, the molding manners of the first encapsulant layer 3 and the second encapsulant layer 4 may be the same or different, and this embodiment is not limited in this respect. The first and second encapsulation adhesive layers 3 and 4 are made of common easy-to-cure LED encapsulation adhesive, the materials of the first and second encapsulation adhesive layers 3 and 4 may be the same or different, and this embodiment is not limited in any way.
In this embodiment, as shown in fig. 5 or fig. 7, the first encapsulant layer 3 may cover the process cut surface 6 of the substrate 1 even beyond the process cut surface 6, or may not exceed the process cut surface 6. After cutting, the outer side surface of the first packaging adhesive layer 3 is flush with the outer side surface 103 of the substrate 1, or not flush with the outer side surface, and then the second packaging adhesive layer 4 is formed; as shown in fig. 7, the outer side surface of the first encapsulating adhesive layer 3 may also be located in the process cutting surface 6 of the substrate 1, after cutting, before the second encapsulating adhesive layer 4 is not formed, a part of the edge of the front surface 104 of the substrate 1 leaks, and then the second encapsulating adhesive layer 4 is formed to make the second encapsulating adhesive layer 4 cover the leaking part of the edge of the front surface 104 of the substrate 1, and at the same time, completely cover or partially cover the outer side surface 103 of the substrate 1.
In one example, in order to further extend the path of moisture entering the display module, a concave portion 7 may be further disposed on the periphery of the display region 101 of the substrate 1, and the concave portion 7 may be disposed to further extend the path of moisture entering the display module with respect to the planar structure. The recess 7 in this embodiment may be a complete groove, or may be a lower recess formed by cutting a part of the groove. The method can be flexibly set according to application requirements.
For example, referring to fig. 8, a concave portion 7 is provided on the front surface 104 of the substrate 1 at the periphery of the display region 101, and the concave portion 7 is a lower concave portion formed by cutting a part of a groove. For example, as shown in fig. 9, a groove may be provided on the substrate 1 at the periphery of the display region 101, and then cut along the process cut surface 6. After cutting, the remaining part of the groove is located at the edge of the substrate 1 forming a recess 7, so that the outer side 103 of the substrate 1 forms a step structure. At this moment, the contact area between the first packaging adhesive layer 3 or the second packaging adhesive layer 4 and the substrate 1 is increased, the path of water vapor entering from the interface between the packaging adhesive layer and the substrate 1 can be prolonged, and the packaging effect of the display module is better. In fig. 8, the path of water vapor intrusion is: the extension of the path for the water vapor to invade is realized from the interface between the second packaging adhesive layer 4 and the outer side surface 103 of the substrate 1 to the interface between the second packaging adhesive layer 4 and the groove bottom and the groove wall of the concave portion 7 and then to the interface between the first packaging adhesive layer 3 and the front surface 104 of the substrate 1.
In the present embodiment, the depth of the recess 7 can be flexibly set, for example, but not limited to, 0.1 to 0.9 times the thickness of the substrate 1. It will be appreciated that the depth of the recess 7 is the distance between the bottom of the recess 7 and the front surface 104 of the substrate 1. The greater the depth setting of the recess 7, the greater the lengthening of the path of the ingress of moisture from the interface between the second encapsulating glue layer 4 and the substrate 1.
In this embodiment, the first encapsulant layer 3 may cover the recess 7 on the substrate 1, or may not cover the recess 7 on the substrate 1, and specifically, may be flexibly configured according to the application requirement. For example, referring to fig. 8, the first encapsulant layer 3 does not cover the recess 7 on the substrate 1. When the display module shown in fig. 8 is manufactured, referring to fig. 9, the first encapsulant layer 3 may be formed on the front surface of the substrate 1, but the first encapsulant layer 3 does not cover the groove. Then cutting is carried out along the process cutting surface 6, the substrate 1 and the first packaging adhesive layer 3 shown in the figure 8 are obtained after cutting, and then a second packaging adhesive layer 4 is formed on the substrate 1, wherein the recess 7 is completely covered by the second packaging adhesive layer 4.
For another example, referring to fig. 10, the first encapsulant layer 3 covers the recess 7 on the substrate 1. When the display module shown in fig. 10 is manufactured, referring to fig. 11, the first encapsulant layer 3 may be formed on the front surface 104 of the substrate 1, and the first encapsulant layer 3 covers the groove. Then cutting is carried out along the process cutting surface 6, the substrate 1 and the first packaging adhesive layer 3 shown in fig. 10 are obtained after cutting, and then the second packaging adhesive layer 4 is formed on the substrate 1, and the concave part 7 is not covered by the second packaging adhesive layer 4. The path of the water vapor intrusion in fig. 10 is: the extension of the path for the water vapor to invade can also be achieved from the interface between the second encapsulating adhesive layer 4 and the side surface 103 of the substrate 1 to the interface between the first encapsulating adhesive layer 3 and the groove bottom and groove wall of the recess 7 and then to the interface between the first encapsulating adhesive layer 3 and the front surface 104 of the substrate 1.
Of course, in the present embodiment, the path of moisture entering is not limited to be extended by providing the concave portion 7, and the concave portion 7 may be replaced by a boss, or a combination of a concave portion and a boss (that is, a concave-convex structure). In order to further prolong the water vapor entering path, the surface of the concave part 7 or the boss can be a rough surface, for example, a step surface or a sawtooth surface can be arranged, so that the water vapor entering path can be further prolonged, and the bonding strength between the packaging adhesive layer and the substrate 1 can be improved. In this embodiment, when the concave portion 7 is replaced by a convex plate, or replaced by a combination of the concave portion and the convex plate, the convex plate may be set not higher than the light-emitting top surface of the LED chip 2, so as to avoid the convex plate from blocking or interfering with the light emitted from the light-emitting top surface of the LED chip 2, thereby ensuring the light-emitting effect. Of course, in other examples of this embodiment, the boss may also be higher than the light-emitting top surface of the LED chip 2, so as to shield at least a part of light emitted from the light-emitting top surface of the LED chip 2, and when a plurality of display modules are spliced to form a display screen, the occurrence of optical crosstalk between adjacent display modules may be avoided to some extent.
In this embodiment, the refractive index of the first encapsulant layer 3 is greater than or equal to the refractive index of the second encapsulant layer 4. Therefore, the light emitting efficiency of the LED chip 2 can be improved, and the display effect of the display module is better. For example, in some application scenarios, the refractive index of the first encapsulant layer 3 may be selected to be 1.50-1.58, and the refractive index of the second encapsulant layer 4 may be selected to be 1.50-1.52.
When the display module is spliced by at least two display modules, the distance L1 between the predetermined process cut surface 6 illustrated in fig. 5, 7, 8 and 11 and the LED chip 2 at the outermost edge on the substrate 1 may be less than half of the line pitch L2 between the LED chips 2 in adjacent lines. Can guarantee that the concatenation gap is enough little this moment, can guarantee that the border line of display module assembly and the distance between the display area are enough little, a plurality of display module assembly concatenation show the back, can reduce the concatenation gap between the display module assembly for the wholeness and the display effect of display screen are better. When the display module is used for displaying, the distance between the process cutting surface 6 and the LED chip 2 on the most edge of the substrate 1 can achieve a good display effect, and the embodiment is not particularly limited.
In order to achieve a better sealing effect, the second encapsulant layer 4 may further extend to the back surface 105 of the substrate 1 along the outer side surface 103 of the substrate 1, such that the second encapsulant layer 4 covers the outer side surface 103 of the substrate 1 and the back surface 105 of the substrate 1. Therefore, the side surface 103 of the substrate 1 is not penetrated by water vapor, and the sealing effect of the display module is better.
Another alternative embodiment of the utility model:
the embodiment provides an LED display screen, and the LED display screen comprises the LED display module. In one example, the display module can be manufactured by only one display module, and in another example, as shown in fig. 12, a plurality of display modules can be spliced. It should be understood that the number of the LED display modules used in the present embodiment can be selected according to application requirements, for example, two, three, four, five, or more than six LED display modules can be spliced to obtain an LED display screen. The LED display screen in this embodiment may be a flexible display screen or a rigid display screen, and may be applied to various electronic devices, such as a display, a mobile terminal, a computer, a wearable device, an advertisement device, and a vehicle-mounted device. The display module of this display screen is difficult for receiving the invasion of steam, and the luminescence unit that shows is more difficult to become invalid, has prolonged the life of display screen. And, by the display screen of a plurality of display module assembly concatenations, the concatenation gap between the display module assembly is little, has improved the display effect of display screen.
The display module of the LED display screen is not easy to be invaded by water vapor, and the display module is not easy to break down, so that the good display effect of the display screen is ensured, and the service life of the display screen is prolonged; when simultaneously by a plurality of display module concatenation demonstration, the gap of concatenation is also little, and the display effect is better.
It is to be understood that the utility model is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the utility model as defined by the appended claims.
Claims (10)
1. The LED display module is characterized by comprising a plurality of LED chips (2), a first packaging adhesive layer (3), a second packaging adhesive layer (4) and a substrate (1), wherein the substrate (1) comprises a front surface (104), a back surface (105) opposite to the front surface (104) and an outer side surface (103) arranged between the front surface (104) and the back surface (105), the LED chips (2) are arranged in a display area (101) arranged on the front surface (104), and the first packaging adhesive layer (3) is arranged on the front surface (104) and covers the LED chips (2); the second packaging adhesive layer (4) covers the first packaging adhesive layer (3), extends towards the back surface (105) and at least partially covers the outer side surface (103) of the substrate (1).
2. The LED display module according to claim 1, wherein the second encapsulant layer (4) covers the entire outer side surface (103) of the substrate (1).
3. The LED display module according to claim 1, wherein a recess (7) is provided on the front surface (104) of the substrate (1) at the periphery of the display area (101), and the first encapsulant layer (3) covers the recess (7).
4. The LED display module according to claim 3, wherein the recess (7) is a groove or a depression.
5. The LED display module according to claim 1, wherein a boss is disposed on the front surface (104) of the substrate (1) at the periphery of the display area (101), and the first encapsulant layer (3) covers the boss.
6. The LED display module according to claim 5, wherein the boss is not higher than a light emitting top surface of the LED chip (2).
7. The LED display module according to any of claims 1-6, wherein the second encapsulating glue layer (4) extends along the outer side (103) of the substrate (1) to the back side (105) of the substrate (1).
8. The LED display module according to any of claims 1-6, wherein the refractive index of the first encapsulant layer (3) is greater than or equal to the refractive index of the second encapsulant layer (4).
9. The LED display module according to any of claims 1-6, wherein at least one of the first encapsulating glue layer (3) and the second encapsulating glue layer (4) comprises: at least one of light conversion particles and diffusion particles.
10. An LED display screen, characterized in that, comprises the LED display module set as claimed in any one of claims 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122409206.8U CN215527753U (en) | 2021-09-30 | 2021-09-30 | LED display module and LED display screen |
| PCT/CN2022/123579 WO2023051823A1 (en) | 2021-09-30 | 2022-09-30 | Display module and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122409206.8U CN215527753U (en) | 2021-09-30 | 2021-09-30 | LED display module and LED display screen |
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| Publication Number | Publication Date |
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| CN215527753U true CN215527753U (en) | 2022-01-14 |
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| CN202122409206.8U Active CN215527753U (en) | 2021-09-30 | 2021-09-30 | LED display module and LED display screen |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023226033A1 (en) * | 2022-05-27 | 2023-11-30 | 京东方科技集团股份有限公司 | Display substrate, mold assembly, tiled display module and display device |
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2021
- 2021-09-30 CN CN202122409206.8U patent/CN215527753U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023226033A1 (en) * | 2022-05-27 | 2023-11-30 | 京东方科技集团股份有限公司 | Display substrate, mold assembly, tiled display module and display device |
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Inventor after: Ma Wenbo Inventor after: Li Zhuangzhi Inventor after: Xing Meizheng Inventor before: Ma Wenbo Inventor before: Li Zhuangzhi Inventor before: Xing meizheng |
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| CB03 | Change of inventor or designer information |