CN214542278U - LED lamp bead and backlight source - Google Patents

Abstract

The utility model relates to a light emitting diode technical field provides a light emitting diode lamp pearl and backlight, and the light emitting diode lamp pearl includes the base plate and locates the light emitting diode chip on the base plate, and the base plate has the front installation face that is used for installing the light emitting diode chip and the back installation face relative with front installation face, and the front installation face of base plate coats and is stamped first extinction glue film. The utility model provides a first extinction glue film is laid at the front installation face of base plate to emitting diode lamp pearl, utilizes the light that first extinction glue film separation emitting diode chip sent, makes the light that emitting diode chip sent can't see through first extinction glue film to ensure that the base plate of emitting diode lamp pearl is not leak light.

Description

LED lamp bead and backlight source

Technical Field

The utility model relates to a Light Emitting Diode (LED) technical field especially provides a LED lamp pearl and have this LED lamp pearl be used for indicating device's backlight.

Background

The traditional light-emitting diode prevents that side light leakage product forms the leak protection photo structure of one deck black colloid most all its week through the mode of mould pressing, however, the PCB carrier plate of light-emitting diode product is the resin substrate, and is the combined material of glass fiber and epoxy, has certain light transmissivity for, like this, leads to there being the light leak phenomenon in the bottom of traditional light-emitting diode prevents side light leakage product, and user experience effect is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a light emitting diode lamp pearl aims at solving the problem that there is the light leak in the bottom of current light emitting diode product.

In order to achieve the above object, the utility model adopts the following technical scheme:

in a first aspect, the application provides a light emitting diode lamp bead, which comprises a substrate, a light emitting diode chip arranged on the substrate and a light transmitting colloid packaged at the outer side of the light emitting diode chip, wherein the substrate is provided with a front mounting surface and a back mounting surface opposite to the front mounting surface, the front mounting surface is provided with a first metal area and a first non-metal area, the light emitting diode chip is connected with the first metal area, and a first light absorption glue layer is arranged in the first non-metal area.

The utility model has the advantages that: the utility model provides a first extinction glue film is laid in the first non-metallic area of the positive installation face of base plate to emitting diode lamp pearl, utilizes the light that first extinction glue film separation emitting diode chip sent, promptly, the light that the emitting diode chip sent can't see through first extinction glue film to ensure that the base plate of emitting diode lamp pearl is not leak.

In one embodiment, the light emitting diode lamp bead further comprises a light blocking layer packaged on the outer side of the light transmitting colloid, the light blocking layer is provided with a light emitting hole, and the light blocking layer is arranged on the first light absorption glue layer and is in contact with the first light absorption glue layer.

In one embodiment, the thickness of the first light absorption glue layer under the light blocking layer is smaller than or equal to the thickness of the first light absorption glue layer under the light transmitting glue.

In one embodiment, the substrate is white or black.

In one embodiment, the light blocking layer includes a light reflecting colloid encapsulated outside the light transmitting colloid and a light absorbing colloid encapsulated outside the light reflecting colloid.

In one embodiment, the first metal region has a silver plating layer therein.

In one embodiment, the back mounting surface of the substrate has a second metal region and a second non-metal region, the second metal region is used for connecting an external circuit, and the second non-metal region has a second light absorption glue layer.

In one embodiment, the second metal region has a gold plating layer therein and the first metal region has a silver plating layer therein.

In one embodiment, the thickness of the second light absorbing glue layer is less than or equal to the thickness of the gold-plated layer.

In a second aspect, the present application further provides a backlight source for an indicating device, including the above light emitting diode lamp bead.

The utility model has the advantages that: the utility model provides a backlight on the basis that has above-mentioned emitting diode lamp pearl, can obtain the higher suggestion of luminous intensity or indicating effect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic view of a front view structure of a substrate of an led lamp bead provided in an embodiment of the present invention;

fig. 2 is a schematic view of a back view structure of a substrate of an led lamp bead provided in an embodiment of the present invention;

fig. 3 is a schematic side view of a light-emitting diode lamp bead according to an embodiment of the present invention;

fig. 4 is a schematic side view of a light emitting diode lamp bead provided in an embodiment of the present invention;

fig. 5 is a schematic side view of a light-emitting diode lamp bead provided in an embodiment of the present invention;

fig. 6 is a side view schematic diagram of the light emitting diode lamp bead provided by an embodiment of the utility model.

Wherein, in the figures, the respective reference numerals:

the light-emitting diode lamp bead structure comprises a light-emitting diode lamp bead 100, a substrate 10, a light-emitting diode chip 20, a front mounting surface 11, a back mounting surface 12, a first light-absorbing adhesive layer 30, a first nonmetal area 111, a first metal area 112, a second light-absorbing adhesive layer 40, a second metal area 121, a second nonmetal area 122, a light-transmitting adhesive 50, a light-reflecting adhesive 60, a light-blocking layer 70, a first sub-light-emitting hole 81, a second sub-light-emitting hole 82 and a light-emitting hole 80.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or component being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other or mutually interacted. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1 to 3, the present application provides an led lamp bead 100, including a substrate 10, an led chip 20 disposed on the substrate 10, and a light-transmitting encapsulant 50 encapsulated outside the led chip 20, where the substrate 10 has a front surface mounting surface 11 and a back surface mounting surface 12 opposite to the front surface mounting surface 11, the front surface mounting surface 11 of the substrate 10 has a first metal region 112 and a first non-metal region 111, in an embodiment, the front surface mounting surface 11 is composed of the first metal region 112 and the first non-metal region 111, the led chip 20 is connected to the first metal region 112, the first non-metal region 111 has a first light-absorbing encapsulant layer 30 therein, and in an embodiment, the first light-absorbing encapsulant layer 30 is fully distributed in the first non-metal region 111. It is understood that the front mounting surface 11 and the back mounting surface 12 are opposite, the mounting surface on which the led chip 20 is mounted is the front mounting surface 11, the first light-absorbing adhesive layer 30 has a low light transmittance and has a corresponding color, such as a black adhesive layer, which may be black epoxy, and the light absorption capability of the first light-absorbing adhesive layer 30 greatly reduces the probability that the light of the led chip 20 is transmitted from the substrate 10 to the outside.

The utility model provides a light emitting diode lamp pearl 100 has first metal zone 112 and first extinction glue film 30 at the front installation face 11 of base plate 10, and first metal zone 112 itself is difficult for the printing opacity and utilizes the light that first extinction glue film 30 separation emitting diode chip 20 sent, promptly, the light that emitting diode chip 20 sent can't see through first extinction glue film 30 to ensure that emitting diode lamp pearl 100's base plate 10 is not light-tight.

Referring to fig. 1 and 3, in one embodiment, the first metal region 112 is a metal plating region, and the metal plating region itself has light transmittance resistance, so as to block light and facilitate the soldering connection with the led chip 20. The first non-metal area 111 has no metal coating, and therefore, the first light-absorbing glue layer 30 is coated on the first non-metal area 111 to prevent light from passing through or reduce the probability of light passing through.

Specifically, in one embodiment, the first metal region 112 has a silver plating layer therein. Understandably, the silver coating has a good light reflecting effect, that is, light projected on the silver coating can be mostly reflected back, so that the overall brightness of the led lamp bead 100 can be improved.

Referring to fig. 2 and fig. 3, in an embodiment, the back mounting surface 12 of the substrate 10 has a second metal region 121 and a second non-metal region 122, in an embodiment, the back mounting surface 12 is composed of the second metal region 121 and the second non-metal region 122, the second metal region 121 is used for connecting an external circuit, the second non-metal region 122 has a second light-absorbing adhesive layer 40, and in an embodiment, the second light-absorbing adhesive layer 40 is fully distributed in the second non-metal region 122. Here, the second light absorption glue layer 40 has a relatively low light transmittance and a corresponding color, such as a black glue layer, which may be black epoxy resin. The light leakage prevention capability at the bottom of the LED lamp bead 100 is further improved by additionally arranging the second light absorption glue layer 40.

Referring to fig. 2, in an embodiment, the back surface mounting surface 12 has a second metal region 121 and a second light absorption glue layer 40, the second metal region 121 is a metal plating region, the metal plating region itself has light transmittance prevention property, can block light, and is also convenient for being soldered to an external circuit, and the second metal region 121 may have a gold plating layer to improve the sulfur-proof and oxidation-resistant capability of the led lamp bead 100. Similarly, the second non-metal region 122 is a metal-free coating, so that the second metal region 121 itself is not easy to transmit light and the second light-absorbing glue layer 40 is coated on the second non-metal region 122 to prevent light from transmitting or reduce the probability of light transmission, thereby ensuring that the substrate 10 of the led lamp bead 100 is not light-tight.

In one embodiment, the thickness of the second layer of light absorbing glue 40 is less than or equal to the thickness of the gold-plate layer to facilitate the solder connection of the gold-plate layer to external circuitry.

Specifically, in one embodiment, the substrate 10 is a non-light transmissive substrate. It can be understood that the non-transparent substrate itself has a low light transmittance, for example, the non-transparent substrate is made of white epoxy resin or black epoxy resin to enhance the light leakage prevention capability at the bottom of the led lamp bead 100, and if the non-transparent substrate is made of white material, light can be further reflected to improve the overall brightness of the led lamp bead 100.

Specifically, referring to fig. 3 to 5, in an embodiment, the led lamp bead 100 includes a transparent colloid 50 encapsulated outside the led chip 20 and a light blocking layer encapsulated outside the transparent colloid 50, the light blocking layer is provided with a light emitting hole 80 and is disposed on the first light absorbing colloid 30, and further, the light blocking layer contacts the first light absorbing colloid 30 to prevent light leakage at a joint of the light blocking layer and the substrate 10, in this embodiment, the light blocking layer includes a reflective colloid 60 encapsulated outside the transparent colloid 50 and a light absorbing colloid 70 encapsulated outside the reflective colloid 60. In an embodiment, the thickness of the first light absorbing adhesive layer 30 under the light blocking layer is less than or equal to the thickness of the first light absorbing adhesive layer 30 under the transparent adhesive 50, so as to improve the ability of preventing light leakage at the joint of the light blocking layer and the substrate 10, and especially in the design where the thickness of the first light absorbing adhesive layer 30 under the light blocking layer is less than the thickness of the first light absorbing adhesive layer 30 under the transparent adhesive 50, the first light absorbing adhesive layer 30 will have a step difference, and can further prevent light from being emitted from the joint of the light blocking layer and the substrate 10. Here, the light-transmitting colloid 50 is a sealing colloid such as epoxy resin, and the light-reflecting colloid 60 and the light-absorbing colloid 70 are epoxy resins having different light transmittances and corresponding colors.

The light emitting diode chip 20 is after being supplied with power by the base plate 10 and giving out light, and partial light is through the surface reflection of light colloid 60 to extinction colloid 70 can effectively separate and keep off the light side leakage, and like this, the luminous light intensity of the light emitting diode lamp pearl 100 of this application is higher and effectively separates and keep off the light side leakage.

Referring to fig. 3 to 5, in one embodiment, the light reflecting colloid 60 is formed with a first sub-light emitting hole 81 corresponding to the led chip 20, and the light absorbing colloid 70 is formed with a second sub-light emitting hole 82 corresponding to the first sub-light emitting hole 81. As can be understood, after the light emitting diode chip 20 is powered by the substrate 10 to emit light, light is emitted from the first sub light emitting hole 81 and the second sub light emitting hole 82 to the outside, so that the light emitting diode bead 100 obtains light having directivity.

Specifically, referring to fig. 3 to 5, in one embodiment, the first sub-light emitting hole 81 and the second sub-light emitting hole 82 are communicated to form a light emitting hole 80, and an inner diameter of the light emitting hole 80 is gradually increased along a light emitting direction of the led lamp bead 100. It can be understood that the size of the inner diameter of the light emitting hole 80 affects the light emitting angle and brightness of the led lamp bead 100. When the inner diameter of the light emitting hole 80 is gradually increased along the light emitting direction of the light emitting diode bead 100, a larger light emitting angle can be obtained; here, the inner diameter of the first sub-light emitting hole 81 and the inner diameter of the second sub-light emitting hole 82 are increased in stages. And, according to the actual requirement, the inner diameter of the light emitting hole 80 can also be gradually reduced along the light emitting direction of the led lamp bead 100 to obtain a smaller light emitting angle and focusing brightness, that is, the inner diameter of the first sub light emitting hole 81 and the inner diameter of the second sub light emitting hole 82 are both gradually reduced. Of course, according to actual requirements, the light-emitting angle and brightness of the led lamp bead 100 are finely adjusted, and the inner diameter of the light-emitting hole 80 further includes the following conditions: the inner diameter of the light emitting hole 80 increases and then decreases along the light emitting direction of the led lamp bead 100, that is, the inner diameter of the first sub light emitting hole 81 increases step by step, and the inner diameter of the second sub light emitting hole 82 decreases step by step; the inner diameter of the light emitting hole 80 is first reduced and then increased along the light emitting direction of the led lamp bead 100, that is, the inner diameter of the first sub light emitting hole 81 is gradually reduced, and the inner diameter of the second sub light emitting hole 82 is gradually increased; or, the inner diameter of the light emitting hole 80 is reduced first and then remains unchanged along the light emitting direction of the led lamp bead 100, that is, the inner diameter of the first sub-light emitting hole 81 is reduced step by step, and the inner diameter of the second sub-light emitting hole 82 remains; alternatively, the inner diameter of the light emitting hole 80 is increased first and then maintained constant along the light emitting direction of the led lamp bead 100, that is, the inner diameter of the first sub-light emitting hole 81 is increased step by step, and the inner diameter of the second sub-light emitting hole 82 is maintained.

Referring to fig. 6, in an embodiment, the light blocking layer of the led lamp bead 100 is a light absorbing colloid 70 encapsulated outside the light transmitting colloid 50, the light blocking layer has a light emitting hole 80, an inner diameter of the light emitting hole 80 increases gradually along a light emitting direction of the led lamp bead 100, the light blocking layer is disposed on the first light absorbing colloid layer 30, further, the light blocking layer contacts the first light absorbing colloid layer 30 to prevent light leakage at a connection position of the light blocking layer and the substrate 10, and a thickness of the first light absorbing colloid layer 30 under the light blocking layer is smaller than or equal to a thickness of the first light absorbing colloid layer 30 under the light transmitting colloid 50 to improve a capability of preventing light leakage at the connection position of the light blocking layer and the substrate 10. After the light emitting diode chip 20 is powered by the substrate 10 to emit light, light cannot or mostly cannot pass through the light absorbing colloid 70, so that the purpose of preventing side leakage can be achieved.

In a second aspect, the present application further provides a backlight source for an indicating device, including the above-mentioned led lamp bead 100. On the basis of having above-mentioned emitting diode lamp pearl 100, can obtain the suggestion or the indicating effect that light intensity is higher.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. The utility model provides a light-emitting diode lamp pearl, includes the base plate, locates light-emitting diode chip on the base plate and encapsulate in the printing opacity colloid in the outside of light-emitting diode chip, its characterized in that: the substrate is provided with a front mounting surface and a back mounting surface opposite to the front mounting surface, the front mounting surface is provided with a first metal area and a first nonmetal area, the light emitting diode chip is connected with the first metal area, and a first light absorption glue layer is arranged in the first nonmetal area.

2. The light-emitting diode lamp bead of claim 1, wherein: the LED lamp bead further comprises a light blocking layer packaged on the outer side of the light transmitting colloid, a light emitting hole is formed in the light blocking layer, and the light blocking layer is arranged on the first light absorbing glue layer and is in contact with the first light absorbing glue layer.

3. The light-emitting diode lamp bead of claim 2, wherein: the thickness of the first light-absorbing glue layer under the light-blocking layer is smaller than or equal to the thickness of the first light-absorbing glue layer under the light-transmitting glue.

4. The light-emitting diode lamp bead of claim 2, wherein: the substrate is white or black.

5. The light-emitting diode lamp bead of claim 2, wherein: the light blocking layer comprises a light reflecting colloid packaged on the outer side of the light transmitting colloid and a light absorbing colloid packaged on the outer side of the light reflecting colloid.

6. The light-emitting diode lamp bead of claim 1, wherein: the first metal region has a silver plating layer therein.

7. The light-emitting diode lamp bead of claim 1, wherein: the back surface mounting surface of the substrate is provided with a second metal area and a second nonmetal area, the second metal area is used for connecting an external circuit, and a second light absorption glue layer is arranged in the second nonmetal area.

8. The light-emitting diode lamp bead of claim 7, wherein: the second metal area has a gold plating layer therein, and the first metal area has a silver plating layer therein.

9. The light-emitting diode lamp bead of claim 8, wherein: the thickness of the second light absorption glue layer is smaller than or equal to that of the gold-plated layer.

10. A backlight for an indicating device, comprising: comprising the light-emitting diode lamp bead of any one of claims 1 to 9.

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