CN211375266U - Light source structure, backlight source, backlight module and display device - Google Patents
Light source structure, backlight source, backlight module and display device Download PDFInfo
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- CN211375266U CN211375266U CN201922491689.3U CN201922491689U CN211375266U CN 211375266 U CN211375266 U CN 211375266U CN 201922491689 U CN201922491689 U CN 201922491689U CN 211375266 U CN211375266 U CN 211375266U
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Abstract
The utility model discloses a light source structure, backlight unit and display device, the light source structure is including luminous chip, the light source structure is still including covering luminous chip's packaging layer and reflection stratum, the reflection stratum sets up on the play plain noodles of packaging layer, be equipped with the reflection particle that is used for the reverberation in the reflection stratum. The utility model discloses technical scheme sets up the reflection stratum on the encapsulated layer to when making the light that the luminescence chip sent see through the reflection stratum, at the inside refraction of reflection stratum, thereby make the formation diffuse reflection light after the refraction many times of light when the light-emitting, enlarged light emitting component's light-emitting angle, and make the light-emitting of luminescence chip even soft.
Description
Technical Field
The utility model relates to a show technical field, in particular to light source structure, backlight unit and display device.
Background
LCD TV adopts traditional straight following formula TV mode to compensate and has the gap on the dynamic contrast with OLED TV, promptly in traditional straight following formula TV, through the height reduction of the upper surface of lamp strip printed circuit board to the lower surface of diffuser plate with, and lens among the traditional straight following formula TV of getting rid of, with the design degree of difficulty of avoiding lens, and directly adopt LED as the backlight, however traditional LED's luminous angle is less, it is basically about 120, thereby the quantity demand that will lead to LED of the removal of lens increases and leads to cost increase.
SUMMERY OF THE UTILITY MODEL
The main objective of the present invention is to provide a light source structure, which aims to solve the technical problems of small light emitting angle and uneven light emission of the current light emitting device.
In order to achieve the above object, the present application provides a light source structure, which includes a light emitting chip; the light source structure further comprises a packaging layer and a reflecting layer, wherein the packaging layer covers the light-emitting chip, the reflecting layer is arranged on the light emergent surface of the packaging layer, and reflecting particles used for reflecting light are arranged in the reflecting layer.
Optionally, the encapsulation layer is provided with an accommodating cavity recessed towards the light emitting chip, and the reflecting layer fills the accommodating cavity.
Optionally, the accommodating cavity includes a sidewall, and the sidewall extends from an edge of the light emitting surface of the package layer to the light emitting chip in an inclined manner.
Optionally, the side wall is a slope or a cambered surface.
Optionally, the encapsulation layer contains a quantum dot material or phosphor, and the reflection layer is provided with the quantum dot material or phosphor.
Optionally, the reflective particles are a TiO2 material or a SiO2 material.
Optionally, the light source structure further includes a support, the light emitting chip is a forward-mounted chip, and the forward-mounted chip is connected to the support through a gold wire; or
The light-emitting chip is a flip chip, and the flip chip is in compression joint with the circuit board.
The application also provides a backlight source, which comprises the circuit board and a plurality of light source structures, wherein the adjacent light source structures are equal in distance.
The application also provides a backlight module which comprises the backlight source.
The application also provides a display device, which comprises the backlight module and the display panel. Adopt to set up the reflection stratum on the packaging layer in this embodiment, be equipped with the reflective particle of reverberation in the reflection stratum to when making the light that emitting chip sent to see through the reflection stratum, the reflective particle in the reflection stratum refracts the light, and formation diffuse reflection light after light process refractions many times when the light-emitting has enlarged emitting chip's light-emitting angle, and makes emitting chip's light-emitting even soft.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic view of a light source structure in which a reflective layer is uniform;
FIG. 2 is a schematic diagram of a light source structure in which the side wall of the reflective layer is an inclined surface;
FIG. 3 is a schematic structural view of a light source structure in which a side wall of a reflective layer is a circular arc surface;
FIG. 4 is a schematic cross-sectional view of a backlight module;
fig. 5 is a schematic plan view of a backlight.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1-3, the present embodiment provides a first embodiment of a light source structure, wherein the light source structure includes a light emitting chip 111; the light source structure further comprises a packaging layer 112 and a reflecting layer 113, wherein the packaging layer 112 covers the light emitting chip 111, the reflecting layer 113 is arranged on a light emergent surface of the packaging layer 112, and reflecting particles for reflecting light are arranged in the reflecting layer 113.
The encapsulation layer 112 is used for encapsulating the light emitting region of the light emitting chip 111 to achieve the effects of water resistance, moisture resistance, shock resistance and dust resistance, wherein the encapsulation layer 112 mainly comprises an encapsulation adhesive, the main components of the encapsulation adhesive can be epoxy encapsulation adhesive, silicone encapsulation adhesive, polyurethane encapsulation adhesive, ultraviolet light curing encapsulation adhesive and the like, and the color of the encapsulation adhesive can be transparent and colorless.
In order to increase the light transmittance of the package layer 112 and improve the light emitting effect of the light emitting chip 111, a quantum dot material or yellow phosphor or red-green phosphor is mixed in the package adhesive, wherein the quantum dot material comprises a red quantum dot material and a green quantum dot material, the quantum dot material can be composed of any one of group iii-v elements, the group iii-v element includes CdSe, CaSe, SrSe, ZnSe, CdTe, MgTe, ZnTe, SrTe, MgSe, cace, BaSe, BaTe, ZnS, CaS, MgS, SrS, BaS and CdS, in this embodiment, the quantum dot material can be a CdSe quantum dot material, the size of the red quantum dot is between 4 nm and 10nm, the excited peak wavelength is between 610 nm and 650nm, the size of the green quantum dot is between 2 nm and 7nm, and the excited peak wavelength of the green light is between 510 nm and 560 nm.
The quantum dot material can be any one element of III-V group elements, the III-V group element organic-inorganic hybrid perovskite (CH3NH3PbX3, X ═ Cl, I, Br) material, or the quantum dot material can be II-VI group elements, the II-VI group elements comprise any one of GaAs, GaN, GaP, InP, InN and InAs, or the quantum dot material can be all-inorganic perovskite cesium lead halogen quantum dots (CsPbX3, X ═ Cl, Br, I), or a core-shell structure compound formed by coating a plurality of materials or doped nanocrystalline.
The reflective layer 113 includes a package adhesive and reflective particles, the reflective particles are mixed in the package adhesive to make the reflective layer 113 reflect the penetrated light, wherein the package adhesive of the reflective layer 113 and the package adhesive of the package layer 112 are made of the same material, the reflective particles can be made of TiO2 and SiO2, or can be made of other reflective materials, the reflective layer 113 is disposed on the light-emitting surface of the package layer 112, the light emitted by the light-emitting chip 111 penetrates through the package layer 112 and enters the reflective layer 113, and the reflective particles are contained in the reflective layer 113, so that the light is refracted inside the reflective layer 113, and thus the light forms diffuse reflected light after being refracted for multiple times during light-emitting, almost no direct light exists, the light-emitting angle of the light-emitting chip 111 is enlarged, and the light-emitting of the light-emitting chip 111 is uniform and soft.
Specifically, the shape of the reflective layer 113 on the encapsulation layer 112 may be varied, wherein the reflective layer 113 may be varied, the reflective layer 113 near the light emitting chip 111 is thicker, the reflective layer 113 far from the light reflecting chip is thinner, the reflective layer 113 may also be uniform, and the thickness of the reflective layer 113 is the same.
The shape of the light emitting chip 111 may be rectangular, circular or square, and in this embodiment, the shape may be square, so as to facilitate the arrangement of the light emitting chips 111 and enhance the uniformity of light.
Light-emitting chip 111 can be for just installing the chip or flip chip, wherein, just installing the chip from last to down the material be: the light-emitting diode comprises P-GaN, a light-emitting layer, N-GaN, a substrate and a light-emitting chip 111, wherein the light-emitting chip 111 is arranged in a bracket and is connected with a circuit board 12 through the anode and the cathode of the bracket; the light that the luminescent layer of flip chip arouses directly sends from the another side of electrode, and the flip chip does not have the substrate, and the material of flip chip is transparent, and is right utilizing crimping tool the lamp panel board with fill resin between the flip chip, and right the flip chip carries out the pressure heating to make the flip chip with circuit board 12 is connected. The stent may be a copper stent.
In this embodiment, the reflective layer 113 is disposed on the package layer 112, and reflective particles for reflecting light are disposed in the reflective layer 113, so that when the light emitted from the light emitting chip 111 passes through the reflective layer 113, the reflective particles in the reflective layer 113 refract the light, so that the light is refracted for multiple times during light emitting to form diffuse reflection light, and almost no direct light exists, thereby enlarging the light emitting angle of the light emitting chip 111, and making the light emitting of the light emitting chip 111 uniform and soft.
Further, the encapsulation layer 112 is provided with an accommodating cavity recessed toward the light emitting chip 111, and the reflective layer 113 fills the accommodating cavity.
The concave holding chamber that is equipped with on the play plain noodles of encapsulation layer 112, wherein, the size of the accent in holding chamber is the size of whole play plain noodles to make the light that each bunch of encapsulation layer 112 passed through can both get into the holding intracavity, it has reflection stratum 113 to fill at the holding intracavity, the light that gets into the holding intracavity passes through the inside refraction of reflection stratum 113 in the holding intracavity, thereby make the formation diffuse reflection light after the multiple refraction of light when the light-emitting, almost no direct light, make luminous chip 111's light-emitting more even soft.
Further, the accommodating cavity includes a sidewall extending from an edge of the light emitting surface of the encapsulation layer 112 to the light emitting chip 111 in an inclined manner.
The side wall extends obliquely from the edge of the light-emitting surface of the package layer 112 to the light-emitting chip 111, and an inclined surface is formed between the cavity opening of the accommodating cavity and the cavity bottom of the side wall, so that the light-emitting chip 111 has a larger reflection angle of the light emitted therefrom, and the side wall may be an arc surface.
The side wall is an inclined surface, and the design of the inclined surface enables the light emitted by the light emitting chip 111 to be reflected outwards in the reflecting layer 113 at the largest angle, so that the light emitting angle of the LED is increased.
The side wall is an arc surface, and the design of the arc surface enables the light emitted by the light emitting chip 111 to be reflected more intensively at the reflecting layer 113, so that the light divergence is reduced.
The present application further provides a backlight 1, and as shown in fig. 4 to 5, the backlight 1 includes a circuit board and a plurality of light source structures 11, and the distances between adjacent light source structures 11 are equal. The circuit board described in the present application can be a circuit board such as a PCB circuit board, an FPC (flexible circuit board) or the like that can realize similar control functions.
The light source structures 11 are arranged at equal intervals, wherein a square or rhombus is enclosed between every four light source structures 11, so that the light of the backlight source 1 is uniformly diffused, and the effect of uniform light emission is achieved.
Further, a plurality of the light source structures 11 are arranged on the circuit board 12 in a diamond shape.
In this embodiment, the light source structures 11 may be arranged in a diamond shape, and due to the arrangement of the diamond shape, on the premise that the light emitting is uniform, the number of the light source structures 11 used on the circuit board 12 is minimized, so as to reduce the cost and increase the practicability of the backlight 1.
The application also provides a backlight module, as shown in fig. 4-5, the backlight module includes the backlight source 1, the backlight module includes a reflector plate 13, the reflector plate 13 is disposed on a surface of the backlight source 1 facing the light emitting chip 111, and the reflector plate 13 is provided with a mounting hole for sleeving the light source structure 11.
A diffusion plate 14, wherein the diffusion plate 14 is arranged on the light-emitting side of the backlight source;
at least one optical film 15, wherein the optical film 15 is disposed on the diffusion plate 14.
The backlight module comprises a circuit board 12, a reflector plate 13 and a light source structure 11, wherein the light source structure 11 is connected to the circuit board 12; the reflector plate 13 is arranged on the circuit board 12, and the reflector plate 13 is provided with a mounting hole for sleeving the light source structure 11, so that the reflector plate 13 is positioned on a backlight surface of the light source structure 11, and after the light source structure 11 emits light, the light positioned on the backlight surface is radiated by the reflector plate 13 to enhance the light efficiency.
A diffusion plate 14, wherein the diffusion plate 14 is arranged at the light-emitting side of the backlight source 1
The diffusion plate 14 utilizes the physical phenomena of refraction, reflection and scattering when light encounters two media with different refractive indexes in the traveling path by chemical or physical means, so that the light is refracted, reflected and scattered in different directions, the traveling path of the light is changed, and the effect of optical diffusion is achieved by fully dispersing colors of incident light.
At least one optical film 15, wherein the optical film 15 is disposed on the diffusion plate 14.
The optical film 15 may be one or more of a diffusion sheet, a brightness enhancement sheet, and a DBEF, or may be a composite film formed by combining these films, and when no phosphor or quantum dots are added to the pure blue light source structure 11, the optical film 15 further includes a quantum dot film, and the quantum dot material of the quantum dot film is the same as the quantum dot material of the light source structure 11.
The application also provides a display device, the display device comprises the backlight module and a display panel, and the display panel can be a liquid crystal display panel.
The above only be the specific embodiment of the utility model discloses a to not consequently restrict the utility model discloses a patent range, all be in the utility model discloses a under the design, utilize the equivalent structure transform of doing of the contents of description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.
Claims (10)
1. A light source structure comprises a light emitting chip, and is characterized by further comprising an encapsulation layer covering the light emitting chip; and the reflecting layer is arranged on the light emergent surface of the packaging layer, wherein reflecting particles for reflecting light are arranged in the reflecting layer.
2. The light source structure of claim 1, wherein the encapsulation layer is provided with a receiving cavity recessed toward the light emitting chip, and the reflective layer fills the receiving cavity.
3. The light source structure of claim 2, wherein the receiving cavity comprises a sidewall extending from an edge of a light-emitting surface of the encapsulation layer to the light-emitting chip in an inclined manner.
4. The light source structure of claim 3, wherein the sidewalls are beveled or curved.
5. The light source structure of claim 1, wherein the encapsulation layer contains a quantum dot material or a phosphor, and the reflective layer is provided with the quantum dot material or the phosphor.
6. The light source structure of claim 1, wherein the reflective particles are a TiO2 material or a SiO2 material.
7. The light source structure of claim 1, further comprising a support, wherein the light emitting chip is a front-mounted chip, and the front-mounted chip is connected to the support by gold wires; or
The light-emitting chip is a flip chip, and the flip chip is in compression joint with the circuit board.
8. A backlight source, comprising a circuit board and the light source structures as claimed in any one of claims 1 to 7, wherein the circuit board is provided with a plurality of the light source structures, and the adjacent light source structures are spaced at equal intervals.
9. A backlight module comprising the backlight of claim 8.
10. A display device comprising the backlight module as claimed in claim 9 and a display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922491689.3U CN211375266U (en) | 2019-12-30 | 2019-12-30 | Light source structure, backlight source, backlight module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922491689.3U CN211375266U (en) | 2019-12-30 | 2019-12-30 | Light source structure, backlight source, backlight module and display device |
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| Publication Number | Publication Date |
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| CN211375266U true CN211375266U (en) | 2020-08-28 |
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| CN201922491689.3U Active CN211375266U (en) | 2019-12-30 | 2019-12-30 | Light source structure, backlight source, backlight module and display device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113328023A (en) * | 2021-05-31 | 2021-08-31 | Tcl华星光电技术有限公司 | Light-emitting device, preparation method thereof and display device |
| CN114719201A (en) * | 2022-05-23 | 2022-07-08 | 罗化芯显示科技开发(江苏)有限公司 | LED backlight assembly and manufacturing method thereof |
| CN115407547A (en) * | 2021-05-28 | 2022-11-29 | 海信视像科技股份有限公司 | Display device |
-
2019
- 2019-12-30 CN CN201922491689.3U patent/CN211375266U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115407547A (en) * | 2021-05-28 | 2022-11-29 | 海信视像科技股份有限公司 | Display device |
| CN115407547B (en) * | 2021-05-28 | 2024-04-02 | 海信视像科技股份有限公司 | Display device |
| CN113328023A (en) * | 2021-05-31 | 2021-08-31 | Tcl华星光电技术有限公司 | Light-emitting device, preparation method thereof and display device |
| CN114719201A (en) * | 2022-05-23 | 2022-07-08 | 罗化芯显示科技开发(江苏)有限公司 | LED backlight assembly and manufacturing method thereof |
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