KR102398384B1 - Light emitting diode package and method for manufacturing the same, backlight unit and liquid crystal display device using the same - Google Patents

Abstract

The present invention provides a light emitting diode package having improved light efficiency and a wide light directivity angle, a manufacturing method thereof, a backlight unit and a liquid crystal display using the same, and the light emitting diode package according to the present invention is a light emitting surface of a light extraction member A light emitting diode chip disposed on a second surface opposite to the first surface defined as , a lead frame connected to the light emitting diode chip while supporting the second surface of the light extraction member, and a wavelength of light emitted from the light emitting diode chip to a different wavelength It may include a wavelength conversion member for converting and emitting.

Description

Light emitting diode package, manufacturing method thereof, and backlight unit and liquid crystal display using same

The present invention relates to a liquid crystal display device, and more particularly, to a light emitting diode package, a manufacturing method thereof, and a backlight unit and liquid crystal display device using the same.

In general, a light emitting diode (Light Emitting Didoe) is a semiconductor device that converts electrical energy into light and is widely used in display units of electronic products, various display devices, and lighting devices of vehicles by replacing conventional fluorescent or incandescent lamps.

In particular, the light emitting diode is widely used as a light source of a liquid crystal display because of its advantages of long lifespan, fast response characteristics, low power consumption, and miniaturization compared to conventional fluorescent lamps.

1 is a view for explaining a conventional light emitting diode package.

Referring to FIG. 1 , a conventional light emitting diode package is provided on edges of first and second lead electrodes 10 and 20 and first and second lead electrodes 10 and 20 that are spaced apart from each other at a predetermined interval and are parallel to each other to emit light. A light emitting diode chip bonded to the first lead electrode 10 and/or the second lead electrode 20 by the mold frame 30 defining the space and the conductive paste 45 and disposed in the light emitting space 40), a first wire 50 connecting the first terminal 42 provided on one side of the upper surface of the light emitting diode chip 40 to the first lead electrode 10, provided on the other side of the upper surface of the light emitting diode chip 40 The second wire 60 connecting the second terminal 42 to the second lead electrode 20 and the light emitting space are filled to cover the light emitting diode chip 40 and the first and second wires 50 and 60 and an encapsulation layer 70 .

The light emitting diode chip 40 may be an epi chip that emits light to the light exit surface 72 provided on the front surface of the encapsulation layer 70 , and for example, a blue epi chip that emits blue light. It may be a chip. The encapsulation layer 70 is formed to include a phosphor 72 .

In this conventional light emitting diode package, the first color light CL1 is emitted by the light emitting diode chip 40 according to the driving power applied to the first and second lead electrodes 10 and 20 , and the light emitting diode chip Some of the first color light CL1 emitted by the primary emission of 40 is absorbed by the phosphor 72 mixed in the encapsulation layer 70 and the second color light (not shown) due to secondary emission. time) and emitted to the light exit surface 74 of the encapsulation layer 70 , and the remainder of the first color light CL1 is scattered by the phosphor and emitted to the light exit surface 74 . Accordingly, the conventional light emitting diode package emits white light by mixing the first color light CL1 and the second color light. Here, the first color light CL1 may be blue light, and the second color light may be yellow light.

Such a conventional light emitting diode package has the following problems.

First, the first color light CL1 generated by the light emitting diode chip 40 is absorbed by the first terminal 42 and/or the second terminal 44 and the first and second wires 50 and 60 . and light loss occurs.

Second, the second color light generated by the secondary light emission of the phosphor is also absorbed by the first terminal 42 and/or the second terminal 44 and the first and second wires 50 and 60 to reduce light loss. occurs

Third, since it has a light beam angle according to the inclination of the inner slope of the mold frame, there is a limitation in having a wide beam beam angle.

The present invention has been devised to solve the above problems, and it is a technical task to provide a light emitting diode package having improved light efficiency and a wide light directivity angle, a method for manufacturing the same, and a backlight unit and a liquid crystal display using the same.

The light emitting diode package according to the present invention for achieving the above-described technical problem is a light emitting diode chip disposed on the second surface opposite to the first surface defined as the light emitting surface of the light extraction member, the second surface of the light extraction member It may include a lead frame connected to the light emitting diode chip while supporting it, and a wavelength conversion member for converting a wavelength of light emitted from the light emitting diode chip into another wavelength and emitting it.

A light emitting diode package according to the present invention for achieving the above-described technical problem includes a light emitting diode array having a plurality of light emitting diode packages irradiating light to a light incident part of a light guide plate, and the plurality of light emitting diode packages is a light-emitting diode package The light emitting diode chip disposed on the second surface opposite to the first surface defined as the light emitting surface, the lead frame connected to the light emitting diode chip while supporting the second surface of the light extraction member, and the wavelength of light emitted from the light emitting diode chip are different It may include a wavelength conversion member for converting and emitting a wavelength.

A liquid crystal display device according to the present invention for achieving the above technical problem includes a liquid crystal display panel and a backlight unit irradiating light to the liquid crystal display panel, and the backlight unit includes a plurality of light emitting diode packages irradiating light to a light incident part of a light guide plate and a light emitting diode array having a plurality of light emitting diode packages supporting a light emitting diode chip disposed on a second surface opposite to a first surface defined as a light emitting surface of the light extracting member, and a second surface of the light extracting member It may include a lead frame connected to the light emitting diode chip, and a wavelength conversion member for converting a wavelength of light emitted from the light emitting diode chip into another wavelength and emitting it.

According to the means for solving the above problems, the present invention has the following effects.

First, by preventing light loss due to light absorption of the first and second terminals of the light emitting diode chip and the conductive wire, the light efficiency of the light emitting diode package can be improved, and the light beam angle of the light emitting diode package can be widened.

Second, it is possible to improve the hot spot phenomenon occurring in the light incident portion of the light guide plate by widening the light beam angle of the light emitting diode package, and to reduce the bezel width of the light incident portion by reducing the gap between the light incident portion of the light guide plate and the light emitting diode package. there is.

In addition to the effects of the present invention mentioned above, other features and advantages of the present invention will be described below or will be clearly understood by those of ordinary skill in the art from such description and description.

1 is a view for explaining a conventional light emitting diode package.
2 is a perspective view illustrating a light emitting diode package according to an embodiment of the present invention.
Fig. 3 is a cross-sectional view taken along line II' shown in Fig. 2;
FIG. 4 is a cross-sectional view taken along the line II-II' shown in FIG. 2 .
FIG. 5 is a perspective view illustrating a light extracting member according to an example illustrated in FIG. 3 .
6 is a perspective view illustrating a light extracting member according to another example shown in FIG. 3 .
7 is a perspective view illustrating the light emitting diode chip shown in FIG. 3 .
8A is a simulation diagram illustrating the front luminance of a light emitting diode package according to the present invention.
8B is a simulation diagram illustrating the front luminance of a light emitting diode package according to a comparative example.
9 is a cross-sectional view illustrating a light emitting diode package according to another example of the present invention.
10 is a cross-sectional view illustrating a light emitting diode package according to another example of the present invention.
11 is a cross-sectional view illustrating a partial cross-section of a backlight unit according to an embodiment of the present invention.
12 is a perspective view illustrating the light emitting diode array and the light guide plate shown in FIG. 11 .
13 is a cross-sectional view taken along line III-III' shown in FIG. 12 .
14 is a perspective view schematically illustrating a liquid crystal display according to an exemplary embodiment of the present invention.
15 is a cross-sectional view taken along the line VI-VI' shown in FIG. 14 .
16A to 16H are diagrams for explaining step-by-step a method of manufacturing a light emitting diode package according to the present invention.
17A to 17C are views for explaining another method of manufacturing a light extracting member in a method of manufacturing a light emitting diode package according to the present invention.

The meaning of the terms described in this specification should be understood as follows.

The singular expression is to be understood as including the plural expression unless the context clearly defines otherwise, and the terms "first", "second", etc. are used to distinguish one element from another, The scope of rights should not be limited by these terms. It should be understood that terms such as “comprise” or “have” do not preclude the possibility of addition or existence of one or more other features or numbers, steps, operations, components, parts, or combinations thereof. The term “at least one” should be understood to include all possible combinations from one or more related items. For example, the meaning of “at least one of the first, second, and third items” means that each of the first, second, or third items as well as two of the first, second and third items It means a combination of all items that can be presented from more than one. The term “on” is meant to include not only cases in which a certain component is formed directly above another component, but also a case in which a third component is interposed between these components.

Hereinafter, a light emitting diode package, a manufacturing method thereof, and preferred examples of a backlight unit and a liquid crystal display using the same according to the present invention will be described in detail with reference to the accompanying drawings. In adding reference numerals to components of each drawing, the same components may have the same reference numerals as much as possible even though they are indicated in different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

2 is a perspective view showing a light emitting diode package according to an embodiment of the present invention, FIG. 3 is a cross-sectional view taken along line II' shown in FIG. 2, and FIG. 4 is a cross-sectional view taken along line II-II' shown in FIG. am.

2 to 4 , the light emitting diode package 100 according to an embodiment of the present invention includes a light extraction member 110 , a light emitting diode chip 120 , a lead frame 130 , and a wavelength conversion member 140 . includes

The light extraction member 110 emits light emitted from the light emitting diode chip 120 to the light exit surface, that is, to the outside. The light extraction member 110 according to an example, as shown in FIG. 5 , includes a first surface 111 , a second surface 113 opposite to the first surface 111 , and at least two sidewalls 115 . , 116) may be included.

The first surface 111 is defined as a light exit surface and has a first size. The second surface 113 has a second size smaller than the first size of the first surface 111 .

The at least two sidewalls 115 and 116 are provided to be inclined between the first surface 111 and the second surface 113 . Here, the angle θ between the reference line RL extending from the second surface 113 and the sidewalls 115 and 116 to be parallel to the first surface 111 may be set to an acute angle, but is not limited thereto. It may be set to an angle to satisfy the light directivity angle set in the light emitting diode package 100 .

As such, the light extraction member 110 according to an example has a first surface 111 having a first size, a second surface 113 having a second size smaller than the first size, and two inclined short side walls 115 . ), and an inverted pyramid structure having two inclined long side walls 116 . Accordingly, the light extraction member 110 according to an example has a cross-sectional area that gradually increases from the second surface 113 adjacent to the light emitting diode chip 120 to the first surface 111 which is the light emitting surface. The light emitted from the chip 120 increases the light directivity angle emitted to the outside.

The light extraction member 110 according to an example may include an optical pattern 115a provided on each of the short side wall 115 and the long side wall 116 . The optical pattern 115a reflects light incident on the sidewalls 115 and 116 from the light emitting diode chip 120 toward the first surface 111 to increase the amount of light emitted from the first surface 111 . For example, the optical pattern 115a may be a lens pattern and a prism pattern patterned to be convex or concave from the sidewalls 115 and 116 .

The light extraction member 110 may be made of a transparent material, for example, may be made of a silicon material. The light extraction member 110 internally reflects and refracts the light incident from the light emitting diode chip 120 to make it incident on the wavelength conversion member 140 through the light exit surface.

The light extraction member 110 according to an example further includes a groove portion 117 provided on the second surface 113 . The groove 117 is provided concavely from the second surface 113 to the first surface 111 to have a certain depth, and accommodates the light emitting diode chip 120 as well as each side of the light emitting diode chip 120 . wrap around The groove 117 facilitates alignment of the light emitting diode chip 120 disposed on the second surface 113 of the light extraction member 110 , and the light emitted toward the side of the light emitting diode chip 120 is transmitted through the sidewall It is reflected by (115, 116) so that the light proceeds toward the light exit surface.

As shown in FIG. 6 , the light extraction member 110 according to another example includes a first surface 111 , a second surface 113 , two inclined short side walls 115 , and two vertical fields. It may have an equilateral trapezoidal structure having sidewalls 116a. The optical pattern 115a may be provided on the two inclined short sidewalls 115 .

Referring back to FIGS. 2 to 5 , the light emitting diode chip 120 is disposed on the second surface 113 of the light extraction member 110 and excitation light according to the driving power supplied from the lead frame 130 . light), that is, it emits the first color light. For example, the light emitting diode chip 120 may be a blue light emitting diode chip emitting blue light.

5 to 7 , the light emitting diode chip 120 according to an example includes a substrate 121 , a buffer layer 122 , a first semiconductor layer 123 , an active layer 124 , and a second semiconductor layer. 125 , a first terminal 126 , a second terminal 127 , and a reflective layer 128 .

The substrate 121 may be made of a material such as sapphire (Al ₂ O ₃ ), silicon carbide (SiC), zinc oxide (ZnO), silicon (Si), or gallium arsenide (GaAs). Here, sapphire is mainly used as a substrate for a blue or green light emitting device because it is relatively easy to grow a GaN-based semiconductor material and is stable at a high temperature. Accordingly, the substrate 121 may be a sapphire substrate. The substrate 121 may be attached to the second surface 113 of the light extraction member 110 or to the bottom surface of the groove 117 provided on the second surface 113 .

The buffer layer 122 is formed between the substrate 121 and the first semiconductor layer 123 in order to reduce a difference in lattice constant between the substrate 121 and the first semiconductor layer 123 , and is made of a material of GaN or AlN. can

The first semiconductor layer 123 is formed on the buffer layer 122 to provide electrons to the active layer 124 . The first semiconductor layer 123 according to an example may be made of an n-GaN-based semiconductor material, and the n-GaN-based semiconductor material may be GaN, AlGaN, InGaN, AlInGaN, or the like. Here, Si, Ge, Se, Te, or C may be used as the impurity used for doping the first semiconductor layer 123 .

The active layer 124 is formed on the first semiconductor layer 123 to emit light. Here, the active layer 124 is formed on the remaining portion except for one edge portion of the first semiconductor layer 123 . The active layer 124 has a multi-quantum well (MQW) structure having a well layer and a barrier layer having a band gap higher than that of the well layer. For example, a blue light emitting diode chip may have a multi-quantum well structure such as InGaN/GaN.

The second semiconductor layer 125 is formed on the active layer 124 to provide holes to the active layer 124 . The second semiconductor layer 125 according to an example may be made of a p-GaN-based semiconductor material, and the p-GaN-based semiconductor material may be GaN, AlGaN, InGaN, AlInGaN, or the like. Here, as an impurity used for doping the second semiconductor layer 124 , Mg, Zn, Be, or the like may be used.

A transparent electrode layer (not shown) may be additionally formed on the second semiconductor layer 125 . The transparent electrode layer reduces contact resistance with the second semiconductor layer 125 having a relatively high energy band gap. The transparent electrode layer may be made of a light-transmitting material so that light generated in the active layer 124 may be emitted upward.

The first terminal 126 is formed on the active layer 123 . Here, the first terminal 126 may be provided on one surface of the light emitting diode chip 120 facing the lead frame 130 . The first terminal 126 may have a single-layer structure or a multi-layer structure made of any one material selected from Ti, Cr, Al, and Au or an alloy material of two or more.

The second terminal 127 is formed on one edge portion of the first semiconductor layer 123 exposed without being covered by the active layer 123 by mesa etching. Here, the second terminal 127 is provided on one surface of the light emitting diode chip 120 and the other surface spaced apart from the first terminal 126 to face the lead frame 130 while being stepped. The second terminal 127 may have a single-layer structure or a multi-layer structure made of any one material selected from Ti, Cr, Al, and Au or an alloy material of two or more.

The reflective layer 128 is interposed between the active layer 123 and the first terminal 126 to reflect the light generated from the active layer 123 toward the substrate 121 to improve the light output efficiency of the light emitting diode chip 120 . Here, the reflective layer 128 has at least one via hole, and the first terminal 126 passes through the reflective layer 128 , ie, is electrically connected to the active layer 123 through the via hole. In order to improve reflection efficiency, the reflective layer 128 according to an example may have a distributed Bragg reflector structure, and may have a stacked structure of SiO ₂ and TiO 2 . The reflective layer 128 may be formed to a thickness of 100 nm or less.

As such, the light emitting diode chip 120 according to an example is inserted into the groove portion 117 provided on the second surface 113 of the light extraction member 110 to have a vertically inverted shape. That is, the substrate 121 of the light emitting diode chip 120 according to an example may be inserted into the groove portion 117 of the light extraction member 110 and attached to the bottom surface of the groove portion 117 by the adhesive member 119 . there is. Accordingly, each of the first and second terminals 126 and 127 of the light emitting diode chip 120 is exposed to the outside by the groove 117 of the light extraction member 110 .

The lead frame 130 supports the second surface 113 of the light extraction member 110 and is connected to the light emitting diode chip 120 . The lead frame 130 supplies driving power to the first and second terminals 126 and 127 of the light emitting diode chip 120 . The lead frame 130 according to an example includes first and second lead electrodes 132 and 134 that are spaced apart from each other to face the second surface 113 of the light extraction member 110 and are parallel to each other.

The first lead electrode 132 is electrically connected to the first terminal 126 of the light emitting diode chip 120 . For example, the first lead electrode 132 is electrically connected to the first terminal 126 of the light emitting diode chip 120 by a die bonding process using the conductive paste 133 . The first lead electrode 132 supports one side of the second surface 113 of the light extraction member 110 and the light emitting diode chip 120 , and applies first driving power supplied from the outside to the second surface of the light emitting diode chip 120 . 1 is supplied to the terminal 126 . Here, in the present invention, the first terminal 126 of the light emitting diode chip 120 is formed to have a relatively wider size than the second terminal 127 , and the first lead electrode 132 and the light emitting diode chip are formed through a die bonding process. By electrically connecting the first terminal 126 of 120 , heat generated in the active layer 123 of the light emitting diode chip 120 can be effectively dissipated, and between the light emitting diode chip 120 and the lead frame 130 . Adhesion can be increased.

The second lead electrode 134 is electrically connected to the second terminal 127 of the light emitting diode chip 120 . For example, the second lead electrode 134 is electrically connected to the second terminal 127 of the light emitting diode chip 120 by a reverse wire bonding process using the conductive wire 135 . The second lead electrode 134 supports the other side of the second surface 113 of the light extraction member 110 , and applies the second driving power supplied from the outside to the second terminal 127 of the light emitting diode chip 120 . supply

In the reverse wire bonding process, the conductive wire 135 is placed in the wiring space provided between the first and second lead electrodes 132 and 134 parallel to each other under the second surface 113 of the light extraction member 110, and , by bonding one end of the conductive wire 135 to the second lead electrode 134 , and then bonding the other end of the conductive wire 135 to the second terminal 127 of the light emitting diode chip 120 . The second terminal 127 of the light emitting diode chip 120 and the second lead electrode 134 may be electrically connected through the .

The first and second lead electrodes 132 and 134 may be made of Al or Ag/Cu having high thermal conductivity for heat dissipation of the light emitting diode chip 120 .

Additionally, the conductive wire 135 may be coated with a reflective material. The reflective material reflects light incident on the conductive wire 135 , thereby minimizing light loss due to light absorption of the conductive wire 135 . Here, the reflective material may be made of a reflective resin, for example, white silicone or white paste UV resin. Furthermore, the reflective material is also coated on the first terminal 126 and/or the second terminal 127 of the light emitting diode chip 120 , so that the first terminal 126 and/or the second terminal of the light emitting diode chip 120 . Minimize the light loss due to the light absorption of (127).

Meanwhile, the second lead electrode 134 may be connected to the second terminal 127 of the light emitting diode chip 120 by the same die bonding process as the first lead electrode 132 instead of the wire bonding process, but for this purpose The structure of the light emitting diode chip 120 needs to be changed. That is, in order to die-bonding the second lead electrode 134 and the second terminal 127 of the light emitting diode chip 120 , an additional process for forming the second terminal 127 up to the height of the first terminal 126 is required. It is necessary, and a process of additionally forming an insulating film to insulate the first and second terminals 126 and 127 located on the same plane is required. Accordingly, in the present invention, by electrically connecting the light emitting diode chip 120 to the lead frame 130 without changing the special structure of the light emitting diode chip 120 through a hybrid bonding process that selectively uses a die bonding process and a wire bonding process, Adhesion between the light emitting diode chip 120 and the lead frame 130 and heat dissipation characteristics may be improved.

The wavelength conversion member 140 converts the wavelength of light emitted from the light emitting diode chip 120 into another wavelength to emit it. That is, the wavelength conversion member 140 is attached to the first surface 111 , more specifically, the light exit surface of the light extraction member 110 , and is incident from the light extraction member 110 through the fluorescent material 142 . The light emitting diode package 100 emits white light by mixing the first and second color lights by absorbing the first color light and emitting the second color light whose wavelength is converted. Here, since the wavelength conversion member 140 is attached to the entire first surface 111 of the light extraction member 110 , the light incident from the light extraction member 110 is emitted in the front direction and the side direction to emit light in the light emitting diode package. (100) to further increase the light directivity angle. In addition, since the fluorescent material 142 is not included in the light extraction member 110 but is included in the wavelength conversion member 140 , in the present invention, the wavelength conversion member 140 can emit uniform second color light, Through this, the light emitting diode package 100 may emit uniform white light.

The wavelength conversion member 140 according to an example may be a phosphor sheet including the phosphor material 142 . The phosphor sheet is attached to the first surface 111 of the light extraction member 110 to absorb the first color light emitted from the light emitting diode chip 120 and incident through internal reflection and refraction of the light extraction member 110 . and re-emit to emit a second color light. For example, when the light emitting diode chip 120 is a blue light emitting diode chip that emits a blue wavelength of 430 nm to 480 nm, the phosphor sheet is excited by light of a blue wavelength and the emitted wavelength is yellow. may include

The phosphor sheet according to an example may be made of a transparent adhesive such as a thermosetting resin or UV-curable resin including a fluorescent material 142 , and may be attached to or coated on the first surface 111 of the light extraction member 110 .

According to another example, the phosphor sheet may be manufactured in a sheet shape by sintering a mixture of ceramic and fluorescent material, and may be attached to the first surface 111 of the light extraction member 110 .

Additionally, in the wavelength conversion member 140 , in addition to one type of fluorescent material 142 , various well-known fluorescent materials for wavelength conversion may be additionally mixed as needed.

Referring back to FIGS. 2 to 4 , the light emitting diode package 100 according to an embodiment of the present invention may further include a light reflection member 150 .

The light reflection member 150 according to an example is provided to surround the short side wall 115 and the long side wall 116 of the light extraction member 110 , and the light incident on the side walls 115 and 116 of the light extraction member 110 is provided. By reflecting the light loss of the light extraction member 110 is prevented, the light extraction efficiency of the light extraction member 110 is increased.

The light reflection member 150 according to another example is provided to surround the short side wall 115 of the light extraction member 110 and reflects the light incident on the short side wall 115 of the light extraction member 110 to reflect the light extraction member ( By preventing the light loss of 110 , the light extraction efficiency of the light extraction member 110 is increased.

The light reflection member 150 may be made of white silicon or white paste UV resin.

Additionally, the light emitting diode package 100 according to an embodiment of the present invention may further include a sealing member 160 .

The sealing member 160 is filled in the wiring space provided between the first and second lead electrodes 132 and 134 spaced apart from each other for the reverse wire bonding process to seal the wiring space and the conductive wire 135 . . The sealing member 160 conceals the conductive wire 135 while preventing moisture penetration into the wiring space. The sealing member 160 according to an example may be made of epoxy, that is, white epoxy.

As such, in the light emitting diode package 100 according to an example of the present invention, when driving power is applied to the first and second terminals 126 and 217 of the light emitting diode chip 120 through the lead frame 130, White light is emitted to the outside by light emission of the light emitting diode chip 120 . That is, when the light emitting diode chip 120 emits light, the first color light emitted from the light emitting diode chip 120 is internally reflected and refracted by the light extracting member 110 that does not contain a fluorescent material, and thus the light extracting member 110 . ), a portion of the first color light incident on the wavelength conversion member 140 through the light exit surface of the wavelength conversion member 140 is converted into second color light by the fluorescent material of the wavelength conversion member 140 . The remaining first color light that is converted and emitted to the outside and incident on the wavelength conversion member 140 passes through the wavelength conversion member 140 as it is and is emitted to the outside. Accordingly, the light emitting diode package 100 according to an embodiment of the present invention emits white light by mixing the first color light and the second color light emitted from the upper surface and the side surface of the wavelength conversion member 140 to the outside. .

8A is a simulation diagram illustrating the front luminance of a light emitting diode package according to the present invention, and FIG. 8B is a simulation diagram illustrating the front luminance of a light emitting diode package according to a comparative example.

First, in the simulation, a light emitting diode package according to each of the present invention and Comparative Example having a 1 mm size light emitting diode chip and the same fluorescent material was used.

As can be seen from FIG. 8A , in the light emitting diode package according to the present invention, light emitted from the light emitting diode chip 120 is not absorbed by the first and second terminals 126 and 127 and the conductive wire 135, and light is extracted It can be seen that the member 110 has a relatively wide orientation angle by being emitted to the outside through the wavelength conversion member 140 through internal reflection and refraction of the member 110 . In the case of the light emitting diode package according to the present invention, it was measured to have a full width at half maximum (HW1) of 0.8 mm.

In contrast, as can be seen from FIG. 8B , in the light emitting diode package according to the comparative example, light emitted from the light emitting diode chip is absorbed by the first and second terminals and the conductive wire, as well as according to the slope of the inner slope of the mold frame It can be seen that it has a relatively narrow light directivity angle. In the case of the light emitting diode package according to this comparative example, it was measured to have a full width at half maximum (HW2) of 0.6 mm.

As described above, in the light emitting diode package 100 according to an embodiment of the present invention, the substrate 121 of the light emitting diode chip 120 is attached to the lower surface of the light extraction member 110 having a light exit surface, and the light extraction member The wavelength conversion member 140 is provided on the light emitting surface of 110 to prevent light loss due to light absorption of the first and second terminals 126 and 127 of the light emitting diode chip 120 and the conductive wire 135 . As a result, light efficiency is improved and a wide light beam angle can be obtained.

9 is a cross-sectional view for explaining a light emitting diode package according to another example of the present invention, which consists of two light emitting diode chips in the light emitting diode package according to an example of the present invention.

Referring to FIG. 9 , the light emitting diode package 200 according to another example of the present invention includes first and second light extraction members 110 - 1 and 110 - 2 , and first and second light emitting diode chips 120 - 1 , 120 - 2 ), a lead frame 230 , and a wavelength conversion member 240 .

The first light extraction member 110 - 1 emits light emitted from the first light emitting diode chip 120 - 1 to the light exit surface, that is, to the outside. The first light extracting member 110-1 according to an example, as shown in FIG. 5, includes a first surface 111, a second surface 113 opposite to the first surface 111, and at least two The sidewalls 115 and 116 are included, which is the same as the light extraction member 110 of the light emitting diode package according to an embodiment of the present invention, and thus a redundant description thereof will be omitted.

The second light extracting member 110-2 is parallel to the long axis longitudinal direction (x) of the first light extracting member 110-1 so as to be in contact with one side wall of the first light extracting member 110-1. are placed The second light extraction member 110 - 2 emits light emitted from the second light emitting diode chip 120 - 2 to the light exit surface, that is, to the outside. The second light extraction member 110 - 2 according to an example, as shown in FIG. 5 , includes a first surface 111 , a second surface 113 opposite to the first surface 111 , and at least two It includes four sidewalls 115 and 116, which have the same configuration except that they are disposed to be in contact with one short sidewall of the first light extracting member 110-1, so a redundant description thereof will be omitted. do it with

Each of the first and second light extraction members 110 - 1 and 110 - 2 includes a groove 117 concave from the second surface 111 .

The first light emitting diode chip 120 - 1 is disposed on the second surface 113 of the first light extraction member 110 - 1 to emit excitation light according to the driving power supplied from the lead frame 130 . That is, since it is the same as the light emitting diode chip 120 of the light emitting diode package according to an embodiment of the present invention except for emitting the first color light, a redundant description thereof will be omitted.

The first light emitting diode chip 120 - 1 may be inserted into the groove 117 provided on the second surface 113 of the first light extraction member 110 - 1 . In this case, the substrate 121 of the first light emitting diode chip 120 - 1 may be attached to the bottom surface of the groove portion 117 .

The second light emitting diode chip 120 - 2 is disposed on the second surface 113 of the second light extraction member 110 - 2 to emit excitation light according to the driving power supplied from the lead frame 130 . That is, since it is the same as the light emitting diode chip 120 of the light emitting diode package according to an embodiment of the present invention except for emitting the first color light, a redundant description thereof will be omitted.

The second light emitting diode chip 120 - 2 may be inserted into the groove 117 provided on the second surface 113 of the second light extraction member 110 - 2 . In this case, the substrate 121 of the second light emitting diode chip 120 - 2 may be attached to the bottom surface of the groove portion 117 .

A pitch between the first and second light emitting diode chips 120 - 1 and 120 - 2 may be set to correspond to a light beam angle set in the light emitting diode package 200 . For example, the light beam direction angle of the light emitting diode package 200 may increase as the pitch between the first and second light emitting diode chips 120 - 1 and 120 - 2 increases.

The lead frame 230 supports the second surface 113 of each of the first and second light extraction members 110-1 and 110-2, and the first and second light emitting diode chips 120-1 and 120- 2) is connected to That is, the lead frame 230 is connected to the first and second light emitting diode chips 120-1 and 120-2, and the second of the first and second light extraction members 110-1 and 110-2, respectively. It covers the side 113 . The lead frame 230 supplies driving power to the first and second terminals 126 and 127 of the first and second light emitting diode chips 120-1 and 120-2, respectively. The lead frame 230 according to an example includes first to third lead electrodes 232 , 234 , and 236 that are spaced apart from each other to face the second surface 113 of the light extraction member 110 and are parallel to each other.

The first lead electrode 232 is electrically connected to the first terminal 126 of the first light emitting diode chip 120 - 1 . For example, except that the first lead electrode 232 is electrically bonded to the first terminal 126 of the first light emitting diode chip 120-1 by a die bonding process using a conductive paste. Since and is the same as the first lead electrode 132 of the light emitting diode package according to an example of the present invention, a redundant description thereof will be omitted.

The second lead electrode 234 is disposed parallel to the first lead electrode 232 with a first wiring space therebetween and is electrically connected to the first terminal 126 of the second light emitting diode chip 120 - 2 . While being connected, it is electrically connected to the second terminal 127 of the first light emitting diode chip 120 - 1 . For example, the second lead electrode 234 is electrically bonded to the first terminal 126 of the second light emitting diode chip 120-2 by a die bonding process using a conductive paste, It is electrically connected to the second terminal 127 of the first light emitting diode chip 120 - 1 by a reverse wire bonding process using the first conductive wire 135a.

The third lead electrode 236 is disposed parallel to the second lead electrode 234 with a second wiring space therebetween and is electrically connected to the second terminal 127 of the second light emitting diode chip 120 - 2 . connected For example, the third lead electrode 236 is connected to the second terminal 127 of the second light emitting diode chip 120-2 by a reverse wire bonding process using the second conductive wire 135b. electrically connected to

Additionally, a reflective material may be coated on each of the first and second conductive wires 135a and 125b. Furthermore, the reflective material may also be coated on the first terminal 126 and/or the second terminal 127 of each of the first and second light emitting diode chips 120 - 1 and 120 - 2 .

The wavelength conversion member 240 is attached to the first surface 111 of each of the first and second light extraction members 110 - 1 and 110 - 2 , that is, the entire light exit surface. The wavelength conversion member 240 is formed to include the fluorescent material 142 , and is incident through the light exit surfaces of the first and second light extraction members 110 - 1 and 110 - 2 through the fluorescent material 142 . By absorbing the first color light, the wavelength of the converted second color light is emitted. In an example of the present invention, the wavelength conversion member 240 is disposed to cover the first surface 111 of each of the first and second light extraction members 110-1 and 110-2. Since it is the same as the wavelength conversion member 140 of the light emitting diode package according to the present invention, a redundant description thereof will be omitted.

The light emitting diode package 200 according to another example of the present invention may further include a light reflection member 250 .

The light reflection member 250 surrounds the short side wall 115 of each of the first and second light extraction members 110-1 and 110-2, or surrounds the short side wall 115 and the long side wall (not shown). to be prepared. That is, the light reflection member 250 is formed to cover the sidewalls of each of the first and second light extraction members 110-1 and 110-2 exposed to the outside, and the first and second light extraction members 110- 1, 110-2) is formed to seal the space between them. The light reflection member 250 becomes the first and second light extraction members 110-1 and 110-2 by reflecting the light incident on each of the first and second light extraction members 110-1 and 110-2, respectively. ) to increase the respective light extraction efficiency.

Additionally, the light emitting diode package 200 according to an embodiment of the present invention may further include a sealing member 260 .

The sealing member 260 is formed between the first wiring space provided between the first and second lead electrodes 232 and 234 and between the second and third lead electrodes 234 and 236 for the reverse wire bonding process. By filling each of the provided second wiring spaces, the first and second wiring spaces and the first and second conductive wires 135a and 135b are sealed. The sealing member 260 conceals the first and second conductive wires 135a and 135b while preventing moisture penetration into the first and second wiring spaces. The sealing member 260 according to an example may be made of epoxy, that is, white epoxy.

As described above, the light emitting diode package 200 according to another example of the present invention includes two light emitting diode chips 120 - 1 and 120 - 2 , so that the light emitting diode according to an example has one light emitting diode chip 120 . It may have a relatively increased light directivity angle compared to the package 100 , and the ratio of the front light quantity of the wavelength conversion member 140 and The side light intensity ratio can be optimized to a desired ratio.

Additionally, the light emitting diode package according to the present invention may include three or more light extracting members, three or more light emitting diode chips, and a wavelength conversion member covering all of the first surfaces of each of the three or more light extracting members. In this case, as described above, each of the three or more light emitting diode chips is disposed on the second surface of each of the light extraction members or is inserted into the groove provided on the second surface of each of the light extraction members, and the die bonding process and the reverse wire It may be electrically connected to the lead frame by a bonding process.

10 is a cross-sectional view for explaining a light emitting diode package according to another example of the present invention, which is configured by changing the arrangement of the wavelength conversion member in the light emitting diode package according to the example shown in FIGS. 2 to 7 . Accordingly, only the wavelength conversion member and related components will be described below.

Referring to FIG. 10 , the wavelength conversion member 140 according to another example converts the wavelength of light emitted from the light emitting diode chip 120 into a different wavelength and emits it to the light extraction member 110 . That is, the wavelength conversion member 140 is interposed between the light extraction member 110 and the light emitting diode chip 120 to convert the wavelength of the first color light emitted from the light emitting diode chip 120 into the second color light. discharged to the extraction member 110 . The wavelength conversion member 140 is attached to the substrate 121 of the light emitting diode chip 120 , and on the bottom surface of the groove 117 provided on the second surface of the light extraction member 110 by the adhesive member 119 . is attached Here, the wavelength conversion member 140 may be formed of a fluorescent material sheet including the same fluorescent material as described above.

The wavelength conversion member 140 is attached to the rear surface of the substrate 121 during the manufacturing process of the light emitting diode chip 120 , and is cut together with the light emitting diode chip 120 during the cutting process of the light emitting diode chip 120 to emit light. It may be provided on the substrate 121 of the diode chip 120 .

As such, the light emitting diode package according to another example of the present invention has the same effect as the light emitting diode package according to the above-described example, and the process of attaching the wavelength conversion member 140 to the light extraction member 110 is omitted. Thus, the manufacturing process can be simplified.

Additionally, in the light emitting diode package according to another example of the present invention shown in FIG. 9 , the wavelength conversion member 240 is not attached to the first surface of the first and second light extraction members 110-1 and 110-2. interposed between the second surface of the first light extracting member 110-1 and the first light emitting diode chip 120a, and the second surface of the second light extracting member 110-2 and the second light emitting diode chip (120b) may be interposed.

11 is a cross-sectional view illustrating a partial cross-section of a backlight unit according to an embodiment of the present invention, and FIG. 12 is a perspective view illustrating the light emitting diode array and the light guide plate shown in FIG. 11 .

11 and 12 , the backlight unit 500 according to an embodiment of the present invention includes a light guide plate 510 , a light emitting diode array 520 , a reflective sheet 530 , and optical sheets 540 . .

The light guide plate 510 has a rectangular plate shape to include the light incident part 512 provided on at least one side thereof. The light guide plate 510 includes an optical pattern (not shown) for emitting the light incident from the light incident part 512 in the upper surface direction.

The light emitting diode array 520 irradiates light to the light incident part 512 of the light guide plate 510 using a light emitting diode package. The light emitting diode array 520 according to an example may include a printed circuit board 522 and a plurality of light emitting diode packages 524 .

The printed circuit board 522 is disposed on one side of the light guide plate 510 to face the light incident part 512 of the light guide plate 510 . The printed circuit board 522 includes an anode power line (not shown) for supplying anode power to the anode terminal of each of the plurality of light emitting diode packages 524 and a cathode power supply to the cathode terminal of each of the plurality of light emitting diode packages 524 Includes a cathode power line (not shown) for supplying.

Each of the plurality of light emitting diode packages 524 is mounted on a printed circuit board 522 at regular intervals to irradiate light to the light incident portion 512 of the light guide plate 510 . Since each of the plurality of light emitting diode packages 524 has the same configuration as the light emitting diode packages 100 and 200 according to the present invention described above with reference to FIGS. 2 to 9 , a redundant description thereof will be omitted.

The lead frames 130 and 230 (refer to FIG. 2 or FIG. 9 ) of each of the plurality of light emitting diode packages 524 are respectively connected to an anode power line and a cathode power line of the printed circuit board 522 by a surface mounting technique. Accordingly, each of the plurality of light emitting diode packages 524 emits light by an anode power and a cathode power to irradiate light to the light incident part 512 of the light guide plate 510 .

The reflective sheet 530 is disposed to cover a lower portion of the light guide plate 510 . The reflective sheet 530 minimizes light loss by reflecting light incident through the lower surface of the light guide plate 510 toward the inside of the light guide plate 510 .

The optical sheets 540 are disposed on the light guide plate 510 to improve luminance characteristics of light emitted from the light guide plate 510 . For example, the optical sheets 540 may include, but are not limited to, a lower diffusion sheet, a prism sheet, and an upper diffusion sheet, and a diffusion sheet, a prism sheet, and a dual brightness enhancement film (dual brightness en-hancement). film), and a laminated combination of two or more selected from lenticular sheets.

As described above, in the backlight unit 500 according to an embodiment of the present invention, each of the plurality of light emitting diode packages 524 has improved light efficiency and a wide light directivity angle. The hot spot phenomenon can be minimized and the light efficiency can be improved, so that the distance between the light incident part 12 of the light guide plate 10 and the light emitting diode package 22 is reduced, so that the bezel width of the light incident part can be reduced. can In addition, in the backlight unit 500 according to an embodiment of the present invention, the number of required light emitting diode packages 524 is reduced due to the wide light directivity angle of each of the plurality of light emitting diode packages 524, so that the manufacturing cost is reduced. can

Additionally, the backlight unit 500 according to an embodiment of the present invention may further include a plurality of light path changing members 550 as shown in FIGS. 12 and 13 .

Each of the plurality of light path changing members 550 is attached to the printed circuit board 522 so as to be disposed between the plurality of light emitting diode packages 524 . For example, each of the plurality of light path changing members 550 is a propagation path of light emitted to and incident on a side surface of each of the adjacent first and second light emitting diode packages 524 , for example, a side surface of the wavelength converting member 140 . is converted toward the light incident portion 512 of the light guide plate 510 to further prevent a hot spot phenomenon in the light incident portion 512 of the light guide plate 510 .

Each of the plurality of light path changing members 550 according to an example emits light from a lower surface 551 attached to the printed circuit board 522 by an adhesive member 560 and a side surface of the first light emitting diode package 524 , The first reflective surface 552 for reflecting the incident light toward the light incident part 512 of the light guide plate 510 and the light emitted from the side surface of the second light emitting diode package 524 to the light incident part of the light guide plate 510 . and a second reflective surface 554 that reflects toward (512). Each of the plurality of light path changing members 550 may have a triangular cross-section in which the first and second reflective surfaces 554 are inclined at the same angle from the lower surface 551 .

Each of the plurality of light path changing members 550 has a height of the light guide plate 510 while propagating the light incident from each side of the adjacent first and second light emitting diode packages 524 to the light incident part 512 of the light guide plate 510 . In order to prevent a hot spot phenomenon in the light incident part 512 , it is preferable that the light emitting diode package 524 be equal to or higher than the height of the light emitting diode package 524 . That is, the vertex of the light path changing member 550 having a triangular cross-section may be located on the same horizontal line as the height of the light emitting diode package 524 or may be located higher than the height of the light emitting diode package 524 .

14 is a perspective view schematically illustrating a liquid crystal display according to an embodiment of the present invention, and FIG. 15 is a cross-sectional view taken along line VI-VI′ of FIG. 14 .

14 and 15 , a liquid crystal display according to an embodiment of the present invention includes a liquid crystal display panel 610 , a backlight unit 620 , a guide frame 630 , a storage case 640 , and a panel driving circuit unit 650 . ), an outer cover 660 , and a front partial cover 670 .

The liquid crystal display panel 610 includes a lower substrate 611 and an upper substrate 613 that are bonded to each other with a liquid crystal layer interposed therebetween, and displays a predetermined image using light emitted from the backlight unit 620 . .

The lower substrate 611 is a thin film transistor array substrate and includes a plurality of pixels (not shown) formed in each pixel area intersected by a plurality of gate lines (not shown) and a plurality of data lines (not shown). Each pixel may include a thin film transistor (not shown) connected to a gate line and a data line, a pixel electrode connected to the thin film transistor, and a common electrode formed adjacent to the pixel electrode and supplied with a common voltage.

A pad part (not shown) connected to each signal line is provided on the lower edge of the lower substrate 611 , and the pad part is connected to the panel driver 650 . Also, a gate driving circuit (not shown) for supplying a gate signal to a gate line of the liquid crystal display panel 610 is formed on the left and/or right edge portions of the lower substrate 611 . A gate driving circuit is formed together with the thin film transistor manufacturing process of each pixel so as to be connected to each gate line.

The upper substrate 613 includes a pixel defining pattern defining an opening region overlapping each pixel region formed on the lower substrate 611 , and a color filter formed in the opening region. The upper substrate 613 is oppositely bonded to the lower substrate 611 with the liquid crystal layer interposed therebetween by a sealant to cover the entire lower substrate 611 except for the pad portion of the lower substrate 611 .

An alignment layer (not shown) for setting a pretilt angle of the liquid crystal is formed on at least one of the lower substrate 611 and the upper substrate 613 . The liquid crystal layer is interposed between the lower substrate 611 and the upper substrate 613, and liquid crystal molecules are arranged in a horizontal direction according to a transverse electric field formed by a data voltage and a common voltage applied to the pixel electrode for each pixel. made of liquid

A lower polarization member 615 having a first polarization axis is attached to the rear surface of the lower substrate 611 , and upper polarized light having a second polarization axis intersecting the first polarization axis is attached to the front surface of the upper substrate 613 . A member 617 is attached.

As such, the liquid crystal display panel 610 drives the liquid crystal layer according to the electric field formed for each pixel by the data voltage and the common voltage applied to each pixel, thereby displaying a predetermined color image according to the light transmittance of the liquid crystal layer. .

The backlight unit 620 irradiates light to the rear surface of the liquid crystal display panel 610 . The backlight unit 620 according to an example includes a light guide plate 510 , a light emitting diode array 520 , a reflective sheet 530 , and optical sheets 540 , and the backlight unit 620 is shown in FIGS. Since it has the same configuration as the backlight unit 500 shown in FIG. 13 , a redundant description thereof will be omitted.

The guide frame 630 is formed in a rectangular band shape to support a rear edge portion of the liquid crystal display panel 610 . The guide frame 630 includes a panel support for supporting the rear edge of the liquid crystal display panel 610 , and a guide sidewall formed vertically from the panel support to surround each side of the storage case 640 . Here, the panel support portion of the guide frame 640 may be physically coupled to the rear edge portion of the liquid crystal display panel 610 through an adhesive member 635 such as a double-sided tape, a thermosetting resin, or a photocurable resin.

The storage case 640 accommodates the backlight unit 620 and supports the guide frame 630 . The storage case 640 according to an example may include a bottom surface that supports the backlight unit 620 , and a case sidewall that is bent vertically from an end of the bottom surface to support the panel support of the guide frame 630 . A printed circuit board 522 of the light emitting diode array 520 may be attached to a case sidewall corresponding to the light incident portion of the light guide plate 510 among the case sidewalls of the storage case 640 .

The panel driving circuit unit 650 is connected to a pad unit provided on the lower substrate 611 to drive each pixel of the liquid crystal display panel 610 to display a predetermined color image on the liquid crystal display panel 610 . The panel driving circuit unit 650 according to an example includes a plurality of flexible circuit films 651 , a data driving integrated circuit 653 , a display printed circuit board 655 , and a timing controller (not shown).

Each of the plurality of flexible circuit films 651 is attached to the pad portion of the lower substrate 611 and the printed circuit board 655 for display by a film attaching process, and is a Tape Carrier Package (TCP) or Chip On Flexible (COF) Board or Chip On Film). Each of the plurality of flexible circuit films 651 is bent to surround the lower edge of the liquid crystal display panel 610 and is disposed on the rear surface of the guide frame 630 .

The data driving integrated circuit 653 is mounted on each of the plurality of flexible circuit films 651 and is connected to the pad portion through the flexible circuit film 651 . The data driving integrated circuit 653 receives the pixel data and the data control signal for each pixel supplied from the timing controller, converts the pixel data for each pixel into an analog data signal according to the data control signal, and converts the data to the corresponding data through the pad unit. supply to the line.

The display printed circuit board 655 is connected to a plurality of flexible circuit films 651 . The display printed circuit board 655 serves to provide a signal necessary for displaying an image to each pixel of the liquid crystal display panel 610 to the data driving integrated circuit 653 and the gate driving circuit. To this end, various signal wires, various power supply circuits (not shown), and a memory device (not shown) are mounted on the display printed circuit board 655 .

The timing controller is mounted on the printed circuit board 655 for display and transmits digital image data input from the driving system in response to a timing synchronization signal supplied from an external driving system (not shown) to the pixel arrangement of the liquid crystal display panel 610 . The pixel data for each pixel is generated by arranging to fit the structure, and the generated pixel data for each pixel is provided to the data driving integrated circuit 653 . In addition, the timing controller generates a data control signal and a gate control signal, respectively, based on the timing synchronization signal to control driving timings of the data driving integrated circuit 653 and the gate driving circuit, respectively.

Additionally, the timing controller may individually control the luminance of each region of the liquid crystal display panel 610 by partially controlling the light emitting diode packages 524 of the backlight unit 620 through edge-type local dimming technology. .

The outer cover 660 constitutes the outermost rear surface and side surfaces of the liquid crystal display device, and surrounds the guide frame 630 and each side surface of the liquid crystal display panel 610 while supporting the rear surface of the storage case 640 . To this end, the outer cover 660 is vertically bent from the cover plate supporting the rear surface of the storage case 640 and the end of the cover plate to surround each side of the guide frame 630 and the liquid crystal display panel 610 . cover sidewalls. Here, the upper portion of the side wall of the cover surrounds each side of the liquid crystal display panel 610 except for the front surface of the liquid crystal display panel 610 to cover the entire front surface of the liquid crystal display panel 610 of the liquid crystal display device. exposed forward.

Additionally, since the upper and left edges of the liquid crystal display panel 610 connected to the panel driving circuit unit 650 are not covered by a separate mechanism, the upper surface of the liquid crystal display panel 610 and A side sealing member (not shown) having a predetermined thickness may be additionally provided on the upper side, the left side, and the right side of the liquid crystal display panel 610 to protect the side and light leakage from the left side and the right side. The side sealing member is made of a thermosetting or photo-curable resin and may be formed through a coating process of applying a predetermined thickness to the upper, left, and right surfaces of the liquid crystal display panel 610 and a curing process performed immediately after the application process. .

The front cover 670 is assembled with the outer cover 660 to cover the lower edge of the liquid crystal display panel 610 . That is, the pad portion of the liquid crystal display panel 610 connected to the panel driving circuit unit 650 is not covered by the outer cover 660 but is exposed in front of the liquid crystal display device. The front cover 670 covers the lower edge portion of the liquid crystal display panel 610 , the pad portion, the panel driving circuit portion 650 , and the cover sidewalls of the outer cover 660 to thereby cover the pad portion of the liquid crystal display panel 610 . and the panel driving circuit unit 650 are hidden. Accordingly, according to the present invention, the front surface of the liquid crystal display panel 610 except for the lower edge portion of the liquid crystal display panel 610 covered by the front cover 670 is implemented as a flat surface without a step, thereby providing a liquid crystal display. The aesthetics of the device may be improved.

As described above, in the liquid crystal display according to the present invention, a hot spot phenomenon occurs in the light incident portion 512 of the light guide plate 510 due to the improved light efficiency and wide light directivity of the light emitting diode package 524 included in the backlight unit 620 . As this is minimized, the image quality may be improved, and the upper surface of the liquid crystal display panel 610 except for the lower edge portion of the liquid crystal display panel 610 is exposed to the outside, and thus has an improved aesthetic feeling.

16A to 16H are views for explaining step by step a method of manufacturing a light emitting diode package according to the present invention, which may be a manufacturing method for a light emitting diode package according to an example of the present invention shown in FIGS. 2 to 7 . there is.

A method of manufacturing a light emitting diode package according to the present invention will be described in stages with reference to FIGS. 16A to 16H .

First, as shown in FIG. 16A , a material for a light extraction member 110a is applied on the stage 710 . Here, the material for the light extraction member 110a may be silicon, for example, white clear silicon.

Subsequently, as shown in FIG. 16B , a first surface 111 having a first size and a second size smaller than the first size are formed by molding the material 110a for the light extraction member using the mold 730 . The light extraction member 110 including two sides 113 and at least two inclined sidewalls 115 is manufactured. For example, the light extraction member 110 may have a pyramidal structure or an equilateral trapezoidal structure. The mold 730 may include a pattern portion 732 having a pyramid structure or an equilateral trapezoid structure having a shape structure opposite to that of the light extraction member 110 . That is, the pattern part 732 has an opening having the same size as the first surface 111 of the light extraction member 110 , and an inner bottom surface having the same size as the second surface 113 of the light extraction member 110 . 732a , an inclined surface 732b inclined in the same manner as the sidewall 115 of the light extraction member 110 may be included.

Additionally, the pattern portion 732 of the mold 730 further includes a protrusion 732c protruding from the inner bottom surface 732a toward the opening in the form of a square pillar. When the material for the light extraction member 110a is molded using the mold 730 including the projection 732c, the second surface 113 of the light extraction member 110 has a groove corresponding to the projection 732c. (117) will be provided.

In addition, the pattern portion 732 of the mold 730 further includes an optical pattern protrusion 732d provided on the inclined surface 732b. When the material for the light extraction member 110a is molded using the mold 730 including the optical pattern projection 732d, the sidewall 115 of the light extraction member 110 corresponds to the optical pattern projection 732d. An optical pattern 115a to be used is provided.

Then, as shown in FIG. 16C , a sidewall mold 750 having a vertical sidewall facing the sidewall 115 of the light extracting member 110 is disposed on the stage 710 .

Then, the light reflective member on the sidewall 115 of the light extraction member 110 by filling the space between the sidewall 115 of the light extraction member 110 and the vertical sidewall of the sidewall mold 750 and curing the light reflective material (150) is formed.

Then, as shown in FIG. 16D , the light emitting diode chip 120 is disposed on the second surface 113 of the light extraction member 110 . That is, the light emitting diode chip 120 is attached to the bottom surface of the groove portion 117 provided on the second surface 113 of the light extraction member 110 . At this time, the substrate 121 (refer to FIG. 7 ) of the light emitting diode chip 120 is attached to the bottom surface of the groove 117 by an adhesive member 119 , and the first and second terminals of the light emitting diode chip 120 . Reference numerals 126 and 127 are exposed to the outside of the second surface 113 of the light extraction member 110 .

Then, as shown in FIG. 16E , after separating the light extracting member 110 to which the light emitting diode chip 120 is attached from the stage 710 , the entire first surface 111 of the light extracting member 110 . The wavelength conversion member 140 is attached to the Here, the wavelength conversion member 140 may be a phosphor sheet including a phosphor.

Meanwhile, in FIGS. 16A to 16D , the stage 710 may be replaced with the wavelength conversion member 140 .

Then, as shown in FIG. 16F , a lead frame is disposed on the second surface 113 of the light extraction member 110 , and the lead frame is subjected to a die bonding process using a conductive paste 133 . Electrically connecting the first terminal 126 of the light emitting diode chip 120 to the first lead electrode 132 by bonding the first lead electrode 132 of the light emitting diode chip 120 to the first terminal 126 of the light emitting diode chip 120 . do.

Then, as shown in FIG. 16G , the second lead electrode 134 of the lead frame is connected to the light emitting diode chip through a reverse wire bonding process using the conductive wire 135 using the wiring space. The second terminal 127 of the light emitting diode chip 120 is electrically connected to the second lead electrode 134 by wire bonding to the second terminal 127 of 120 .

Then, as shown in FIG. 16H, the conductive wire 135 while sealing the wiring space by filling and curing the sealing member 160 in the wiring space between the first and second lead electrodes 132 and 134. A sealing member 160 for hiding the Here, the sealing member 160 may be made of epoxy, that is, white epoxy.

Finally, when the sealing member 160 is formed, the wavelength conversion member 140 is attached to the first surface 111 and the light extraction member 110 to which the lead frame is attached to the second surface 113 is moved up and down. By inverting, the manufacturing process of the light emitting diode package is completed.

As described above, according to the manufacturing method of the light emitting diode package according to the present invention, the light emitting diode package is attached to the lower surface of the light extraction member 110 having a light emitting surface, the substrate of the light emitting diode chip 120, the light extraction member Since the wavelength conversion member 140 is attached to the light exit surface of 110 , light loss due to light absorption by the first and second terminals 126 and 127 of the light emitting diode chip 120 and the conductive wire 135 is prevented. As a result, light efficiency is improved and a wide light directivity angle can be obtained.

Additionally, in FIGS. 16D and 16E , the wavelength conversion member 140 is not attached to the entire first surface 111 of the light extracting member 110 , but is attached to the light emitting diode chip 120 to form an adhesive member 119 . may be attached to the bottom surface of the groove portion 117 by the

17A to 17C are views for explaining another method of manufacturing a light extracting member in a method of manufacturing a light emitting diode package according to the present invention.

Referring to FIGS. 17A to 17C , in the manufacturing method of the light emitting diode package according to the present invention, another manufacturing method of the light extraction member will be described as follows.

First, as shown in FIG. 17A , a material 110a for a light extraction member is applied on the stage 710 (or a wavelength conversion member). Here, the material for the light extraction member 110a may be silicon, for example, white clear silicon.

Then, as shown in FIG. 17B, by patterning the material for light extraction member 110a through a photolithography process, the first surface 111 having a first size and a second size having a second size smaller than the first size A light extraction member 110 including a surface 113 and at least two inclined sidewalls 115 is manufactured. For example, the light extraction member 110 may have a pyramidal structure or an equilateral trapezoidal structure.

Then, as shown in FIG. 17C , a groove 117 having a predetermined depth is prepared from the second surface 113 of the light extraction member 110 using a laser.

Then, a light emitting diode package is manufactured by performing the same process as shown in FIGS. 16C to 16H .

Meanwhile, the light emitting diode package according to another example of the present invention shown in FIG. 9 may be manufactured in the same manner as the manufacturing method of the light emitting diode package according to the present invention shown in FIGS. 16A to 16H . Hereinafter, a method of manufacturing a light emitting diode package according to another example of the present invention shown in FIG. 9 will be briefly described as follows.

First, a material for a light extraction member is molded through a molding process using a mold having first and second pattern portions corresponding to the first and second light extraction members 110-1 and 110-2, respectively, or a photolithography process The first and second light extracting members 110 - 1 and 110 - 2 are prepared by patterning the material for the light extracting member through a laser process.

Subsequently, light reflection sealing the space between the first and second light extracting members 110-1 and 110-2 while covering the sidewalls of each of the first and second light extracting members 110-1 and 110-2 A member 250 is formed.

Next, the first light emitting diode chip 120-1 is inserted into the groove portion 117 of the first light extraction member 110-1, and the first light emitting diode chip 120-1 is inserted into the groove portion 117 of the second light extraction member 110-2. 2 The light emitting diode chip 120 - 2 is inserted and disposed.

Next, the wavelength conversion member 240 is attached to the entire first surface 111 of each of the first and second light extraction members 110 - 1 and 110 - 2 .

Then, the first lead electrode 232 of the lead frame is bonded to the first terminal 126 of the first light emitting diode chip 120-1 through a die bonding process using the conductive paste 133, and , bonding the second lead electrode 234 of the lead frame to the first terminal 126 of the second light emitting diode chip 120 - 2 .

Then, through a reverse wire bonding process using a wiring space, the first conductive wire 135a is connected to the second lead electrode 234 of the lead frame and the first light emitting diode chip 120-1. Wire bonding to the second terminal 127, and wire bonding the second conductive wire 135b to the third lead electrode 236 of the lead frame and the second terminal 127 of the second light emitting diode chip 120-2. do.

Then, the sealing member 260 is filled in the wiring space between the first to third lead electrodes 232, 234, 236 and cured to seal the wiring space by curing the first and second conductive wires 135a, 135b) is concealed.

Finally, when the sealing member 260 is formed, the first and second light extracting members to which the wavelength conversion member 240 is attached to the first surface 111 and lead frames are attached to the second surface 113 . By inverting (110-1. 110-2) up and down, the manufacturing process of the light emitting diode package 200 is completed.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which the present invention pertains that various substitutions, modifications and changes are possible within the scope of the present invention. It will be clear to those who have the knowledge of Therefore, the scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention.

100, 200: light emitting diode package 110: light extraction member
120: light emitting diode chip 130: lead frame
140: wavelength conversion member 150: light reflection member
160: sealing member 500, 620: backlight unit
510: light guide plate 520: light emitting diode array
522: printed circuit board 524: light emitting diode package
550: light path changing member 610: liquid crystal display panel
630: guide frame 640: storage case
660: outer cover 670: front partial cover

Claims (21)

at least one light extraction member having a first surface defined as a light exit surface and a second surface opposite to the first surface;
at least one light emitting diode chip disposed on the second surface of the light extraction member;
a lead frame supporting a second surface of the light extraction member and including a first lead electrode and a second lead electrode connected to the light emitting diode chip; and
a wavelength conversion member for converting a wavelength of light emitted from the light emitting diode chip into another wavelength and emitting it; and
A wiring space is provided between the first lead electrode and the second lead electrode disposed to be spaced apart from each other while facing the second surface of the light extraction member, and disposed in the wiring space, the light emitting diode chip and the second lead electrode A light emitting diode package comprising a conductive wire connecting the two lead electrodes. The method of claim 1,
The light extraction member includes at least two sidewalls inclined between the first surface and the second surface,
The second surface of the light extraction member has a smaller area than the first surface, the light emitting diode package. 3. The method of claim 2,
The light extraction member further includes a groove provided on the second surface,
The light emitting diode chip is inserted into the groove portion, the light emitting diode package. 4. The method of claim 3,
The light emitting diode package further comprising a light reflection member covering a sidewall of the light extraction member. 3. The method of claim 2,
The light extraction member further comprises an optical pattern provided on the sidewall, the light emitting diode package. The method of claim 1,
The light emitting diode chip has first and second terminals spaced apart from each other and connected to the lead frame,
The first lead electrode is electrically connected to the first terminal,
The second lead electrode is spaced apart from the first lead electrode and is electrically connected to the second terminal, a light emitting diode package. 7. The method of claim 6,
The first lead electrode is electrically connected to the first terminal of the light emitting diode chip by a conductive paste, the light emitting diode package. 4. The method of claim 3,
The light emitting diode chip,
a substrate attached to the second surface of the light extraction member or attached to a bottom surface of the groove provided on the second surface;
a buffer layer provided on the substrate;
a first semiconductor layer provided on the buffer layer;
an active layer provided on the first semiconductor layer;
a second semiconductor layer provided on the active layer;
a reflective layer provided on the second semiconductor layer;
a first terminal provided on the reflective layer and connected to the second semiconductor layer through the reflective layer; and
It is disposed to be spaced apart from the first terminal, and is provided on an upper surface of the first semiconductor layer that is not covered and exposed by the reflective layer, the second semiconductor layer, and the active layer and includes a second terminal connected to the first semiconductor layer , light emitting diode package. 9. The method of claim 8,
A reflective material is coated on at least one of the conductive wire and the first and second terminals, the light emitting diode package. 3. The method of claim 2,
The wavelength conversion member includes a fluorescent material,
The wavelength conversion member is attached to the first surface of the light extraction member or interposed between the light extraction member and the light emitting diode chip, a light emitting diode package. a light guide plate having a light incident part;
a light emitting diode array irradiating light to the light incident portion of the light guide plate; and
and optical sheets disposed on the light guide plate;
The light emitting diode array,
A plurality of light emitting diode packages according to any one of claims 1 to 10; and
and a printed circuit board on which the plurality of light emitting diode packages are mounted at regular intervals. 12. The method of claim 11,
A light path changing member provided on the printed circuit board to be disposed between the plurality of light emitting diode packages, the light path changing member being emitted from a side surface of the adjacent light emitting diode package to advance the light incident portion of the light guide plate, backlight unit. liquid crystal display panel;
a guide frame supporting the liquid crystal display panel;
a storage case supporting the guide frame; and
A liquid crystal display comprising the backlight unit of claim 11 accommodated in the storage case and irradiating light to the liquid crystal display panel. 14. The method of claim 13,
The backlight unit is provided on the printed circuit board to be disposed between the plurality of light emitting diode packages, and a light path changing member that advances the incident light emitted from the side surface of the adjacent light emitting diode package to the light receiving portion of the light guide plate. Further comprising, a liquid crystal display device. providing at least one light extraction member having a first surface defined as a light exit surface and a second surface opposite to the first surface;
attaching at least one light emitting diode chip to the second surface of the light extraction member; and
disposing a lead frame on the second surface of the light extraction member and connecting the light emitting diode chip to the lead frame,
The lead frame faces the second surface of the light extraction member and includes a first lead electrode and a second lead electrode disposed to be spaced apart from each other,
A wiring space is provided between the first lead electrode and the second lead electrode disposed to be spaced apart from each other,
The step of connecting the light emitting diode chip to the lead frame comprises:
and electrically connecting the light emitting diode chip to the second lead electrode using a conductive wire provided in the wiring space. 16. The method of claim 15,
The light extraction member includes at least two sidewalls inclined between the first surface and the second surface,
The second surface of the light extracting member has a smaller area than the first surface, the method of manufacturing a light emitting diode package. 17. The method of claim 16,
The step of providing the light extraction member includes the step of providing at least one groove portion on the second surface,
The light emitting diode chip is inserted into the groove portion, the method of manufacturing a light emitting diode package. 18. The method according to claim 16 or 17,
Further comprising the step of providing a light reflection member on the sidewall of the light extraction member, the manufacturing method of the light emitting diode package. 18. The method according to claim 16 or 17,
The step of providing the light extraction member comprises the step of providing an optical pattern on the sidewall, a method of manufacturing a light emitting diode package. 18. The method according to any one of claims 15 to 17,
The light emitting diode chip has first and second terminals spaced apart from each other and connected to the lead frame,
The step of connecting the light emitting diode chip to the lead frame comprises:
electrically connecting a first terminal of the light emitting diode chip to the first lead frame using a conductive paste; and
and electrically connecting a second terminal of the light emitting diode chip to the second lead frame using the conductive wire. 18. The method according to any one of claims 15 to 17,
The method further comprising the steps of attaching a wavelength conversion member including a fluorescent material to the first surface of the light extraction member and disposing the wavelength conversion member between the light emitting diode chip and the light extraction member, A method of manufacturing a light emitting diode package.

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