CN104037316B - A kind of LED inorganic encapsulateds support and its method for packing - Google Patents
A kind of LED inorganic encapsulateds support and its method for packing Download PDFInfo
- Publication number
- CN104037316B CN104037316B CN201410273557.2A CN201410273557A CN104037316B CN 104037316 B CN104037316 B CN 104037316B CN 201410273557 A CN201410273557 A CN 201410273557A CN 104037316 B CN104037316 B CN 104037316B
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- Prior art keywords
- glass lens
- rack body
- led
- metal layer
- support
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
A kind of LED inorganic encapsulateds support and its method for packing,（1）Die bond, bonding wire are carried out to LED chip；（2）Using steel mesh typography toward painting tin cream on the second step of rack body；（3）Rack body is preheated, tin cream is unlikely to melt, and original normal temperature lower carriage body first step expands into gap cooperation with the interference fit of glass lens；（4）Glass lens is arranged on the mould being adapted to rack body；（5）The rack body after preheating is taken out to be combined with glass lens；（6）The LED support for installing lens crosses a Reflow Soldering.Due to the thermal coefficient of expansion of the thermal coefficient of expansion more than glass lens of second metal layer material therefor on First Transition face, the size that the size that first order step opens will open more than glass lens, so that glass lens and first step during work with synthesizing interference fits, extrusion stress is released, the fatigue life of material is improve.
Description
Technical field
The present invention relates to LED support, especially a kind of LED inorganic encapsulateds support and its method for packing.
Background technology
LED is light emitting diode, is a kind of solid semiconductor luminescent device.With the development of LED technologies, LED's
Encapsulation wave band gradually develops toward near ultraviolet even deep ultraviolet direction, and power also develops toward high-power aspect.But use tradition
Organosilicon glue material encapsulation, such as, using epoxy encapsulation direct insertion LED more, using silicones adopting surface mounted LED more
Or silica gel packaging, and such organosilicon material is under long-time service condition, because the influence of the factors such as water, light, heat is easily lost
Effect, causes the sharp-decay of luminous flux, the radiation flux of device etc., even results in component failure.It is integrated for great power LED
For light source, due to a variety of causes, such as chip heating, situations such as radiating is not enough, cause device surface temperature too high, and then cause
Component failure.In order to avoid the defect that organic packages bring, LED inorganic encapsulated technologies are gradually risen, such as Chinese patent, publication number
It is a kind of 103325922 LED method for packing, it discloses comprising the following steps（1）Pretreatment；Including to glass
The surface of cover plate, expansion alloy and substrate lands is pre-processed（2）Welding（a）Metal and ceramic welding, first will be swollen
Swollen alloy is placed in fixture with substrate mounting, and ceramic substrate connects negative electrode, and expansion alloy connects anode, using high-frequency induction heating,
Fixture is placed in alternating magnetic field, regulating frequency controls expansion alloy temperature at 200 ~ 300 DEG C；Apply the straight of 700 ~ 900V
Stream voltage, is maintained after temperature, 15 ~ 30min of voltage, and DC voltage is stopped, and ceramic substrate is welded on expansion alloy
Together（b）Metal and glass solder, glass cover-plate is moved on on expansion alloy, and expansion alloy connects anode, and glass cover-plate connects the moon
Pole, fixture is placed in alternating magnetic field, applies the DC voltage of 600 ~ 900v, after maintenance temperature, 15 ~ 50min of voltage,
DC voltage is stopped, welding is completed.Due to LED support, operationally temperature can be raised, and LED support and glass lens can
Expand with heat and contract with cold phenomenon, because glass lens is different from the material of rack body, therefore the flexible amplitude of the two is different, weldering
Place is met due to stress caused by thermal expansion coefficient difference, increases the fatigue of weld layer, make the big discounting of service life of LED support
Button.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of LED inorganic encapsulateds support and its method for packing, overcome existing
Have between inorganic packaged glass lens and support because thermal expansion coefficient difference causes stress produced problem.
In order to solve the above technical problems, one of technical scheme is：A kind of LED inorganic encapsulateds support, including branch
Frame body and the glass lens covered with the rack body, the rack body are provided with the depression for housing LED chip,
The top inward flange of the rack body is provided around the first step that the depression is set, and the top of the rack body is in institute
State first step periphery and be provided with second step, second step is higher than first step, the is formed between second step and first step
One transition face, forms the second transition face between rack body top and second step, the edge of the glass lens is arranged on institute
State on first step, the side edge of the glass lens is provided with the first metal layer, and the First Transition face is provided with the second gold medal
Category layer, the second metal layer is corresponding with the side of the first metal layer, and the first metal layer was with second metal layer under normal temperature
It is full of cooperation；Second transition face is provided with the 3rd metal level, the 3rd metal level, second step and the first metal layer
Top surrounds and tin cream is filled with the groove around the first step, the groove jointly.First Transition face and glass lens
Interference fit, can produce the extrusion stress between metal level at normal temperatures, so as to strengthen air-tightness.Because interference fit is grasped
In suitable scope, when rack body is heated, the expansion of its size coordinates for gap, so as to facilitate the installation of glass lens；
After encapsulation is finished, operationally ultraviolet LED lights and produces heat, whole device is heated, due to the second gold medal on First Transition face
Belong to the thermal coefficient of expansion of the thermal coefficient of expansion more than glass lens of layer material therefor, the size that first order step opens will be more than
The size that glass lens opens so that glass lens and first step during work with interference fits are synthesized, release
Extrusion stress, improves the fatigue life of material.Tin paste layer is placed in groove, tin cream and the second transition face, second step with
And the contacts side surfaces of glass lens, it is ensured that three welded seals in face in reflow process, while tin cream usage amount or many
Or seal request is can reach less, so as to expand the admissible error of tin cream usage amount, the technology for reducing brush tin cream technique will
Ask, improve economic benefit.Due to still having the coat of metal at the contacts side surfaces of First Transition face and glass lens, in Reflow Soldering
During gap coordinate and allow tin cream to be infiltrated toward in gap, filled up the microcosmic out-of-flatness that glass lens side is likely to occur,
So as to improve the reliability of welding.Tin paste layer remains the free degree of upper surface, it is allowed to which tin cream heat expansion at different temperatures is cold
Contracting, so as to release weld due to stress caused by thermal expansion coefficient difference, improves the fatigue life of weld layer.
Used as improvement, the second step is provided with the 3rd metal level.
Used as improvement, the first metal layer, second metal layer and the 3rd metal level are silver coating, Gold plated Layer or alloy
Layer.
Used as improvement, the glass lens is square.
Used as improvement, the glass lens is provided with hemisphere jut.
Used as improvement, the rack body material is aluminium, copper or ceramics.This programme is using metal or ceramic material as branch
Frame body, can substantially reduce thermal resistance, improve the service life of LED, and ceramics are more suitable for setting for thermoelectricity separation as insulating materials
Meter.
Used as improvement, the depression is square.
In order to solve the above technical problems, the two of technical scheme are：A kind of LED as claimed in claim 1 is inorganic
Package support method for packing, comprises the following steps：
（1）Die bond, bonding wire are carried out to LED chip in the depression of LED support body；
（2）Using steel mesh typography toward painting tin cream on the second step of rack body；
（3）Rack body is preheated, preheating temperature is 120 DEG C to 150 DEG C, it is ensured that tin cream is unlikely to melt at a temperature of this
Change, and original normal temperature lower carriage body first step expands into gap cooperation with the interference fit of glass lens；
（4）Glass lens is arranged on the mould being adapted to rack body；
（5）Take out the rack body of preheating and coordinate it with glass lens；
（6）The LED support for installing lens crosses a Reflow Soldering.
As improvement, the step（5）Specific method：The rack body after preheating is taken out, 180 ° of upset is buckled in glass
On lens, rack body is then overturn 180 ° together with glass lens again, take out mould.
The beneficial effect brought compared with prior art of the present invention is：
Under normal temperature, glass transparent is interference fit with rack body, can produce the extrusion stress between metal level, so that
Enhancing air-tightness；
Because interference fit is rested in suitable scope, when rack body is heated, the expansion of its size coordinates for gap,
So as to facilitate the installation of glass lens；
During LED operation, because the thermal coefficient of expansion of second metal layer material therefor on First Transition face is more than glass lens
Thermal coefficient of expansion, the size that the size that first order step opens will open more than glass lens so that work when glass
Glass lens, with interference fits are synthesized, release extrusion stress with first step, improve the fatigue life of material.
Brief description of the drawings
Fig. 1 is the utility model front view.
Fig. 2 is the utility model top view.
Fig. 3 is the utility model decomposition view.
Fig. 4 is another form of glass lens schematic diagram.
Specific embodiment
With reference to Figure of description, the invention will be further described.
As shown in Figures 1 to 3, a kind of LED inorganic encapsulateds support, including rack body 1 and covered with the rack body 1
Glass lens 4.The glass lens 4 is square, and the glass lens 4 is provided with hemisphere jut, lens is had certain matching somebody with somebody
Light action, in addition, as shown in figure 4, the glass lens 4 can also be simple glass plate.As shown in figure 3, on the rack body 1
The square depression 3 for housing LED chip is provided with, the top inward flange of the rack body 1 is provided around the depression and sets
First step 6, the top of the rack body 1 is provided with second step 7 in the periphery of the first step 6, and second step 7 is higher than
First step 6, forms First Transition face, between the top of rack body 1 and second step 7 between second step 7 and first step 6
The second transition face is formed, the edge of the glass lens 4 is arranged on the first step 6.The side side of the glass lens 4
Edge is provided with the first metal layer 10, and the First Transition face is provided with second metal layer 8, the metal of the second metal layer 8 and first
The side correspondence of layer 10, and the first metal layer 10 and second metal layer 8 are interference fit under normal temperature；Set on the second step 7
There is the 3rd metal level 9, second transition face is provided with the 3rd metal level 9, the first metal layer 10, the and of second metal layer 8
3rd metal level 9 is silver coating, Gold plated Layer or alloy-layer；3rd metal level 9, second step 7 and the first metal layer
10 top surrounds and tin cream is filled with the groove 5 around the first step 6, the groove 5 jointly.
The method for packing of LED inorganic encapsulated supports：
（1）Die bond, bonding wire are carried out to LED chip in the depression of LED support body 1；
（2）Using steel mesh typography toward painting tin cream on the second step 7 of rack body 1；
（3）Rack body 1 is preheated, preheating temperature is 120 DEG C to 150 DEG C, it is ensured that tin cream is unlikely at a temperature of this
Melt, and the original first step 6 of normal temperature lower carriage body 1 expands into gap cooperation with the interference fit of glass lens 4；
（4）Glass lens 4 is arranged on the mould being adapted to rack body 1；
（5）Take out preheating after rack body 1, upset 180 ° be buckled on glass lens 4, then by rack body 1 together with
Glass lens 4 overturns 180 ° again, takes out mould；
（6）The LED support for installing lens crosses a Reflow Soldering.
This programme, as rack body 1, can substantially reduce thermal resistance using metal or ceramic material, improve the use of LED
Life-span, ceramics are more suitable for the design of thermoelectricity separation as insulating materials.Interference is matched somebody with somebody at normal temperatures with glass lens 4 in First Transition face
Close, the extrusion stress between metal level can be produced, so as to strengthen air-tightness.Because interference fit rests in suitable scope
Interior, when rack body 1 is heated, the expansion of its size coordinates for gap, so as to facilitate the installation of glass lens 4；After encapsulation is finished,
Operationally ultraviolet LED lights and produces heat, whole device is heated, due to material used by second metal layer 8 on First Transition face
The thermal coefficient of expansion of material is more than the thermal coefficient of expansion of glass lens 4, and the size that first order step opens will be more than glass lens 4
The size opened so that glass lens 4 and first step 6 during work with interference fits are synthesized, releasing extruding should
Power, improves the fatigue life of material.Tin paste layer is placed in groove, tin cream and the second transition face, second step 7 and glass
The contacts side surfaces of lens 4, it is ensured that three welded seals in face in reflow process, while tin cream usage amount is more or less equal
Seal request is can reach, so as to expand the admissible error of tin cream usage amount, the technical requirements of brush tin cream technique is reduced, improved
Economic benefit.Due to still having the coat of metal at the contacts side surfaces of First Transition face and glass lens 4, in reflow process
Gap coordinate and allow tin cream to be infiltrated toward in gap, the microcosmic out-of-flatness that the side of glass lens 4 is likely to occur has been filled up, so as to carry
The reliability of height welding.Tin paste layer remains the free degree of upper surface, it is allowed to tin cream expanding with heat and contract with cold at different temperatures, so that
Weld is released due to stress caused by thermal expansion coefficient difference, the fatigue life of weld layer is improved.
Claims (9)
1. a kind of LED inorganic encapsulateds support, including rack body and the glass lens covered with the rack body, its feature exist
In：The rack body is provided with the depression for housing LED chip, and the top inward flange of the rack body is provided around institute
The first step that depression is set is stated, the top of the rack body is provided with second step, second in the first step periphery
Rank is higher than first step, forms First Transition face between second step and first step, rack body top and second step it
Between form the second transition face, the edge of the glass lens is arranged on the first step, the side side of the glass lens
Edge is provided with the first metal layer, and the First Transition face is provided with second metal layer, the second metal layer and the first metal layer
Side correspondence, and the first metal layer and second metal layer are interference fit under normal temperature；Second transition face is provided with the 3rd gold medal
Category layer, the top of the 3rd metal level, second step and the first metal layer surrounds around the recessed of the first step jointly
Tin cream is filled with groove, the groove.
2. a kind of LED inorganic encapsulateds support according to claim 1, it is characterised in that：The second step is provided with
Three metal levels.
3. a kind of LED inorganic encapsulateds support according to claim 1, it is characterised in that：The first metal layer, the second gold medal
Category layer and the 3rd metal level are silver coating, Gold plated Layer or alloy-layer.
4. a kind of LED inorganic encapsulateds support according to claim 1, it is characterised in that：The glass lens is square.
5. a kind of LED inorganic encapsulateds support according to claim 4, it is characterised in that：The glass lens is provided with ball
Shape is raised.
6. a kind of LED inorganic encapsulateds support according to claim 1, it is characterised in that：The rack body material be aluminium,
Copper or ceramics.
7. a kind of LED inorganic encapsulateds support according to claim 1, it is characterised in that：The depression is square.
8. a kind of LED inorganic encapsulateds support method for packing as claimed in claim 1, it is characterised in that comprise the following steps：
（1）Die bond, bonding wire are carried out to LED chip in the depression of LED support body；
（2）Using steel mesh typography toward painting tin cream on the second step of rack body；
（3）Rack body is preheated, preheating temperature is 120 DEG C to 150 DEG C, it is ensured that tin cream is unlikely to melt at a temperature of this,
And original normal temperature lower carriage body first step expands into gap cooperation with the interference fit of glass lens；
（4）Glass lens is arranged on the mould being adapted to rack body；
（5）Take out the rack body of preheating and coordinate it with glass lens；
（6）The LED support for installing lens crosses a Reflow Soldering.
9. LED inorganic encapsulateds support method for packing according to claim 8, it is characterised in that：The step（5）It is specific
Method：Take out preheating after rack body, upset 180 ° be buckled on glass lens, then by rack body together with glass lens again
180 ° of upset, takes out mould.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410273557.2A CN104037316B (en) | 2014-06-19 | 2014-06-19 | A kind of LED inorganic encapsulateds support and its method for packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410273557.2A CN104037316B (en) | 2014-06-19 | 2014-06-19 | A kind of LED inorganic encapsulateds support and its method for packing |
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| CN104037316A CN104037316A (en) | 2014-09-10 |
| CN104037316B true CN104037316B (en) | 2017-06-20 |
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| CN105895778A (en) * | 2014-11-30 | 2016-08-24 | 浙江英特来光电科技有限公司 | Entire board package ceramic LED lamp filament and processing method thereof |
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| CN112490339B (en) * | 2020-12-10 | 2022-06-03 | 鸿利智汇集团股份有限公司 | Inorganic packaging method for LED |
| CN113113524A (en) * | 2021-03-30 | 2021-07-13 | 佛山市国星光电股份有限公司 | Deep ultraviolet LED device and manufacturing method thereof |
| CN114335297A (en) * | 2021-12-28 | 2022-04-12 | 北京大学东莞光电研究院 | Silk-screen packaging method for LED lens |
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