CN105895778A - Entire board package ceramic LED lamp filament and processing method thereof - Google Patents
Entire board package ceramic LED lamp filament and processing method thereof Download PDFInfo
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- CN105895778A CN105895778A CN201410747101.5A CN201410747101A CN105895778A CN 105895778 A CN105895778 A CN 105895778A CN 201410747101 A CN201410747101 A CN 201410747101A CN 105895778 A CN105895778 A CN 105895778A
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- imposite
- ceramic substrate
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- led lamp
- wafer
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- 239000000919 ceramic Substances 0.000 title claims abstract description 86
- 238000003672 processing method Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 86
- 229910052751 metal Inorganic materials 0.000 claims abstract description 77
- 239000002184 metal Substances 0.000 claims abstract description 77
- 238000000034 method Methods 0.000 claims abstract description 22
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000005516 engineering process Methods 0.000 claims abstract description 12
- 235000012431 wafers Nutrition 0.000 claims description 35
- 238000005538 encapsulation Methods 0.000 claims description 21
- 238000005476 soldering Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 238000009795 derivation Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 5
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 25
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The present invention discloses an entire board package ceramic LED lamp filament and a processing method thereof. An entire board package ceramic substrate is taken as a LED filament pedestal, and the entire board package ceramic substrate is divided into several bar-shaped ceramic substrate regions taking as single-stripe filament solid crystal bonding wire pedestal. The entire board package ceramic substrate is fixed on a metal rack at one time, the technology is simplified, and the yield is greatly improved. Compared with a traditional LED filament, the flatness and the stability of the entire board package ceramic substrate fixed on the metal rack is improved while the yield is improved, so that the substrate excursion caused by human influence and the different flatness phenomenon caused by different intensities are greatly reduced in the manual disposing process, the yield of the program is improved, the time required by the process is shortened, and the product cost is reduced. The subsequent operations of the invention are the entire board operation, so that the flatness of each bar-shaped ceramic substrate area is ensured, and the undesirable phenomenon caused by unevenness between the substrates in the subsequent operations is greatly reduced.
Description
Technical field
The present invention relates to LED field, the ceramic LED lamp silk of a kind of imposite encapsulation and processing method thereof.
Background technology
LED filament is a kind of filament (such as tengsten lamp) for substituting traditional lighting light fixture, and conventional LED light source to reach one
Fixed illuminance and illuminating area, need to install the optics of lens etc additional, affect lighting effect, can reduce LED due
Energy-saving effect, LED filament realizes 360 ° of full angle luminescences, and wide-angle is luminous and is not required to add lens, it is achieved three-dimensional light source,
Bring unprecedented lighting experience.
Existing LED filament product:
It is all by wall scroll LED filament substrate, is fixed on one by one on a plate rack, then be packaged operation, there is operation
Complexity, volume production difficulty is big, and stability is the highest, and the shortcoming such as yield is relatively low.
Traditional LED lamp silk also needs to carry out following operation before encapsulation operation:
Glue bottle unfreezing adds glue point glue anchored filament and support baking test.
And at present anchored filament substrate and support need to use manual placement, during easily pollute substrate, cause follow-up die bond, weldering
Line, packaging technology bad, additionally manual place substrate during be easily caused substrate and be scraped off, damage, have impact on product
The yields of product.
Ye You company uses limit clamp to be placed on support by substrate, and it is fixed gently to press solidly.The method, still needs substrate hands one by one
Move and be positioned on limit clamp.And this kind of mode is after sapphire has been placed, the support removal that cover plate will fix need to be taken away,
Substrate displacement is easily caused in the process because fixing glue does not solidify.
In sum, traditional LED lamp silk, is all to be fixed on one by one in metal rack, and bar and bar are i.e. between metal rack and metal rack
Spacing be 1-2mm, after substrate puts into metal rack one by one, carry out follow-up operation by support carriage full wafer metal rack, as
Die bond, bonding wire, sealing etc..Because the size of metal rack is narrower and thin, add the gap between every metal rack relatively big, often
Flatness between bar substrate it is difficult to ensure that, bring a lot of inconvenience to subsequent handling, considerably increase the bad of each operation, as
Crystal-bonding adhesive amount differs, differ in die bond position, wafer levitation, bonding wire weld partially, bonding wire is viscous, bonding wire rosin joint, sealing glue amount not
One, it is bad that finished color is inconsistent etc., and easily causes equipment alarm in die bond, wire bonding process, largely effects on board yield.
Summary of the invention
It is an object of the invention to provide the ceramic LED of the imposite encapsulation of a kind of good heat dissipation, life-span length, low cost, easily production
Filament and processing method thereof, need to be fixed on wall scroll LED filament substrate on a plate rack one by one solving existing LED filament,
Being packaged operation again, there is complex procedures, volume production difficulty is big, and stability is the highest, and LED filament substrate two ends metal is easy
Depart from LED-baseplate, and the shortcoming such as yield is relatively low.
For achieving the above object, the present invention provides following technical scheme:
The ceramic LED lamp silk of a kind of imposite encapsulation, uses imposite ceramic substrate as the pedestal of LED filament, described imposite
Ceramic substrate is divided equally some bar shaped ceramic substrate districts as wall scroll filament die bond bonding wire pedestal.
Traditional LED lamp silk needs to be fixed in metal rack by wall scroll substrate the most one by one, and the present invention is by imposite ceramic substrate
One-time fix in metal rack, simplify technique, thus largely improve yield.Compared with traditional LED lamp silk
(needing to be positioned over metal rack by hand one by one), while improving yield, improves the flatness being substantially secured in metal rack, with
And stability, greatly reduce because the substrate caused by man's activity in manual placement process offsets, and make because dynamics differs
The flatness become differs phenomenon, improves the yields of this operation, shortens operation required time, reduce product cost.
And the follow-up operation of the present invention is all that imposite carries out operation, it is ensured that the flatness in every bar shaped ceramic substrate district, it is substantially reduced
Each station that subsequent handling causes because of out-of-flatness between substrate one by one is bad, while improve the performance of product, improves product
The yields of product, also ensure that the yield of board equally.
As the further scheme of the present invention: described imposite ceramic substrate two ends use thick film technology silk-screen to have 3-15 micron
Thick metal level.
As the further scheme of the present invention: described metal level is conductive metal layer, including silver layer or silver palladium alloy layer.
As the further scheme of the present invention: the surface configuration of described imposite ceramic substrate has some wafers, and adjacent crystalline substance
Between sheet, and it is connected by metal contact wires between wafer with metal level.
As the further scheme of the present invention: be connected by serial or parallel connection or string the side combined between adjacent wafer
Formula.
As the further scheme of the present invention: described metal level uses solder reflow techniques to be bonded in metal rack by soldering paste, system
Obtain the leadout electrode of LED filament, it is achieved the derivation of internal circuit.
As the further scheme of the present invention: the one side being provided with wafer at imposite ceramic substrate is packaged with fluorescent material dielectric layer,
And carry out curing molding,
As the further scheme of the present invention: the one side being not provided with wafer at imposite ceramic substrate also can be packaged with fluorescent material medium
Layer.
The processing method of ceramic LED lamp silk of a kind of imposite encapsulation, initially with imposite ceramic substrate as the base of LED filament
Seat, and imposite ceramic substrate is divided equally some bar shaped ceramic substrate districts as wall scroll filament die bond bonding wire pedestal；Then whole
Plate ceramic substrate two ends use the metal level that thick film technology silk-screen 3-15 micron is thick；Again in the surface configuration of imposite ceramic substrate
Have between some wafers, and adjacent wafer, and be connected by metal contact wires between wafer with metal level, adjacent crystalline substance
It is connected by serial or parallel connection or string the mode combined between sheet；Then use solder reflow techniques by metal level by soldering paste
It is bonded in metal rack, prepares the leadout electrode of LED filament, it is achieved the derivation of internal circuit；Last at imposite ceramic substrate
The one side being provided with wafer is packaged with fluorescent material dielectric layer, and carries out curing molding.
As the further scheme of the present invention: described be not provided with the one side of wafer at base of ceramic and also can be packaged with fluorescent material medium
Layer
Compared with prior art, the invention has the beneficial effects as follows:
1. the present invention uses imposite ceramic substrate as the pedestal of LED filament, not only increases the thermal diffusivity of LED filament, also
Just protect the service life of LED filament；Meanwhile, compared with sapphire, imposite ceramic substrate 1 ensured while the life-span,
Greatly reduce cost.
2. the present invention uses thick film technology silk-screen silver layer or silver palladium alloy layer at imposite ceramic substrate two ends, and uses Reflow Soldering
Realize fixing with metal rack and be connected, solving traditional LED lamp silk and make in LED encapsulation, assembling light fixture process and
During later stage use, sheet metal is prone to the problem that substrate comes off, and substantially increases product yield and quality.Meanwhile, improve
Product flatness, the problems such as fixing glue glue amount is inconsistent, prevent because product out-of-flatness is in works such as follow-up die bond, bonding wire, some glue
That causes in skill is bad, further improves product yield and quality.
Metal level the most of the present invention uses solder reflow techniques to be attached with metal rack by soldering paste；On the one hand, can be effective
Improve the cohesive force between imposite ceramic substrate and metal rack, solve traditional LED lamp silk and make in LED encapsulation, assemble lamp
During tool process and later stage use, sheet metal is prone to the problem that substrate comes off, and substantially increases product yield and quality；
On the other hand, solder reflow techniques is used, it is ensured that flatness that imposite ceramic substrate is fixed in metal rack and flatness
Concordance, substantially reduces traditional LED lamp silk and because of substrate be fixed on that metal rack out-of-flatness causes bad and thus causes
Die bond, bonding wire, some glue etc. are bad, further increase product yield；It addition, employing scheme need not by mould molding,
Substantially increase volume production feasibility and stability, and yield.
4. the present invention sets SAC soldering paste, through reflow soldering at described metal rack point glue location point so that imposite ceramic substrate
On the coating of silver layer and metal rack combine closely, wafer can be improved inadequate with support coating cohesive force, junction out-of-flatness,
The problems such as the glue bad control of amount of fixing glue, also just improve the reliability of imposite ceramic substrate and metal rack bonding, improve product
Flatness, the problems such as the glue amount of fixing glue is inconsistent, prevent because of product out-of-flatness, in works such as follow-up die bond, bonding wire, some glue
That causes in skill is bad.
Accompanying drawing explanation
Fig. 1 is the structural representation of imposite ceramic substrate；
Fig. 2 is the structural representation that two ends are provided with the imposite ceramic substrate of metal level；
Fig. 3 is the structural representation of metal rack；
Fig. 4 is the ceramic LED lamp silk of imposite encapsulation plane structure chart before sealing；
In figure: 1-imposite ceramic substrate, 2-bar shaped ceramic substrate district, 3-metal level, 4-metal rack, 5-wafer, 6-metal
Connecting line.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the technical scheme of this patent is described in more detail.
Refer to Fig. 1-4, the ceramic LED lamp silk of a kind of imposite encapsulation, use imposite ceramic substrate 1 as LED filament
Pedestal；Described imposite ceramic substrate 1 is divided equally some bar shaped ceramic substrate districts 2 as wall scroll filament die bond bonding wire pedestal；
Described imposite ceramic substrate 1 two ends use thick film technology silk-screen to have the metal level 3 that 3-15 micron is thick, and described metal level 3 is
Conductive metal layer, it is preferred to use silver layer or silver palladium alloy layer；The surface configuration of described imposite ceramic substrate 1 has some crystalline substances
Between sheet 5, and adjacent wafer 5, and it is connected by metal contact wires 6 between wafer 5 with metal level 3, adjacent
It is connected by serial or parallel connection or string the mode combined between product sheet 5；Described metal level 3 uses Reflow Soldering by soldering paste
Technology is bonded in metal rack 4, prepares the leadout electrode of LED filament, it is achieved the derivation of internal circuit, and described soldering paste uses
SAC soldering paste；The one side being provided with wafer 5 at imposite ceramic substrate 1 is packaged with fluorescent material dielectric layer, and is solidified into
Type；As preferably, the one side being not provided with wafer 5 at imposite ceramic substrate 1 is also packaged with fluorescent material dielectric layer；Described fluorescence
Powder dielectric layer is mixed with silica gel or other media by single or two or more fluorescent material.
The present invention uses imposite ceramic substrate 1 as the pedestal of LED filament, not only increases the thermal diffusivity of LED filament, also
Ensure that the service life of LED filament；Meanwhile, compared with sapphire, imposite ceramic substrate 1 ensured while the life-span,
Greatly reduce cost.
The present invention uses thick film technology silk-screen silver layer or silver palladium alloy layer at imposite ceramic substrate 1 two ends, and uses Reflow Soldering
Realize fixing with metal rack 4 and be connected, solving traditional LED lamp silk and make in LED encapsulation, assembling light fixture process, with
And during later stage use, sheet metal is prone to the problem that substrate comes off, and substantially increases product yield and quality.Meanwhile, improve
Product flatness, the problems such as fixing glue glue amount is inconsistent, prevent because product out-of-flatness is at follow-up die bond, bonding wire, some glue etc.
That causes in technique is bad, further improves product yield and quality.
Metal level 3 of the present invention uses solder reflow techniques to be attached with metal rack 4 by soldering paste；On the one hand, Ke Yiyou
Effect improves the cohesive force between imposite ceramic substrate 1 and metal rack 4, solves traditional LED lamp silk and makes in LED encapsulation,
Assemble light fixture process and later stage use during sheet metal be prone to the problem that substrate comes off, substantially increase product yield and
Quality；On the other hand, use solder reflow techniques, it is ensured that the flatness that imposite ceramic substrate 1 is fixed in metal rack 4 with
And the concordance of flatness, substantially reduce traditional LED lamp silk because of substrate be fixed on that metal rack out-of-flatness causes bad and
The die bond that thus causes, bonding wire, some glue etc. are bad, further increase product yield；It addition, employing scheme need not lead to
Cross mould molding, substantially increase volume production feasibility and stability, and yield.
The present invention sets SAC soldering paste, through reflow soldering at 4 glue location points of described metal rack so that imposite ceramic substrate
The coating of the silver layer on 1 and metal rack 4 is combined closely, and can improve wafer inadequate with support coating cohesive force, and junction is not
Smooth, the problem such as the glue bad control of amount of fixing glue, also just improve the reliability of imposite ceramic substrate 1 and metal rack 4 bonding,
Improve product flatness, the problem such as the glue amount of fixing glue is inconsistent, prevent because of product out-of-flatness, at follow-up die bond, bonding wire,
That causes in the techniques such as some glue is bad.
The processing method of the ceramic LED lamp silk of a kind of imposite encapsulation, initially with imposite ceramic substrate 1 as LED filament
Pedestal, and imposite ceramic substrate 1 is divided equally some bar shaped ceramic substrate districts 2 as wall scroll filament die bond bonding wire pedestal；So
After use the metal level 3 that thick film technology silk-screen 3-15 micron is thick at imposite ceramic substrate 1 two ends；Again at imposite ceramic substrate 1
Surface configuration have between some wafers 5, and adjacent wafer 5, and between wafer 5 and metal level 3 by metal even
Wiring 6 connects, and is connected by serial or parallel connection or string the mode combined between adjacent wafer 5；Then soldering paste is passed through
Use solder reflow techniques to be bonded in metal rack 4 by metal level 3, prepare the leadout electrode of LED filament, it is achieved internal circuit
Derivation；Finally imposite ceramic substrate 1 is provided with the one side of wafer 5 and is packaged with fluorescent material dielectric layer, and be solidified into
Type.
Above the better embodiment of this patent is explained in detail, but this patent is not limited to above-mentioned embodiment,
In the ken that those of ordinary skill in the art is possessed, it is also possible to make each on the premise of without departing from this patent objective
Plant change.
Claims (10)
1. the ceramic LED lamp silk of an imposite encapsulation, it is characterised in that use imposite ceramic substrate as the base of LED filament
Seat, described imposite ceramic substrate is divided equally some bar shaped ceramic substrate districts as wall scroll filament die bond bonding wire pedestal.
The ceramic LED lamp silk of imposite the most according to claim 1 encapsulation, it is characterised in that described imposite ceramic base
Plate two ends use thick film technology silk-screen to have the metal level that 3-15 micron is thick.
The ceramic LED lamp silk of imposite the most according to claim 2 encapsulation, it is characterised in that described metal level is conduction
Metal level, including silver layer or silver palladium alloy layer.
4. the ceramic LED lamp silk encapsulated according to the imposite one of claim 1-3 Suo Shu, it is characterised in that described imposite
The surface configuration of ceramic substrate has between some wafers, and adjacent wafer, and between wafer and metal level by metal even
Wiring connects.
The ceramic LED lamp silk of imposite the most according to claim 4 encapsulation, it is characterised in that between adjacent wafer
It is connected by serial or parallel connection or string the mode combined.
6. the ceramic LED lamp silk encapsulated according to the imposite described in Claims 2 or 3, it is characterised in that described metal level leads to
Crossing soldering paste uses solder reflow techniques to be bonded in metal rack, prepares the leadout electrode of LED filament, it is achieved the derivation of internal circuit.
The ceramic LED lamp silk of imposite the most according to claim 4 encapsulation, it is characterised in that set at imposite ceramic substrate
The one side being equipped with wafer is packaged with fluorescent material dielectric layer, and carries out curing molding.
The ceramic LED lamp silk of imposite the most according to claim 7 encapsulation, it is characterised in that at imposite ceramic substrate not
The one side arranging wafer also can be packaged with fluorescent material dielectric layer.
9. the processing method of the ceramic LED lamp silk of an imposite encapsulation, it is characterised in that make initially with imposite ceramic substrate
For the pedestal of LED filament, and imposite ceramic substrate is divided equally some bar shaped ceramic bases as wall scroll filament die bond bonding wire pedestal
Plate district；Then the metal level that thick film technology silk-screen 3-15 micron is thick is used at imposite ceramic substrate two ends；Again at imposite pottery
The surface configuration of substrate has between some wafers, and adjacent wafer, and passes through metal contact wires between wafer and metal level
Connect, between adjacent wafer, be connected by serial or parallel connection or string the mode combined；Then backflow is used by soldering paste
Metal level is bonded in metal rack by welding technology, prepares the leadout electrode of LED filament, it is achieved the derivation of internal circuit；Finally
The one side being provided with wafer at imposite ceramic substrate is packaged with fluorescent material dielectric layer, and carries out curing molding.
The processing method of the ceramic LED lamp silk of imposite the most according to claim 9 encapsulation, it is characterised in that described
The one side being not provided with wafer at base of ceramic also can be packaged with fluorescent material dielectric layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410747101.5A CN105895778A (en) | 2014-11-30 | 2014-11-30 | Entire board package ceramic LED lamp filament and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410747101.5A CN105895778A (en) | 2014-11-30 | 2014-11-30 | Entire board package ceramic LED lamp filament and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105895778A true CN105895778A (en) | 2016-08-24 |
Family
ID=56701025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410747101.5A Pending CN105895778A (en) | 2014-11-30 | 2014-11-30 | Entire board package ceramic LED lamp filament and processing method thereof |
Country Status (1)
| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108772262A (en) * | 2018-08-27 | 2018-11-09 | 广东华辉煌光电科技有限公司 | A kind of porous pit filament cover board |
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|---|---|---|---|---|
| CN102244189A (en) * | 2011-07-19 | 2011-11-16 | 彩虹集团公司 | LED encapsulated by ceramic substrate in integrated mode |
| JP2014063780A (en) * | 2012-09-20 | 2014-04-10 | Nippon Steel & Sumikin Electronics Devices Inc | Light-emitting element mounting substrate and manufacturing method therefor |
| CN103824926A (en) * | 2014-03-05 | 2014-05-28 | 中国科学院半导体研究所 | Method for producing multi-chip LED (light-emitting diode) package |
| CN203812909U (en) * | 2014-03-21 | 2014-09-03 | 深圳市佳捷特陶瓷电路技术有限公司 | LED filament transparent ceramic substrate |
| CN104037316A (en) * | 2014-06-19 | 2014-09-10 | 广州市鸿利光电股份有限公司 | Inorganic LED packaging support and packaging method thereof |
-
2014
- 2014-11-30 CN CN201410747101.5A patent/CN105895778A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244189A (en) * | 2011-07-19 | 2011-11-16 | 彩虹集团公司 | LED encapsulated by ceramic substrate in integrated mode |
| JP2014063780A (en) * | 2012-09-20 | 2014-04-10 | Nippon Steel & Sumikin Electronics Devices Inc | Light-emitting element mounting substrate and manufacturing method therefor |
| CN103824926A (en) * | 2014-03-05 | 2014-05-28 | 中国科学院半导体研究所 | Method for producing multi-chip LED (light-emitting diode) package |
| CN203812909U (en) * | 2014-03-21 | 2014-09-03 | 深圳市佳捷特陶瓷电路技术有限公司 | LED filament transparent ceramic substrate |
| CN104037316A (en) * | 2014-06-19 | 2014-09-10 | 广州市鸿利光电股份有限公司 | Inorganic LED packaging support and packaging method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108772262A (en) * | 2018-08-27 | 2018-11-09 | 广东华辉煌光电科技有限公司 | A kind of porous pit filament cover board |
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Application publication date: 20160824 |