NL2011840B1 - Bearing heating panel, remote type fluorescent powder structured LED light source and production method thereof. - Google Patents
Bearing heating panel, remote type fluorescent powder structured LED light source and production method thereof. Download PDFInfo
- Publication number
- NL2011840B1 NL2011840B1 NL2011840A NL2011840A NL2011840B1 NL 2011840 B1 NL2011840 B1 NL 2011840B1 NL 2011840 A NL2011840 A NL 2011840A NL 2011840 A NL2011840 A NL 2011840A NL 2011840 B1 NL2011840 B1 NL 2011840B1
- Authority
- NL
- Netherlands
- Prior art keywords
- heating panel
- light
- fluorescent powder
- bearing heating
- bowl
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 86
- 239000000843 powder Substances 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000012780 transparent material Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000035515 penetration Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 5
- 230000000149 penetrating effect Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 101150038956 cup-4 gene Proteins 0.000 description 16
- 238000001228 spectrum Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
A bearing heating panel is provided. The bearing heating panel is provided with cavities penetrating through the bearing heating panel in the thickness direction. A remote type fluorescent powder structured LED light source made of the mentioned bearing heating panel is also provided. The bearing heating panel is located at the opening end of a light cup. A method for producing the remote fluorescent powder structured LED light sources in batches is also provided. The bearing heating panel has high dissipation and prolongs the service life. The remote type fluorescent powder structured LED light source made from the bearing heating panel is closer to the LED chip in virtue of the feature of good heat dissipation effect of the bearing heating panel, thereby reducing the volume of the remote type fluorescent powder structured LED light source, and saving materials and cost.
Description
Bearing heating panel, remote type fluorescent powder structured LED light source and production method thereof
Technical field
The present invention relates to LED illumination field, in particular to a bearing heating panel, a remote type fluorescent powder structured LED light source and a batch production method thereof.
Description of the Related Art
White LED lights usually consist of GaN semiconductor light-emitting devices (LED chips) emitting blue spectrum and fluorescent powder materials capable of converting the blue spectrum into other spectrums (the most common is the yellow spectrum). Wherein, the fluorescent powder materials are usually encapsulated in colloidal silica. LED light sources generate a huge amount of heat during working; while over high working temperature is one of major factors limiting the performance and service life of the LED light sources.
Two main reasons causing heating in the LED light sources are as below: 1. the majority of electricity is converted into heat due to the limited conversion efficiency when the LED chips convert the electricity into light. 2. When the fluorescent powder materials absorb the blue spectrum and convert it into other spectrums, a part of the energy is lost due to the physical principle, and the lost energy is converted into heat. Wherein, the heat generated by the LED chips can be dissipated by LEDs themselves. However, the fluorescent powder encapsulated in the silica gel materials is a poor conductor for heat, usually resulting in over high temperature in the fluorescent powder area and affecting the performance and service life of the light sources.
The fluorescent powder structures can be classified into the contact type and the remote type according to the placement mode of the fluorescent powder. Wherein, the remote type fluorescent powder structure is prior to the contact type fluorescent powder structure in optical performance. However, the remote type fluorescent powder structure is difficult to dissipate heat and therefore usually used in a large area far away from the LED chip. Displacement in this way can reduce the heating density of the fluorescent powder materials and increase the heat dissipating area of the fluorescent powder materials to avoid high temperature in the fluorescent powder area. The existing remote type fluorescent powder structure has the disadvantage of high product cost due to use of a great amount of expensive fluorescent powder and silica gel materials. If the distance from the fluorescent powder structure to the LED chip and the area of the fluorescent powder is shortened to reduce the cost, the temperature of the fluorescent powder materials will rise dramatically, affecting the performance and service life of the light sources.
CONTENTS OF THE PRESENT INVENTION
The present invention provides a bearing heating panel with a good heat dissipating effect, a remote type fluorescent powder structured LED light source and a batch production method thereof.
To fulfill the above objectives, the present invention first provides a technical scheme: A bearing heating panel is provided. The bearing heating panel is provided with a fluorescent area. A plurality of cavities penetrating through the bearing heating panel in the thickness direction is adjacently formed in the fluorescent area. The cavities are filled with fluorescent powder. The fluorescent area of the heating panel corresponds to the light-emitting path of the LED chip.
Wherein, the inner wall of each cavity is provided with a reflective layer.
Wherein, the bearing heating panel is a silicon wafer or a metal plate.
The present invention also provides a technical scheme: A remote type fluorescent powder structured LED light source comprises a light cup and a bearing heating panel as mentioned in the above technical scheme. The bottom of the light cup is provided with an LED chip. The bearing heating panel is located at the rim of the light cu. The fluorescent area on the bearing heating panel corresponds to the rim of the light cup.
Wherein, a light panel is recessed to form the light cup, and the bearing heating panel is bonded with the light panel through a transparent material.
Wherein, the light cup is filled with transparent silica gel.
Wherein, the LED chip is connected with a bonding pad, and the bonding pad is led out along the inner wall of the light cup through the joint of the bearing heating panel and the open end of the light cup.
Wherein, the LED chip is connected with a bonding pad, and the bonding pad is led out from the bottom face of the light cup.
Wherein, the area of the fluorescent area is not smaller than the opening area of the recess.
The present invention also provides a method for producing LED light sources in batches, comprising steps of: A. manufacturing light cups, specifically comprising steps of: al. Etching a light panel to form a plurality of light cups in an array at the same time. a2. Installing an LED chip at the bottom of each light cup; and, a3. connecting each LED chip to a bonding pad, wherein the bonding pad is led out along the inner wall of each light cup via the open end of each light cup or by penetrating through the bottom of each light cup; B. manufacturing bearing heating pads, specifically comprising steps of: bl. dividing a heating panel to form bearing heating panels in an array and etching in each bearing heating panel to form a plurality of cavities, wherein the plurality of cavities are adjacently formed and penetrate through each bearing heating panel in the thickness direction. b2. Covering the inner wall of each cavity with a reflective layer; and, b3. filling each cavity with fluorescent powder, wherein the cavities filled with fluorescent powder form a fluorescent area, and the fluorescent area on each bearing heating panel corresponds to the rim of each light cup; C. bonding the light panel with light cups and the heating panel with fluorescent areas, wherein each fluorescent area corresponds to a light cup; and, D. cutting the bonded heating panel and light panel along the array to obtain a plurality of LED light sources.
The present invention has the following beneficial effects. In the prior art, the remote fluorescent powder structure is required to increase the heating area away from the LED chip to improve the heat dissipating effect of the fluorescent powder, so that the use of materials such as the fluorescent powder and silica gel is increased. While in the present invention, the bearing heating panel is provided with a plurality of cavities filled with the fluorescent powder, and the heat is quickly transferred to the heating panel when the fluorescent powder emits heat, thereby enhancing the heat dissipating rate, shortening the distance between the bearing heating panel and the LED chip as much as possible, and saving materials and cost. In the remote type fluorescent powder structured LED light source provided by the present invention, the bearing heating panel is directly located at the opening of the light cup, the distance between the LED chip and the remote type fluorescent powder substrate is just equal to the depth of the body of the light cup, thus realizing use of the remote type fluorescent powder equivalent to that of the contact type fluorescent powder, improving the optical performance of the LED light source and saving materials and cost. The present invention also provides a method for producing the LED light sources in batches. A plurality of light cups and a plurality of bearing heating panels in arrays are and manufactured on the light panel and the heating panel respectively and correspondingly, bonded at one time and then uniformly cut into the LED light sources, so the productions speed is fast.
Attached drawings of the Specification
Figure 1 is a sectional view of a remote type fluorescent powder substrate of the present invention.
Figure 2 is a sectional view of an LED light source of a remote type fluorescent powder structure of the present invention.
Figure 3 is a flowchart of a method for producing LED lights in batches of the present invention.
In the figure, 1-bearing heating panel; 2-fluorescent powder; 3-reflective layer; 4-light cup; 5-transparent silica gel; 6-LED chip.
DETAILED DESCRIPTION OF THE PRESENT INVENTION
The technical contents, structural features, objective and effects of the present invention are described in detail with reference to embodiments and attached drawings.
Refer to figure 1 and figure 2. This embodiment provides a bearing heating panel. The bearing heating panel 1 is a silicon wafer. The bearing heating panel 1 is provided with a fluorescent area. The fluorescent area is internally provided with a plurality of adjacent cavities penetrating through the bearing heating panel 1 in the thickness direction and filled with fluorescent powder 2. The fluorescent area of the bearing heating panel 1 is used to set the light-emitting path for the corresponding LED chip 6. In the heat dissipating process of the fluorescent powder 2 in this embodiment, the heat is quickly transferred to the bearing-heating panel 1, thereby improving the heat dissipation efficiency, reducing the distance between the fluorescent powder and the LED chip as much as possible in use, and saving materials and saving cost due to the small fluorescent area.
In this embodiment, the inner wall of each cavity is provided with a reflective layer 3, so the reflectivity of the inner wall of each cavity on the bearing heating panel 1 can be enhanced. In this embodiment, to quickly coat the reflective layers, the reflective layers are located on the whole bearing heating panel.
In this embodiment, the bearing heating panel 1 is a silicon wafer. Of course, in other embodiments, the bearing panel 1 may also be other heat conducting materials, such as the aluminum plate.
Refer to figure 2. Another embodiment provides a remote type fluorescent powder structured LED light source, comprising a light cup 4 and a bearing-heating panel 1 as mentioned in the above embodiments. The bottom of the light cup 4 is provided with an LED chip 6. The bearing heating panel 1 is located at the rim of each light cup 4. The fluorescent area on the bearing heating panel 1 corresponds to the rim of the light cup 4. The distance from the LED chip 6 to the bearing heating panel 1 is just the depth of the body of the light cup 4 itself, realizing the use of the remote type fluorescent powder equivalent to that of the contact type fluorescent powder, improving the optical performance of the LED light source, reducing the volume of the LED light source, and saving materials and cost. The bearing heating panel has a good heat dissipating effect, so the service life of the LED light source is prolonged. In this embodiment, the fluorescent area is not smaller than the opening area of the light cup 4, thus ensuring that the bearing heating panel 1 does not block the light emitted out of the light cup from the LED chip.
In this embodiment, a light panel is recessed to form the light cup 4, and the bearing heating panel is bonded with the light panel through a transparent material. Generally, the transparent material is silica gel. Bonding of the bearing heating panel 1 and the opening end of the light cup 4 can ensure convenient production and high sealing capability, and the transparent materials employed can improve the permeability of light. Moreover, the transparent silica gel 5 filled in the light cup 4 can fix and protect the LED chip 6.
In this embodiment, the LED chip 6 is connected with a bonding pad (not shown in the figure). The bonding pad is led out along the inner wall of the light cup 4 through the joint of the bearing heating panel 1 and the opening end of the light cup 4. In another embodiment, the LED chip 6 is connected with a bonding pad, and the bonding pad is led out from the bottom face of the light cup.
In a specific embodiment, a method for quickly producing LED light sources in batches is provided, as shown in figure 3, comprising steps of: A. manufacturing light cups 4, specifically comprising steps of: al. Etching a light panel to form a plurality of light cups 4 in an array at the same time. a2. Installing an LED chip 6 at the bottom of each light cup 4 . a3. Connecting the anode and cathode of each LED chip 6 to a bonding pad respectively, wherein the boning pad is led out along the inner wall of the light cup 4 via the open end of the light cup 4 or by penetrating through the bottom of the light cup 4; B. manufacturing bearing heating panels 1, specifically comprising steps of: bl. dividing a heating panel to generate bearing heating panels 1 in an array, and etching in each bearing heating panel 1 to form a plurality of cavities, wherein the plurality of cavities are adjacently formed and penetrate through the bearing heating panel 1 in the thickness direction. b2. Covering the inner wall of each cavity with a reflective layer 3. b3. Filling the cavities with fluorescent powder 2, wherein the plurality of cavities filled with fluorescent powder form a fluorescent area, and the fluorescent area on the bearing heating panel corresponds to the rim of the light cup; C. bonding the light panel with light cups 4 and the heating panel with fluorescent areas, wherein each fluorescent area corresponds to a light cup 4/ and, D. cutting the bonded heating panel and light panel along the array to obtain a plurality of LED light sources.
The above are only the exemplary embodiment of the present invention, which cannot limit the present invention. Within the spirit and principle of the present invention, any modification of the equivalent structure or equivalent flow, or direct or indirect application in other related technical fields all shall be fall in the protection scope of the present invention.
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310294597.0A CN103346243B (en) | 2013-07-12 | 2013-07-12 | Carry heat sink and the LED light source of long-distance fluorescent powder structure and production method thereof |
| CN201310294597 | 2013-07-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NL2011840A NL2011840A (en) | 2015-01-13 |
| NL2011840B1 true NL2011840B1 (en) | 2016-07-04 |
Family
ID=49281027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2011840A NL2011840B1 (en) | 2013-07-12 | 2013-11-26 | Bearing heating panel, remote type fluorescent powder structured LED light source and production method thereof. |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103346243B (en) |
| NL (1) | NL2011840B1 (en) |
| WO (1) | WO2015003402A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3117267B1 (en) * | 2014-03-11 | 2018-05-02 | Osram Sylvania Inc. | Light converter assemblies with enhanced heat dissipation |
| JP6459354B2 (en) * | 2014-09-30 | 2019-01-30 | 日亜化学工業株式会社 | Translucent member and method for manufacturing the same, light emitting device and method for manufacturing the same |
| EP3361140B1 (en) * | 2015-10-09 | 2019-08-28 | Panasonic Intellectual Property Management Co., Ltd. | Wavelength conversion device and lighting apparatus |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7355284B2 (en) * | 2004-03-29 | 2008-04-08 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element |
| JP2007311731A (en) * | 2006-05-17 | 2007-11-29 | Ikuo Iwai | Light emitting device employing led |
| KR100766925B1 (en) * | 2006-05-19 | 2007-10-17 | 삼성에스디아이 주식회사 | Light emission device and liquid crsytal display device with the light emission device as back light unit |
| JP2011520281A (en) * | 2008-05-07 | 2011-07-14 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Illumination device comprising an LED having a self-supporting grid comprising a luminescent material and a method of making a self-supporting grid |
| JP2009277843A (en) * | 2008-05-14 | 2009-11-26 | Nec Lighting Ltd | Light-emitting device, illuminating apparatus with the same, and back light for liquid crystal display |
| CN101761810B (en) * | 2010-02-25 | 2011-10-05 | 宁波复洋光电有限公司 | White light plane light source LED module and manufacturing method thereof |
| CN102437257A (en) * | 2011-12-05 | 2012-05-02 | 深圳市瑞丰光电子股份有限公司 | Manufacture method of light emitting diode packaging structure |
| CN102983125B (en) * | 2012-11-27 | 2015-07-01 | 北京半导体照明科技促进中心 | LED (Light Emitting Diode) encapsulating body, manufacturing method thereof and LED system containing LED encapsulating body |
| CN102938442B (en) * | 2012-11-27 | 2015-06-24 | 北京半导体照明科技促进中心 | LED package unit and LED package system having same |
| CN203434192U (en) * | 2013-07-12 | 2014-02-12 | 广东洲明节能科技有限公司 | Bearing heat-radiating plate, and LED light source of remote phosphor structure |
-
2013
- 2013-07-12 CN CN201310294597.0A patent/CN103346243B/en active Active
- 2013-07-17 WO PCT/CN2013/079505 patent/WO2015003402A1/en active Application Filing
- 2013-11-26 NL NL2011840A patent/NL2011840B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| NL2011840A (en) | 2015-01-13 |
| CN103346243B (en) | 2016-08-31 |
| CN103346243A (en) | 2013-10-09 |
| WO2015003402A1 (en) | 2015-01-15 |
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| Date | Code | Title | Description |
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| MM | Lapsed because of non-payment of the annual fee |
Effective date: 20221201 |