CN103346243A - Bearing heat-dissipation board, LED light source of remote fluorescent powder structure and production method of LED light source - Google Patents
Bearing heat-dissipation board, LED light source of remote fluorescent powder structure and production method of LED light source Download PDFInfo
- Publication number
- CN103346243A CN103346243A CN2013102945970A CN201310294597A CN103346243A CN 103346243 A CN103346243 A CN 103346243A CN 2013102945970 A CN2013102945970 A CN 2013102945970A CN 201310294597 A CN201310294597 A CN 201310294597A CN 103346243 A CN103346243 A CN 103346243A
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- Prior art keywords
- heating panel
- light source
- led light
- lamp cup
- cup
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
Abstract
The invention discloses a bearing heat-dissipation board. The bearing heat-dissipation board is provided with a cavity penetrating through the bearing heat-dissipation board in the thickness direction, and fluorescent powder is embedded in the cavity. Meanwhile, the invention discloses an LED light source of a remote fluorescent powder structure. The LED light source of the remote fluorescent powder structure is made by using the bearing heat-dissipation board. The bearing heat-dissipation board is arranged at an open end of a lamp cup. The invention further discloses a method for rapidly producing the LED light source of the remote fluorescent powder structure in volume. The bearing heat-dissipation board is good in heat dissipation performance, and prolongs the service life. Besides, the LED light source of the remote fluorescent powder structure is made by using the bearing heat-dissipation board, makes full use of the characteristic of good heat dissipation performance of the bearing heat-dissipation board, and enables the bearing heat-dissipation board to be close to an LED chip in a short distance. The size of the LED light source of the remote fluorescent powder structure is reduced, materials are saved, and cost is saved.
Description
Technical field
The present invention relates to the LED lighting field, relate in particular to a kind of led light source and production method in batches thereof of carrying heating panel and remote fluorescence powder structure.
Background technology
LED illumination white light source is made up of with the phosphor material powder that blue light can be converted to other various spectrum (the most common with gold-tinted) the spectrochrome GaN light emitting semiconductor device (led chip) that turns blue usually.Wherein, phosphor material powder generally is wrapped among the colloidal silica.Led light source produces a large amount of heat energy at work, and too high working temperature is one of the key constraints in led light source performance and life-span.
Heating in the led light source mainly contains following two reasons, and one, led chip is being converted to the light time with electricity, because conversion efficiency is limited, most of electric energy is converted to heat energy; Two, phosphor material powder is when the absorption blue light is converted to other spectrum, and owing to physical principle is lost part energy, this power conversion is heat energy.Wherein, the heat that led chip produces can still, because fluorescent material is wrapped among the silica gel material, be the non-conductor of heat by LED heat radiation itself, and this often causes the phosphor area temperature too high, influences light source performance and life-span.
The mode that fluorescent material is placed can be divided into contact phosphor structure and remote fluorescence powder structure.Wherein remote fluorescence powder structure is better than the optical property of contact phosphor structure.But because remote fluorescence powder structure is difficult for heat radiation, often be placed on from the last large tracts of land of the far distance of led chip and use, place like this, can reduce the heat generation density of phosphor material powder, increase the area of dissipation of fluorescent material simultaneously, thereby avoid producing high temperature in phosphor area.The shortcoming of existing remote fluorescence powder structure is, needs a large amount of use expensive fluorescent material and silica gel materials, has increased the cost of product.If in order to reduce cost, and reduce phosphor structure to the distance of led chip and the area of fluorescent material, then the temperature of phosphor material powder can sharply increase, and influences performance and the life-span of light source.
Summary of the invention
The invention provides a kind of carrying heating panel of good heat dissipation effect and led light source and the batch manufacturing method thereof of remote fluorescence powder structure.
To achieve these goals, a kind of technical solution scheme that the present invention at first proposes is: a kind of carrying heating panel, described carrying heating panel is provided with phosphor region, and what be provided with a plurality of contiguous settings in the phosphor region runs through the cavity that carries heating panel in thickness direction, and cavity is embedded with fluorescent material; The phosphor region of described heating panel is used for the emitting light path setting of corresponding led chip.
Wherein, the inwall of described cavity is provided with reflector layer.
Wherein, described carrying heating panel is silicon chip or metallic plate.
The present invention has proposed a kind of technical scheme again: a kind of led light source of remote fluorescence powder structure, comprise Lamp cup and as the described carrying heating panel of above-mentioned technical scheme, the cup end of described Lamp cup, arrange led chip, described carrying heating panel is arranged on the rim of a cup of Lamp cup, and the phosphor region on the described carrying heating panel is corresponding with the rim of a cup of Lamp cup.
Wherein, a lamp plate indent forms described Lamp cup, and is bonding by transparent material between described carrying heating panel and the lamp plate.
Wherein, fill full transparent silica gel in the described Lamp cup.
Wherein, described led chip is connected with pad, and pad is drawn through the junction of the openend of carrying heating panel and described Lamp cup along the Lamp cup inwall.
Wherein, described led chip is connected with pad, and pad is drawn from the bottom surface of Lamp cup.
Wherein, described phosphor region area is not less than the aperture area of described groove.
The invention allows for a kind of method of producing led light source in batches, it comprises step,
A, make Lamp cup, specifically comprise step, a1, when a lamp plate becomes array, etch a plurality of Lamp cups; A2, led chip is installed in the bottom of each Lamp cup; A3, each led chip connect pad, and pad is drawn through the openend of Lamp cup or a cup end of passing Lamp cup along the Lamp cup inwall;
B, make the carrying heating panel, specifically comprise step, b1, mark off the carrying heating panel what a heating panel became array, and in each carrying heating panel a plurality of cavitys of etching, the adjacent setting of described a plurality of cavitys also runs through the carrying heating panel in thickness direction; B2, cover reflector layer at the inwall of cavity; B3, embed fluorescent material in cavity, the cavity groups that embeds fluorescent material forms phosphor region, and the phosphor region on the described carrying heating panel is corresponding with the rim of a cup of Lamp cup;
C, will have the lamp plate of Lamp cup and have the heating panel of phosphor region bonding, wherein, the corresponding Lamp cup of each phosphor region;
D, the heating panel after bonding and lamp plate are cut along array, obtain a plurality of led light sources.
Beneficial effect of the present invention is, be different from the remote fluorescence powder structure of prior art, need increase area of dissipation away from led chip and can improve remote fluorescence powder good heat dissipation effect, to such an extent as to improve the use of materials such as fluorescent material and silica gel, the present invention is provided with a plurality of cavitys at the carrying heating panel, then fluorescent material is embedded in the cavity, make fluorescent material in the heating process, heat is delivered on the heating panel fast, improve rate of heat dispation, the distance of dwindling carrying heating panel and led chip that can also try one's best is saved materials, saves cost; And the led light source of remote fluorescence powder structure provided by the invention, exactly above-mentioned carrying heating panel is set directly at the opening part of Lamp cup, the distance of led chip and remote fluorescence powder substrate is the degree of depth of Lamp cup itself, realize that the remote fluorescence powder is equivalent to the use of contact fluorescent material, both improved the optical property of led light source, reduce the volume of led light source simultaneously, saved materials, saved cost; The invention also proposes a kind of method of producing led light source in batches, on lamp plate and heating panel respectively simultaneously the corresponding array that becomes produce a plurality of Lamp cups and carrying heating panel, the unified led light source that cuts into after the disposable stickup is produced fast then.
Description of drawings
Fig. 1 is the schematic cross-section of remote fluorescence powder substrate of the present invention;
Fig. 2 is the schematic cross-section of the led light source of remote fluorescence powder structure of the present invention;
Fig. 3 is the schematic flow sheet of the method for batch process led light source of the present invention.
Among the figure, 1, the carrying heating panel; 2, fluorescent material; 3, reflector layer; 4, Lamp cup; 5, transparent silica gel; 6, led chip.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1 and Fig. 2, a kind of carrying heating panel of present embodiment, carrying heating panel 1 is silicon chip, described carrying heating panel 1 is provided with phosphor region, what be provided with a plurality of contiguous settings in the phosphor region runs through the cavity that carries heating panel 1 in thickness direction, and cavity is embedded with fluorescent material 2; The phosphor region of described carrying heating panel 1 is used for the emitting light path setting of corresponding led chip 6.Fluorescent material 2 of the present invention is in the heating process, and heat is delivered on the carrying heating panel 1 fast, improves rate of heat dispation, in use, the distance of dwindling fluorescent material and led chip that can also try one's best, the phosphor region area is little, reach the saving materials, save the effect of cost.
In the present embodiment, the inwall of described cavity is provided with the reflecting rate that reflector layer 3 can improve the cavity inner wall on the carrying heating panel 1, and in the present embodiment, in order to be coated with reflector layer fast, described reflector layer is positioned on whole carrying heating panels 1.
In the present embodiment, described carrying heating panel 1 is silicon chip, and certainly, in other embodiments, carrying heating panel 1 can be other Heat Conduction Material also, as metallic plates such as aluminium.
See also Fig. 2, in another execution mode, a kind of led light source of remote fluorescence powder structure is provided, comprise the carrying heating panel 1 in Lamp cup 4 and the various embodiments described above, the cup end of described Lamp cup 4, arrange led chip 6, described carrying heating panel 1 is arranged on the rim of a cup of Lamp cup 4, and the phosphor region on the described carrying heating panel 1 is corresponding with the rim of a cup of Lamp cup 4.The distance of led chip 6 and carrying heating panel 1 is the degree of depth of Lamp cup 4 itself, realize that the remote fluorescence powder is equivalent to the use of contact fluorescent material, both improved the optical property of led light source, reduced the volume of led light source simultaneously, save materials, save cost, the good heat dissipation effect of carrying heating panel, improve the useful life of led light source, in the present embodiment, described phosphor region area is not less than the aperture area of described Lamp cup 4, can guarantee to carry the light ejaculation Lamp cup that heating panel 1 can not block led chip like this.
In the present embodiment, a lamp plate indent forms described Lamp cup 4, and bonding by transparent material between described carrying heating panel and the lamp plate, transparent material is generally silica gel.Bonding between the openend of described carrying heating panel 1 and Lamp cup 4, can conveniently produce, the seal height uses well-illuminated material simultaneously, can improve the permeability of light.And fill full transparent silica gel 5 in the described Lamp cup 4, and both can fixed L ED chip 6, can also protect led chip 6.
In the present embodiment, described led chip 6 is connected with the pad (not shown), and pad is drawn through carrying heating panel 1 and the junction of the openend of Lamp cup 4 along Lamp cup 4 inwalls, in another embodiment, described led chip 6 is connected with pad, and pad is drawn from the bottom surface of Lamp cup.
In one embodiment, in order to produce led light source fast in batches, concrete production method is as Fig. 3, to comprise step:
A, making Lamp cup 4 specifically comprise step:
A1, when becoming array, a lamp plate etches a plurality of Lamp cups 4;
A2, led chip 6 is installed in the bottom of each Lamp cup 4;
The both positive and negative polarity of a3, each led chip 6 connects pad respectively, and pad is drawn at an end through the openend of Lamp cup 4 or the cup that passes Lamp cup 4 along Lamp cup 4 inwalls;
B, making carrying heating panel 1 specifically comprise step:
B1, mark off carrying heating panel 1 what a heating panel became array, and in each carrying heating panel 1 a plurality of cavitys of etching, the adjacent setting of described a plurality of cavitys also runs through carrying heating panel 1 in thickness direction;
B2, cover reflector layer 3 at the inwall of cavity;
B3, embed fluorescent material 2 in the cavity, the described a plurality of cavitys that embed fluorescent material form phosphor regions, and the phosphor region on the described carrying heating panel is corresponding with the rim of a cup of Lamp cup;
C, will have the lamp plate of Lamp cup 4 and have the heating panel of phosphor region bonding, wherein, the corresponding Lamp cup 4 of each phosphor region;
D, the heating panel after bonding and lamp plate are cut along array, obtain a plurality of led light sources.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. a carrying heating panel is characterized in that described carrying heating panel is provided with phosphor region, and what be provided with a plurality of contiguous settings in the phosphor region runs through the cavity that carries heating panel in thickness direction, and cavity is embedded with fluorescent material; The phosphor region of described heating panel is used for the emitting light path setting of corresponding led chip.
2. carrying heating panel according to claim 1 is characterized in that, the inwall of described cavity is provided with reflector layer.
3. carrying heating panel according to claim 1 is characterized in that, described carrying heating panel is silicon chip or metallic plate.
4. the led light source of a remote fluorescence powder structure, it is characterized in that, comprise Lamp cup and as each described carrying heating panel of claim 1-3, the cup end of described Lamp cup, arrange led chip, described carrying heating panel is arranged on the rim of a cup of Lamp cup, and the phosphor region on the described carrying heating panel is corresponding with the rim of a cup of Lamp cup.
5. the led light source of remote fluorescence powder structure according to claim 4 is characterized in that, a lamp plate indent forms described Lamp cup, and is bonding by transparent material between described carrying heating panel and the lamp plate.
6. the led light source of remote fluorescence powder structure according to claim 4 is characterized in that, fills full transparent silica gel in the described Lamp cup.
7. the led light source of remote fluorescence powder structure according to claim 4 is characterized in that, described led chip is connected with pad, and pad is drawn through the junction of the openend of carrying heating panel and described Lamp cup along the Lamp cup inwall.
8. the led light source of remote fluorescence powder structure according to claim 4 is characterized in that, described led chip is connected with pad, and pad is drawn from the bottom surface of Lamp cup.
9. the led light source of remote fluorescence powder structure according to claim 4 is characterized in that, described phosphor region area is not less than the aperture area of described groove.
10. a method of producing led light source in batches is characterized in that it comprises step,
A, making Lamp cup specifically comprise step,
A1, when becoming array, a lamp plate etches a plurality of Lamp cups;
A2, led chip is installed in the bottom of each Lamp cup;
The both positive and negative polarity of a3, each led chip connects pad respectively, and pad is drawn at an end through the openend of Lamp cup or the cup that passes Lamp cup along the Lamp cup inwall;
B, making carrying heating panel specifically comprise step,
B1, mark off the carrying heating panel what a heating panel became array, and in each carrying heating panel a plurality of cavitys of etching, the adjacent setting of described a plurality of cavitys also runs through the carrying heating panel in thickness direction;
B2, cover reflector layer at the inwall of cavity;
B3, embed fluorescent material in cavity, the described a plurality of cavitys that embed fluorescent material form phosphor regions, and the phosphor region on the described carrying heating panel is corresponding with the rim of a cup of Lamp cup;
C, will have the lamp plate of Lamp cup and have the heating panel of phosphor region bonding, wherein, the corresponding Lamp cup of each phosphor region;
D, the heating panel after bonding and lamp plate are cut along array, obtain a plurality of led light sources.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310294597.0A CN103346243B (en) | 2013-07-12 | 2013-07-12 | Carry heat sink and the LED light source of long-distance fluorescent powder structure and production method thereof |
| PCT/CN2013/079505 WO2015003402A1 (en) | 2013-07-12 | 2013-07-17 | Bearing heat-dissipating plate, led light source of remote fluorescent powder structure and production method therefor |
| NL2011840A NL2011840B1 (en) | 2013-07-12 | 2013-11-26 | Bearing heating panel, remote type fluorescent powder structured LED light source and production method thereof. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310294597.0A CN103346243B (en) | 2013-07-12 | 2013-07-12 | Carry heat sink and the LED light source of long-distance fluorescent powder structure and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103346243A true CN103346243A (en) | 2013-10-09 |
| CN103346243B CN103346243B (en) | 2016-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310294597.0A Active CN103346243B (en) | 2013-07-12 | 2013-07-12 | Carry heat sink and the LED light source of long-distance fluorescent powder structure and production method thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103346243B (en) |
| NL (1) | NL2011840B1 (en) |
| WO (1) | WO2015003402A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105470368A (en) * | 2014-09-30 | 2016-04-06 | 日亚化学工业株式会社 | Light emitting device and method for manufacturing thereof |
| CN108139038A (en) * | 2015-10-09 | 2018-06-08 | 松下知识产权经营株式会社 | Wavelength converter and lighting device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015138495A1 (en) * | 2014-03-11 | 2015-09-17 | Osram Sylvania Inc. | Light converter assemblies with enhanced heat dissipation |
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- 2013-07-12 CN CN201310294597.0A patent/CN103346243B/en active Active
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- 2013-11-26 NL NL2011840A patent/NL2011840B1/en not_active IP Right Cessation
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| CN105470368A (en) * | 2014-09-30 | 2016-04-06 | 日亚化学工业株式会社 | Light emitting device and method for manufacturing thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| NL2011840A (en) | 2015-01-13 |
| CN103346243B (en) | 2016-08-31 |
| WO2015003402A1 (en) | 2015-01-15 |
| NL2011840B1 (en) | 2016-07-04 |
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