CN201206742Y - LED lighting module - Google Patents
LED lighting module Download PDFInfo
- Publication number
- CN201206742Y CN201206742Y CNU2008200841242U CN200820084124U CN201206742Y CN 201206742 Y CN201206742 Y CN 201206742Y CN U2008200841242 U CNU2008200841242 U CN U2008200841242U CN 200820084124 U CN200820084124 U CN 200820084124U CN 201206742 Y CN201206742 Y CN 201206742Y
- Authority
- CN
- China
- Prior art keywords
- module
- light source
- cooling
- light
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000002513 implantation Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract 9
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 206010020843 Hyperthermia Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000036031 hyperthermia Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
An LED lighting module is mainly composed of a light source module, a power supply module and a cooling module, wherein the light source module consists of at least an LED chip, circuit substrates and a secondary optical component, and is mounted in the cooling module, and the circuit substrates thereof are connected via at least a heat-conducting pipe; the heat-conducting pipes are arranged on the cooling module; one or more oscillators which can automatically generate air flow and improve the cooling efficiency are embedded into the cooling module; an air flow diverging groove which can diverge the air flow and improve the cooling efficiency is formed on the cooling module; and high-density cooling fins with equal space or alternative space are arranged on the cooling module. The LED lighting module has the characteristics of reasonable and compact structure, convenient and reliable use, small size, light weight, high universality, convenient assembly, long service life, high luminous efficacy and the like.
Description
Technical field
The utility model relates to a kind of semiconductor light emitting lighting device, belong to lighting technical field.
Background technology
LED lighting that can be practical at present, major part is by the led light source chip, heat radiation aluminium block or loose type radiating fin, electric wire, power supply, secondary optics parts (light cup or lens etc.), parts such as light source sealing cover glass machine shell assemble, the LED lighting that this structure is formed exists following deficiency: the one, and the heat that LED crystal grain is produced, mode with heat point source is dispelled the heat to all directions, the sectional area of its heat dissipation direction is little, can't reach fast and conduct heat in large area to heat abstractor (aluminium block or loose type aluminium fin), be easy to be accumulated in led chip inside, cause chip temperature to be higher than its maximum operating temperature, cause light decay or damage; The 2nd, each encapsulation unit must weld 2 both positive and negative polarity contacts, and its solder joint is many, processed complex, and quality management and control difficulty is big, is difficult for volume production; The 3rd, prior art must be set about from chip exterior if will form high efficiency and low-risk parallel circuit, causes wiring many, processed complex etc.; The 4th, because base plate line only has simple positive and negative electrode circuit, so do not possess the colorful control ability of RGB mixed light; The 5th, packing forms has frame, and the light that can reduce LED crystal grain appears rate; The 6th, encapsulating material is inapplicable, because energising can produce the hyperthermia radiation greater than 100C when afterwards light is by encapsulating material, so the selection of encapsulating material must meet following condition: should keep high transmission rate under 1 high temperature, to keep illumination efficiency; Should soften during 2 high temperature, in order to avoid encapsulating material causes grain oxidation because of the stress that expands with heat and contract with cold forms the crack; 3 are difficult for wearing out; Employed in the market encapsulating material major part is an epoxide resin material, can't satisfy above-mentioned requirements; The 7th, for lighting factory, because parts are many, assembling or procedure of processing are numerous and diverse, are unfavorable for volume production; The 8th, power supply uses constant voltage/current isolator, and wayward function can't make the illumination output optimization and the diversification of chip; The 9th, volume and weight are big, can't with the collocation of existing lamp outer casing, must use specific shell, unfavorablely put goods on the market fast, versatility is poor.
Summary of the invention
The purpose of this utility model is to overcome the deficiency of above-mentioned existence, and provides a kind of rational in infrastructure, compact, and easy to use, reliable, size is frivolous, and highly versatile is easy to assembly, can ensure the light source quality, improves the light-emitting diode lighting module of effect.
The purpose of this utility model is finished by following technical solution, it mainly is made up of light source module, power module and radiating module, described light source module is made of at least one led chip, circuit substrate, secondary optics parts, this light source module is installed in the radiating module, and the circuit substrate of light source module links to each other by at least one heat pipe, and this heat pipe is disposed on the radiating module.
Implant in the described radiating module single or a plurality of oscillators that can produce air-flow automatically, improve radiating efficiency are arranged.
The air-flow that described radiating module is provided with can disperse air-flow, improve radiating efficiency disperses groove.
Described radiating module is provided with highdensity fin, and the sheet spacing is between equidistant or close lean phase.
The utility model utilizes the led lighting light source module, by assembling with the modularization of power module and radiating module, make the temperature of led chip and circuit substrate joint be lower than 80C, can ensure the light source quality, prolong the service life of led chip, have rational in infrastructurely, compact, easy to use, reliable, size is frivolous, highly versatile, easy to assembly, characteristics such as luminous efficacy height can make integral LED lighting module power reach more than the 150W.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is that the A of Fig. 1 is to structural representation.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described in detail: shown in the accompanying drawing 1,2, the utility model mainly is made up of light source module 1, power module 2 and radiating module 3, described light source module 1 is made up of at least one led chip, secondary optics parts and substrate, and described led chip is that single crystal grain or polycrystalline grain constitute through no frame encapsulation; Adopt polycrystalline grain packaged type, can improve the power and the luminous flux of spot light, can lower the scattering ratio of light by medium (air), the power of spot light can reach 1.0-12.0W; Led chip adopts no frame packaged type, and the light that can improve crystal grain appears rate and luminous efficiency.Described substrate is a circuit substrate, and implanting on it has single or a plurality of led chips, and the general power scope is 4.0-48.0W; Also implantable on the described substrate have single or a plurality of RGBs (RGB) mixed light led chip, makes the use variation of light source, and the general power scope is 12.0-48.0W.This light source module 1 can be made up of a plurality of, several rows and forms, and is installed in the radiating module 3.
The circuit substrate of light source module 1 described in the utility model links to each other by at least one heat pipe 4, and this heat pipe 4 is disposed on the radiating module 3.Described heat pipe is that flattening its thickness of back is 2.5-4.5mm by heat pipe flattening or the brake forming of original outer diameter 6mm, and width is 6.0-10.0mm, and length is less than or equal to 1900mm.
Implant in the described radiating module 3 single or a plurality of oscillators 5 that can produce air-flow automatically, improve radiating efficiency are arranged.
The air-flow that described radiating module 3 is provided with can disperse air-flow, improve radiating efficiency disperses groove 6.
Described radiating module 3 is provided with highdensity radiating fin, and the sheet spacing is between equidistant or close lean phase.
Radiating module described in the utility model is faced and the face shaping variation of side-looking, and the outward appearance of facing can be rectangle, square, circle, hexagon, ellipse, egg shape etc.; The face shaping of side-looking can be rectangle, waveform, chevron and triangle etc., and the lighting of the various moulding of can arranging in pairs or groups.
Claims (4)
1, a kind of light-emitting diode lighting module, it mainly is made up of light source module, power module and radiating module, described light source module is made of at least one led chip, circuit substrate, secondary optics parts, it is characterized in that this light source module is installed in the radiating module, and the circuit substrate of light source module links to each other by at least one heat pipe, and this heat pipe is disposed on the radiating module.
2, light-emitting diode lighting module according to claim 1 is characterized in that implantation has single or a plurality of oscillators that can produce air-flow automatically, improve radiating efficiency in the described radiating module.
3, light-emitting diode lighting module according to claim 1 and 2 is characterized in that described radiating module is provided with the air-flow that can disperse air-flow, improve radiating efficiency and disperses groove.
4, light-emitting diode lighting module according to claim 3 is characterized in that described radiating module is provided with highdensity fin, and the sheet spacing is between equidistant or close lean phase.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200841242U CN201206742Y (en) | 2008-03-17 | 2008-03-17 | LED lighting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200841242U CN201206742Y (en) | 2008-03-17 | 2008-03-17 | LED lighting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201206742Y true CN201206742Y (en) | 2009-03-11 |
Family
ID=40465805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200841242U Ceased CN201206742Y (en) | 2008-03-17 | 2008-03-17 | LED lighting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201206742Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102192489A (en) * | 2010-03-11 | 2011-09-21 | 骆俊光 | High Efficiency Cooling Device |
| CN106678619A (en) * | 2017-01-23 | 2017-05-17 | 福建新大陆电脑股份有限公司 | Adjustable light source device |
-
2008
- 2008-03-17 CN CNU2008200841242U patent/CN201206742Y/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102192489A (en) * | 2010-03-11 | 2011-09-21 | 骆俊光 | High Efficiency Cooling Device |
| CN106678619A (en) * | 2017-01-23 | 2017-05-17 | 福建新大陆电脑股份有限公司 | Adjustable light source device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C35 | Partial or whole invalidation of patent or utility model | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20101026 Decision number of declaring invalidation: 15421 Granted publication date: 20090311 |