CN201206742Y - LED lighting module - Google Patents

LED lighting module Download PDF

Info

Publication number
CN201206742Y
CN201206742Y CNU2008200841242U CN200820084124U CN201206742Y CN 201206742 Y CN201206742 Y CN 201206742Y CN U2008200841242 U CNU2008200841242 U CN U2008200841242U CN 200820084124 U CN200820084124 U CN 200820084124U CN 201206742 Y CN201206742 Y CN 201206742Y
Authority
CN
China
Prior art keywords
module
light source
cooling
light
radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
CNU2008200841242U
Other languages
Chinese (zh)
Inventor
罗世昌
刘峻成
陈呈烈
张仁泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EVER ADVANCED TECHNOLOGIES Co Ltd
Original Assignee
EVER ADVANCED TECHNOLOGIES Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
Application filed by EVER ADVANCED TECHNOLOGIES Co Ltd filed Critical EVER ADVANCED TECHNOLOGIES Co Ltd
Priority to CNU2008200841242U priority Critical patent/CN201206742Y/en
Application granted granted Critical
Publication of CN201206742Y publication Critical patent/CN201206742Y/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40465805&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN201206742(Y) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An LED lighting module is mainly composed of a light source module, a power supply module and a cooling module, wherein the light source module consists of at least an LED chip, circuit substrates and a secondary optical component, and is mounted in the cooling module, and the circuit substrates thereof are connected via at least a heat-conducting pipe; the heat-conducting pipes are arranged on the cooling module; one or more oscillators which can automatically generate air flow and improve the cooling efficiency are embedded into the cooling module; an air flow diverging groove which can diverge the air flow and improve the cooling efficiency is formed on the cooling module; and high-density cooling fins with equal space or alternative space are arranged on the cooling module. The LED lighting module has the characteristics of reasonable and compact structure, convenient and reliable use, small size, light weight, high universality, convenient assembly, long service life, high luminous efficacy and the like.

Description

Light-emitting diode lighting module
Technical field
The utility model relates to a kind of semiconductor light emitting lighting device, belong to lighting technical field.
Background technology
LED lighting that can be practical at present, major part is by the led light source chip, heat radiation aluminium block or loose type radiating fin, electric wire, power supply, secondary optics parts (light cup or lens etc.), parts such as light source sealing cover glass machine shell assemble, the LED lighting that this structure is formed exists following deficiency: the one, and the heat that LED crystal grain is produced, mode with heat point source is dispelled the heat to all directions, the sectional area of its heat dissipation direction is little, can't reach fast and conduct heat in large area to heat abstractor (aluminium block or loose type aluminium fin), be easy to be accumulated in led chip inside, cause chip temperature to be higher than its maximum operating temperature, cause light decay or damage; The 2nd, each encapsulation unit must weld 2 both positive and negative polarity contacts, and its solder joint is many, processed complex, and quality management and control difficulty is big, is difficult for volume production; The 3rd, prior art must be set about from chip exterior if will form high efficiency and low-risk parallel circuit, causes wiring many, processed complex etc.; The 4th, because base plate line only has simple positive and negative electrode circuit, so do not possess the colorful control ability of RGB mixed light; The 5th, packing forms has frame, and the light that can reduce LED crystal grain appears rate; The 6th, encapsulating material is inapplicable, because energising can produce the hyperthermia radiation greater than 100C when afterwards light is by encapsulating material, so the selection of encapsulating material must meet following condition: should keep high transmission rate under 1 high temperature, to keep illumination efficiency; Should soften during 2 high temperature, in order to avoid encapsulating material causes grain oxidation because of the stress that expands with heat and contract with cold forms the crack; 3 are difficult for wearing out; Employed in the market encapsulating material major part is an epoxide resin material, can't satisfy above-mentioned requirements; The 7th, for lighting factory, because parts are many, assembling or procedure of processing are numerous and diverse, are unfavorable for volume production; The 8th, power supply uses constant voltage/current isolator, and wayward function can't make the illumination output optimization and the diversification of chip; The 9th, volume and weight are big, can't with the collocation of existing lamp outer casing, must use specific shell, unfavorablely put goods on the market fast, versatility is poor.
Summary of the invention
The purpose of this utility model is to overcome the deficiency of above-mentioned existence, and provides a kind of rational in infrastructure, compact, and easy to use, reliable, size is frivolous, and highly versatile is easy to assembly, can ensure the light source quality, improves the light-emitting diode lighting module of effect.
The purpose of this utility model is finished by following technical solution, it mainly is made up of light source module, power module and radiating module, described light source module is made of at least one led chip, circuit substrate, secondary optics parts, this light source module is installed in the radiating module, and the circuit substrate of light source module links to each other by at least one heat pipe, and this heat pipe is disposed on the radiating module.
Implant in the described radiating module single or a plurality of oscillators that can produce air-flow automatically, improve radiating efficiency are arranged.
The air-flow that described radiating module is provided with can disperse air-flow, improve radiating efficiency disperses groove.
Described radiating module is provided with highdensity fin, and the sheet spacing is between equidistant or close lean phase.
The utility model utilizes the led lighting light source module, by assembling with the modularization of power module and radiating module, make the temperature of led chip and circuit substrate joint be lower than 80C, can ensure the light source quality, prolong the service life of led chip, have rational in infrastructurely, compact, easy to use, reliable, size is frivolous, highly versatile, easy to assembly, characteristics such as luminous efficacy height can make integral LED lighting module power reach more than the 150W.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is that the A of Fig. 1 is to structural representation.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described in detail: shown in the accompanying drawing 1,2, the utility model mainly is made up of light source module 1, power module 2 and radiating module 3, described light source module 1 is made up of at least one led chip, secondary optics parts and substrate, and described led chip is that single crystal grain or polycrystalline grain constitute through no frame encapsulation; Adopt polycrystalline grain packaged type, can improve the power and the luminous flux of spot light, can lower the scattering ratio of light by medium (air), the power of spot light can reach 1.0-12.0W; Led chip adopts no frame packaged type, and the light that can improve crystal grain appears rate and luminous efficiency.Described substrate is a circuit substrate, and implanting on it has single or a plurality of led chips, and the general power scope is 4.0-48.0W; Also implantable on the described substrate have single or a plurality of RGBs (RGB) mixed light led chip, makes the use variation of light source, and the general power scope is 12.0-48.0W.This light source module 1 can be made up of a plurality of, several rows and forms, and is installed in the radiating module 3.
The circuit substrate of light source module 1 described in the utility model links to each other by at least one heat pipe 4, and this heat pipe 4 is disposed on the radiating module 3.Described heat pipe is that flattening its thickness of back is 2.5-4.5mm by heat pipe flattening or the brake forming of original outer diameter 6mm, and width is 6.0-10.0mm, and length is less than or equal to 1900mm.
Implant in the described radiating module 3 single or a plurality of oscillators 5 that can produce air-flow automatically, improve radiating efficiency are arranged.
The air-flow that described radiating module 3 is provided with can disperse air-flow, improve radiating efficiency disperses groove 6.
Described radiating module 3 is provided with highdensity radiating fin, and the sheet spacing is between equidistant or close lean phase.
Radiating module described in the utility model is faced and the face shaping variation of side-looking, and the outward appearance of facing can be rectangle, square, circle, hexagon, ellipse, egg shape etc.; The face shaping of side-looking can be rectangle, waveform, chevron and triangle etc., and the lighting of the various moulding of can arranging in pairs or groups.

Claims (4)

1, a kind of light-emitting diode lighting module, it mainly is made up of light source module, power module and radiating module, described light source module is made of at least one led chip, circuit substrate, secondary optics parts, it is characterized in that this light source module is installed in the radiating module, and the circuit substrate of light source module links to each other by at least one heat pipe, and this heat pipe is disposed on the radiating module.
2, light-emitting diode lighting module according to claim 1 is characterized in that implantation has single or a plurality of oscillators that can produce air-flow automatically, improve radiating efficiency in the described radiating module.
3, light-emitting diode lighting module according to claim 1 and 2 is characterized in that described radiating module is provided with the air-flow that can disperse air-flow, improve radiating efficiency and disperses groove.
4, light-emitting diode lighting module according to claim 3 is characterized in that described radiating module is provided with highdensity fin, and the sheet spacing is between equidistant or close lean phase.
CNU2008200841242U 2008-03-17 2008-03-17 LED lighting module Ceased CN201206742Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200841242U CN201206742Y (en) 2008-03-17 2008-03-17 LED lighting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200841242U CN201206742Y (en) 2008-03-17 2008-03-17 LED lighting module

Publications (1)

Publication Number Publication Date
CN201206742Y true CN201206742Y (en) 2009-03-11

Family

ID=40465805

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008200841242U Ceased CN201206742Y (en) 2008-03-17 2008-03-17 LED lighting module

Country Status (1)

Country Link
CN (1) CN201206742Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102192489A (en) * 2010-03-11 2011-09-21 骆俊光 Efficient heat radiation device
CN106678619A (en) * 2017-01-23 2017-05-17 福建新大陆电脑股份有限公司 Adjustable light source device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102192489A (en) * 2010-03-11 2011-09-21 骆俊光 Efficient heat radiation device
CN106678619A (en) * 2017-01-23 2017-05-17 福建新大陆电脑股份有限公司 Adjustable light source device

Similar Documents

Publication Publication Date Title
CN101649968B (en) Light-emitting diode illumination apparatus
CN201363572Y (en) LED light source module
CN101315927B (en) High power LED phase transition heat sink structure
CN202040724U (en) Efficient LED lamp
CN102130111A (en) Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device
CN201373367Y (en) High-power LED light source module adopting semiconductor for cooling
CN102748739B (en) Heat conducting and radiating system of LED (Light-Emitting Diode) lamp
CN201206742Y (en) LED lighting module
CN103236489A (en) LED (light emitting diode) packaging structure
CN101294660B (en) LED lighting lamp
CN202013881U (en) Integrated packaging structure with vertically structured LED chips
CN205560300U (en) Packaged type LED lamp
CN202003993U (en) Large power LED packaging structure
CN201887075U (en) Led
CN101847624A (en) COB modularized LED encapsulation technology
CN201462504U (en) Light emitting diode light source module
CN202532237U (en) Dustproof LED (Light Emitting Diode) module easily radiating heat
CN208422957U (en) A kind of integrated LED multi-chip three-dimension packaging light source
CN202549839U (en) Novel LED (Light-Emitting Diode) light-emitting chip and LED lamp formed by assembling same
CN102569284B (en) The LED that New LED luminescence chip and assembling thereof are formed
CN202259437U (en) Multi-reflection cup integrated type LED (light emitting diode) packaging structure
CN100570213C (en) Light-emitting diode lighting module
CN201166348Y (en) High heat radiation performance LED illuminating apparatus
CN201547725U (en) Heat dissipation device of LED lamp
CN201180950Y (en) Light source module of LED

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C35 Partial or whole invalidation of patent or utility model
IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20101026

Decision number of declaring invalidation: 15421

Granted publication date: 20090311