CN101761810B - White light plane light source LED module and manufacturing method thereof - Google Patents

White light plane light source LED module and manufacturing method thereof Download PDF

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Publication number
CN101761810B
CN101761810B CN2010101139564A CN201010113956A CN101761810B CN 101761810 B CN101761810 B CN 101761810B CN 2010101139564 A CN2010101139564 A CN 2010101139564A CN 201010113956 A CN201010113956 A CN 201010113956A CN 101761810 B CN101761810 B CN 101761810B
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glue
pcb substrate
light source
white
housing
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CN2010101139564A
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Chinese (zh)
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CN101761810A (en
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占文琪
应利明
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宁波复洋光电有限公司
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Publication of CN101761810A publication Critical patent/CN101761810A/en
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Abstract

The present invention discloses a white light plane light source LED module and a manufacturing method thereof. The white light plane light source LED module comprises a shell, a PCB base plate arranged in the shell, a lead and an LED illuminator arranged on the PCB base plate and a transparent epoxy glue layer injected in the shell in order to fix the PCB base plate and the LED illuminator. The inner cavity of the shell is provided with a plurality of reflection cavities having a reverse cone structure formed by using white mirror faces; an LED chip of the LED illuminator is arranged on the bottom center of the reflection cavity; an adhesive film which is provided with a fluorescent powder glue layer transparent point is adhered on the front side of the shell; the position of the fluorescent powder glue layer transparent point is opposite to the LED chip of the LED illuminator; and the fluorescent powder glue layer comprises fluorescent powder and transparent silica gel, wherein the fluorescent powder is hemisphere-shaped. The method comprises the steps of manufacturing PCB base plate and the shell, packaging the transparent epoxy glue layer, manufacturing the adhesive film and sticking the film. The product of the present invention has the advantages of low cost, uniform radiance, high illuminating efficiency, big variability and long use life.

Description

A kind of white light plane light source LED module and preparation method thereof

Technical field

The present invention relates to lighting field.Especially a kind of white light plane light source LED module and preparation method thereof.

Background technology

Led light source is in the white-light illuminating field, show that the application in this field is very extensive, and its potentiality also are very huge.In the past, the white light LEDs particle that the common employing of white light plane light source LED module encapsulates with little chip (as, 0603SMD, ¢ 3 etc.).The defective of this method mainly contains: the light point is many after one, forming module, also can be dazzling.Many groups of grains lump together, and realize the dull and stereotyped matrix of forming.Tens compositions of few usefulness, many usefulness hundreds ofs composition light source product.But because light source is made up of tens even up to a hundred the very high spot lights of light intensity, launching light has high light dazzle point on microcosmic.If be radiated at the not so good body surface of diffuse reflection performance, will feel has many bright spots or even thorn eyespot, and it is unintelligible to cause object to observe, not separated between point and point, section and the section.This phenomenon is particularly evident on the display screen that uses some particle LED to form.Two, the packaged LED lamp of many particles is combined, and surface configuration differs, complex procedures not only, and adsorb dust easily, not easy to clean and influence attractive in appearance.Three, the single lamplight brightness of LED is inconsistent, causes the uniformity of plurality of LEDs combination back light poor.The packaged LED lamp of many particles is combined the single lamp of the LED that need select the characteristic unanimity, has increased the technology difficulty of production process, and the single-point uniformity is difficult to control on the modular surface light source.Four, luminous efficiency is low, the inner chamber angle of the lighting angle of spot light, efficient and face mould piece is inconsistent, and integrated retroreflective efficient is low like this, and light loss is bigger.Five, spot light is welded on the modular surface light source PCB, and its heat energy is difficult to directly distribute.

At present, the preparation method of white light LEDs is that blue-light LED chip 3 ' (Fig. 6) is installed in the bowl-type housing 1 ', covering is to be mixed with the fluorescent material (YAG) that can produce fluorescence: the epoxy adhesive layer (Fig. 6 that contains CE fluorescent material, PCB substrate 2 ', lead-in wire 6 '), blue light is excited by fluorescent material by the epoxy adhesive layer 4 ' back that contains fluorescent material and produces white light.Make the dazzling and inconsistent inaesthetic problem of surface configuration of former light that solved like this.But because the volume of the resin bed of fluorescent material is relatively large, the fluorescent material of sneaking in the resin is also more relatively.Because of fluorescent material very expensive (about 500 yuan/gram), price is higher than gold, so making is very uneconomical like this, cost is high especially.Because of even inadequately unavoidably with the fluorescent material of going into, the light intensity that causes led module to send is inconsistent again.In addition, because the light that the LED illuminator sends passes through the variable thickness sample of the resin bed of fluorescent material, the inner chamber angle of the lighting angle of spot light, efficient and face mould piece is inconsistent, and integrated retroreflective efficient is low like this, and light loss is bigger, and illumination effect is poor.Moreover the epoxy adhesive layer that contains CE fluorescent material covers and makes led module heat radiation difficulty, and the coefficient of expansion that adds fluorescent material and resin again is different, the application time is a length slightly, this epoxy adhesive layer that contains fluorescent material will cause damages such as be full of cracks, and then influences module and use, and is directly connected to module service life.

In a word, in the white light plane light source LED module field, also there are problems such as weak heat-dissipating, light consistency are poor, cost height, luminous efficiency is low, service life is short in present white light plane light source LED module product.

Summary of the invention

Technical problem to be solved by this invention is at the deficiencies in the prior art, discloses to society that a kind of cost of manufacture is low, the brightness high conformity, and luminous efficiency height, accommodation are big, the white light plane light source LED module of long service life.Another object of the present invention provides a kind of making white light plane light source LED module method.

White light plane light source LED module product of the present invention is such:

A kind of white light plane light source LED module comprises: the PCB substrate in housing, the housing, install a plurality of lead-in wires and LED illuminator on the PCB substrate, flow in the housing PCB substrate and the fixing transparent epoxy glue-line of illuminator; It is characterized in that: described The housing inner chamber is established the planar inverted cone build structure reflection cavity that is of a plurality of white mirror, and the led chip of described LED illuminator just is being the reflection cavity bottom center of inverted cone build; Installing a pad pasting that is laid with fluorescent material glue-line diaphanous spot on the described housing front, the position of described phosphor gel is corresponding with the led chip on being laid in the PCB substrate, described fluorescent material glue-line is made up of fluorescent material and transparent silica gel, and this fluorescent material glue-line is dome-type.

Described pad pasting comprises, leaves the fluorescent material glue-line laid on the layer of toner of diaphanous spot and the described diaphanous spot and the adhesive-layer of organic hyaline membrane bottom surface on organic hyaline membrane, the organic hyaline membrane; The position of described diaphanous spot is corresponding with the described led chip that is laid on the PCB substrate.

Thickness<the 0.5mm of described fluorescent material glue-line.

Described LED illuminator comprises, transparent insulation glue, the aluminum steel that links to each other with described copper layer and led chip and led chip LED on the copper layer on the PCB substrate and pad, this pad and the white welding resistance around the led chip.

Described to flow in the housing described PCB substrate and the fixing transparent epoxy glue-line material of described LED illuminator be pure transparent epoxy resin, and transparent insulation glue is transparent silica gel.

Be the method for making above-mentioned white light plane light source LED module below, it is characterized in that: its manufacturing step is as follows:

1) make PCB substrate and housing:

A. make the PCB substrate:

1. design corresponding line construction according to designing requirement;

2. again according to the principle of the uniform dispersion of led chip, design solid brilliant position matrix;

3. the PCB substrate surface is plugged lead-in wire after brushing white welding resistance;

4. solid brilliant: as to require to prepare supporting blue led chip according to colour temperature; Adopt the transparent silica gel high temperature resistant, that thermal diffusivity good, cohesive force is very strong to form the transparent insulation glue-line, on solid brilliant platform, led chip is bonded on the pairing pad locations of PCB substrate, around solid brilliant position, brush white welding resistance as crystal-bonding adhesive;

5. the bonding aluminum steel is finished circuit and is connected: on the bonding platform with led chip electrode and PCB substrate counter electrode copper layer bonding on aluminum steel;

6. put it into then in the baking box, keep 130 ℃-150 ℃, toasted 1-1.5 hour, crystal-bonding adhesive solidifies the back led chip and is securely fixed on the PCB substrate.

B. make housing:

1. require to make punching block according to product design, make and establish a plurality of inverted cone build structure reflection cavities in housing profile and the inner chamber;

2. the housing inner chamber adopt white mirror planar, be the design of inverted cone build, to increase rising angle and light extraction efficiency.

2) encapsulation transparent epoxy glue-line is installed in the PCB substrate in the housing:

1. at housing inner chamber perfusion transparent epoxy resin glue;

2. after vacuumizing, be fixed in the housing inner chamber detecting qualified PCB substrate;

3. advance 75 ℃ of baking boxs then--95 ℃/3H--4H, treat its cooling curing thereafter.

3) make pad pasting:, make the pad pasting that matches according to the shape and the requirement of housing inner chamber of product upper surface;

1. be ready to big Zhang Youji hyaline membrane, check to have or not ripples line, stain, broken hole, organic hyaline membrane whether to meet the specification of production requirement, thickness, rice number; Whether glue meets state quality standard (GB/T 4851-1998);

2. the circular diaphanous spot position of needs point fluorescent glue is covered with paster, these diaphanous spots are corresponding suitable with the LED luminescence chip position of installing on the PCB substrate, then with black ink in the serigraphy; Advance oven for drying again;

3. paster is all thrown off, exposed a plurality of printing opacity circles, the phosphor gel that on printing opacity circled point, prepares with point gum machine by designing requirement; Advance oven for drying again;

4. brush one deck viscose glue at organic hyaline membrane back side.

4) paste pad pasting:

Stick on the front of plane module after the pad pasting that is brushed with one deck viscose glue opened greatly cut by specification.

The measure of optimizing above preparation method also comprises:

In the described step 3), phosphor gel is 100 by soft silica gel and fluorescent material by weight percentage on the described pad pasting surface: 1-100: 6 ratio allotment forms, and the fluorescent material glue-line is dome-type, its thickness<0.5mm.

Described step 2) in during encapsulation transparent epoxy glue-line, employing be pure epoxy resin glue.

When making the PCB substrate among the described step 1) a, substrate adopts aluminium base, copper layer and pad to adopt copper-clad plate, and bond pad surface is gold-plated.

The white minute surface of described step 1) b middle shell inner chamber is to adopt white PPO or PPA.

The white minute surface of described step 1) b middle shell inner chamber also can adopt white that enough intensity is arranged, fire-retardant heatproof, the material of anti-aging, good heat conductivity.

Advantage of the present invention is:

Because housing inner chamber of the present invention is established the planar inverted cone build structure reflection cavity that is of a plurality of employing white mirror, the led chip of LED illuminator is located at the reflection cavity bottom center that is the inverted cone build, installing a pad pasting that is laid with fluorescent material glue-line diaphanous spot on the housing front, the position of described phosphor gel is corresponding with the led chip on being laid in the PCB substrate, make and keep bigger distance between the fluorescent material glue-line of pad pasting and the led chip, (it highly is more than the 4mm), make light that chip sends before arriving the fluorescent material glue-line, can be dispersed in than chip list area big in tens times the reflection chamber.Make the light source point on the microcosmic be evenly distributed in, reduced the luminous intensity on the unit are, overcome dazzle well, improved consistency of colour, reduced the obstruction of bright dipping, improved luminous efficiency than on the large tracts of land.

The present invention adopts the form of pad pasting, and phosphor gel point cloth is on skin covering of the surface, and pad pasting is attached on the module of blue light plane, can select the white light pad pasting that is fit to according to the white light that is fit to own colour temperature in use.When changing the colour temperature of white light plane light source LED module as desire, blue light plane module need not be changed, and it is just passable only to change the pad pasting that is fit to.Because of same blue light plane module, stick pad pasting positive white or warm white, just can directly adjust the white light colour temperature of whole plane module.Therefore product accommodation of the present invention is big, and is flexible very simple and direct, can satisfy the different needs of user, and saved cost.

In addition, the fluorescent material that is consumed in the fluorescent material glue-line diaphanous spot of pad pasting more than the fluorescent material that epoxy adhesive layer consumed that is mixed with fluorescent material in the old product few (because of latter's packed layer volume big), save the fluorescent material of a large amount of costlinesses (expensive super gold), reduced the cost of product once more.

Description of drawings

Fig. 1 is an embodiment of the invention white light plane light source LED module stereogram (broken section);

Fig. 2 is an embodiment of the invention product structure schematic diagram (cutaway view);

Fig. 3 is an embodiment of the invention product vertical view;

Fig. 4 is a LED luminous body structure schematic diagram in the embodiment of the invention product;

Fig. 5 is that embodiment of the invention product pastes the mode structure schematic diagram;

Fig. 6 is a present former white light plane light source LED module structural representation body (cutaway view).

The specific embodiment

The title of each Reference numeral of the present invention is:

Housing 1, reflection cavity 11, PCB substrate 2, LED illuminator 3, led chip 31, aluminum steel 32, transparent insulation glue-line 33, copper layer 34, pad 35, white welding resistance 36, transparent epoxy glue-line 4, pad pasting 5, adhesive-layer 51, organic hyaline membrane 52, fluorescent material glue-line 53, fluorescent material glue-line diaphanous spot 54, layer of toner 55, lead-in wire 6.

Shown in Fig. 1-5, white light plane light source LED module of the present invention comprises: the PCB substrate 2 in housing 1, this housing, install a plurality of lead-in wires 6 and LED illuminator 3 on the PCB substrate, flow in the housing 1 PCB substrate 2 and the fixing transparent epoxy glue-line 4 of LED illuminator; It is characterized in that: described housing 1 inner chamber is established the planar inverted cone build structure reflection cavity 11 that is of a plurality of white mirror, reflection cavity 11 bottom center that the led chip 31 of described LED illuminator 3 just is being the inverted cone build; Installing a pad pasting 5 that is laid with fluorescent material glue-line diaphanous spot 54 on described housing 1 front, the position of described fluorescent material glue-line diaphanous spot 54 is corresponding with the led chip 31 on being laid in PCB substrate 2.

Described pad pasting 5 comprises, leaves the fluorescent material glue-line 53 laid on the layer of toner 55 of fluorescent material glue-line diaphanous spot 54 and the described fluorescent material glue-line diaphanous spot 54 and the adhesive-layer 51 of organic hyaline membrane bottom surface on organic hyaline membrane 52, the organic hyaline membrane; The position of described fluorescent material glue-line 53 is corresponding with the described led chip that is laid on the PCB substrate.

Described fluorescent material glue-line 53 is made up of fluorescent material and transparent silica gel, and this fluorescent material glue-line 53 is dome-type, the thickness<0.5mm of described fluorescent material glue-line 53.

Described LED illuminator 3 comprises, transparent insulation glue 33, the aluminum steel 32 that links to each other with described copper layer 34 and led chip 31 and led chip 31 on the copper layer 34 on the PCB substrate 2 and pad 35, this pad and the white welding resistance 36 around the led chip.

Described to flow in the housing 1 described PCB substrate 2 and described LED illuminator 3 fixing transparent epoxy glue-line 4 materials are pure transparent epoxy resins, and transparent insulation glue 33 is transparent silica gel.

Present embodiment adopts 460-465nm wave band blue led chip, led chip normal light intensity 180-200mcd, voltage range is 3.0-3.5V, chip size 14mil x 14mil, employing can be by 460-465nm light excited fluorescent powder, such as the grand TMT-00432-6065 fluorescent material in Taiwan.Present embodiment is according to the requirement design PCB substrate 2 of 8 row, 8 row.Housing 1 frame adopts the fire-retardant engineering material of white PPO, and perfusion thickness is the transparent epoxy resin glue formation transparent epoxy glue-line 4 of 4.5mm in the cavity of housing frame and 2 formation of PCB substrate, sticks the pad pasting 4 that scribbles fluorescent glue directly over the module of plane.

The brightness of present embodiment white light module single-point is 4LM, and single-point is 0.06W, light-emitting area 16mm 2As calculate the about 0.25LM/mm of unit are luminous flux with luminous efficiency 4LM 2, the light source block surface temperature can be stabilized in below 40 ℃ when the test environment temperature was 25 ℃ in actual the use.

The preparation method of above-mentioned white light plane light source LED module is: its making step is as follows:

1) make PCB substrate 2 and housing 1:

A. make PCB substrate 2: substrate adopts aluminium base, copper layer 34 and pad 35 to adopt copper-clad plate;

1. design corresponding line construction according to designing requirement;

2. again according to the principle of the uniform dispersion of led chip, design solid brilliant position matrix;

3. the PCB substrate surface is plugged lead-in wire 6 after brushing white welding resistance;

4. solid brilliant: as to require to prepare supporting blue led chip according to colour temperature; Adopt the transparent silica gel high temperature resistant, that thermal diffusivity good, cohesive force is very strong to form transparent insulation glue-line 33 as crystal-bonding adhesive, on solid brilliant platform, led chip 31 is bonded on pad 35 positions of PCB substrate 2 pairing surface gold-plating, around solid brilliant position, brushes white welding resistance 36;

5. the bonding aluminum steel is finished circuit and is connected: on the bonding platform with led chip 31 electrodes and PCB substrate 2 counter electrode copper layers 34 bonding on aluminum steel 32;

6. put it into then in the baking box, keep 150 ℃, toasted 1 hour, crystal-bonding adhesive solidifies, and led chip 31 is securely fixed on the PCB substrate.LED illuminator 3 has been arranged on the substrate.

B. make housing 1:

1. require to make punching block according to product design, make and establish a plurality of inverted cone build structure reflection cavities 11 in housing 1 profile and the inner chamber;

2. housing 1 adopts white PPO, PPA material, presses the punching block injection moulding with injection machine, makes inner chamber become the planar reflection cavity 11 that is inverted cone build structure of white mirror, to increase rising angle and light extraction efficiency.

2) encapsulation transparent epoxy glue-line 4 is installed in PCB substrate 2 in the housing 1:

1. pour into transparent pure epoxy resin glue at housing 1 inner chamber;

2. after vacuumizing, be fixed in the housing inner chamber detecting qualified PCB substrate 2;

3. advance 75 ℃ of-95 ℃/4H of baking box then, treat its cooling curing thereafter.

3) make pad pasting:

According to product upper surface shape, the pad pasting 5 that matches is made in housing 1 inner chamber requirement;

1. be ready to big Zhang Youji hyaline membrane 52, check to have or not ripples line, stain, broken hole, organic hyaline membrane whether to meet the specification of production requirement, thickness, rice number; Whether glue meets state quality standard (GB/T 4851-1998);

2. circular fluorescent arogel layer diaphanous spot 54 positions of needs point fluorescent glue are covered with paster, these fluorescent material glue-line diaphanous spots 54 are corresponding suitable with LED luminescence chip 31 positions of installing on PCB substrate 2, then with black ink in the serigraphy; Advance oven for drying again and become layer of toner 55;

3. paster is all thrown off, expose a plurality of printing opacity circles-circular fluorescent arogel layer diaphanous spot 54 by designing requirement, on circular fluorescent arogel layer diaphanous spot 54, put the phosphor gel for preparing with point gum machine, phosphor gel is 100 by soft silica gel and fluorescent material by weight percentage: 1-100: 6 ratio allotment, fluorescent material glue-line 53 is dome-type, its thickness<0.5mm; Advance oven for drying again;

4. brush one deck viscose glue at organic hyaline membrane 52 back sides and form adhesive-layer 51.

4) paste pad pasting 5:

Stick on the front of plane module after the pad pasting that is brushed with one deck viscose glue 5 opened greatly cut by specification.

The present invention also has following advantage: adopt many particles blue led chip to be distributed on the PCB substrate, and integral body is packaged together and forms the plane light emitting module, stick in the above again and be coated with the pad pasting that fluorescent material is a little arranged, like this, can make thermal source disperse to distribute, reduced the caloric value on the unit are, the heat radiation demanding criteria is reduced.

Led chip directly is fixed on the PCB substrate, can cover the copper layer by wiring board fast like this calorie spread is arrived whole wiring board surface, by realize heat radiation than the PCB wiring board surface of the big hundred times of led chip area, can effectively reduce the operating temperature of system, temperature can be controlled at below 50 ℃, and product is prolonged service life.

Claims (6)

1. the preparation method of a white light plane light source LED module, it is characterized in that: its manufacturing step is as follows:
1) make PCB substrate (2) and housing (1):
A. make PCB substrate (2):
1. design corresponding line construction according to designing requirement;
2. again according to the principle of the uniform dispersion of led chip, design solid brilliant position matrix;
3. the PCB substrate surface is plugged lead-in wire (6) after brushing white welding resistance;
4. solid brilliant: as to require to prepare supporting blue led chip according to colour temperature; Adopt the transparent silica gel high temperature resistant, that thermal diffusivity good, cohesive force is very strong to form transparent insulation glue-line (33) as crystal-bonding adhesive, on solid brilliant platform, led chip (31) is bonded on the pairing pad of PCB substrate (2) (35) position, around solid brilliant position, brushes white welding resistance (36);
5. the bonding aluminum steel is finished circuit and is connected: on the bonding platform with led chip (31) electrode and PCB substrate (2) counter electrode copper layer (34) bonding on aluminum steel (32);
6. put it into then in the baking box, keep 130 ℃-150 ℃, toasted 1-1.5 hour, crystal-bonding adhesive solidifies back led chip (31) and is securely fixed on the PCB substrate;
B. make housing (1):
1. require to make punching block according to product design, make and establish a plurality of inverted cone build structure reflection cavities (11) in housing (1) profile and the inner chamber;
2. housing (1) inner chamber adopt white mirror planar, be inverted cone build structure Design;
2) encapsulation transparent epoxy glue-line (4) is installed in PCB substrate (2) in the housing (1):
1. at housing (1) inner chamber perfusion transparent epoxy resin glue;
2. after vacuumizing, be fixed in the housing inner chamber detecting qualified PCB substrate (2);
3. advance 75 ℃ of-95 ℃/3H--4H of baking box then, treat its cooling curing thereafter;
3) make pad pasting:
According to product upper surface shape, the pad pasting (5) that matches is made in housing (1) inner chamber requirement;
1. be ready to big Zhang Youji hyaline membrane (52), check to have or not ripples line, stain, broken hole, organic hyaline membrane whether to meet the specification of production requirement, thickness, rice number; Whether glue meets state quality standard GB/T 4851-1998;
2. circular fluorescent arogel layer diaphanous spot (54) position of needs point fluorescent glue is covered with paster, these fluorescent material glue-line diaphanous spots (54) are corresponding suitable with LED luminescence chip (31) position of installing on PCB substrate (2), then with black ink in the serigraphy; Advance oven for drying again and become layer of toner (55);
3. paster is all thrown off, exposed a plurality of printing opacity circles-circular fluorescent arogel layer diaphanous spot (54), go up the phosphor gel for preparing on the point at circular fluorescent arogel layer diaphanous spot (54) with point gum machine by designing requirement; Advance oven for drying again;
4. brush one deck viscose glue at organic hyaline membrane (52) back side and form adhesive-layer (51);
4) paste pad pasting (5):
Stick on the front of plane module after the pad pasting that is brushed with one deck viscose glue (5) opened greatly cut by specification.
2. the method for making white light plane light source LED module according to claim 1, it is characterized in that: in the described step 3), phosphor gel is 100 by soft silica gel and fluorescent material by weight percentage on described pad pasting (5) surface: 1-100: 6 ratio allotment forms, fluorescent material glue-line (53) is dome-type, its thickness<0.5mm.
3. the method for making white light plane light source LED module according to claim 2 is characterized in that: encapsulation transparent epoxy glue-line when (4) described step 2), employing be pure epoxy resin glue.
4. the method for making white light plane light source LED module according to claim 3, it is characterized in that: when making PCB substrate (2) among the described step 1) a, substrate adopts aluminium base, copper layer (34) and pad (35) to adopt copper-clad plate, pad (35) surface gold-plating.
5. the method for making white light plane light source LED module according to claim 4 is characterized in that: the white minute surface at step 1) b middle shell (1) inner chamber is to adopt white PPO or PPA.
6. the method for making white light plane light source LED module according to claim 4 is characterized in that: at the white minute surface of step 1) b middle shell (1) inner chamber is to adopt enough intensity is arranged, fire-retardant heatproof, the material of anti-aging, good heat conductivity.
CN2010101139564A 2010-02-25 2010-02-25 White light plane light source LED module and manufacturing method thereof CN101761810B (en)

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CN102242896B (en) * 2011-07-07 2015-11-25 宁波方太厨具有限公司 A kind of LED-backlit device
CN102506327A (en) * 2011-11-08 2012-06-20 上海亚明灯泡厂有限公司 LED (light emitting diode) area light source module and method for obtaining uniform area light source white light
CN103369071A (en) * 2012-04-05 2013-10-23 苏州萃智新技术开发有限公司 Mobile phone screen film
TWI505440B (en) 2012-06-04 2015-10-21 Lextar Electronics Corp Light source module
CN103546111A (en) * 2012-07-12 2014-01-29 湖南省福晶电子有限公司 Concave-cap-packaged quartz crystal resonator and production method thereof
CN103354068A (en) * 2013-07-02 2013-10-16 王鹏 Method for manufacturing LED displayer and LED displayer
CN103346243B (en) * 2013-07-12 2016-08-31 广东洲明节能科技有限公司 Carry heat sink and the LED light source of long-distance fluorescent powder structure and production method thereof
US10193031B2 (en) 2016-03-11 2019-01-29 Rohinni, LLC Method for applying phosphor to light emitting diodes and apparatus thereof
CN108803149A (en) * 2018-07-20 2018-11-13 京东方科技集团股份有限公司 Area source and preparation method thereof and liquid crystal display device

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