CN203979962U - A kind of LED light source assembly that is applicable to area source - Google Patents
A kind of LED light source assembly that is applicable to area source Download PDFInfo
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- CN203979962U CN203979962U CN201420392460.9U CN201420392460U CN203979962U CN 203979962 U CN203979962 U CN 203979962U CN 201420392460 U CN201420392460 U CN 201420392460U CN 203979962 U CN203979962 U CN 203979962U
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Abstract
The utility model relates to a kind of LED light source assembly that is applicable to area source, and it comprises LED light source plate and LGP.Described LED light source plate is by LED light source plate, and the multiple LED luminescence chips that are mounted on LED light source plate form; Between described LED light source plate and LGP, be provided with fluorescent glass plate; Described LED light source plate, fluorescent glass plate and LGP stack successively according to order from the bottom to top; The LED light source assembly that is applicable to area source that adopts technique scheme, it can realize the more effect of Uniform Illumination; In technique scheme, due to the fluorescent material that adopts fluorescent glass alternative package on LED luminescence chip, so avoided organic material for the encapsulating fluorescent material performance failure under LED hot operation, also can avoid encapsulating the high manufacturing cost that fluorescent material produces in the production process of LED light source assembly simultaneously.
Description
Technical field
The utility model relates to a kind of lighting apparatus, especially a kind of LED light source assembly that is applicable to area source.
Background technology
For liquid crystal display device, LED light source assembly is one of critical component of its work.LED light source assembly mainly forms by being packaged with the elements such as the LED light source of LED fluorescent material and resin.Conventionally, LED encapsulating material adopts organic material, and LED can produce suitable heat when luminous, and heat accumulation can cause the life-span of organic material to be reduced for a long time, thereby reduces the service life of backlight, has also limited its range of application.In addition, LED point rubber seal dress is also a complicated manufacturing process, and it not only makes the production process of LED light source assembly more complicated, has also increased the manufacturing cost of LED chip encapsulation.
Utility model content
the technical problems to be solved in the utility model is to provide a kind of LED light source assembly that is applicable to area source, and it can provide uniform illuminating effect, and has production and the good feature of in use dispelling the heat of being easy to.
For solving the problems of the technologies described above, the utility model relates to a kind of LED light source assembly that is applicable to area source, and it comprises LED light source plate and LGP.Described LED light source plate is by LED light source plate, and the multiple LED luminescence chips that are mounted on LED light source plate form; Between described LED light source plate and LGP, be provided with fluorescent glass plate; Described LED light source plate, fluorescent glass plate and LGP stack successively according to order from the bottom to top.
As a kind of improvement of the present utility model, in described LED light source plate, LED luminescence chip adopts annulus array, and the home position of annulus array is provided with at least two LED luminescence chips around; Described LED light source plate bottom is provided with fin.Adopt above-mentioned design, because the Illumination Distribution of single LEDs luminescence chip is circular, therefore multiple LED of circular array can realize the more uniform Illumination Distribution of integral LED luminescence chip, and the scope that the LED luminescence chip that is arranged on circular array center can make the irradiation of LED light source assembly distribute is larger; The fin of LED light source plate bottom sheds its high heat in the course of the work LED luminescence chip being produced in time.
As a kind of improvement of the present utility model, between described LED light source plate and fluorescent glass plate, be provided with light conducting cylinder, described light conducting cylinder adopts the base area on LED light source plate to be greater than, the trapezoidal tubular structure of its base area on fluorescent glass plate; In LED light source plate, LED luminescence chip is all positioned at light conducting cylinder inside.Adopt above-mentioned design, the light conducting cylinder of tubular can make the light that LED luminescence chip sends reflect on the sidewall of light conducting cylinder, thereby the light originally with certain orientation is evenly reflexed in fluorescent glass plate and LGP, the more uniform illuminating effect of final formation.
As a kind of improvement of the present utility model, two bottom surfaces of described light conducting cylinder are provided with fly's-eye lens, and it can enter light conducting cylinder at light, and in light conducting cylinder ejaculation process, by fly's-eye lens, light is disperseed, thereby further promote the uniform illuminating effect of LED light source assembly.
As a kind of improvement of the present utility model, described fluorescent glass plate is by glass substrate, and the fluorescent glass layer being mounted on glass substrate forms; The laminating layer of described glass substrate and fluorescent glass layer adopts curved-surface structure, two end faces of described fluorescent glass all adopt the curved-surface structure matching with glass substrate curved surface, the curved surface of glass substrate and fluorescent glass layer is all towards bend of light conducting plate, and glass substrate exists maximum ga(u)ge on the axis of LGP.Adopt above-mentioned design, it is owing to having applied fluorescent glass between LED light source plate and LGP, so without encapsulate fluorescent material with organic materials such as silica gel on LED luminescence chip, thereby make LED luminescence chip in the course of the work without being subject to temperatures involved, extend its service life, and then further promoted the service life of LED-backlit plate; The curved design of glass substrate and fluorescent glass layer makes it form free-form surface lens, after the light that makes to send from LED luminescence chip enters fluorescent glass plate, can realize more uniform illuminating effect.
As a kind of improvement of the present utility model, described glass substrate adopts pyroceram, the minimum thickness of described glass substrate is at least 2 millimeters, the thickness of fluorescent glass layer is at least 0.09 millimeter, it can guarantee that glass substrate is unaffected under hot environment, makes the job stability of itself and fluorescent glass layer be ensured simultaneously.
As a kind of improvement of the present utility model, between described LED light source plate, fluorescent glass plate and LGP, adopt transparent heat conduction binding agent to be connected, it can better realize LED light source assembly radiating effect in the course of the work by the binding agent with thermal conductivity.
As a kind of improvement of the present utility model, described transparent heat conduction binding agent adopts transparent high-termal conductivity resin, is added with one or more the mixture in polythiophene Heat Conduction Material, grapheme material, aluminium oxide in described transparent high-termal conductivity resin.
Adopt the LED light source assembly that is applicable to area source of technique scheme, it produces light by the LED luminescence chip of circular array in the course of the work, it is through fly's-eye lens and trapezoidal light conducting cylinder, thereby will disperse uniform light injects in fluorescent glass layer, fluorescent material in light fluorescence excitation glassy layer, realizes the more effect of Uniform Illumination by LGP after light is converted; In technique scheme, due to the fluorescent material that adopts fluorescent glass alternative package on LED luminescence chip, so avoided organic material for the encapsulating fluorescent material performance failure under LED hot operation, also can avoid encapsulating the high manufacturing cost that fluorescent material produces in the production process of LED light source assembly simultaneously.
Brief description of the drawings
Fig. 1 is the utility model schematic diagram;
Fig. 2 is LED light source plate schematic diagram in the utility model;
Fig. 3 is fly's-eye lens partial view in the utility model;
Reference numerals list:
1-LGP, 2-LED light source plate, 3-LED luminescence chip, 4-fin, 5-light conducting cylinder, 6-fly's-eye lens, 7-glass substrate, 8-fluorescent glass layer.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, further illustrate the utility model, should understand following detailed description of the invention and only be not used in restriction scope of the present utility model for the utility model is described.It should be noted that, word 'fornt', 'back', " left side ", " right side ", "up" and "down" that use is described below refer to the direction in accompanying drawing, and word " interior " and " outward " refer to respectively the direction towards or away from specific features geometric center.
A kind of LED light source assembly that is applicable to area source as shown in Figure 1, it comprises LED light source plate and LGP 1.Described LED light source plate is by LED light source plate 2, and the multiple LED luminescence chips 3 that are mounted on LED light source plate 2 form; Between described LED light source plate and LGP 1, be provided with fluorescent glass plate; Described LED light source plate, fluorescent glass plate and LGP 1 stack successively according to order from the bottom to top.
As a kind of improvement of the present utility model, as shown in Figure 2, in described LED light source plate, LED luminescence chip 3 adopts annulus array, and the home position of annulus array is provided with at least two LED luminescence chips 3 around; Described LED light source plate bottom is provided with fin 4.Adopt above-mentioned design, because the Illumination Distribution of single LEDs luminescence chip is circular, therefore multiple LED of circular array can realize the more uniform Illumination Distribution of integral LED luminescence chip, and the scope that the LED luminescence chip that is arranged on circular array center can make the irradiation of LED light source assembly distribute is larger; The fin of LED light source plate bottom sheds its high heat in the course of the work LED luminescence chip being produced in time.
As a kind of improvement of the present utility model, between described LED light source plate and fluorescent glass plate, be provided with light conducting cylinder 5, described light conducting cylinder 5 adopts the base area on LED light source plate to be greater than, the trapezoidal tubular structure of its base area on fluorescent glass plate; In LED light source plate, LED luminescence chip is all positioned at light conducting cylinder inside.Adopt above-mentioned design, the light conducting cylinder of tubular can make the light that LED luminescence chip sends reflect on the sidewall of light conducting cylinder, thereby the light originally with certain orientation is evenly reflexed in fluorescent glass plate and LGP, the more uniform illuminating effect of final formation.
As a kind of improvement of the present utility model, as shown in Figure 3, two bottom surfaces of described light conducting cylinder 5 are provided with fly's-eye lens 6, it can enter light conducting cylinder at light, and in light conducting cylinder ejaculation process, by fly's-eye lens, light is disperseed, thereby further promote the uniform illuminating effect of LED light source assembly.
As a kind of improvement of the present utility model, described fluorescent glass plate is by glass substrate 7, and the fluorescent glass layer 8 being mounted on glass substrate 7 forms; Described glass substrate 7 adopts curved-surface structure with the laminating layer of fluorescent glass layer 8, two end faces of described fluorescent glass 8 all adopt the curved-surface structure matching with glass substrate 7 curved surfaces, the curved surface of glass substrate 7 and fluorescent glass layer 8 is all towards LGP 1 bending, and glass substrate 7 exists maximum ga(u)ge on the axis of LGP 1.Adopt above-mentioned design, it is owing to having applied fluorescent glass between LED light source plate and LGP, so without encapsulate fluorescent material with organic materials such as silica gel on LED luminescence chip, thereby make LED luminescence chip in the course of the work without being subject to temperatures involved, extend its service life, and then further promoted the service life of LED-backlit plate; The curved design of glass substrate and fluorescent glass layer makes it form free-form surface lens, after the light that makes to send from LED luminescence chip enters fluorescent glass plate, can realize more uniform illuminating effect.
As a kind of improvement of the present utility model, described glass substrate 7 adopts pyroceram, the minimum thickness of described glass substrate 7 is at least 2 millimeters, the thickness of fluorescent glass layer 8 is at least 0.09 millimeter, it can guarantee that glass substrate is unaffected under hot environment, makes the job stability of itself and fluorescent glass layer be ensured simultaneously.
As a kind of improvement of the present utility model, between described LED light source plate, fluorescent glass plate and LGP, adopt transparent heat conduction binding agent to be connected, described transparent heat conduction binding agent adopts transparent high-termal conductivity resin, is added with the mixture of polythiophene Heat Conduction Material and grapheme material in described transparent high-termal conductivity resin.
Adopt the LED light source assembly that is applicable to area source of technique scheme, it produces light by the LED luminescence chip of circular array in the course of the work, it is through fly's-eye lens and trapezoidal light conducting cylinder, thereby will disperse uniform light injects in fluorescent glass layer, fluorescent material in light fluorescence excitation glassy layer, realizes the more effect of Uniform Illumination by LGP after light is converted; In technique scheme, due to the fluorescent material that adopts fluorescent glass alternative package on LED luminescence chip, so avoided organic material for the encapsulating fluorescent material performance failure under LED hot operation, also can avoid encapsulating the high manufacturing cost that fluorescent material produces in the production process of LED light source assembly simultaneously.
Claims (8)
1. a LED light source assembly that is applicable to area source, it comprises LED light source plate and LGP, it is characterized in that, described LED light source plate is by LED light source plate, and the multiple LED luminescence chips that are mounted on LED light source plate form; Between described LED light source plate and LGP, be provided with fluorescent glass plate; Described LED light source plate, fluorescent glass plate and LGP stack successively according to order from the bottom to top.
2. according to the LED light source assembly that is applicable to area source claimed in claim 1, it is characterized in that, in described LED light source plate, LED luminescence chip adopts annulus array, and the home position of annulus array is provided with at least two LED luminescence chips around; Described LED light source plate bottom is provided with fin.
3. according to the LED light source assembly that is applicable to area source claimed in claim 2, it is characterized in that, between described LED light source plate and fluorescent glass plate, be provided with light conducting cylinder, described light conducting cylinder adopts the base area on LED light source plate to be greater than, the trapezoidal tubular structure of its base area on fluorescent glass plate; In LED light source plate, LED luminescence chip is all positioned at light conducting cylinder inside.
4. according to the LED light source assembly that is applicable to area source claimed in claim 3, it is characterized in that, two bottom surfaces of described light conducting cylinder are provided with fly's-eye lens.
5. according to the LED light source assembly that is applicable to area source described in claim 1 to 4 any one, it is characterized in that, described fluorescent glass plate is by glass substrate, and the fluorescent glass layer being mounted on glass substrate forms; The laminating layer of described glass substrate and fluorescent glass layer adopts curved-surface structure, two end faces of described fluorescent glass all adopt the curved-surface structure matching with glass substrate curved surface, the curved surface of glass substrate and fluorescent glass layer is all towards bend of light conducting plate, and glass substrate exists maximum ga(u)ge on the axis of LGP.
6. according to the LED light source assembly that is applicable to area source claimed in claim 4, it is characterized in that, described glass substrate adopts pyroceram, and the minimum thickness of described glass substrate is at least 2 millimeters, and the thickness of fluorescent glass layer is at least 0.09 millimeter.
7. according to the LED light source assembly that is applicable to area source claimed in claim 1, it is characterized in that, between described LED light source plate, fluorescent glass plate and LGP, adopt transparent heat conduction binding agent to be connected.
8. according to the LED light source assembly that is applicable to area source claimed in claim 7, it is characterized in that, described transparent heat conduction binding agent adopts transparent high-termal conductivity resin, is added with one or more the mixture in polythiophene Heat Conduction Material, grapheme material, aluminium oxide in described transparent high-termal conductivity resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420392460.9U CN203979962U (en) | 2014-07-16 | 2014-07-16 | A kind of LED light source assembly that is applicable to area source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420392460.9U CN203979962U (en) | 2014-07-16 | 2014-07-16 | A kind of LED light source assembly that is applicable to area source |
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| CN203979962U true CN203979962U (en) | 2014-12-03 |
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| CN201420392460.9U Expired - Fee Related CN203979962U (en) | 2014-07-16 | 2014-07-16 | A kind of LED light source assembly that is applicable to area source |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106468799A (en) * | 2015-08-20 | 2017-03-01 | 夏普株式会社 | Light guide plate, edge light type backlight and liquid crystal indicator |
| CN109357172A (en) * | 2018-09-30 | 2019-02-19 | 深圳市光科全息技术有限公司 | A kind of anti-blue light LED light |
-
2014
- 2014-07-16 CN CN201420392460.9U patent/CN203979962U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106468799A (en) * | 2015-08-20 | 2017-03-01 | 夏普株式会社 | Light guide plate, edge light type backlight and liquid crystal indicator |
| CN109357172A (en) * | 2018-09-30 | 2019-02-19 | 深圳市光科全息技术有限公司 | A kind of anti-blue light LED light |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141203 Termination date: 20150716 |
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| EXPY | Termination of patent right or utility model |