CN205645861U - Energy -conserving LED filament - Google Patents
Energy -conserving LED filament Download PDFInfo
- Publication number
- CN205645861U CN205645861U CN201521131360.1U CN201521131360U CN205645861U CN 205645861 U CN205645861 U CN 205645861U CN 201521131360 U CN201521131360 U CN 201521131360U CN 205645861 U CN205645861 U CN 205645861U
- Authority
- CN
- China
- Prior art keywords
- led chip
- heat
- substrate
- filament
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The utility model provides an energy -conserving LED filament, includes base plate, LED chip, the LED chip sets up at the substrate surface, pass through metal wire connected between the adjacent LED chip, LED chip bilateral symmetry sets up on the base plate, and mind -set both ends orientation equidistance reduces gradually in the distance follow base plate between the adjacent LED chip, the base plate both ends are equipped with electrode pin, electrode pin passes through metal wire connected with the LED chip, the base plate still is equipped with the heat -insulating material that looses, scattered heat -insulating material and as an organic wholeization of base plate structure. The utility model discloses rationally set up the distance between the LED chip, reduced the heat at middle part when the LED filament uses for the heat distribution of whole piece LED filament is more even, but also has set up scattered heat -insulating material, and the heat -insulating material's that looses heat conductivity is high, big with base plate looks specific area, has increased the heat radiating area of LED filament, thereby has improved the heat -sinking capability of filament, and then improved the ability of the real load power of filament, has reached energy -concerving and environment -protective effect.
Description
Technical field
This utility model relates to LED field, espespecially a kind of LED filament.
Background technology
LED is the semiconductor device of a kind of solid-state that can convert electrical energy into visible ray, and it directly can be converted into light electricity.LED light source has the features such as energy-conservation, long-lived, environmental protection, solid encapsulation, determines LED and is that instead of the optimal light source of traditional light source, has purposes widely.LED lamp plate is capable of 360 ° of full angle luminescences simultaneously, and wide-angle is luminous, it is possible to becomes three-dimensional light source, brings unprecedented lighting experience.
nullSo that LED filament possesses enough brightness when luminescence，Existing LED filament is connected in series with tens of LED chip between the electrode at its two ends，Reach ambient lighting although it is so and gone out the requirement of light intensity，But the length of LED filament is long，The LED filament lamp of prior art is not easily achieved the lamp more than 850lm，It is it is crucial that the area of dissipation of filament is little，LED chip can not give full play to the ability of the bearing power of itself，And existing LED filament is all equally spaced on substrate to arrange LED chip，The heat sent due to each LED chip is constant，Heat between each LED chip is overlaying state，Position, portion in a substrate in baseset，Now it is in high heat state in the middle part of substrate，Heat skewness，Cause power consumption the biggest，And it is the most energy-conservation.
Utility model content
For solving the problems referred to above, this utility model provides and is beneficial to heat radiation, low-power consumption and the uniform energy-saving LED filament that dispels the heat.
For achieving the above object, the technical solution adopted in the utility model is: a kind of energy-saving LED filament, including substrate, LED chip, described LED chip is arranged on substrate surface, connected by metal wire between described adjacent LED chip, described LED chip is symmetrical set on substrate, and the distance between adjacent LED chip gradually decreases to direction of both ends is equidistant from substrate center, described substrate two ends are provided with electrode pin, described electrode pin is connected by metal wire with LED chip, described substrate is additionally provided with radiating piece, described radiating piece is integrated with substrate.
Specifically, described radiating piece is the rectangular heat dissipation part with through hole.
Specifically, described radiating piece is fixed at substrate one end.
Specifically, described substrate is transparency carrier or ceramic substrate.
Specifically, the substrate surface being provided with LED chip described in is provided with fluorescent material dielectric layer.
The beneficial effects of the utility model are: this utility model rationally arranges the distance between LED chip, reduce the heat in the middle part of when LED filament uses, the heat distribution making whole piece LED filament is more uniform, but also it is provided with radiating piece, the thermal conductivity of radiating piece is high big with substrate phase specific area, increases the area of dissipation of LED filament, thus improves the heat-sinking capability of filament, and then improve the ability of the payload power of filament, reach the effect of energy-conserving and environment-protective.
Accompanying drawing explanation
Fig. 1 is Facad structure schematic diagram of the present utility model.
Drawing reference numeral illustrates: 1. substrate；2. LED chip；3.
Metal wire；4. electrode pin；5. radiating piece；51. through holes；6. fluorescent material dielectric layer.
Detailed description of the invention
Refer to shown in Fig. 1, this utility model is about a kind of energy-saving LED filament, including substrate 1, LED chip 2, described LED chip 2 is arranged on substrate 1 surface, connected by metal wire 3 between described adjacent LED chip 2, described LED chip 2 is symmetrical set on substrate 1, and the distance between adjacent LED chip 2 gradually decreases to direction of both ends is equidistant from substrate 1 center, described substrate 1 two ends are provided with electrode pin 4, described electrode pin 4 is connected by metal wire 3 with LED chip 2, described substrate 1 is additionally provided with radiating piece 5, described radiating piece 5 is integrated with substrate 1.
Compared with prior art, this utility model rationally arranges the distance between LED chip 2, reduce the heat in the middle part of when LED filament uses, the heat distribution making whole piece LED filament is more uniform, but also is provided with radiating piece 5, and the thermal conductivity of radiating piece 5 is high big with substrate 1 phase specific area, increase the area of dissipation of LED filament, thus improve the heat-sinking capability of filament, and then improve the ability of the payload power of filament, reach the effect of energy-conserving and environment-protective.
Specifically, described radiating piece 5 is the rectangular heat dissipation part 5 with through hole 51.
Use such scheme, be provided with through hole 51 and make radiating piece 5 reach more preferable radiating effect.
Specifically, described radiating piece 5 is fixed at substrate 1 one end.
Specifically, described substrate 1 is transparency carrier 1 or ceramic substrate 1.
Specifically, substrate 1 surface being provided with LED chip 2 described in is provided with fluorescent material dielectric layer 6.
Below by specific embodiment, this utility model is further described.
Originally being embodied as on spr substrate 1 being arranged with odd number LED chip 2, LED chip 2, centered by middle LED chip 2, is symmetrical set on substrate 1, and the distance between adjacent LED chip 2 gradually decreases to direction of both ends is equidistant from substrate 1 center.Substrate 1 two ends are provided with electrode pin 4, wherein use metal wire 3 to be connected between LED chip 2 with LED chip 2, also use metal wire 3 to be connected between LED chip 2 with electrode pin 4.And substrate 1 surface being provided with wafer 2 is provided with fluorescent material dielectric layer 6, wherein 6 layers of fluorescent material medium is mixed with silica gel or other media by single or two or more fluorescent material, and substrate 1 one side is provided with fluorescent material dielectric layer 6, is more beneficial for heat radiation.Be also associated with radiating piece 5 in one end of substrate 1, radiating piece 5 is provided with the through hole 51 more conducively dispelled the heat, and improves the ability of the payload power of filament, has reached the effect of energy-conserving and environment-protective.
Embodiment of above is only to be described preferred implementation of the present utility model; not scope of the present utility model is defined; on the premise of without departing from this utility model design spirit; various deformation that the technical solution of the utility model is made by this area ordinary skill technical staff and improvement, all should fall in the protection domain that claims of the present utility model determine.
Claims (5)
1. an energy-saving LED filament, including substrate, LED chip, described LED chip is arranged on substrate surface, connected by metal wire between described adjacent LED chip, it is characterized in that: described LED chip is symmetrical set on substrate, and the distance between adjacent LED chip gradually decreases to direction of both ends is equidistant from substrate center, described substrate two ends are provided with electrode pin, described electrode pin is connected by metal wire with LED chip, described substrate is additionally provided with radiating piece, and described radiating piece is integrated with substrate.
A kind of energy-saving LED filament the most according to claim 1, it is characterised in that: described radiating piece is the rectangular heat dissipation part with through hole.
A kind of energy-saving LED filament the most according to claim 1, it is characterised in that: described radiating piece is fixed at substrate one end.
A kind of energy-saving LED filament the most according to claim 1, it is characterised in that: described substrate is transparency carrier or ceramic substrate.
A kind of energy-saving LED filament the most according to claim 1, it is characterised in that the substrate surface being provided with LED chip described in: is provided with fluorescent material dielectric layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521131360.1U CN205645861U (en) | 2015-12-30 | 2015-12-30 | Energy -conserving LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521131360.1U CN205645861U (en) | 2015-12-30 | 2015-12-30 | Energy -conserving LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205645861U true CN205645861U (en) | 2016-10-12 |
Family
ID=57077769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521131360.1U Expired - Fee Related CN205645861U (en) | 2015-12-30 | 2015-12-30 | Energy -conserving LED filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205645861U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022077547A1 (en) * | 2020-10-14 | 2022-04-21 | Tcl华星光电技术有限公司 | Backlight module and display device |
-
2015
- 2015-12-30 CN CN201521131360.1U patent/CN205645861U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022077547A1 (en) * | 2020-10-14 | 2022-04-21 | Tcl华星光电技术有限公司 | Backlight module and display device |
| US11762234B2 (en) | 2020-10-14 | 2023-09-19 | Tcl China Star Optoelectronics Technology Co., Ltd | Backlight module and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161012 Termination date: 20161230 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |