WO2015003402A1

WO2015003402A1 - Bearing heat-dissipating plate, led light source of remote fluorescent powder structure and production method therefor

Info

Publication number: WO2015003402A1
Application number: PCT/CN2013/079505
Authority: WO
Inventors: 林洺锋; 韦嘉; 徐振雷; 梁润园; 张春旺; 胡丹; 包厚华
Original assignee: 广东洲明节能科技有限公司
Priority date: 2013-07-12
Filing date: 2013-07-17
Publication date: 2015-01-15
Also published as: NL2011840B1; NL2011840A; CN103346243B; CN103346243A

Abstract

A bearing heat-dissipating plate (1), comprising a cavity penetrating the bearing heat-dissipating plate (1) in a thickness direction, fluorescent powder (2) being embedded in the cavity. An LED light source, comprising the above-mentioned bearing heat-dissipating plate (1), the bearing heat-dissipating plate (1) being arranged at an opening end of a lamp cup (4) to form a remote fluorescent powder structure. Further disclosed is a method for producing LED light sources in bulk. The bearing heat-dissipating plate (1) has good heat-dissipating performance, thereby improving the service life. The distance between the fluorescent powder (2) in the LED light source and an LED chip (6) is short, thereby reducing the volume of the LED light source of the remote fluorescent powder structure.

Description

LED light source carrying heat sink and remote phosphor structure and production method thereof

The invention relates to the field of LED illumination, in particular to an LED light source carrying a heat dissipation plate and a remote phosphor structure and a batch production method thereof. Background technique

LED illumination White light sources typically consist of a blue-emitting GaN semiconductor light-emitting device (LED chip) and a phosphor material that converts blue light into a variety of other spectra (most common with yellow light). Among them, the phosphor material is generally wrapped in a silica gel body. LED light sources generate a large amount of thermal energy during operation, and excessive operating temperatures are one of the main limiting factors for the performance and lifetime of LED light sources.

There are two main reasons for the heat generation in the LED light source. First, when the LED chip converts electricity into light, most of the electrical energy is converted into thermal energy due to limited conversion efficiency. 2. When the phosphor material is converted into other spectra by absorbing blue light, A portion of the energy is lost due to physical principles, which is converted to thermal energy. Among them, the heat generated by the LED chip can be dissipated by the LED itself. However, since the phosphor is wrapped in the silicone material, it is a poor conductor of heat, which often causes the temperature of the phosphor region to be too high, affecting the performance and life of the light source.

Phosphor placement can be divided into contact phosphor structures and remote phosphor structures. Among them, the far-end phosphor structure has better optical properties than the contact phosphor structure. However, since the remote phosphor structure is not easy to dissipate heat, it is often placed at a large distance from the LED chip, so that it can reduce the heat density of the phosphor material and increase the heat dissipation area of the phosphor, thereby avoiding fluorescence. The powder area produces high temperatures. A disadvantage of the existing remote phosphor structure is that it requires a large amount of expensive phosphor and silica material, which increases the cost of the product. If the distance between the phosphor structure and the LED chip and the area of the phosphor are reduced in order to reduce the cost, the temperature of the phosphor material is drastically increased, affecting the performance and life of the light source. Summary of the invention

The invention provides an LED light source with a heat dissipation effect and a heat sink board and a remote phosphor structure. Its mass production method.

In order to achieve the above object, the first technical solution proposed by the present invention is as follows: a heat-receiving plate is disposed, wherein the load-bearing heat-dissipating plate is provided with a fluorescent region, and the fluorescent region is provided with a plurality of adjacently disposed heat-dissipating heat-transmitting plates. a cavity of the plate, a phosphor embedded in the cavity; a fluorescent area of the heat dissipation plate is used for corresponding

The outgoing light path of the LED chip is set.

Wherein, the inner wall of the cavity is provided with a light reflecting layer.

The load-bearing heat dissipation plate is a silicon wafer or a metal plate.

The present invention further provides a technical solution for: a remote phosphor structure LED light source, comprising a lamp cup and a load bearing heat sink according to the above technical solution, wherein the cup bottom of the lamp cup is provided with an LED chip, the bearing The heat dissipation plate is disposed on the cup mouth of the lamp cup, and the fluorescent area on the heat dissipation plate corresponds to the cup mouth of the lamp cup.

Wherein, the lamp cup is formed in a light board, and the load bearing heat sink and the light board are bonded by a transparent material.

Wherein, the lamp cup is filled with transparent silica gel.

Wherein, the LED chip is connected with a pad, and the pad is led out along the inner wall of the lamp cup through a connection between the bearing heat sink and the open end of the lamp cup.

Wherein, the LED chip is connected with a pad, and the pad is drawn from the bottom surface of the lamp cup.

The area of the fluorescent area is not less than the opening area of the groove.

The invention also proposes a method for mass producing an LED light source, which comprises the steps,

A, the production of the lamp cup, specifically including the steps, al, etching a plurality of lamp cups while arraying on a light board; a2, mounting LED chips at the bottom of each lamp cup; a3, each LED chip connection welding a disk, the pad is drawn along the inner wall of the lamp cup through the open end of the lamp cup or through the bottom of the cup;

B. fabricating a heat dissipating plate, specifically comprising the steps of: bl, dividing an array of heat dissipating plates in an array on a heat dissipating plate, and etching a plurality of cavities in each of the carrying heat dissipating plates, wherein the plurality of cavities are adjacent to each other Providing and carrying a heat dissipation plate in a thickness direction; b2, covering a reflective layer on an inner wall of the cavity; b3, embedding a phosphor into the cavity, and forming a fluorescent region by a cavity group embedded in the phosphor, the bearing on the heat dissipation plate The fluorescent area corresponds to the cup opening of the lamp cup;

C. Bonding the lamp board with the lamp cup to the heat sink with the fluorescent area, wherein each fluorescent zone pair Should be a light cup;

D. Cutting the bonded heat sink and the light board along the array to obtain a plurality of LED light sources.

The invention has the beneficial effects that the remote phosphor structure different from the prior art needs to increase the heat dissipation area away from the LED chip to improve the heat dissipation effect of the remote phosphor, so as to improve the use of materials such as phosphors and silica gel. The heat dissipation plate is provided with a plurality of cavities, and then the phosphor is embedded in the cavity, so that the heat is quickly transferred to the heat dissipation plate during the heating process, the heat dissipation rate is increased, and the heat dissipation plate can be reduced as much as possible. The distance of the LED chip saves materials and saves cost; and the LED light source of the remote phosphor structure provided by the invention directly sets the above-mentioned bearing heat sink plate at the opening of the lamp cup, the distance between the LED chip and the remote phosphor substrate Only the depth of the lamp cup itself, the realization of the remote phosphor is equivalent to the use of the contact phosphor, which not only improves the optical performance of the LED light source, but also reduces the volume of the LED light source, saves materials and saves costs; a batch cup and a heat sink, and then uniformly cut into LEDs after one-time paste Source, production quickly. DRAWINGS

1 is a schematic cross-sectional view of a remote phosphor substrate of the present invention;

2 is a schematic cross-sectional view of an LED light source of a remote phosphor structure of the present invention;

3 is a schematic flow chart of a method for mass producing an LED light source of the present invention.

In the figure, 1, carrying the heat sink; 2, phosphor; 3, reflective layer; 4, lamp cup; 5, transparent silica gel; 6, LED chip. detailed description

The detailed description of the technical contents, structural features, objects and effects of the present invention will be described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 and FIG. 2, a heat-receiving board is disposed on the heat-receiving board of the present embodiment. The heat-receiving board 1 is a silicon wafer. The heat-receiving board 1 is provided with a fluorescent area, and the fluorescent area is provided with a plurality of adjacent thicknesses. The direction penetrates the cavity carrying the heat dissipation plate 1 , and the phosphor 2 is embedded in the cavity; the fluorescent region of the heat dissipation plate 1 is used for the outgoing light path of the LED chip 6 . The phosphor 2 of the present invention is in the process of heating, heat Quickly transfer to the heat-dissipating plate 1 to improve the heat dissipation rate. In the process of use, the distance between the phosphor and the LED chip can be reduced as much as possible, and the area of the fluorescent area is small, which saves the material and saves the cost.

In this embodiment, the inner wall of the cavity is provided with the light reflecting layer 3 to improve the reflectivity of the inner wall of the cavity on the heat radiating plate 1. In this embodiment, in order to quickly apply the light reflecting layer, the reflective layer is located at all. Carrying the heat sink 1 on it.

In this embodiment, the load-bearing heat dissipation plate 1 is a silicon wafer. Of course, in other embodiments, the load-bearing heat dissipation plate 1 may also be other heat-conductive materials, such as metal plates such as aluminum. Referring to FIG. 2, in still another embodiment, an LED light source of a remote phosphor structure is provided, including a lamp cup 4 and a 7-carrier heat dissipation plate 1 in the above embodiments, and a cup bottom LED of the lamp cup 4 is disposed. The chip 6 is disposed on the cup of the lamp cup 4, and the fluorescent area on the heat-receiving plate 1 corresponds to the cup opening of the lamp cup 4. The distance between the LED chip 6 and the heat-dissipating plate 1 is only the depth of the lamp cup 4 itself, and the use of the remote phosphor is equivalent to the use of the contact phosphor, which not only improves the optical performance of the LED light source, but also reduces the volume of the LED light source, saving In the embodiment, the area of the fluorescent area is not less than the opening area of the lamp cup 4, so that the heat-receiving board 1 can be ensured. The light that blocks the LED chip is emitted from the lamp cup.

In this embodiment, the lamp cup 4 is formed in a light board, and the heat carrying board and the light board are bonded by a transparent material, and the transparent material is generally silica gel. The load-bearing heat-dissipating plate 1 is bonded to the open end of the lamp cup 4 to facilitate production, and at the same time, the airtightness is high, and the transparent material can be used to improve the light permeability. The lamp cup 4 is filled with a transparent silicone 5, which can fix the LED chip 6 and protect the LED chip 6.

In this embodiment, the LED chip 6 is connected with a pad (not shown), and the pad is drawn along the inner wall of the lamp cup 4 through the connection between the heat-dissipating plate 1 and the open end of the lamp cup 4, in another implementation. In the example, the LED chip 6 is connected with a pad, and the pad is drawn from the bottom surface of the lamp cup. In a specific embodiment, in order to enable rapid mass production of LED light sources, specific production methods For, as shown in Figure 3, include the steps:

A, the production of the light cup 4, specifically including the steps:

Al, etching a plurality of lamp cups 4 while arranging on a light board;

A2, the LED chip 6 is installed at the bottom of each of the lamp cups 4;

A3, the positive and negative poles of each LED chip 6 are respectively connected to the pads, and the pads are led out along the inner wall of the lamp cup 4 through the open end of the lamp cup 4 or through the bottom of the cup of the lamp cup 4;

B. Making a load bearing heat sink 1 , specifically including the steps:

Bl, an array of heat-dissipating plates 1 is arranged in an array on a heat dissipation plate, and a plurality of cavities are etched in each of the load-bearing heat-dissipating plates 1, and the plurality of cavities are adjacently disposed and penetrate the heat-dissipating plates in the thickness direction. 1;

B2, covering the inner wall of the cavity with a reflective layer 3;

B3, embedding the phosphor 2 into the cavity, the plurality of cavities embedded in the phosphor form a fluorescent region, and the fluorescent region on the heat carrying plate corresponds to the cup opening of the lamp cup;

C, the light board with the lamp cup 4 and the heat sink with a fluorescent area, wherein each fluorescent area corresponds to a light cup 4;

The above is only the embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformations made by the specification and the drawings of the present invention may be directly or indirectly applied to other related technologies. The scope of the invention is included in the scope of patent protection of the present invention.

Claims

WO 2015/003402 +π ^, , _μ. PCT/CN2013/079505 Quan He 1 J Request

1. A load-bearing heat sink plate, characterized in that the load-bearing heat sink plate is provided with a fluorescent area, and a plurality of adjacent cavities are provided in the fluorescent area and penetrate the load-bearing heat sink plate in the thickness direction, and the cavity is embedded with fluorescent powder; The fluorescent area of the heat dissipation plate is used to set the output light path corresponding to the LED chip.

2. The load-bearing heat dissipation plate according to claim 1, characterized in that the inner wall of the cavity is provided with a reflective layer.

3. The heat-carrying heat dissipation plate according to claim 1, characterized in that the heat-carrying heat dissipation plate is a silicon wafer or a metal plate.

4. An LED light source with a remote phosphor structure, characterized in that it includes a lamp cup and a load-bearing heat dissipation plate according to any one of claims 1 to 3, an LED chip is arranged at the bottom of the lamp cup, and the load-bearing The heat dissipation plate is arranged on the mouth of the lamp cup, and the fluorescent area on the heat dissipation plate corresponds to the mouth of the lamp cup.

5. The LED light source with a remote phosphor structure according to claim 4, characterized in that the lamp cup is formed in a lamp panel, and the heat-carrying heat sink plate and the lamp panel are bonded through a transparent material.

6. The LED light source with a remote phosphor structure according to claim 4, wherein the lamp cup is filled with transparent silica gel.

7. The LED light source with a remote phosphor structure according to claim 4, wherein the LED chip is connected to a soldering pad, and the soldering pad is connected along the inner wall of the lamp cup to the open end of the lamp cup through a heat dissipation plate. Lead everywhere.

8. The LED light source with remote phosphor structure according to claim 4, characterized in that the LED chip is connected with a soldering pad, and the soldering pad is led out from the bottom surface of the lamp cup.

9. The LED light source with a remote phosphor structure according to claim 4, wherein the area of the fluorescent area is not less than the opening area of the groove.

10. A method for mass production of LED light sources, characterized in that it includes steps:

A. Making a lamp cup, including specific steps:

al. Etching multiple lamp cups in an array on a lamp board at the same time;

a2. Install LED chips at the bottom of each lamp cup;

a3. The positive and negative poles of each LED chip are connected to the pads respectively, and the pads are led out along the inner wall of the lamp cup through the open end of the lamp cup or through the bottom of the lamp cup;

B. Make the load-bearing heat sink plate, including specific steps: bl. Divide load-bearing heat dissipation plates into an array on a heat dissipation plate, and etch multiple cavities in each load-bearing heat dissipation plate. The plurality of cavities are arranged adjacently and penetrate the load-bearing heat dissipation plate in the thickness direction;

b2. Cover the inner wall of the cavity with a reflective layer;

b3. Embed phosphor powder into the cavity, and the multiple cavities embedded with phosphor powder form a fluorescent area, and the fluorescent area on the heat sink plate corresponds to the mouth of the lamp cup;

c. Bond the lamp panel with the lamp cup to the heat sink plate with the fluorescent area, where each fluorescent area corresponds to a lamp cup;

D. Cut the bonded heat sink and light panels along the array to obtain multiple LED light sources.