NL2011840A - Bearing heating panel, remote type fluorescent powder structured led light source and production method thereof. - Google Patents

Bearing heating panel, remote type fluorescent powder structured led light source and production method thereof. Download PDF

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Publication number
NL2011840A
NL2011840A NL2011840A NL2011840A NL2011840A NL 2011840 A NL2011840 A NL 2011840A NL 2011840 A NL2011840 A NL 2011840A NL 2011840 A NL2011840 A NL 2011840A NL 2011840 A NL2011840 A NL 2011840A
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NL
Netherlands
Prior art keywords
light
heating panel
fluorescent powder
bowl
panel
Prior art date
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NL2011840A
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Dutch (nl)
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NL2011840B1 (en
Inventor
Mingfeng Lin
Jia Wei
Zhenlei Xu
Runyuan Liang
Chunwang Zhang
Dan Hu
Houhua Bao
Original Assignee
Guangdong Unilumin Energy Savings Technology Co
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Publication of NL2011840A publication Critical patent/NL2011840A/en
Application granted granted Critical
Publication of NL2011840B1 publication Critical patent/NL2011840B1/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies

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  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

Bearing heating panel, remote type fluorescent powder structured LED light source and production method thereof
Technical field
The present invention relates to LED illumination field, in particular to a bearing heating panel, a remote type fluorescent powder structured LED light source and a batch production method thereof.
Description of the Related Art
White LED lights usually consist of GaN semiconductor light-emitting devices (LED chips) emitting blue spectrum and fluorescent powder materials capable of converting the blue spectrum into other spectrums (the most common is the yellow spectrum). Wherein, the fluorescent powder materials are usually encapsulated in colloidal silica. LED light sources generate a huge amount of heat during working; while over high working temperature is one of major factors limiting the performance and service life of the LED light sources.
Two main reasons causing heating in the LED light sources are as below: 1. the majority of electricity is converted into heat due to the limited conversion efficiency when the LED chips convert the electricity into light. 2. When the fluorescent powder materials absorb the blue spectrum and convert it into other spectrums, a part of the energy is lost due to the physical principle, and the lost energy is converted into heat. Wherein, the heat generated by the LED chips can be dissipated by LEDs themselves. However, the fluorescent powder encapsulated in the silica gel materials is a poor conductor for heat, usually resulting in over high temperature in the fluorescent powder area and affecting the performance and service life of the light sources.
The fluorescent powder structures can be classified into the contact type and the remote type according to the placement mode of the fluorescent powder. Wherein, the remote type fluorescent powder structure is prior to the contact type fluorescent powder structure in optical performance. However, the remote type fluorescent powder structure is difficult to dissipate heat and therefore usually used in a large area far away from the LED chip. Displacement in this way can reduce the heating density of the fluorescent powder materials and increase the heat dissipating area of the fluorescent powder materials to avoid high temperature in the fluorescent powder area. The existing remote type fluorescent powder structure has the disadvantage of high product cost due to use of a great amount of expensive fluorescent powder and silica gel materials. If the distance from the fluorescent powder structure to the LED chip and the area of the fluorescent powder is shortened to reduce the cost, the temperature of the fluorescent powder materials will rise dramatically, affecting the performance and service life of the light sources.
CONTENTS OF THE PRESENT INVENTION
The present invention provides a bearing heating panel with a good heat dissipating effect, a remote type fluorescent powder structured LED light source and a batch production method thereof.
To fulfill the above objectives, the present invention first provides a technical scheme: A bearing heating panel is provided. The bearing heating panel is provided with a fluorescent area. A plurality of cavities penetrating through the bearing heating panel in the thickness direction is adjacently formed in the fluorescent area. The cavities are filled with fluorescent powder. The fluorescent area of the heating panel corresponds to the light-emitting path of the LED chip.
Wherein, the inner wall of each cavity is provided with a reflective layer.
Wherein, the bearing heating panel is a silicon wafer or a metal plate.
The present invention also provides a technical scheme: A remote type fluorescent powder structured LED light source comprises a light cup and a bearing heating panel as mentioned in the above technical scheme. The bottom of the light cup is provided with an LED chip. The bearing heating panel is located at the rim of the light cu. The fluorescent area on the bearing heating panel corresponds to the rim of the light cup.
Wherein, a light panel is recessed to form the light cup, and the bearing heating panel is bonded with the light panel through a transparent material.
Wherein, the light cup is filled with transparent silica gel.
Wherein, the LED chip is connected with a bonding pad, and the bonding pad is led out along the inner wall of the light cup through the joint of the bearing heating panel and the open end of the light cup.
Wherein, the LED chip is connected with a bonding pad, and the bonding pad is led out from the bottom face of the light cup.
Wherein, the area of the fluorescent area is not smaller than the opening area of the recess.
The present invention also provides a method for producing LED light sources in batches, comprising steps of: A. manufacturing light cups, specifically comprising steps of: al. Etching a light panel to form a plurality of light cups in an array at the same time. a2. Installing an LED chip at the bottom of each light cup; and, a3. connecting each LED chip to a bonding pad, wherein the bonding pad is led out along the inner wall of each light cup via the open end of each light cup or by penetrating through the bottom of each light cup; B. manufacturing bearing heating pads, specifically comprising steps of: bl. dividing a heating panel to form bearing heating panels in an array and etching in each bearing heating panel to form a plurality of cavities, wherein the plurality of cavities are adjacently formed and penetrate through each bearing heating panel in the thickness direction. b2. Covering the inner wall of each cavity with a reflective layer; and, b3. filling each cavity with fluorescent powder, wherein the cavities filled with fluorescent powder form a fluorescent area, and the fluorescent area on each bearing heating panel corresponds to the rim of each light cup; C. bonding the light panel with light cups and the heating panel with fluorescent areas, wherein each fluorescent area corresponds to a light cup; and, D. cutting the bonded heating panel and light panel along the array to obtain a plurality of LED light sources.
The present invention has the following beneficial effects. In the prior art, the remote fluorescent powder structure is required to increase the heating area away from the LED chip to improve the heat dissipating effect of the fluorescent powder, so that the use of materials such as the fluorescent powder and silica gel is increased. While in the present invention, the bearing heating panel is provided with a plurality of cavities filled with the fluorescent powder, and the heat is quickly transferred to the heating panel when the fluorescent powder emits heat, thereby enhancing the heat dissipating rate, shortening the distance between the bearing heating panel and the LED chip as much as possible, and saving materials and cost. In the remote type fluorescent powder structured LED light source provided by the present invention, the bearing heating panel is directly located at the opening of the light cup, the distance between the LED chip and the remote type fluorescent powder substrate is just equal to the depth of the body of the light cup, thus realizing use of the remote type fluorescent powder equivalent to that of the contact type fluorescent powder, improving the optical performance of the LED light source and saving materials and cost. The present invention also provides a method for producing the LED light sources in batches. A plurality of light cups and a plurality of bearing heating panels in arrays are and manufactured on the light panel and the heating panel respectively and correspondingly, bonded at one time and then uniformly cut into the LED light sources, so the productions speed is fast.
Attached drawings of the Specification
Figure 1 is a sectional view of a remote type fluorescent powder substrate of the present invention.
Figure 2 is a sectional view of an LED light source of a remote type fluorescent powder structure of the present invention.
Figure 3 is a flowchart of a method for producing LED lights in batches of the present invention.
In the figure, 1-bearing heating panel; 2-fluorescent powder; 3-reflective layer; 4-light cup; 5-transparent silica gel; 6-LED chip.
DETAILED DESCRIPTION OF THE PRESENT INVENTION
The technical contents, structural features, objective and effects of the present invention are described in detail with reference to embodiments and attached drawings.
Refer to figure 1 and figure 2. This embodiment provides a bearing heating panel. The bearing heating panel 1 is a silicon wafer. The bearing heating panel 1 is provided with a fluorescent area. The fluorescent area is internally provided with a plurality of adjacent cavities penetrating through the bearing heating panel 1 in the thickness direction and filled with fluorescent powder 2. The fluorescent area of the bearing heating panel 1 is used to set the light-emitting path for the corresponding LED chip 6. In the heat dissipating process of the fluorescent powder 2 in this embodiment, the heat is quickly transferred to the bearing-heating panel 1, thereby improving the heat dissipation efficiency, reducing the distance between the fluorescent powder and the LED chip as much as possible in use, and saving materials and saving cost due to the small fluorescent area.
In this embodiment, the inner wall of each cavity is provided with a reflective layer 3, so the reflectivity of the inner wall of each cavity on the bearing heating panel 1 can be enhanced. In this embodiment, to quickly coat the reflective layers, the reflective layers are located on the whole bearing heating panel.
In this embodiment, the bearing heating panel 1 is a silicon wafer. Of course, in other embodiments, the bearing panel 1 may also be other heat conducting materials, such as the aluminum plate.
Refer to figure 2. Another embodiment provides a remote type fluorescent powder structured LED light source, comprising a light cup 4 and a bearing-heating panel 1 as mentioned in the above embodiments. The bottom of the light cup 4 is provided with an LED chip 6. The bearing heating panel 1 is located at the rim of each light cup 4. The fluorescent area on the bearing heating panel 1 corresponds to the rim of the light cup 4. The distance from the LED chip 6 to the bearing heating panel 1 is just the depth of the body of the light cup 4 itself, realizing the use of the remote type fluorescent powder equivalent to that of the contact type fluorescent powder, improving the optical performance of the LED light source, reducing the volume of the LED light source, and saving materials and cost. The bearing heating panel has a good heat dissipating effect, so the service life of the LED light source is prolonged. In this embodiment, the fluorescent area is not smaller than the opening area of the light cup 4, thus ensuring that the bearing heating panel 1 does not block the light emitted out of the light cup from the LED chip.
In this embodiment, a light panel is recessed to form the light cup 4, and the bearing heating panel is bonded with the light panel through a transparent material. Generally, the transparent material is silica gel. Bonding of the bearing heating panel 1 and the opening end of the light cup 4 can ensure convenient production and high sealing capability, and the transparent materials employed can improve the permeability of light. Moreover, the transparent silica gel 5 filled in the light cup 4 can fix and protect the LED chip 6.
In this embodiment, the LED chip 6 is connected with a bonding pad (not shown in the figure). The bonding pad is led out along the inner wall of the light cup 4 through the joint of the bearing heating panel 1 and the opening end of the light cup 4. In another embodiment, the LED chip 6 is connected with a bonding pad, and the bonding pad is led out from the bottom face of the light cup.
In a specific embodiment, a method for quickly producing LED light sources in batches is provided, as shown in figure 3, comprising steps of: A. manufacturing light cups 4, specifically comprising steps of: al. Etching a light panel to form a plurality of light cups 4 in an array at the same time. a2. Installing an LED chip 6 at the bottom of each light cup 4 . a3. Connecting the anode and cathode of each LED chip 6 to a bonding pad respectively, wherein the boning pad is led out along the inner wall of the light cup 4 via the open end of the light cup 4 or by penetrating through the bottom of the light cup 4; B. manufacturing bearing heating panels 1, specifically comprising steps of: bl. dividing a heating panel to generate bearing heating panels 1 in an array, and etching in each bearing heating panel 1 to form a plurality of cavities, wherein the plurality of cavities are adjacently formed and penetrate through the bearing heating panel 1 in the thickness direction. b2. Covering the inner wall of each cavity with a reflective layer 3. b3. Filling the cavities with fluorescent powder 2, wherein the plurality of cavities filled with fluorescent powder form a fluorescent area, and the fluorescent area on the bearing heating panel corresponds to the rim of the light cup; C. bonding the light panel with light cups 4 and the heating panel with fluorescent areas, wherein each fluorescent area corresponds to a light cup 4/ and, D. cutting the bonded heating panel and light panel along the array to obtain a plurality of LED light sources.
The above are only the exemplary embodiment of the present invention, which cannot limit the present invention. Within the spirit and principle of the present invention, any modification of the equivalent structure or equivalent flow, or direct or indirect application in other related technical fields all shall be fall in the protection scope of the present invention.

Claims (10)

1. Dragend verwarmingspaneel, gekenmerkt doordat genoemd dragend verwarmingspaneel voorzien is van. een fluorescerend gebied; welk fluorescerend gebied intern voorzien is van een meertal naastliggende holten, die doorheen het dragend verwarmingselement in de dikterichting reiken; welke holten gevuld zijn met fluorescerend poeder; waarbij het fluorescerend gebied van genoemd verwarmingspaneel correspondeert met het licht-emitterende pad van een LED chip.1. Bearing heating panel, characterized in that said bearing heating panel is provided with. a fluorescent region; which fluorescent region is internally provided with a plurality of adjacent cavities, which extend through the supporting heating element in the thickness direction; which cavities are filled with fluorescent powder; wherein the fluorescent region of said heating panel corresponds to the light-emitting path of an LED chip. 2. Dragend verwarmingspaneel volgens conclusie 1, met het kenmerk, dat de binnenwand van iedere holte voorzien is van een reflectielaag.2. A load-bearing heating panel according to claim 1, characterized in that the inner wall of each cavity is provided with a reflection layer. 3. Dragend verwarmingspaneel volgens conclusie 1, het kenmerk, dat genoemd dragend verwarmingspaneel een silicium-wafer is of een metalen plaat.3. Supporting heating panel according to claim 1, characterized in that said supporting heating panel is a silicon wafer or a metal plate. 4. Een afstandstype fluorescerend poeder gestructureerde LED lichtbron, gekenmerkt door het opnemen van een lichtkom en een dragend verwarmingspaneel volgens één der conclusies 1-3, welke bodem van genoemde lichtkom voorzien is van een LED chip, en genoemd dragend verwarmingspaneel gepositioneerd is aan de rand van genoemde lichtkom, en het fluorescerende gebied op genoemd dragend verwarmingspaneel correspondeert met de rand van de lichtkom.A distance type fluorescent powder structured LED light source, characterized by receiving a light bowl and a supporting heating panel according to any one of claims 1-3, which bottom of said light bowl is provided with an LED chip, and said supporting heating panel is positioned at the edge of said light bowl, and the fluorescent region on said bearing heating panel corresponds to the edge of the light bowl. 5. Afstandstype fluorescerend poeder gestructureerde LED lichtbron volgens conclusie 4, met het kenmerk, dat een lichtpaneel in een uitsparing is opgenomen voor het vormen van genoemde lichtkom, en genoemd dragend verwarmingspaneel verbonden is met genoemde lichtkom via een transparant materiaal.Distance type fluorescent powder structured LED light source according to claim 4, characterized in that a light panel is received in a recess to form said light bowl, and said bearing heating panel is connected to said light bowl via a transparent material. 6. Afstandstype fluorescerend poeder gestructureerde LED lichtbron volgens conclusie 4, met het kenmerk, dat genoemde lichtkom gevuld is met een transparente silicagel.Distance type fluorescent powder structured LED light source according to claim 4, characterized in that said light bowl is filled with a transparent silica gel. 7. Afstandstype fluorescerend poeder gestructureerde LED lichtbron volgens conclusie 4, met het kenmerk, dat genoemde LED chip verbonden is met een bindingsvulling, en genoemde bindingsvulling gevoerd is langs de binnenwand van de lichtkom via de verbinding van het dragend verwarmingspaneel en het open uiteinde van genoemde lichtkom.Distance type fluorescent powder structured LED light source according to claim 4, characterized in that said LED chip is connected to a bonding fill, and said bonding fill is conducted along the inner wall of the light bowl via the connection of the supporting heating panel and the open end of said light bowl. 8. Afstandstype fluorescerend poeder gestructureerde LED lichtbron volgens conclusie 4, mét het kenmerk, dat genoemde LED chip verbonden is met een bindingsvulling, en genoemde bindingsvulling gevoerd is uit het bodemoppervlak van genoemde lichtkom.Distance type fluorescent powder structured LED light source according to claim 4, characterized in that said LED chip is connected to a bonding fill, and said bonding fill is fed from the bottom surface of said light bowl. 9. Afstandstype fluorescerend poeder gestructureerde LED lichtbron volgens conclusie 4, met het kenmerk, dat genoemd fluorescerend gebied niet kleiner is dan het openingsge-bied van genoemde uitsparing.Distance type fluorescent powder structured LED light source according to claim 4, characterized in that said fluorescent area is not smaller than the opening area of said recess. 10. Werkwijze voor het vervaardigen van LED lichtbronnen in batches, gekenmerkt door het omvatten van de stappen van: A. het vervaardigen van lichtkommen, specifiek omvattende de stappen van: al. het etsen van een lichtpaneel voor het tegelijkertijd vormen van een meertal lichtkommen in een array. a2. Installeren van een LED chip op de bodem van iedere lichtkom. a3. Verbinden van de anode en de kathode van iedere LED chip met een respectievelijke verbindingsvulling, waarin de verbindingsvulling gevoerd is langs de binnenwand van de lichtbron via het open uiteinde van de lichtkom of door penetratie door de bodem van de lichtkom. B. Vervaardigen van dragende verwarmingspanelen, specifiek omvattende de stappen van: bl. het verdelen van een verwarmingspaneel voor het opwekken van dragende verwarmingspanelen in een array, en etsen van ieder dragend verwarmingspaneel voor het vormen van een meertal holten, waarbij het meertal holten naast elkaar gevormd zijn en in de dikterich-ting door ieder dragend verwarmingspaneel reiken. b2. Bedekken van de binnenwand van iedere holte met een reflectielaag. b3. Vullen van de holten met fluorescerend poeder, waarbij het meertal holten gevuld met fluorescerend poeder een fluorescerend gebied vormen, en het fluorescerend gebied op het dragend verwarmingspaneel correspondeert met de rand van iedere lichtkom. C. Verbinden van het lichtpaneel met lichtkommen en het ver-warmingspaneel met fluorescerende gebieden, waarbij ieder fluorescerend gebied met een lichtkom correspondeert; en, D. snijden van het verbonden verwarmingspaneel en lichtpaneel langs de array voor het verkrijgen van een meertal LED lichtbronnen.A method for manufacturing LED light sources in batches, characterized by comprising the steps of: A. manufacturing light bowls, specifically comprising the steps of: al. Etching a light panel to simultaneously form a multi-light bowls in an array. a2. Installing an LED chip on the bottom of every light bowl. a3. Connecting the anode and cathode of each LED chip to a respective connection filling, wherein the connection filling is conducted along the inner wall of the light source via the open end of the light bowl or by penetration through the bottom of the light bowl. B. Manufacture of load-bearing heating panels, specifically comprising the steps of: bl. dividing a heating panel to generate supporting heating panels in an array, and etching each supporting heating panel to form a multi-cavity, wherein the multi-cavities are formed side by side and extend in the thickness direction through each bearing heating panel. b2. Cover the inner wall of each cavity with a reflection layer. b3. Filling the cavities with fluorescent powder, the multitude of cavities filled with fluorescent powder forming a fluorescent region, and the fluorescent region on the supporting heating panel corresponding to the edge of each light bowl. C. Connecting the light panel with light bowls and the heating panel with fluorescent areas, each fluorescent area corresponding to a light bowl; and, D. cutting the connected heating panel and light panel along the array to obtain a plurality of LED light sources.
NL2011840A 2013-07-12 2013-11-26 Bearing heating panel, remote type fluorescent powder structured LED light source and production method thereof. NL2011840B1 (en)

Applications Claiming Priority (2)

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CN201310294597 2013-07-12
CN201310294597.0A CN103346243B (en) 2013-07-12 2013-07-12 Carry heat sink and the LED light source of long-distance fluorescent powder structure and production method thereof

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NL2011840A true NL2011840A (en) 2015-01-13
NL2011840B1 NL2011840B1 (en) 2016-07-04

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NL2011840B1 (en) 2016-07-04
WO2015003402A1 (en) 2015-01-15
CN103346243A (en) 2013-10-09
CN103346243B (en) 2016-08-31

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