TWI237411B - Process and structure for packaging LED's - Google Patents

Abstract

A process is disclosed for packaging LED chips. A provided chip carrier includes a plurality of carrier units. A plurality of LED chips are disposed on the carrier units of the chip carrier. Then, a transparent molding compound is formed on the chip carrier to seal the chips. A plurality of grooves are formed in the transparent molding compound so that a plurality of reflector spaces are formed by the grooves and the chip carrier. A plurality of metallic reflector are disposed in the reflector space, metallic reflectors are located on the corresponding carrier units and surround the corresponding LED chips. The reflect surfaces of the metallic reflectors are not adhered with the transparent molding compound. Therefore, it can prevent the delamination between the molding compound and the reflect surfaces to affect the brightness and quality of the LED.

Description

1237411 V. Description of the invention (1) " ~ 一 " '~ ----- ----- [Technical field to which the invention belongs] The present invention relates to a light-emitting diode chip packaging process :: about a A chirped light emitting diode chip packaging process is formed in advance before the reflector is set. Revealing the Right Moon Heart [Previous Technology] It is known that the light emitting diode package (Light_emitting di () de P ^ kage ’LED package) is a common semiconductor package type

It has the advantages of high brightness, corrosion resistance, low power consumption, fast response speed, long axe life and good reliability. T A conventional high-brightness light-emitting diode chip packaging process is described below. Please refer to FIG. 1A. First, a wafer carrier 11 () is provided, which has a φ surface 111. Then, referring to FIG. IB, a metal reflector i 2o is provided on the surface 111 to reflect light and has For the function of heat dissipation, the metal reflecting member 1 2 0 has a smooth reflecting surface 1 2 1 and an opening 1 2 2. The opening 1 2 2 and the wafer carrier u 0 form a wafer accommodating space a. Please refer to FIG. 1C to set a light-emitting diode wafer 1 30 in the wafer accommodating space A. Please refer to FIG. 1D to form a translucent sealing gel 1 4 〇 in the wafer accommodating space. A, to seal the light-emitting diode wafer 130, and the light-transmitting sealant 140 is in contact with and adheres to the reflective surface 1 2 1 of the metal reflection member 120 to make a conventional light-emitting diode Body package structure 100. # In the conventional light-emitting diode chip packaging process described above, the metal reflector 120 is first set on the wafer carrier 110, and then the light-transmitting sealing compound 1 40 is formed to seal the light-emitting diode wafer. 1 30, so the translucent sealing compound 140 is adhered to the smooth reflecting surface 121 of the metal reflecting member 1 20,

Page 7 1237411 V. Description of the invention (2) To make the baby smooth and poor, it is easy to join, which will affect the development of a kind of certificate No. 220282 No. 'It is a carrier, followed by a flat layer However, the light-emitting diode chip piece and the reflecting surface, the reflecting surface is a reflecting surface, and has brightness and quality. [Summary of the invention] In the packaging process of the present invention, the carrier is firstly sealed, and then the two or more light emitting grooves are sealed. In the containing space, the reflecting surface 1 21 and the translucent sealing gel 1 4 Q Compared with the smooth reflective surface 1 2 1 and the transparent sealing gel 1 4 0, irregular bonding cracks and layer breakages occur, and the brightness and quality of the photodiode package structure 100 are. Luminescence * one-pole wafer packaging process, as disclosed in the Republic of China Patent No. "Method for Enhancing Light-emitting Diode Exemption", provides a method for packaging light-emitting diodes. First, the surface of the carrier is provided. After the planarization process is performed, a reflective surface is formed on the flat layer, and then attached to the carrier, and finally a resin is formed to seal the crystals, and the resin is adhered to the reflective surface, and, Because the smooth surface has a poor bonding force, the resin and the layer are damaged. Therefore, the main purpose of affecting the light-emitting diode is to form a polar crystal and the grooves, and then use it for reflection. The reflection surface of one of the pieces is free of the metal reflection pieces. It is to raise a plurality of light-transmitting and translucent molding sheets. Then, the groove system and the crystal are provided with a plurality of light rays and do not adhere to the reflection surface and the reflection surface. A light-emitting diode wafer encapsulating a diode wafer is provided with a colloid on the wafer and the translucent mold carrier forms a composite metal reflecting member. The light-transmitting mold encapsulation colloid is placed on a wafer. Carry To form a plurality of colloidal seal the plurality of reflective member reflecting member, the plurality of metal, thus avoiding colloids produce

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V. Description of the invention (3) The cracking and delamination damage of the directional odor. A secondary object of the present invention is to provide a light-emitting diode package structure, which includes a substrate, a light-emitting diode wafer, a light-transmitting moldable gel, and a metal emitter. The light-emitting diode wafer The carrier is provided on the wafer carrier. The light-transmissive molding compound system is formed on the surface of the wafer carrier to seal the light-emitting diode wafer. The metal reflector is located on the corresponding carrier limb. The corresponding light emitting diode wafers are placed on and around the light emitting diodes, and one of the reflective surfaces of the metal reflecting member is not adhered to the transparent molding compound, which can avoid the reflecting surface of the metallic reflecting member and the transparent member. The optical moldable colloid has delamination damage, which affects the brightness and quality of the light-emitting body. The light-emitting diode chip packaging process according to the present invention mainly includes the following steps: First, a wafer carrier is provided. The wafer carrier has: a surface and includes a plurality of carrier units; and then, a plurality of light-emitting units are provided. A polar wafer is on the wafer carrier; then, a light-transmitting molding gel is formed on the surface of the wafer carrier to seal the light-emitting diode wafers; t rear, A light-transmitting molding gel is formed into a plurality of Grooves, so that the grooves and the wafer carrier form a plurality of reflecting member accommodating spaces; then, a plurality of metal reflecting members are set in the reflecting member accommodating spaces to facilitate the light diode packaging structure. , [Implementation method]

With reference to the drawings, the present invention will be illustrated by the following embodiments. Douyi, a specific embodiment of the present invention, FIG. 2A to FIG. 2G are cross-sectional views of a round package structure during the manufacturing process, please refer to FIG. 2A

Page 9 1237411 -------------_ 1 —.., -... .—.. Rn— in V. Description of the invention (4) '—— ^ —, · .— ~ As shown in the figure, a wafer carrier 2] 0 is provided, which has a surface 2 1 1-having a plurality of carrier units 2 1 2. The wafer carrier 2 1 0 may be a lead wire or a circuit board. In this embodiment, the wafer carrier 21 is a circuit board (as shown in FIG. 3). Then, referring to the second figure, a plurality of-light emitting diode wafers 22 are placed on the upper surface of the wafer carrier 21, and a mother® photodiode wafer 2 2 0 is located on the corresponding carrier unit 21 2 ,, The light-emitting diode wafers 220 may be arranged in a flip-chip bonding method or an X-type bonding method, and may be electrically connected to the chip carrier 21 in an eastern manner. In this embodiment, the light-emitting diode wafer 2 2 0 is electrically connected to the wafer carrier 2 1 0 through a plurality of bumps 22 1. 2. Refer to FIG. 2C for reference to form a light-transmitting mold-molding colloid 230 on the surface 2 1 1 of the carrier 2 1 0, and the mold-molding colloid 2 3 0 seals the light-emitting diode wafers 2 20, preferably, the light-transmitting mold-molding colloid 230 contains fluorescent powder and light powder to use the fluorescent powder to absorb and transform light from the light-emitting diode chips 2 2 0, And emit light of different wavelengths. Then, referring to FIG. 2D, a plurality of grooves 231 are formed in the light-transmitting molding compound 23, so that the grooves 231 and the wafer carrier 21 form a plurality of reflecting members. Space B. Please refer to FIG. 2E. In this embodiment, an adhesive layer 2 5 0 can be formed on the wafer carrier 2 1 0. The adhesive layer 2 5 0 can be a thin adhesive film or a b-level ^ adhesive layer . Referring to FIG. 2F, a plurality of metal reflecting members 26 0 are disposed in the reflecting member valley spaces B. The metal reflecting members 26 0 are adhered to the wafer carrier 21 0 through the adhesive layer 250. Preferably, the adhesive layer 2 50 is dielectric and may be a thermally conductive adhesive to conduct the light emitting diode chip.

Page 10 1237411 V. Description of the invention (5) ^ 1 ~~~ 2 2 0 The heat emitted from the wafer carrier 2] to the metal reflectors 260 to achieve better heat dissipation. Each metal reflector 26 is located on the corresponding carrier unit 2 1 2 and surrounds the corresponding light emitting diodes. ^ Τ ground, the metal reflector 260 has-a reflecting surface 261 = the reflecting surface k 261 The light-transmitting molding compound 23 is not adhered. In this embodiment, the metal reflecting member 2 60 can be made from a single metal plate by stamping or etching—or ”formed by metal powder metallurgy casting in advance, and then plated with a reflective film. / Please refer to FIG. 2G, preferably, after the metal reflection members 26 () are disposed, 'a plurality of lenses 27 such as a convex lens are disposed on the metal reflection members 260' to correct the light emission In the present embodiment, after the lenses 2 70 are set, the wafer carrier 2 1 10 is cut to form a plurality of light emitting diode packaging structures 2 0. 〇. Alternatively, in another embodiment, after the wafer carrier 21 is cut, a plurality of lenses 2 7 0 may be placed again to form a plurality of light emitting diode packages. Preferably, the lenses 270 are processed by an optical key film to achieve the function of focusing. Please refer to FIG. 2G, which is a polar package structure 200 formed according to the above-mentioned packaging process. A carrier unit 212 included in the package may be a

A coil or a circuit substrate, a light-emitting diode wafer 220 is disposed on the chrysanthemum unit 212, and a light-transmitting molding compound 23 is formed on the carrier sheet to seal the light-emitting diode wafer 22. The translucent mold system contains fluorescent powder to emit light of different wavelengths. January: a reflector 260 is disposed on the carrier unit 212 and surrounds the corresponding genera

1237411 V. Description of the invention (6) Photodiode wafer 220. In this embodiment, the lens 270 is disposed on the metal reflecting member 260. According to the light-emitting diode chip packaging process of the present invention, before the metal reflectors 2 60 are provided, the light-transmitting molding compound 2 3 0 is formed on the surface 2 11 of the wafer carrier 2 1 0, so The reflective surface 26 1 of the metallic reflective members 2 6 0 may not be adhered by the light-transmitting molding compound 23 0, which can avoid the occurrence of inconsistency between the reflective surfaces 2 6 1 and the molding compound 2 3 〇 Regular cracks and del ami nat ion conditions affect the brightness and quality of light-emitting diodes, and the metal reflectors 2 β 〇 are used to reflect light to concentrate the light-emitting diodes. The light generated by the chip 220 has a heat dissipation function, and is suitable for packaging the thermal energy chip 2 2 0 generated by the high-brightness light-emitting diode light-emitting diode chip 22 0, and derives these emissions as the protection of the present invention. a, Anyone who is familiar with this:;: Please define the scope of the patent later. Any changes made within the scope and: change: =: = Shenhe Fan Yewei Page 12 1237411 Simple illustration of the diagram [Simplified illustration of the diagram] Section 1 Figure A to Figure 1D: In the conventional light-emitting diode chip packaging process Sectional schematic diagram of a wafer carrier; Figures 2A to 2G: Sectional schematic diagrams of a wafer carrier in a light-emitting diode packaging process according to a specific embodiment of the present invention; and Figure 3: According to this A specific embodiment of the invention, a top view of a wafer carrier of the light emitting diode package structure. Brief description of the component symbols: 1 ◦ 0 Light-emitting diode package structure 11 0 Wafer carrier 111 Surface 1 2 2 Opening 120 Metal reflector 121 Reflective surface 130 Light-emitting diode wafer 140 Translucent encapsulant 200 Light-emitting diode package Structure 21 0 Wafer carrier 211 Surface 212 Carrier unit 2 2 1 Bump 220 Light-emitting diode wafer 230 Molded gel 231 Groove 2 5 0 Adhesive layer 260 Metal reflector 261 Reflective surface 270 Lens A Wafer receiving space B Reflection Accommodating space

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Claims (1)

1237411 Force, patent application scope [Patent application scope] 1. Body chip packaging process, including: there is a complex body, the wafer carrier has a surface and contains several carrier units; '-桎 C ί Γ A light-emitting diode wafer is on the wafer carrier, and the light-emitting diode wafers are arranged on the carrier units; # _ = becomes a light-transmitting molding gel on the surface of the wafer carrier, and the molding glue The light-emitting diode wafers are sealed by the system; 4 light-transmitting mold-molding colloids form a plurality of grooves (groove) so as to form a plurality of reflecting member accommodation spaces with the 4 carrier; and Eight sighs place a plurality of metal reflectors in the space for accommodating the reflectors, and each of the metal reflectors is located on a corresponding carrier unit and surrounds the corresponding light-emitting diode wafers. " 1% 2 The light-emitting diode chip packaging process as described in item 1 of Shenqing's patent scope, wherein the metal reflectors have a reflective surface, which is not adhered by the transparent and optical molding compound Pick up. 3. The light-emitting diode chip packaging process according to item 1 of the scope of the patent application, which further includes: In the step of setting the metal reflectors, an adhesive layer is formed on the wafer carrier to adhere to the chip carriers. Metal reflector. Process J. The light emitting diode chip package as described in item 3 of the scope of the patent application, wherein the adhesive layer is dielectric. The light emitting diode chip is packaged as described in item 3 of the patent application, wherein the adhesive layer is a thermally conductive adhesive. The light-emitting diode chip package as described in item 1 of the scope of patent application Page 1237411 ---- Application scope of patents, of which 7, if applying for these procedures, these procedures are like applying for patents, which are applied through patents, which include a plurality of lenses at 10, if applying for patents, where the crystals If you apply for some of these wafer carriers. 13. If you apply for a special trip, it also includes a polar body seal structure. 14. A light-emitting wafer carrier process. 11 process. 12 process. Metal reflector. The scope of the first. The metal reflector. The scope of the first. 1: Read the first anti-interest range of these metals. The first carrier is the first range of luminous diodes. The first luminous diode system is the first luminous diode system described in the single metal plate production item. The metal powder is used in advance. Ί Made. The chip package metallurgical casting system described in the item includes the metal reflection item described in the item. The hair described in Item A lead frame or the hair set described in Item The hair set described in Item is a fluorescent powder packaged with a light-emitting diode chip. Steps of the photodiode device Photodiode, a circuit base, and the photodiode method are based on photodiode wire-type electric chip packaging, and then a chip encapsulation board is set. Chip-on-chip bonding. The chip package is systematically connected to the light-emitting diode chip package described in item 1 of the scope of interest: cutting the wafer carrier to form a plurality of light-emitting diode chip packaging structures, including: «body-light-emitting diode A body wafer, which is disposed on the wafer carrier; a light-transmitting molding compound, which is formed on the wafer carrier to seal the light-emitting diode wafer; and Page 15 " 11 · ^ 1237411 Scope of patent application-one-^ ---- one metal reflector, the basin is equipped with a striker wafer. It is placed on the wafer carrier and surrounds the light-emitting polar body wafer, such as Na-f in item 14 of the patent application scope, wherein the metal reflector is adhered with a f / encapsulating structural molding compound. The reflecting surface does not have the light transmission range, and the light-emitting diode-sealed structure described in Item 14. Dagger 3 — Adhesive layer to adhere the metal reflector to the wafer. 17, build, 18, 19, build, 20 build, shape. = The light-emitting diode packaging structure described in item 6 of the patent application, wherein the adhesive layer is dielectric. ^ The light emitting diode package structure described in item 16 of the patent application range, wherein the adhesive layer is a thermally conductive adhesive. The light-emitting diode packaging structure described in item 14 of the scope of patent application, wherein the metal reflector is made of a single metal plate. The light-emitting diode package structure described in item 14 of the scope of the patent application, wherein the metal reflecting member is cast in advance using metal powder metallurgy. 21 The light-emitting diode package structure described in item 14 of the patent scope 'Wherein the light-transmitting molding compound comprises a fluorescent powder. The light-emitting diode packaging structure described in item 4 of the scope of the patent application, which further includes a lens, which is disposed on the metal reflector. 〇 i. The light emitting diode package structure as described in item 14 of the scope of patent application & ' wherein the substrate is a lead frame or a circuit substrate. Page 16