CN102738110A - Surface-mounted type lead frame - Google Patents
Surface-mounted type lead frame Download PDFInfo
- Publication number
- CN102738110A CN102738110A CN2012102071106A CN201210207110A CN102738110A CN 102738110 A CN102738110 A CN 102738110A CN 2012102071106 A CN2012102071106 A CN 2012102071106A CN 201210207110 A CN201210207110 A CN 201210207110A CN 102738110 A CN102738110 A CN 102738110A
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- CN
- China
- Prior art keywords
- lead
- wire
- paster
- dao
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Led Device Packages (AREA)
Abstract
The invention relates to a surface-mounted type lead frame, which comprises a first lead, a second lead and a third lead. The second lead is positioned between the first lead and the third lead and comprises a second surface-mounted pad; a plurality of first through holes are formed in positions, which are close to a non-leading-out end on the upper part, of the second surface-mounted pad; and a second through hole is formed in position, which is close to a leading-out end on the lower part, of the second surface-mounted pad. Bonding force of a package and the surface-mounted pad is strengthened, and accordingly the phenomenon that the package is layered can be prevented effectively.
Description
Technical field
The present invention relates to a kind of lead frame, be specifically related to a kind of SMD lead frame, belong to technical field of electronic components.
Background technology
The surface and the back side of the paster Ji Dao that existing paster lead frame is included are smooth flat; And the paster Ji Dao of this kind lead frame and diode chip for backlight unit or triode Chip Packaging are behind packaging body; Lamination appears in packaging body easily, has reduced reliability of products.
Summary of the invention
The objective of the invention is: provide a kind of and can strengthen paster Ji Dao and packaging body adhesion, prevent the SMD lead frame of packaging body generation layering, to overcome the deficiency of prior art.
In order to achieve the above object; Technical scheme of the present invention is: a kind of SMD lead frame; Comprise first lead-in wire, second lead-in wire and the 3rd lead-in wire, said second lead-in wire is between first lead-in wire and the 3rd lead-in wire, and second lead-in wire comprises the second paster Ji Dao; And its: the said second paster Ji Dao is being provided with several first through holes near the non-exit in its top place, the second paster Ji Dao is being provided with second through hole near its underpart exit place.
In technique scheme, the non-exit of the said second paster Ji Dao is provided with the fin that is connected as a single entity with it.
In technique scheme, the non-exit of the said second paster Ji Dao and be provided with depression near the fin place, said depression is cone tip shape.
In technique scheme, said several first through holes are the formation shape along the Width of the second paster Ji Dao has pitch arrangement.
In technique scheme, said first through hole and second through hole are manhole or for ellipse hole or for the polygon through hole, perhaps are any two or three combination of said three kinds of shape through holes.
In technique scheme, said first lead-in wire has first gap and second gap respectively with the 3rd lead-in wire, and first gap and second gap lay respectively at the outside that first lead-in wire and the 3rd goes between.
The good effect that the present invention had is: because the second paster Ji Dao of second lead-in wire of the present invention is provided with several through holes; Also irritate in the through hole of paster Ji Dao after the feasible encapsulation packaging body is arranged; Not only increased the contact area of paster Ji Dao and packaging body; And strengthened the adhesion of packaging body and paster Ji Dao, thus can effectively prevent packaging body generation layering, improved reliability of products.Realized the object of the invention.
Description of drawings
Fig. 1 is the structural representation of a kind of embodiment of the present invention;
Fig. 2 is along the cutaway view of A-A direction among Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and the embodiment that provides, the present invention is further described, but is not limited thereto.
Like Fig. 1, shown in 2; A kind of SMD lead frame; Comprise first lead-in wire, 1, second lead-in wire the 2 and the 3rd lead-in wire 3, said second lead-in wire 2 is between first lead-in wire the 1 and the 3rd lead-in wire 3, and second lead-in wire 2 comprises the second paster base island 2-1; And its: the said second paster base island 2-1 is being provided with 3 first through hole 2-1-1 near the non-exit 2-3 in its top place, the second paster base island 2-1 is being provided with the second through hole 2-1-2 near exit 2-4 place, its underpart.The said first through hole 2-1-1 and the second through hole 2-1-2 are manhole.
As shown in Figure 1, in order to improve radiating effect of the present invention, the non-exit 2-4 of the said second paster base island 2-1 is provided with the fin 2-2 that is connected as a single entity with it.
Like Fig. 1, shown in 2, in order further to increase the contact area of paster Ji Dao and packaging body, the non-exit 2-4 of the said second paster base island 2-1 and be provided with the 2-2-1 that caves near fin 2-2 place, said depression 2-2-1 is cone tip shape.
As shown in Figure 1, more reasonable, compact in order to guarantee the present invention, said 3 first through hole 2-1-1 are the formation shape along the Width of the second paster base island 2-1 has pitch arrangement.And the said first through hole 2-1-1 can have 3 ~ 5.
As shown in Figure 1, the said first through hole 2-1-1 and the second through hole 2-1-2 are manhole or for ellipse hole or for the polygon through hole, perhaps are any two or three combination of said three kinds of shape through holes.
As shown in Figure 1; In order further to improve the adhesion of the present invention and packaging body; Said first lead-in wire the 1 and the 3rd lead-in wire 3 has the first gap 1-1 and the second gap 3-1 respectively, and the first gap 1-1 and the second gap 3-1 lay respectively at go between 3 the outside of first lead-in wire the 1 and the 3rd.
Lab scale effect of the present invention shows, the present invention and diode or triode are encapsulated in packaging body after, increased the contact area of paster Ji Dao and packaging body, strengthened the adhesion of packaging body and paster Ji Dao simultaneously, thereby can effectively prevent packaging body generation layering.Realized original intention of the present invention.
Certainly, the first through hole 2-1-1 of the present invention and the second through hole 2-1-2 are not limited to the disclosed several kinds of difformities of the application, also can adopt the through hole of other geometry.
Claims (6)
1. SMD lead frame; Comprise first lead-in wire (1), second lead-in wire (2) and the 3rd lead-in wire (3); Said second lead-in wire (2) is positioned between first lead-in wire (1) and the 3rd lead-in wire (3); Second lead-in wire (2) comprises the second paster Ji Dao (2-1); It is characterized in that: the said second paster Ji Dao (2-1) is locating to be provided with several first through holes (2-1-1) near its top non-exit (2-3), the second paster Ji Dao (2-1) is locating to be provided with second through hole (2-1-2) near its underpart exit (2-4).
2. SMD lead frame according to claim 1 is characterized in that: the non-exit (2-4) of the said second paster Ji Dao (2-1) is provided with the fin (2-2) that is connected as a single entity with it.
3. SMD lead frame according to claim 2 is characterized in that: the non-exit (2-4) of the said second paster Ji Dao (2-1) and locate to be provided with depression (2-2-1) near fin (2-2), said depression (2-2-1) is cone tip shape.
4. SMD lead frame according to claim 1 is characterized in that: said several first through holes (2-1-1) are the formation shape along the Width of the second paster Ji Dao (2-1) has pitch arrangement.
5. SMD lead frame according to claim 1; It is characterized in that: said first through hole (2-1-1) and second through hole (2-1-2) be for manhole or for ellipse hole or for the polygon through hole, perhaps is any two or three combination of said three kinds of shape through holes.
6. SMD lead frame according to claim 1; It is characterized in that: said first lead-in wire (1) has first gap (1-1) and second gap (3-1) respectively with the 3rd lead-in wire (3), and first gap (1-1) and second gap (3-1) lay respectively at first go between (1) and the 3rd go between (3) the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102071106A CN102738110A (en) | 2012-08-10 | 2012-08-10 | Surface-mounted type lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102071106A CN102738110A (en) | 2012-08-10 | 2012-08-10 | Surface-mounted type lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102738110A true CN102738110A (en) | 2012-10-17 |
Family
ID=46993329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102071106A Pending CN102738110A (en) | 2012-08-10 | 2012-08-10 | Surface-mounted type lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102738110A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928422A (en) * | 2014-03-27 | 2014-07-16 | 张轩 | Lead frame suitable for high-temperature environment |
| CN108717827A (en) * | 2018-05-14 | 2018-10-30 | 昆山国显光电有限公司 | Screen module, display screen and electric terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071797A (en) * | 2007-04-29 | 2007-11-14 | 江苏长电科技股份有限公司 | Effective packaging method for improving component-device sub-layer of semiconductor plastic package |
| CN201450005U (en) * | 2009-05-08 | 2010-05-05 | 常州银河世纪微电子有限公司 | Three-end voltage stabilizer |
| CN201838584U (en) * | 2010-09-30 | 2011-05-18 | 常州银河世纪微电子有限公司 | Encapsulated triode |
| CN202796929U (en) * | 2012-08-10 | 2013-03-13 | 常州银河世纪微电子有限公司 | Paster type lead frame |
-
2012
- 2012-08-10 CN CN2012102071106A patent/CN102738110A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071797A (en) * | 2007-04-29 | 2007-11-14 | 江苏长电科技股份有限公司 | Effective packaging method for improving component-device sub-layer of semiconductor plastic package |
| CN201450005U (en) * | 2009-05-08 | 2010-05-05 | 常州银河世纪微电子有限公司 | Three-end voltage stabilizer |
| CN201838584U (en) * | 2010-09-30 | 2011-05-18 | 常州银河世纪微电子有限公司 | Encapsulated triode |
| CN202796929U (en) * | 2012-08-10 | 2013-03-13 | 常州银河世纪微电子有限公司 | Paster type lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928422A (en) * | 2014-03-27 | 2014-07-16 | 张轩 | Lead frame suitable for high-temperature environment |
| CN108717827A (en) * | 2018-05-14 | 2018-10-30 | 昆山国显光电有限公司 | Screen module, display screen and electric terminal |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121017 |