CN206271695U - A kind of lead frame structure and semiconductor devices - Google Patents
A kind of lead frame structure and semiconductor devices Download PDFInfo
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- CN206271695U CN206271695U CN201621267097.3U CN201621267097U CN206271695U CN 206271695 U CN206271695 U CN 206271695U CN 201621267097 U CN201621267097 U CN 201621267097U CN 206271695 U CN206271695 U CN 206271695U
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- pin
- lead frame
- frame structure
- dao
- projection
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Abstract
The utility model discloses a kind of lead frame structure and semiconductor devices.Lead frame structure includes Ji Dao and the pin set around the Ji Dao, and the pin includes spaced first pin in the base island, the region on the side of first pin near the Ji Dao are provided with the projection for protruding from the side.Projection can increase the adhesion between pin and plastic packaging colloid, it is to avoid pin is pulled, and so as to avoid wire bond fracture, improve yields of the lead frame after rib cutting shaping, and simple structure, low cost.
Description
Technical field
The utility model is related to the technical field of semiconductor devices, more particularly to a kind of lead frame structure and semiconductor device
Part.
Background technology
Existing lead frame is as shown in figure 1, including base island 1 ', base island 1 ' is surrounded with outward pin and connecting pin (extended meeting afterwards
It is removed), pin includes and the first pin 2 ' of the interval setting of base island 1 ' (Ji Weiyuji islands 1 ' are directly connected to) and straight with Ji Dao
The second pin for connecing in succession, lead frame can carry out plastic packaging treatment after being welded with chip, as shown in Fig. 2 will mould after plastic packaging
When the lead frame rib cutting (will connecting pin excision) being honored as a queen and shaping (by pin bending in similar to S-shaped), such as Fig. 3 and Fig. 4
Shown, the first pin 2 ' can be pulled in shaping, and 2 ' are drawn to the position of 2a ' from Fig. 3 so that copper 2b ' exposes, plastic packaging
Therefore internal bonding wire (being connected to the wire between chip and pin) is also broken, and causes the lead frame after plastic packaging to be scrapped.
Utility model content
First purpose of the present utility model is to propose a kind of lead frame structure, and pin and plastic packaging glue are increased using projection
Adhesion between body, it is to avoid pin is pulled, so as to avoid wire bond fracture.
It is that, up to this purpose, the utility model uses following technical scheme：
A kind of lead frame structure, including Ji Dao and around the Ji Dao set pin, the pin include with it is described
Spaced first pin in base island, be provided near the region of the Ji Dao on the side of first pin protrude from it is described
The projection of side.
Wherein, it is described to project through punching press or etching formation.
Wherein, the height that the projection protrudes from side is 0.05mm-0.15mm.
Wherein, the height that the projection protrudes from side is 0.075mm.
Wherein, the projection is sophisticated shape.
Wherein, the raised edge positioned at the side.
Wherein, first pin near one end of Ji Dao along the Ji Dao peripheral interval setting, and to away from described
The side of Ji Dao inclines, and forms inclined plane, the raised junction positioned at the inclined plane with the side.
Wherein, the number of first pin is multiple, and multiple first pins are set around the Ji Dao, and each described the
The projection is provided with one pin.
Second purpose of the present utility model is to propose a kind of semiconductor devices, and pin and plastic packaging colloid are increased using projection
Between adhesion, it is to avoid pin is pulled, so as to avoid wire bond fracture.
It is that, up to this purpose, the utility model uses following technical scheme：
A kind of semiconductor devices, it is characterised in that including above-mentioned lead frame structure.
Beneficial effect：The utility model provides a kind of lead frame structure and semiconductor devices.Lead frame structure bag
Kuo Ji islands and around the Ji Dao set pin, the pin include with spaced first pin in the base island, it is described
Region on the side of the first pin near the Ji Dao is provided with the projection for protruding from the side.Projection can increase pin
And the adhesion between plastic packaging colloid, it is to avoid pin is pulled, so as to avoid wire bond fracture, improve lead frame rib cutting into
Yields after shape, and simple structure, low cost.
Brief description of the drawings
Fig. 1 is the front view of the lead frame of prior art.
Fig. 2 is the front view carried out after plastic packaging of the lead frame of prior art.
Fig. 3 is the front view after the rib cutting shaping of the lead frame after the plastic packaging of prior art.
Fig. 4 is the side figure after the rib cutting shaping of the lead frame after the plastic packaging of prior art.
Fig. 5 is the front view of lead frame of the present utility model.
Fig. 6 is the partial enlarged drawing at the A of Fig. 5.
Fig. 7 is the front view carried out after plastic packaging of lead frame of the present utility model.
Fig. 8 is the front view after the rib cutting shaping of the lead frame after plastic packaging of the present utility model.
Wherein：
The pin of 1- Ji Dao, 2- first, 21- is raised, 1 '-Ji Dao, 2 '-the first pins, the first pin after 2a '-deformation,
2b '-copper.
Specific embodiment
It is that the technical problem for solving the utility model, the technical scheme for using and the technique effect for reaching are clearer,
Further illustrate the technical solution of the utility model below in conjunction with the accompanying drawings and by specific embodiment.
Embodiment 1
A kind of lead frame structure is present embodiments provided, as shown in Figure 5 and Figure 6, including base island 1 and circular base island 1 set
The pin put, pin includes first pin 2 spaced with base island 1, near the region on base island 1 on the side of the first pin 2
It is provided with and protrudes from raised the 21 of side.Pin also includes the second pin being directly connected with base island 1, and second pin is due to straight
Jie Yuji islands 1 connect, and in bending by the pulling force on base island 1, will not be pulled.First pin 2 is by the way that in side, (side refers to
The face of the both sides that the first pin 2 extends) raised 21 are set, the side of the first pin 2 is no longer smooth surface, can increase by the first pin
Adhesion between 2 and plastic packaging colloid, it is to avoid the first pin 2 is pulled, so as to avoid wire bond fracture, improves lead frame and exists
Yields after rib cutting shaping, and simple structure, low cost.The lead frame of the present embodiment is after plastic packaging as shown in fig. 7, in warp
After crossing rib cutting and bending, as shown in figure 8, the first pin 2 is remained in that in the original location, will not be pulled.
Raised 21 can be by being stamped and formed out, i.e., when the first pin 2 is stamped and formed out, between stamping die is increased herein
Gap, is deliberately formed burr structure, forms raised 21, and this kind of mode need not increase additional process, simple and reliable.Raised 21
Can be formed by etching, this kind of mode can not change existing stamping mold, form raised 21 through overetch again.Raised 21
Above-mentioned generation type can also be not limited to, as long as raised 21 from side protrusion can be formed, can avoid first from drawing
Pin 21 is pulled.Raised 21 protrude from the highly minimum of side cannot be below 0.05mm, can not otherwise hold the first pin, cause
First pin due between plastic packaging colloid adhesion it is relatively low and be pulled；Due to the interval between the first pin 2 and base island 1 not
It is too big, therefore, in order to avoid chip short circuit, the height of raised 21 raised 21 protrusion of height no more than 0.15mm, raised 21
The height for protruding from side is convenient in 0.075mm ratios, can take into account the first adhesion of the pin 2 with plastic packaging colloid and gap.
Raised the 21 of the present embodiment are sophisticated shape, and this kind of structure is easy to shaping, other shapes can also, it is not restricted herein.
Raised the 21 of the present embodiment are arranged at the edge of side, and plastic packaging glue is relativelyed close to during due to the first 2 bending of pin
The edge of body, and in order to the size after plastic packaging is as small as possible, plastic packaging colloid edge in itself is also very close to the end of pin
Portion, therefore, it can be arranged at the edge of side by raised 21, so that ensure that raised 21 are located in plastic packaging colloid, and in front end
Hold the first pin 2, it is to avoid the first pin 2 is pulled.Specifically, the first pin 2 is close to the one end on base island 1 along base island 1
Peripheral interval setting, and inclined to the side away from base island 1, and inclined plane is formed, raised 21 are located at the friendship of inclined plane and side
Meet place, it is to avoid the first pin 2 is pulled.Because the end of the first pin 21 is deviateed to the side away from base island 1, therefore, first
Pin 2 has formd the structure for protruding from side in the side away from base island 1 in itself, can strengthen and plastic packaging colloid between
Adhesion, it is only necessary to set raised 21 with the junction of inclined plane near the side on base island 1 in the first pin 2.This implementation
The number of the first pin 2 of example is multiple, and multiple first pins 2 set around base island 1, are provided with each first pin 2
Raised 21, it is ensured that each first pin 2 is not pulled.
Embodiment 2
Present embodiments provide a kind of semiconductor devices, including embodiment 1 lead frame structure.First pin 2 passes through
In side, (side refers to the face of the both sides that the first pin 2 extends) sets raised 21, and the side of the first pin 2 is no longer smooth surface,
The adhesion between the first pin 2 and plastic packaging colloid can be increased, it is to avoid the first pin 2 is pulled, so as to avoid wire bond fracture,
Improve yields of the lead frame after rib cutting shaping, and simple structure, low cost.
Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality
With new thought, will change in specific embodiments and applications, this specification content should not be construed as
To limitation of the present utility model.
Claims (9)
1. a kind of lead frame structure, it is characterised in that the pin set including Ji Dao (1) and around the Ji Dao (1), it is described
Pin includes and spaced first pins (2) of the Ji Dao (1), the close base on the side of first pin (2)
The region on island (1) is provided with the projection (21) for protruding from the side.
2. lead frame structure as claimed in claim 1, it is characterised in that the projection (21) is by punching press or etching shape
Into.
3. lead frame structure as claimed in claim 1, it is characterised in that the height that the projection (21) protrudes from side is
0.05mm-0.15mm。
4. lead frame structure as claimed in claim 3, it is characterised in that the height that the projection (21) protrudes from side is
0.075mm。
5. the lead frame structure as described in claim any one of 1-4, it is characterised in that the projection (21) is sophisticated shape.
6. the lead frame structure as described in claim any one of 1-4, it is characterised in that the projection (21) is positioned at the side
The edge in face.
7. lead frame structure as claimed in claim 6, it is characterised in that first pin (2) near Ji Dao (1) one
Hold along the peripheral interval setting of the Ji Dao (1), and inclined to the side away from the Ji Dao (1), and form inclined plane, it is described
The junction of raised (21) positioned at the inclined plane with the side.
8. lead frame structure as claimed in claim 7, it is characterised in that the number of first pin (2) is multiple, many
Individual first pin (2) is set around the Ji Dao (1), and the projection (21) is provided with each described first pin (2).
9. a kind of semiconductor devices, it is characterised in that including the lead frame structure as described in claim any one of 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621267097.3U CN206271695U (en) | 2016-11-21 | 2016-11-21 | A kind of lead frame structure and semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621267097.3U CN206271695U (en) | 2016-11-21 | 2016-11-21 | A kind of lead frame structure and semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206271695U true CN206271695U (en) | 2017-06-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621267097.3U Active CN206271695U (en) | 2016-11-21 | 2016-11-21 | A kind of lead frame structure and semiconductor devices |
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| Country | Link |
|---|---|
| CN (1) | CN206271695U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493179A (en) * | 2018-02-06 | 2018-09-04 | 昆山市品能精密电子有限公司 | The firm integrated circuit supporting structure of chip adhesive and its manufacturing method |
-
2016
- 2016-11-21 CN CN201621267097.3U patent/CN206271695U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493179A (en) * | 2018-02-06 | 2018-09-04 | 昆山市品能精密电子有限公司 | The firm integrated circuit supporting structure of chip adhesive and its manufacturing method |
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