CN106935518B - Chip packaging method - Google Patents
Chip packaging method Download PDFInfo
- Publication number
- CN106935518B CN106935518B CN201511027882.1A CN201511027882A CN106935518B CN 106935518 B CN106935518 B CN 106935518B CN 201511027882 A CN201511027882 A CN 201511027882A CN 106935518 B CN106935518 B CN 106935518B
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- CN
- China
- Prior art keywords
- plastic
- chip
- lead frame
- frame
- exhaust groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
Abstract
The present invention discloses a kind of chip packaging method comprising: lead frame is provided, which includes island area, lead terminal, frame ends and connect muscle portion；Chip is placed in the island area of the lead frame；Bonding line is connected between the pad of the chip and corresponding lead terminal；Plastic-sealed body is formed by plastic package die with, in the plastic-sealed body, the plastic-sealed body includes the plastic-sealed body end engaged with the frame ends by the chip, bonding line and part lead frame plastic packaging；The chip product is separated from the lead frame.Exhaust groove is arranged in the position close to the frame ends of the plastic package die, when carrying out plastic packaging by the plastic package die from the exhaust groove discharge part flash, this part flash is covered on the partial region of the frame ends, complete metal layer would not be formed in the frame ends in plating in this way, to solve the problems, such as to form wire on the side of chip product.
Description
[technical field]
The present invention relates to a kind of chip manufacturing field more particularly to a kind of chip packaging methods.
[background technique]
There are two types of lead frame includes at present, one is the lead frames formed by etching process, can be referred to as corruption
Lead frame is lost, another kind is the lead frame formed through the stamping process, can be referred to as punching press lead frame.
Branch's face shape of the lead frame formed by etching process is that arc is recessed, and end sides have sharp flash.Such as
It is shown in FIG. 1, the end sides of corrosion lead frame are illustrated, the upper surface of lead frame is 110, lower surface 120,
End sides are 130, it is seen that since end sides are made of corrosion, there is flash, end sides with upper surface 110
Spine is formed with 120 intersection of lower surface.Branch's face shape of the lead frame formed through the stamping process is plane, end
Side is the angle R, no flash.As shown in Figure 2, illustrate the end sides of punching press lead frame, the upper table of lead frame
Face is 210, lower surface 220, end sides 230, it is seen that since end sides are stamped to form, no flash,
End sides 230 and 220 intersection of lower surface are formed with the angle R.
When chip product is pullled separation from corrosion lead frame, the flash of the end sides is easy to cause corrosion
The tin layers of the end upper layer plating of lead frame are carried over, and tin silk is formed on the side of the chip product, cause pin short
Transportation work style danger.
Since the end sides of punching press lead frame are without flash, chip product is being pullled from punching press lead frame point
From when, tin silk will not be formed on the side of the product.Although corrosion frame, which is replaced with ram frame, can solve in institute
The problem of forming tin silk on the side of product is stated, however two other problems can be brought in this way: the first, being unable to satisfy client and wants
It asks；The second, punching press lead frame mold die sinking is costly, and the period is long, influences product and hands over the phase.
It is necessary to propose the new scheme of one kind to solve the problems, such as to form wire on the side of the product.
[summary of the invention]
One of the objects of the present invention is to provide a kind of chip packaging methods, can also while using lead frame is corroded
It enough solves the problems, such as to form wire on the side of chip product.
To achieve the above object, according to an aspect of the present invention, the present invention provides chip packaging method comprising: it mentions
For lead frame, which includes the company of island area, lead terminal, frame ends and the connection lead terminal and island area
Muscle portion；Chip is placed in the island area of the lead frame；Bonding line is connected to the weldering of the chip by bonding technology
Between disk and corresponding lead terminal；Plastic-sealed body is formed by plastic package die with by the chip, bonding line and part lead frame
For frame plastic packaging in the plastic-sealed body, the plastic-sealed body includes the plastic-sealed body end engaged with the frame ends；Being exposed to
State one layer of metal of plating on the leadframe portion outside plastic-sealed body；Company's muscle portion of the lead frame is cut off to form chip production
Product, the chip product is supported by the frame ends at this time；With the chip product is isolated from the lead frame
Come；Wherein, the plastic package die close to the frame ends position be arranged exhaust groove, by the plastic package die into
From the exhaust groove discharge part flash when row plastic packaging, this part flash is covered on the partial region of the frame ends.
Further, the lead frame is fabricated by etching process.
Further, the depth of the exhaust groove is 0.010mm to 0.030mm.
Further, the width of the exhaust groove is the 1/4 to 1/3 of the width of the plastic-sealed body.
Further, one layer of metal that the plating is formed is one layer of tin.
Further, it is recessed that the gas is arranged in the direction separated from the lead frame according to the chip product
Specific location of the slot on the plastic package die.
Further, the exhaust groove is set to the lower impressions of the plastic package die.
Compared with prior art, in the present invention, by the position close to the frame ends of the plastic package die
Exhaust groove is set, and when carrying out plastic packaging by the plastic package die from the exhaust groove discharge part flash, this part is overflow
Material is covered on the partial region of the frame ends, would not be formed in the frame ends in plating so complete
Metal layer, to solve the problems, such as to form wire on the side of chip product.
[Detailed description of the invention]
In order to illustrate the technical solution of the embodiments of the present invention more clearly, required use in being described below to embodiment
Attached drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this
For the those of ordinary skill of field, without any creative labor, it can also be obtained according to these attached drawings other
Attached drawing.Wherein:
Fig. 1 illustrates the end sides of corrosion lead frame, and wherein end sides have flash；
Fig. 2 illustrates the end sides of punching press lead frame, and wherein end sides do not have flash；
Fig. 3 is the flow diagram of chip packaging method in one embodiment in the present invention；
Fig. 4 is the schematic diagram of product structure after the plastic packaging step in Fig. 3；
Fig. 5 is the schematic diagram of separating step in the prior art；
Fig. 6 is the schematic diagram of the separating step in Fig. 3.
[specific embodiment]
Detailed description of the invention is mainly by program, step, logical block, process or other symbolistic descriptions come directly
Or the running of simulation technical solution of the present invention indirectly.For the thorough explanation present invention, set forth in following description very
More specific details.And in these no specific details, the present invention then can may be realized still.Technical staff in fields makes
With these descriptions herein and state that the others skilled in the art into fields effectively introduce their work essence.Change sentence
It talks about, for the purpose of the present invention of avoiding confusion, since well known methods and procedures has been readily appreciated that they are not detailed
Thin description.
" one embodiment " or " embodiment " referred to herein, which refers to, may be included at least one implementation of the invention
A particular feature, structure, or characteristic." in one embodiment " that different places occur in the present specification not refers both to same
A embodiment, nor the individual or selective embodiment mutually exclusive with other embodiments.
Fig. 3 is the flow diagram of chip packaging method 300 in one embodiment in the present invention, using corrosion
It can also solve the problems, such as to form wire on the side of chip product while lead frame.
As shown in Figure 3, the chip packaging method 300 includes the following steps.
Step 310, lead frame is provided, which includes described in island area, lead terminal, frame ends and connection
Company's muscle portion of lead terminal and island area.
As shown in connection with fig. 4, the lead frame is marked as 410, and the island area of the lead frame 410 is by plastic packaging in core
It in flake products 420, does not show that, the muscle portion of the lead frame 410 also has been not shown, the lead of the lead frame 410
Terminal is marked as 411, and the frame ends of the lead frame 410 are marked as 412.
In the present invention, the lead frame is fabricated by etching process, can be referred to as corrosion lead frame
Frame.As described in background, since the lead frame is fabricated by etching process, the frame ends 412
Side is jagged.
Step 320, chip (not shown) is placed in the island area of the lead frame.
Step 330, bonding line is connected between the pad of the chip and corresponding lead terminal by bonding technology.
The bonding technology can be using the conventional bonding technology in fields, therefore is not described in detail especially herein.
Step 340, plastic-sealed body plastic packaging step: is formed with by the chip, bonding line and part lead by plastic package die
For frame plastic packaging in the plastic-sealed body, the plastic-sealed body includes the plastic-sealed body end 421 engaged with the frame ends 412.
Fig. 4 is the schematic diagram of product structure after the plastic packaging step of invention.One of advantages of the present invention or feature are: described
Exhaust groove is arranged in the position close to the frame ends 412 of plastic package die, can be in conjunction with shown in Fig. 4 and Fig. 6, passing through
From the exhaust groove discharge part flash 413 when stating plastic package die progress plastic packaging, this part flash 413 is covered on the frame
On the partial region of end 412.
In one embodiment, the depth of the exhaust groove is 0.010mm to 0.030mm.Preferably, the exhaust is recessed
The depth of slot is 0.025mm.The width of the exhaust groove is the 1/4 to 1/3 of the width of the plastic-sealed body, such as if plastic packaging
The width of body is 4mm, then the width of exhaust groove can be 1mm.
Step 350, one layer of metal is electroplated on the leadframe portion being exposed to outside the plastic-sealed body.
Due to being covered with flash on the partial region of the frame ends 412, in having for the frame ends 412
The region of flash is not plated the metal.
In conjunction with Fig. 4 and shown in fig. 6, the formation covering on the region of the chip product of the frame ends 412
There is flash, and the region far from the chip product forms one layer of metal by plating.In other embodiments, it is also possible to institute
The whole surface for stating frame ends 412 is covered with flash.
In one embodiment, the metal is tin.
Step 360, company's muscle portion of the lead frame is cut off to form chip product 420, at this time the chip product 420
Due to the frame ends 412 and the plastic-sealed body end 421 in conjunction with and be supported.
Step 370, the chip product 420 is separated from the lead frame 410.
In one embodiment, as shown in FIG. 6, the chip product 420 is pulled in the direction of the arrow so that the core
Flake products 420 are separated with the remainder of the lead frame 410.
Fig. 5 illustrates the schematic diagram that existing chip product 520 is separated from lead frame.The lead frame
Frame ends 512 combine with the plastic-sealed body end 521 of the plastic-sealed body, in the frame ends 512 of the lead frame
Plating is formed with one layer of tin 514 on surface.When chip product 520 is separated from lead frame, the frame ends 512
On tin 514 may be carried over to form tin silk.
And in the present invention, as shown in connection with fig. 6, although the lead frame 410 is corrosion lead frame 410, frame
There is burr on the side in frame end portion 412, but due to being covered with flash 413 on the partial region of frame ends 412, without
Upper metal layer is all electroplated, therefore when the chip product 420 is separated from the lead frame 410, it can't
Form tin silk.
In one embodiment, the side that can be separated from the lead frame 410 according to the chip product 420
To specific location of the gas groove on the plastic package die is arranged.Specifically, if the chip product 420 downwards from
It is separated on the lead frame 410, then the frame end towards the lead frame 410 that the exhaust groove is set
The lower surface in portion 412, for example, the exhaust groove is set to the close frame ends of the lower impressions of the plastic package die
At 412 position.If the chip product 420 is separated from the lead frame 410 upwards, the exhaust is recessed
The upper surface for the frame ends 412 towards the lead frame 410 that slot is set.
The scheme for solving the problems, such as tin silk in the present invention, it is easy to operate, expense is low, the period is short, and to chip product nothing itself
Any influence, and it is not related to any alteration problems of client.
Above description sufficiently discloses a specific embodiment of the invention.It should be pointed out that being familiar with the field
Range of any change that technical staff does a specific embodiment of the invention all without departing from claims of the present invention.
Correspondingly, the scope of the claims of the invention is also not limited only to previous embodiment.
Claims (7)
1. a kind of chip packaging method, characterized in that it comprises:
Lead frame is provided, which includes island area, lead terminal, frame ends and the connection lead terminal and island
Company's muscle portion in area；
Chip is placed in the island area of the lead frame；
Bonding line is connected between the pad of the chip and corresponding lead terminal by bonding technology；
By plastic package die formed plastic-sealed body with by the chip, bonding line and part lead frame plastic packaging in the plastic-sealed body
Interior, the plastic-sealed body includes the plastic-sealed body end engaged with the frame ends；
One layer of metal is electroplated on the leadframe portion being exposed to outside the plastic-sealed body；
Company's muscle portion of the lead frame is cut off to form chip product, the chip product is by the frame ends branch at this time
Support；With
The chip product is separated from the lead frame；
Wherein, exhaust groove is arranged in the position close to the frame ends of the plastic package die, is passing through the plastic package die
From the exhaust groove discharge part flash when progress plastic packaging, this part flash is covered on the partial region of the frame ends
On.
2. chip packaging method according to claim 1, it is characterised in that: the lead frame is manufactured by etching process
Made of.
3. chip packaging method according to claim 1, it is characterised in that: the depth of the exhaust groove is 0.010mm
To 0.030mm.
4. chip packaging method according to claim 1, it is characterised in that: the width of the exhaust groove is the plastic packaging
The 1/4 to 1/3 of the width of body.
5. chip packaging method according to claim 1, it is characterised in that: one layer of metal that the plating is formed is one layer
Tin.
6. chip packaging method according to claim 1, it is characterised in that: according to the chip product from the lead frame
Specific location of the exhaust groove on the plastic package die is arranged in the direction separated on frame,
If the chip product is separated from the lead frame downwards, the exhaust groove be set towards described
The lower surface of the frame ends of lead frame；It is described if the chip product is separated from the lead frame upwards
The upper surface for the frame ends towards the lead frame that exhaust groove is set.
7. chip packaging method according to claim 1, it is characterised in that: the exhaust groove is set to the plastic sealed mould
The lower impressions of tool.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027882.1A CN106935518B (en) | 2015-12-31 | 2015-12-31 | Chip packaging method |
| PCT/CN2016/112612 WO2017114411A1 (en) | 2015-12-31 | 2016-12-28 | Chip packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027882.1A CN106935518B (en) | 2015-12-31 | 2015-12-31 | Chip packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106935518A CN106935518A (en) | 2017-07-07 |
| CN106935518B true CN106935518B (en) | 2019-04-12 |
Family
ID=59225643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511027882.1A Active CN106935518B (en) | 2015-12-31 | 2015-12-31 | Chip packaging method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106935518B (en) |
| WO (1) | WO2017114411A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321129A (en) * | 2018-03-30 | 2018-07-24 | 深圳赛意法微电子有限公司 | The packaging method and its package module of power device, lead frame |
| CN109003957A (en) * | 2018-09-18 | 2018-12-14 | 江苏捷捷微电子股份有限公司 | The preparation method of SOT-89/223-2L lead frame and two leg structures |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101442035B (en) * | 2008-12-14 | 2011-03-16 | 天水华天科技股份有限公司 | Flat non down-lead encapsulation piece and method for producing the same |
| CN102403295B (en) * | 2010-09-07 | 2014-08-06 | 万国半导体股份有限公司 | Semiconductor packaging through metallic bonding and method for same |
| KR101398016B1 (en) * | 2012-08-08 | 2014-05-30 | 앰코 테크놀로지 코리아 주식회사 | Lead frame package and manufacturing method thereof |
-
2015
- 2015-12-31 CN CN201511027882.1A patent/CN106935518B/en active Active
-
2016
- 2016-12-28 WO PCT/CN2016/112612 patent/WO2017114411A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN106935518A (en) | 2017-07-07 |
| WO2017114411A1 (en) | 2017-07-06 |
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