CN106935518A - Chip packaging method - Google Patents
Chip packaging method Download PDFInfo
- Publication number
- CN106935518A CN106935518A CN201511027882.1A CN201511027882A CN106935518A CN 106935518 A CN106935518 A CN 106935518A CN 201511027882 A CN201511027882 A CN 201511027882A CN 106935518 A CN106935518 A CN 106935518A
- Authority
- CN
- China
- Prior art keywords
- plastic
- chip
- lead frame
- frame
- sealed body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
Abstract
The present invention discloses a kind of chip packaging method, and it includes：Lead frame is provided, the lead frame includes island area, lead terminal, frame ends and connects muscle portion；Chip is placed in the island area of the lead frame；Bonding line is connected between the pad of the chip and corresponding lead terminal；Plastic-sealed body is formed so that, in the plastic-sealed body, the plastic-sealed body includes the plastic-sealed body end engaged with the frame ends by the chip, bonding line and part lead frame plastic packaging by plastic package die；The chip product is separated from the lead frame.The position of the close described frame ends of the plastic package die sets exhaust groove, when plastic packaging is carried out by the plastic package die from the exhaust groove discharge part flash, this part flash is covered on the subregion of the frame ends, complete metal level so would not be formed in the frame ends in plating, so as to solve the problems, such as to form wire on the side of chip product.
Description
【Technical field】
The present invention relates to a kind of chip manufacturing field, more particularly to a kind of chip packaging method.
【Background technology】
Current lead frame includes two kinds, and a kind of is the lead frame formed by etching process, can be by
Referred to as corrode lead frame, another kind is the lead frame formed by Sheet Metal Forming Technology, can be referred to as punching press
Lead frame.
The branch face of the lead frame formed by etching process is shaped as that arc is recessed, and end sides have sharp hair
Side.As shown in Figure 1, its end sides for illustrating corrosion lead frame, the upper surface of lead frame
It is 110, lower surface is 120, end sides are 130, it is seen that because end sides corrosion is formed, because
This has flash, and end sides are being formed with spine with upper surface 110 and the intersection of lower surface 120.Pass through
The branch face of the lead frame that Sheet Metal Forming Technology is formed is shaped as plane, and end sides are R angles, without flash.Such as
Shown in Fig. 2, its end sides for illustrating punching press lead frame, the upper surface of lead frame is 210,
Lower surface is 220, and end sides are 230, it is seen that because end sides are stamped to form, therefore without flash,
R angles are formed with end sides 230 and the intersection of lower surface 220.
When chip product is pullled into separation from corrosion lead frame, the flash of the end sides is easily led
Cause the tin layers of the end upper strata plating of corrosion lead frame to be carried over, and formed on the side of the chip product
Tin silk, causes pin short-circuit risks.
Because the end sides of punching press lead frame are without flash, thus by chip product from punching press lead frame
When pullling separation, tin silk will not be formed on the side of the product.Although corrosion framework is replaced with into punching press
Framework can solve the problems, such as to form tin silk on the side of the product, but can so bring other two
Individual problem：Firstth, customer requirement cannot be met；Secondth, punching press lead frame mould die sinking is costly, week
Phase is long, and influence product hands over the phase.
It is necessary to propose a kind of new scheme to solve the problems, such as to form wire on the side of the product.
【The content of the invention】
An object of the present invention is to provide a kind of chip packaging method, and it is using the same of corrosion lead frame
When can also solve the problems, such as to form wire on the side of chip product.
To achieve the above object, according to an aspect of the present invention, the present invention provides chip packaging method, its
Including：Lead frame is provided, the lead frame includes island area, lead terminal, frame ends and connection institute
State company's muscle portion in lead terminal and island area；Chip is placed in the island area of the lead frame；By bonding
Be connected to bonding line between the pad of the chip and corresponding lead terminal by technique；By plastic package die shape
Into plastic-sealed body with by the chip, bonding line and part lead frame plastic packaging in the plastic-sealed body, the modeling
Envelope body includes the plastic-sealed body end engaged with the frame ends；It is being exposed to the external lead frame of the plastic packaging
Frame electroplates layer of metal on part；Company's muscle portion of the lead frame is cut off to form chip product, now institute
Chip product is stated to be supported by the frame ends；With the chip product is separated from the lead frame
Out；Wherein, the position of the close described frame ends of the plastic package die sets exhaust groove, is passing through
From the exhaust groove discharge part flash when carrying out plastic packaging, this part flash is covered in institute to the plastic package die
State on the subregion of frame ends.
Further, the lead frame is fabricated by by etching process.
Further, the depth of the exhaust groove is 0.010mm to 0.030mm.
Further, the width of the exhaust groove is the 1/4 to 1/3 of the width of the plastic-sealed body.
Further, the layer of metal that the plating is formed is one layer of tin.
Further, the direction separated from the lead frame according to the chip product, sets institute
State particular location of the gas groove on the plastic package die.
Further, the exhaust groove is arranged at the lower impressions of the plastic package die.
Compared with prior art, in the present invention, by the close described frame ends in the plastic package die
Position set exhaust groove, when plastic packaging is carried out by the plastic package die from the exhaust groove discharge unit
Flash, this part flash is divided to be covered on the subregion of the frame ends, so would not in plating
Complete metal level is formed in the frame ends, so as to solve to form wire on the side of chip product
Problem.
【Brief description of the drawings】
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be to needed for embodiment description
The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only of the invention
Some embodiments, for those of ordinary skill in the art, without having to pay creative labor,
Other accompanying drawings can also be obtained according to these accompanying drawings.Wherein：
Fig. 1 illustrates the end sides of corrosion lead frame, and wherein end sides have flash；
Fig. 2 illustrates the end sides of punching press lead frame, and wherein end sides do not have flash；
Fig. 3 is chip packaging method in present invention schematic flow sheet in one embodiment；
Fig. 4 is the product structure schematic diagram after the plastic packaging step in Fig. 3；
Fig. 5 is the schematic diagram of separating step of the prior art；
Fig. 6 is the schematic diagram of the separating step in Fig. 3.
【Specific embodiment】
It is of the invention describe in detail mainly by program, step, logical block, process or other symbolistic retouch
State the running for carrying out direct or indirect simulation technical solution of the present invention.It is the thorough explanation present invention, in the case where connecing
Many specific details are set forth in the description for coming.And without these specific details when, it is of the invention then may be still
It is capable of achieving.Technical staff in art is described using herein these and stated to its in art
His technical staff effectively introduces their work essence.In other words, it is the purpose of the present invention of avoiding confusion,
Because well known methods and procedures has been readily appreciated that, therefore they are not described in detail.
" one embodiment " or " embodiment " referred to herein refers to that may be included at least one realization side of the invention
Special characteristic, structure or characteristic in formula.Different places occur in this manual " in one embodiment "
Same embodiment is not referred both to, nor the single or selective reality mutually exclusive with other embodiment
Apply example.
Fig. 3 is chip packaging method 300 in present invention schematic flow sheet in one embodiment, its
Can also solve the problems, such as to form wire on the side of chip product while using corrosion lead frame.
As shown in Figure 3, the chip packaging method 300 comprises the following steps.
Step 310, there is provided lead frame, the lead frame include island area, lead terminal, frame ends and
Connect company's muscle portion in the lead terminal and island area.
With reference to shown in Fig. 4, the lead frame is marked as 410, the island area quilt of the lead frame 410
Plastic packaging does not show that the muscle portion of the lead frame 410 also has been not shown in chip product 420,
The lead terminal of the lead frame 410 is marked as 411, and the frame ends of the lead frame 410 are marked
It is designated as 412.
In the present invention, the lead frame is fabricated by by etching process, can be referred to as corrosion
Lead frame.As described in background, because the lead frame is fabricated by by etching process, therefore
The side of the frame ends 412 is jagged.
Step 320, chip (not shown) is placed in the island area of the lead frame.
Step 330, bonding line is connected to the pad and corresponding lead terminal of the chip by bonding technology
Between.The bonding technology can use the conventional bonding technology in art, therefore not special herein
Describe in detail.
Step 340, plastic packaging step：Plastic-sealed body is formed with by the chip, bonding line and portion by plastic package die
Wire frame plastic packaging is separated in the plastic-sealed body, the plastic-sealed body includes being engaged with the frame ends 412
Plastic-sealed body end 421.
Fig. 4 is the product structure schematic diagram after the plastic packaging step of invention.One of advantages of the present invention or feature exist
In：The position of the close described frame ends 412 of the plastic package die sets exhaust groove, can combine Fig. 4
With shown in Fig. 6, when plastic packaging is carried out by the plastic package die from the exhaust groove discharge part flash 413,
This part flash 413 is covered on the subregion of the frame ends 412.
In one embodiment, the depth of the exhaust groove is 0.010mm to 0.030mm.Preferably,
The depth of the exhaust groove is 0.025mm.The width of the exhaust groove is the width of the plastic-sealed body
1/4 to 1/3, if the width of such as plastic-sealed body is 4mm, then the width of exhaust groove can be 1mm.
Step 350, layer of metal is electroplated being exposed on the external leadframe portion of the plastic packaging.
Due to being coated with flash on the subregion of the frame ends 412, therefore in the frame ends 412
The region with flash be not plated the upper metal.
With reference to shown in Fig. 4 and Fig. 6, on the region of the close described chip product of the frame ends 412
Formation is coated with flash, and forms layer of metal by plating away from the region of the chip product.At other
In embodiment, or the whole surface of the frame ends 412 is covered with flash.
In one embodiment, the metal is tin.
Step 360, cuts off company's muscle portion of the lead frame to form chip product 420, now the chip
Product 420 is supported due to the combination of the frame ends 412 and the plastic-sealed body end 421.
Step 370, the chip product 420 is separated from the lead frame 410.
In one embodiment, it is as shown in Figure 6, the chip product 420 is pulled in the direction of the arrow so that
The chip product 420 is obtained to be separated with the remainder of the lead frame 410.
Fig. 5 illustrates the schematic diagram that existing chip product 520 is separated from lead frame.It is described
The frame ends 512 of lead frame are combined with the plastic-sealed body end 521 of the plastic-sealed body, in the lead
Plating is formed with one layer of tin 514 on the surface of the frame ends 512 of framework.In chip product 520 from lead frame
When being separated on frame, the tin 514 in the frame ends 512 may be carried over forming tin silk.
And in the present invention, with reference to shown in Fig. 6, although the lead frame 410 is corrosion lead frame
410, there is burr on the side of its frame ends 412, but due on the subregion of frame ends 412
Flash 413 is coated with, without by all upper metal levels of plating, therefore in the chip product 420 from described
When being separated on lead frame 410, tin silk can't be formed.
In one embodiment, can be separated from the lead frame 410 according to the chip product 420
Direction out, sets particular location of the gas groove on the plastic package die.If specifically, institute
State chip product 420 to be separated from the lead frame 410 downwards, then the exhaust groove is set
The lower surface of the frame ends 412 towards the lead frame 410 put, such as, the exhaust groove sets
It is placed at the position of close described frame ends 412 of the lower impressions of the plastic package die.If the chip
Product 420 is separated from the lead frame 410 upwards, then the face that the exhaust groove is set
To the upper surface of the frame ends 412 of the lead frame 410.
The scheme for solving tin silk problem in the present invention, easy to operate, expense is low, cycle is short, and chip is produced
Product have no effect in itself, and are not related to any alteration problems of client.
Described above fully discloses specific embodiment of the invention.It is pointed out that being familiar with being somebody's turn to do
Any change that the technical staff in field is done to specific embodiment of the invention is all without departing from power of the invention
The scope of sharp claim.Correspondingly, the scope of claim of the invention is also not limited only to foregoing tool
Body implementation method.
Claims (7)
1. a kind of chip packaging method, it is characterised in that it includes：
Lead frame is provided, the lead frame includes that island area, lead terminal, frame ends and connection are described
Lead terminal and company's muscle portion in island area；
Chip is placed in the island area of the lead frame；
Bonding line is connected between the pad of the chip and corresponding lead terminal by bonding technology；
By plastic package die formed plastic-sealed body with by the chip, bonding line and part lead frame plastic packaging in institute
State in plastic-sealed body, the plastic-sealed body includes the plastic-sealed body end engaged with the frame ends；
Layer of metal is electroplated being exposed on the external leadframe portion of the plastic packaging；
Company's muscle portion of the lead frame is cut off to form chip product, now the chip product is by the frame
Frame end portion supports；With
The chip product is separated from the lead frame；
Wherein, the position of the close described frame ends of the plastic package die sets exhaust groove, by institute
Plastic package die is stated when carrying out plastic packaging from the exhaust groove discharge part flash, this part flash is covered in described
On the subregion of frame ends.
2. chip packaging method according to claim 1, it is characterised in that：The lead frame be by
What etching process was fabricated by.
3. chip packaging method according to claim 1, it is characterised in that：The depth of the exhaust groove
Spend for 0.010mm to 0.030mm.
4. chip packaging method according to claim 1, it is characterised in that：The width of the exhaust groove
Spend 1/4 to 1/3 of the width for the plastic-sealed body.
5. chip packaging method according to claim 1, it is characterised in that：The one of the plating formation
Layer metal is one layer of tin.
6. chip packaging method according to claim 1, it is characterised in that：According to the chip product
The direction separated from the lead frame, sets the gas groove specific on the plastic package die
Position.
7. chip packaging method according to claim 1, it is characterised in that：The exhaust groove is set
In the lower impressions of the plastic package die.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027882.1A CN106935518B (en) | 2015-12-31 | 2015-12-31 | Chip packaging method |
| PCT/CN2016/112612 WO2017114411A1 (en) | 2015-12-31 | 2016-12-28 | Chip packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027882.1A CN106935518B (en) | 2015-12-31 | 2015-12-31 | Chip packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106935518A true CN106935518A (en) | 2017-07-07 |
| CN106935518B CN106935518B (en) | 2019-04-12 |
Family
ID=59225643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511027882.1A Active CN106935518B (en) | 2015-12-31 | 2015-12-31 | Chip packaging method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106935518B (en) |
| WO (1) | WO2017114411A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109003957A (en) * | 2018-09-18 | 2018-12-14 | 江苏捷捷微电子股份有限公司 | The preparation method of SOT-89/223-2L lead frame and two leg structures |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321129A (en) * | 2018-03-30 | 2018-07-24 | 深圳赛意法微电子有限公司 | The packaging method and its package module of power device, lead frame |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101442035B (en) * | 2008-12-14 | 2011-03-16 | 天水华天科技股份有限公司 | Flat non down-lead encapsulation piece and method for producing the same |
| CN102403295B (en) * | 2010-09-07 | 2014-08-06 | 万国半导体股份有限公司 | Semiconductor packaging through metallic bonding and method for same |
| KR101398016B1 (en) * | 2012-08-08 | 2014-05-30 | 앰코 테크놀로지 코리아 주식회사 | Lead frame package and manufacturing method thereof |
-
2015
- 2015-12-31 CN CN201511027882.1A patent/CN106935518B/en active Active
-
2016
- 2016-12-28 WO PCT/CN2016/112612 patent/WO2017114411A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109003957A (en) * | 2018-09-18 | 2018-12-14 | 江苏捷捷微电子股份有限公司 | The preparation method of SOT-89/223-2L lead frame and two leg structures |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106935518B (en) | 2019-04-12 |
| WO2017114411A1 (en) | 2017-07-06 |
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