CN208796989U - Ultrathin stamp-mounting-paper diode frame - Google Patents
Ultrathin stamp-mounting-paper diode frame Download PDFInfo
- Publication number
- CN208796989U CN208796989U CN201821732974.9U CN201821732974U CN208796989U CN 208796989 U CN208796989 U CN 208796989U CN 201821732974 U CN201821732974 U CN 201821732974U CN 208796989 U CN208796989 U CN 208796989U
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- China
- Prior art keywords
- chassis base
- frame
- mounting
- plate body
- ultrathin
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Abstract
Ultrathin stamp-mounting-paper diode frame.It is related to photovoltaic art, more particularly to ultrathin stamp-mounting-paper diode frame.It is simple to provide a kind of structure, facilitates processing, connects reliable ultrathin stamp-mounting-paper diode frame.Including chassis base and frame pin, the chassis base is identical with the thickness of frame pin, spacing is equipped between the chassis base and frame pin, the inside of the chassis base is the settlement for chip placement, the frame pin in " mountain " font, including plate body and three pins being located on the outside of plate body, the plate body is towards chip placing area；The plate body is connected with the chip on settlement by wire jumper.The utility model ensure that the effect of welding, be less prone to rosin joint phenomenon, improve product quality.
Description
Technical field
The utility model relates to photovoltaic arts, more particularly to ultrathin stamp-mounting-paper diode frame.
Background technique
With greatly developing for photovoltaic diode, the type of terminal box also becomes more and more, along with the limitation of cost,
So that people are also increasingly stringenter the performance requirement of diode.Traditional product is mainly made by axial direction and TO-263 series of products
With since the thickness of product ontology limits, the cost of terminal box, which is reduced, certain inhibition, becomes this field skill
Art personnel technical problem urgently to be resolved.
State Intellectual Property Office is CN105227129B, entitled " high thermal conductivity in the notification number of 2017.11.28 days bulletins
Patch bypass " diode, bonding area is big, has better heat dissipation performance, improves service life.However, its exist with
Lower problem: a, frame patch form step integral structure by thin slice and sheet, and work in-process, punching press difficulty is big, at high cost；b,
As shown in figure 5, wire jumper welding is welded using 3 point contacts, is easily deformed, not easily-controllable since its pin (i.e. three foot wire jumpers 7) separates
Flatness processed, in this way, being wherein easy to appear rosin joint, technique controlling difficulty is big.
Utility model content
The utility model facilitates processing, connects reliable ultrathin patch in view of the above problems, to provide a kind of structure simple
Piece diode frame.
The technical solution of the utility model is: including chassis base and frame pin, the chassis base and frame pin
Thickness it is identical, spacing is equipped between the chassis base and frame pin, the inside of the chassis base is for placing core
The settlement of piece, the frame pin are in " mountain " font, including plate body and three pins being located on the outside of plate body, the plate body court
To chip placing area；
The plate body is connected with the chip on settlement by wire jumper.
The thickness of the chassis base is lower than 0.4mm.
The chassis base is equipped with a pair and crosses glue hole.
The chassis base and frame pin are copper.
The wire jumper is aluminium strip.
The utility model at work, the thickness of chassis base is carried out thinned, keeps it identical with the thickness of frame pin,
Facilitate processing, ensure that the flatness of frame；Meanwhile frame pin being separately provided, frame pin is set with chassis base interval
It sets, is welded to connect by aluminium strip, in this way, only need to can realize connection by two-point contact, ensure that the effect of welding, be not easy
There is rosin joint phenomenon, improves product quality.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model,
Fig. 2 is the package structure diagram of Fig. 1,
Fig. 3 is the schematic diagram of internal structure of Fig. 1,
Fig. 4 is the structural schematic diagram of the double frame of copper strips,
Fig. 5 is the structural schematic diagram of the prior art；
1 is chassis base in figure, and 10 be settlement, and 2 be frame pin, and 21 be ontology, and 22 be pin, and 3 be chip, and 4 are
Wire jumper, 5 be glue hole, and 6 be plastic-sealed body, and 7 be three foot wire jumpers.
Specific embodiment
The utility model is as shown in Figure 1-3, include chassis base 1 and frame pin 2, the chassis base and frame pin
Thickness it is identical, spacing is equipped between the chassis base and frame pin, the inside of the chassis base is for placing core
The settlement 10 of piece 3, the frame pin are in " mountain " font, including plate body 21 and three pins 22 being located on the outside of plate body, institute
Plate body is stated towards chip placing area 10；
Chip on the plate body and settlement is connected by wire jumper 4.
The utility model at work, the thickness of chassis base is carried out thinned, keeps it identical with the thickness of frame pin,
Facilitate processing, ensure that the flatness of frame；Meanwhile frame pin being separately provided, frame pin is set with chassis base interval
It sets, is welded to connect by aluminium strip, in this way, only need to can realize connection by two-point contact, ensure that the effect of welding, be not easy
There is rosin joint phenomenon, improves product quality.
Frame pin is arranged to plate body and three pins are integrally formed, facilitates processing；Meanwhile it only need to be by aluminium strip connecting plate
Body facilitates processing.Three pins are connected, and keep same plane, weld easily controllable.Finally, passing through plastic-sealed body 6 for frame
Bottom plate and frame pin carry out plastic packaging.
The thickness of the chassis base 1 is lower than 0.4mm.It is carried out by the thickness to chassis base thinned, reduces cost, just
In processing.In this way, chassis base and frame pin can facilitate processing by copper strips punch forming.
The chassis base is equipped with a pair and crosses glue hole 5.In this way, the bond strength of reinforced frame bottom plate and plastic packaging material, even
It connects reliably, improves service life.
The chassis base and frame pin be it is copper, convenient for by copper strips punch forming, processing is simple, guarantee that frame is whole
Body flatness.
The wire jumper 4 is aluminium strip, facilitates processing, at low cost.
As shown in figure 4, processing is simple with normal copper strips punch forming after being thinned, guarantee frame flatness.Double life
Production efficiency is double, and material/equipment overhead cost is low.
Claims (5)
1. ultrathin stamp-mounting-paper diode frame, which is characterized in that including chassis base and frame pin, the chassis base and
The thickness of frame pin is identical, and spacing is equipped between the chassis base and frame pin, and the inside of the chassis base is to use
In the settlement of chip placement, the frame pin is in " mountain " font, including plate body and three pins being located on the outside of plate body, institute
Plate body is stated towards chip placing area；
The plate body is connected with the chip on settlement by wire jumper.
2. ultrathin type stamp-mounting-paper diode frame according to claim 1, which is characterized in that the thickness of the chassis base
Lower than 0.4mm.
3. ultrathin type stamp-mounting-paper diode frame according to claim 1, which is characterized in that the chassis base is equipped with
A pair crosses glue hole.
4. ultrathin type stamp-mounting-paper diode frame according to claim 1, which is characterized in that the chassis base and frame
Pin is copper.
5. ultrathin type stamp-mounting-paper diode frame according to claim 1, which is characterized in that the wire jumper is aluminium strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821732974.9U CN208796989U (en) | 2018-10-24 | 2018-10-24 | Ultrathin stamp-mounting-paper diode frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821732974.9U CN208796989U (en) | 2018-10-24 | 2018-10-24 | Ultrathin stamp-mounting-paper diode frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208796989U true CN208796989U (en) | 2019-04-26 |
Family
ID=66212202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821732974.9U Active CN208796989U (en) | 2018-10-24 | 2018-10-24 | Ultrathin stamp-mounting-paper diode frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208796989U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119397A (en) * | 2018-10-24 | 2019-01-01 | 扬州扬杰电子科技股份有限公司 | A kind of ultrathin type stamp-mounting-paper diode frame |
-
2018
- 2018-10-24 CN CN201821732974.9U patent/CN208796989U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119397A (en) * | 2018-10-24 | 2019-01-01 | 扬州扬杰电子科技股份有限公司 | A kind of ultrathin type stamp-mounting-paper diode frame |
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