CN202633277U - Novel lead wire framework - Google Patents
Novel lead wire framework Download PDFInfo
- Publication number
- CN202633277U CN202633277U CN 201220152344 CN201220152344U CN202633277U CN 202633277 U CN202633277 U CN 202633277U CN 201220152344 CN201220152344 CN 201220152344 CN 201220152344 U CN201220152344 U CN 201220152344U CN 202633277 U CN202633277 U CN 202633277U
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- CN
- China
- Prior art keywords
- pin
- lead wire
- novel lead
- muscle
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a novel lead wire framework, comprising a plurality of framework units horizontally arranged side by side and being in series connection by a middle bar and a lower bar. Each framework unit comprises a radiating zone, a chip zone and a pin zone; the upper side of the chip zone is in connection with the radiating zone provided with a radiating hole; the lower side of the chip zone is in connection with the pin zone; the pin zone comprises left and right pins and an intermediate pin which have intermediate parts and lower parts respectively traversed and connected by an intermediate bar and a lower bar; the left and right pins are symmetrically arranged on two sides of the intermediate pin; an upper end of any pin of the left and right pins is in connection with the chip zone; and the other pin of the left and right pins is in connection with a welding part. The novel lead wire framework has the characteristics of a simple structure, convenient use, strong adherence, good product quality and high safety performance.
Description
Technical field
The utility model relates to a kind of semiconductor element, relates in particular to a kind of novel lead wire framework.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop; It has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority, and lead frame is a basic material important in the electronics and information industry.Lead frame need utilize resin plastic-sealed chip to be fixed into holistic half guiding element at its chip region surface mount chip again.Traditional die portion is a planar structure, adopts the strip plating mode, stays the little solder joint of out-of-flatness protrusion easily, can produce friction between when lead frame is stacked together, and causes the chip section plating area to produce and scratches, and influences product quality; The lead frame chip region carries and is connected chip, and chip normally is bonded to chip region, chip region smooth surface; When bonding silver slurry dropped on the chip region, chip region and chip chamber were prone to residual air, behind the resin-encapsulated lead frame; Product work heating makes resin, air thermal expansion, because both thermal coefficient of expansions are different, thereby damages product; And the ganoid lead frame adherence of resin-encapsulated is not strong, and obscission is peeled off in easy generation, normal, the safe handling of influence; When single frame unit cutting, integrally-built connecting plate excision operating difficulties, waste time and energy, be prone to cause lead frame damage and distortion simultaneously, can't use.
Summary of the invention
In order to address the above problem, it is a kind of simple in structure, easy to use that the utility model provides, and adherence is strong, good product quality, the lead frame of the chip area band groove that security performance is high.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of novel lead wire framework; By a plurality of horizontal Tiles be provided with several frame units through in muscle compose in series with following muscle, frame unit comprises radiating area, chip region and pin area, chip region top connection radiating area; Radiating area is provided with the heat radiation through hole; The chip region below connects pin area, it is characterized in that: said pin area comprises middle part and bottom respectively by the left and right pin and the middle pin of middle muscle and following muscle cross-under, pin both sides in the middle of left and right pin is symmetricly set in; Connection-core section, arbitrary pin upper end in the left and right pin, another pin connects weld part in the left and right pin.
Further, said radiating area top margin is provided with the above step edge of one deck.
Further, said step edge is towards the radiating area front or the back side.
Further, the step edge zero lap that said heat radiation through hole and one deck are above, the heat radiation through hole overlaps with the above step edge of one deck, or the step edge more than heat radiation through hole and one deck is overlapping fully.
Further, said chip region is provided with the above groove identical with contained chip outline of a circle.
Further, said chip region plane is lower than pin area plane 1-2mm.
Further, said down muscle is provided with the through hole with the corresponding setting of middle pin of the some frame units in a plurality of intervals.
Further, said muscle down is provided with and faces the corresponding gap in center between frame unit mutually.
Adopt above technical characterictic, the beneficial effect of the utility model is:
1, chip region is lower than pin area, in the time of can guaranteeing to stack lead frame, reduces friction between layer and the layer, and chip region can not produce scuffing, advances to go on foot and improves product quality;
2, the step edge on radiating area top when encapsulating lead, can increase the adherence between strong encapsulating material of end and lead frame, prevents that encapsulation from coming off, and guarantees Stability Analysis of Structures, good product quality;
3, radiating area is provided with the heat radiation through hole, increases the resin-encapsulated contact area, improves adherence and radiating efficiency, further increases the service life;
4, muscle is provided with gap down, when the segmentation framework unit, is convenient to operation, and is time saving and energy saving, increases work efficiency, and guarantees installation quality simultaneously.
Description of drawings
Accompanying drawing 1 is the structural representation of the utility model;
Accompanying drawing 2 is accompanying drawing 1 left views.
In the accompanying drawing: radiating area 1, heat radiation through hole 11, step edge 12, chip region 2, groove 21, pin area 3, middle pin 31, left side pin 32, right side pin 33, weld zone 34, middle muscle 4, following muscle 5, through hole 6, gap 7.
Embodiment
Below in conjunction with embodiment shown in the drawings the technical scheme of the utility model is done following detailed description the in detail:
Fig. 1, shown in 2; A kind of novel lead wire framework by a plurality of horizontal Tiles be provided with several frame units through in muscle 4 compose in series with following muscle 5; Each frame unit comprises radiating area 1, chip region 2 and pin area 3, and chip region 2 tops connect radiating area 1, and radiating area 1 is provided with heat radiation through hole 11; Radiating area 1 top margin is provided with the above step edge 12 towards the radiating area front or the back side of one deck; The above step edge zero lap of heat radiation through hole and one deck, or the heat radiation through hole overlaps with the above step edge of one deck, or the step edge of dispelling the heat more than through hole and one deck is overlapping fully; Chip region 2 is provided with the above groove 21 identical with contained chip outline of a circle, and chip region 2 planes are lower than pin area 3 plane 1-2mm; Chip region 2 belows connect pin area 3; Pin area comprises that middle part and bottom are respectively by the left and right pin 32,33 and the middle pin 31 of middle muscle 4 and following muscle 5 cross-under; Pin both sides in the middle of left and right pin is symmetricly set in, connection-core section, arbitrary pin upper end 2 in the left and right pin, another pin connects weld part 34 in the left and right pin; Following muscle 5 is provided with the through hole 6 with the corresponding setting of middle pin of the some frame units in a plurality of intervals, and following muscle 5 is provided with and faces the corresponding gap 7 in center between frame unit mutually.
What should explain at last is: above embodiment only in order to the explanation the utility model and and the described technical scheme of unrestricted the utility model; Therefore, although this specification has carried out detailed explanation to the utility model with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the utility model; And all do not break away from the technical scheme and the improvement thereof of the spirit and the scope of the utility model, and it all should be encompassed in the claim scope of the utility model.
Claims (8)
1. novel lead wire framework; By a plurality of horizontal Tiles be provided with several frame units through in muscle compose in series with following muscle, frame unit comprises radiating area, chip region and pin area, chip region top connection radiating area; Radiating area is provided with the heat radiation through hole; The chip region below connects pin area, it is characterized in that: said pin area comprises middle part and bottom respectively by the left and right pin and the middle pin of middle muscle and following muscle cross-under, pin both sides in the middle of left and right pin is symmetricly set in; Connection-core section, arbitrary pin upper end in the left and right pin, another pin connects weld part in the left and right pin.
2. a kind of novel lead wire framework according to claim 1 is characterized in that: said radiating area top margin is provided with the above step edge of one deck.
3. a kind of novel lead wire framework according to claim 2, it is characterized in that: said step edge is towards the radiating area front or the back side.
4. according to claim 2 or 3 described a kind of novel lead wire frameworks; It is characterized in that: the step edge zero lap that said heat radiation through hole and one deck are above; Or the above step edge of heat radiation through hole and one deck overlaps, or the step edge more than heat radiation through hole and one deck is overlapping fully.
5. a kind of novel lead wire framework according to claim 1 is characterized in that: said chip region is provided with the above groove identical with contained chip outline of a circle.
6. according to claim 1 or 5 described a kind of novel lead wire frameworks, it is characterized in that: said chip region plane is lower than pin area plane 1-2mm.
7. a kind of novel lead wire framework according to claim 1 is characterized in that: said down muscle is provided with the through hole with the corresponding setting of middle pin of the some frame units in a plurality of intervals.
8. according to claim 1 or 7 described a kind of novel lead wire frameworks, it is characterized in that: said muscle down is provided with and faces the corresponding gap in center between frame unit mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220152344 CN202633277U (en) | 2012-04-12 | 2012-04-12 | Novel lead wire framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220152344 CN202633277U (en) | 2012-04-12 | 2012-04-12 | Novel lead wire framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202633277U true CN202633277U (en) | 2012-12-26 |
Family
ID=47386435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220152344 Expired - Fee Related CN202633277U (en) | 2012-04-12 | 2012-04-12 | Novel lead wire framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202633277U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633054A (en) * | 2013-04-19 | 2014-03-12 | 汕头华汕电子器件有限公司 | Forward series-connection diode frame structure |
| CN108039342A (en) * | 2017-12-01 | 2018-05-15 | 泰州友润电子科技股份有限公司 | A kind of improved TO-220D7L lead frames |
-
2012
- 2012-04-12 CN CN 201220152344 patent/CN202633277U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633054A (en) * | 2013-04-19 | 2014-03-12 | 汕头华汕电子器件有限公司 | Forward series-connection diode frame structure |
| CN103633054B (en) * | 2013-04-19 | 2016-12-28 | 汕头华汕电子器件有限公司 | A kind of diode frame structure of forward series connection |
| CN108039342A (en) * | 2017-12-01 | 2018-05-15 | 泰州友润电子科技股份有限公司 | A kind of improved TO-220D7L lead frames |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Taizhou Yourun Electronic Co., Ltd. Assignor: Zhang Xuan Contract record no.: 2013320000563 Denomination of utility model: Novel lead frame Granted publication date: 20121226 License type: Exclusive License Record date: 20130619 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20150412 |
|
| EXPY | Termination of patent right or utility model |