CN102637668A - Novel lead frame - Google Patents
Novel lead frame Download PDFInfo
- Publication number
- CN102637668A CN102637668A CN 201210105886 CN201210105886A CN102637668A CN 102637668 A CN102637668 A CN 102637668A CN 201210105886 CN201210105886 CN 201210105886 CN 201210105886 A CN201210105886 A CN 201210105886A CN 102637668 A CN102637668 A CN 102637668A
- Authority
- CN
- China
- Prior art keywords
- pin
- muscle
- radiating area
- lead wire
- novel lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a novel lead frame. The lead frame is formed in a way that a plurality of frame units which are horizontally arranged side by side are connected in series by a middle rib and a lower rib, wherein each frame unit comprises a radiation area, a chip area, a middle pin and left and right pins respectively arranged on the two sides of the middle pin; the radiation area is connected above the chip area; a radiation through hole is arranged on the radiation area; the upper end of the middle pin is connected below the chip area; the lower ends of the middle part, left and right pins are connected on the lower rib; the middle parts of the middle, left and right pins are connected in series by the middle rib; and the radiation through hole faces the top edge or side edge of the radiation area and is open. The lead frame has the advantages of simple structure, strong adherence, good product quality and high safety performance and is convenient to use.
Description
Technical field
The present invention relates to a kind of semiconductor element, relate in particular to a kind of novel lead wire framework.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop; It has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority, and lead frame is a basic material important in the electronics and information industry.Lead frame need utilize resin plastic-sealed chip to be fixed into holistic half guiding element at its chip region surface mount chip again.Traditional die portion is a planar structure, adopts the strip plating mode, stays the little solder joint of out-of-flatness protrusion easily, can produce friction between when lead frame is stacked together, and causes the chip section plating area to produce and scratches, and influences product quality; The radiating area of connection-core section plays thermolysis, and after resin-encapsulated, radiating area separates resin-encapsulated, and whole adherence is not strong, and obscission is peeled off in easy generation, normal, the safe handling of influence; When single frame unit cutting, integrally-built connecting plate excision operating difficulties, waste time and energy, be prone to cause lead frame damage and distortion simultaneously, can't use.
Summary of the invention
In order to address the above problem, the invention provides a kind of simple in structurely, easy to use, adherence is strong, good product quality, the lead frame of the chip area band groove that security performance is high.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of novel lead wire framework; By a plurality of horizontal Tiles be provided with several frame units through in muscle compose in series with following muscle; Frame unit comprises radiating area, chip region, middle pin and lays respectively at left side, the right side pin of middle pin both sides, chip region top connection radiating area, and radiating area is provided with the heat radiation through hole; Pin upper end in the middle of the chip region below connects; Middle pin lower end and left side, pin lower end, right side all are connected in down on the muscle, and middle pin middle part and left side, right side pin middle part are by middle muscle serial connection, and it is characterized in that: said heat radiation through hole is opening-like towards radiating area top margin or side.
Further, said heat radiation through hole is the semicircle opening towards the radiating area top margin, and the opening both sides of radiating area top margin all are connected with pin.
Further, said left side pin and muscle and its terminal weld zone that is connected during stretch out the top of right side pin.
Further, said chip region plane is lower than pin area plane 1-3mm.
Further, the said pin plane of going up is below or above radiating area plane 1-2mm.
Further, said muscle down is provided with the through hole of corresponding middle pin.
Further, said muscle down is provided with and faces the corresponding gap in center between two frame units mutually.
Adopt above technical characterictic, the invention has the beneficial effects as follows:
1, chip region is lower than pin area, in the time of can guaranteeing to stack lead frame, reduces friction between layer and the layer, and chip region can not produce scuffing, advances to go on foot and improves product quality;
2, the step edge of chip region dual-side when encapsulating lead, can strengthen the adherence between encapsulating material and lead frame, prevents that encapsulation from coming off, and guarantees Stability Analysis of Structures, good product quality;
3, radiating area is provided with the heat radiation through hole of opening towards top margin or side, increases the resin-encapsulated contact area, improves encapsulation adherence and radiating efficiency, further increases the service life;
4, muscle is provided with gap down, when the segmentation framework unit, is convenient to operation, and is time saving and energy saving, increases work efficiency, and guarantees installation quality simultaneously.
Description of drawings
Accompanying drawing 1 is a structural representation of the present invention.
Accompanying drawing 2 is accompanying drawing 1 left views.
In the accompanying drawing: radiating area 1, heat radiation through hole 11, last pin 12, chip region 2, pin area 3, middle pin 31, left side pin 32, right side pin 33, weld zone 34, middle muscle 4, following muscle 5, through hole 6, gap 7.
Embodiment
Below in conjunction with embodiment shown in the drawings technical scheme of the present invention is done following detailed description the in detail:
Fig. 1, shown in 2; A kind of novel lead wire framework by a plurality of horizontal Tiles be provided with several frame units through in muscle 4 compose in series with following muscle 5; Each frame unit comprises radiating area 1, chip region 2, middle pin 31 and lays respectively at left side, the right side pin 32,33 of middle pin both sides; Chip region 2 tops connect radiating area 1; Radiating area 1 is provided with towards radiating area top margin or the opening-like heat radiation through hole 11 of side, and heat radiation through hole 11 opening both sides all are connected with pin 12, and last pin 12 planes are below or above radiating area 1 plane 1-2mm; Chip region 2 planes are lower than pin area 3 plane 1-3mm; Pin 31 upper ends in the middle of chip region 2 belows connect; Middle pin lower end and left side, pin lower end, right side all are connected in down on the muscle 5, and middle pin middle part and left side, right side pin middle part are by middle muscle 4 serial connections, and the left side pin stretches out middle muscle and its terminal weld zone 34 that is connected with the top of right side pin; Following muscle 5 is provided with the through hole 6 of corresponding middle pin 31, and following muscle 5 is provided with and faces the corresponding gap 7 in center between two frame units mutually.
What should explain at last is: above embodiment only in order to the explanation the present invention and and unrestricted technical scheme described in the invention; Therefore, although this specification has carried out detailed explanation to the present invention with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the present invention; And all do not break away from the technical scheme and the improvement thereof of the spirit and scope of the present invention, and it all should be encompassed in the claim scope of the present invention.
Claims (7)
1. novel lead wire framework; By a plurality of horizontal Tiles be provided with several frame units through in muscle compose in series with following muscle; Frame unit comprises radiating area, chip region, middle pin and lays respectively at left side, the right side pin of middle pin both sides, chip region top connection radiating area, and radiating area is provided with the heat radiation through hole; Pin upper end in the middle of the chip region below connects; Middle pin lower end and left side, pin lower end, right side all are connected in down on the muscle, and middle pin middle part and left side, right side pin middle part are by middle muscle serial connection, and it is characterized in that: said heat radiation through hole is opening-like towards radiating area top margin or side.
2. a kind of novel lead wire framework according to claim 1 is characterized in that: said heat radiation through hole is the semicircle opening towards the radiating area top margin, and the opening both sides of radiating area top margin all are connected with pin.
3. a kind of novel lead wire framework according to claim 1 is characterized in that: said left side pin stretches out middle muscle and its terminal weld zone that is connected with the top of right side pin.
4. a kind of novel lead wire framework according to claim 1 is characterized in that: said chip region plane is lower than pin area plane 1-3mm.
5. a kind of novel lead wire framework according to claim 1 is characterized in that: the said pin plane of going up is below or above radiating area plane 1-2mm.
6. a kind of novel lead wire framework according to claim 1 is characterized in that: said muscle down is provided with the through hole of corresponding middle pin.
7. a kind of novel lead wire framework according to claim 1 is characterized in that: said muscle down is provided with and faces the corresponding gap in center between two frame units mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210105886 CN102637668A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210105886 CN102637668A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102637668A true CN102637668A (en) | 2012-08-15 |
Family
ID=46622011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210105886 Pending CN102637668A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102637668A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531568A (en) * | 2013-10-28 | 2014-01-22 | 沈健 | Full-plastic package lead frame with top opening |
| CN103617987A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic encapsulated lead frame for low-power electric appliances |
| CN103617981A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame with opened heads |
-
2012
- 2012-04-12 CN CN 201210105886 patent/CN102637668A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531568A (en) * | 2013-10-28 | 2014-01-22 | 沈健 | Full-plastic package lead frame with top opening |
| CN103617987A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic encapsulated lead frame for low-power electric appliances |
| CN103617981A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame with opened heads |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120815 |