CN103617981A - Plastic package lead frame with opened heads - Google Patents
Plastic package lead frame with opened heads Download PDFInfo
- Publication number
- CN103617981A CN103617981A CN201310550083.7A CN201310550083A CN103617981A CN 103617981 A CN103617981 A CN 103617981A CN 201310550083 A CN201310550083 A CN 201310550083A CN 103617981 A CN103617981 A CN 103617981A
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- CN
- China
- Prior art keywords
- lead frame
- heads
- matrix
- opened
- plastic package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a plastic package lead frame with opened heads. The plastic package lead frame with the opened heads is composed of a plurality of lead frame units in a single row. All the lead frame units are connected mutually through connecting ribs, each lead frame unit comprises a base body and terminal pins, the connecting portions of the base bodies and the corresponding terminal pins are bent, an arc-shaped notch is formed in the head of each base body, the radius of the arc-shaped notches is 2.5+/-0.05mm, the connecting pins are provided with bonding areas, the bonding areas are connected with the base bodies, the base bodies are provided with chip carrying areas, each chip carrying area is divided into a left piece and a right piece, and the lead frame units are provided with locating holes. The frame is in a full-encapsulating mode, each chip carrying area is divided into two pieces, the bonding areas of the terminal pins on the two sides are connected with the base bodies, grounding wires do not need to be connected to the two sides, multiple driving wires are arranged in the middle and share one same lead wire, the space of a circuit board is saved, production cost is saved, the heads are designed into the notch form, resistance in injection molding is reduced, and wire breakage due to vibration is prevented.
Description
Technical field
The present invention relates to a kind of plastic packaging lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of plastic packaging lead frame.
In order to solve the problems of the technologies described above, the invention provides a kind of plastic packaging lead frame of head opening, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, described matrix head is provided with arc notch, and the radius of arc notch is 2.5 ± 0.05mm.
As a further improvement on the present invention, described terminal pin is provided with bonding region, and bonding region is connected with matrix.
As a further improvement on the present invention, described matrix is provided with slide glass district, and slide glass is divided into two of left and right.
As a further improvement on the present invention, described lead frame unit is provided with location hole.
Adopt said structure, its beneficial effect is: this framework is total incapsulation form, is divided into Liang Pian slide glass district, and the bonding region of both sides terminal pin is connected with matrix, without earth connection in both sides, many drive wires are beaten in centre, jointly use same lead-in wire, save the space of wiring board, save production cost, head design becomes breach form, and the resistance while reducing injection moulding, prevents from shaking fracture of wire.
Accompanying drawing explanation
Fig. 1 is the structural representation of plastic packaging lead frame of the present invention.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-arc notch, ，6-slide glass district, 5-bonding region, 7-location hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Figure 1, a kind of plastic packaging lead frame of head opening, by 1 single composition of a plurality of lead frames unit, lead frame unit 1 width is 11.405 ± 0.025mm, between each lead frame unit 1, by dowel, interconnect, lead frame unit 1 comprises matrix 2 and terminal pin 3, matrix 1 and terminal pin 3 thickness are 0.6 ± 0.015mm, bend in matrix 2 and terminal pin 3 junctions, make matrix 2 and terminal pin 3 planes at a distance of 1.8 ± 0.05mm, described matrix 2 heads are provided with arc notch 4, the radius of arc notch 4 is 2.5 ± 0.05mm, described terminal pin 3 is provided with bonding region 5, bonding region 5 is connected with matrix 2, described matrix 2 is provided with slide glass district 6, slide glass district 6 is divided into two of left and right, described lead frame unit 1 is provided with location hole 7, location hole 7 diameters are 2.0 ± 0.05mm.
This framework is total incapsulation form, be divided into Liang Pian slide glass district, the bonding region of both sides terminal pin is connected with matrix, and without earth connection, in both sides, many drive wires are beaten in centre, same lead-in wire of common use, the space of saving wiring board, saves production cost, and head design becomes breach form, resistance while reducing injection moulding, prevents from shaking fracture of wire.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (4)
1. the plastic packaging lead frame of a head opening, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, it is characterized in that: lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in matrix (2) and terminal pin (3) junction, described matrix (2) head is provided with arc notch (4), and the radius of arc notch (4) is 2.5 ± 0.05mm.
2. the plastic packaging lead frame of a kind of head opening according to claim 1, is characterized in that: described terminal pin (3) is provided with bonding region (5), and bonding region (5) are connected with matrix (2).
3. the plastic packaging lead frame of a kind of opening according to claim 1, is characterized in that: described matrix (2) is provided with slide glass district (6), and slide glass district (6) are divided into two of left and right.
4. the plastic packaging lead frame of a kind of head opening according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310550083.7A CN103617981A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with opened heads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310550083.7A CN103617981A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with opened heads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103617981A true CN103617981A (en) | 2014-03-05 |
Family
ID=50168684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310550083.7A Pending CN103617981A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with opened heads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617981A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928429A (en) * | 2014-03-28 | 2014-07-16 | 张轩 | Lead frame with split cooling fins |
| CN108807326A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of improved overloading type 3PF lead frames |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080076063A (en) * | 2007-02-14 | 2008-08-20 | 한미반도체 주식회사 | Lead frame for semiconductor package |
| CN102637668A (en) * | 2012-04-12 | 2012-08-15 | 张轩 | Novel lead frame |
| CN203205410U (en) * | 2013-04-27 | 2013-09-18 | 四川立泰电子有限公司 | Fully encapsulated lead frame for common anode diode device |
| CN103531568A (en) * | 2013-10-28 | 2014-01-22 | 沈健 | Full-plastic package lead frame with top opening |
| CN203617286U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame with head being opened |
-
2013
- 2013-11-08 CN CN201310550083.7A patent/CN103617981A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080076063A (en) * | 2007-02-14 | 2008-08-20 | 한미반도체 주식회사 | Lead frame for semiconductor package |
| CN102637668A (en) * | 2012-04-12 | 2012-08-15 | 张轩 | Novel lead frame |
| CN203205410U (en) * | 2013-04-27 | 2013-09-18 | 四川立泰电子有限公司 | Fully encapsulated lead frame for common anode diode device |
| CN103531568A (en) * | 2013-10-28 | 2014-01-22 | 沈健 | Full-plastic package lead frame with top opening |
| CN203617286U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame with head being opened |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928429A (en) * | 2014-03-28 | 2014-07-16 | 张轩 | Lead frame with split cooling fins |
| CN108807326A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of improved overloading type 3PF lead frames |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |