A kind of IDF type large matrix SOP14 lead frame structure
Technical field
The utility model relates to a kind of lead frame of integrated circuit encapsulation technology, particularly relates to the SOP14 lead frame.
Background technology
The encapsulation of SOP series integrated circuit is that biserial is SMD, and the pin number of plastic-sealed body both sides equates that as shown in Figure 1, respectively there are 7 lead-in wires 2 on the both sides on the basic island 1 of SOP14 lead frame.
As shown in Figure 2, domestic existing SOP14 encapsulation, every wire frame has only 5 rows, 14 row, and promptly every is 70.This SOP14 lead frame is rectangular, and two lead frame products wherein are that a product is close to the another product when the Y direction is arranged, and the centre-to-centre spacing of two product Y directions is 8.128mm.It is many that this structure consumes copper material, and production efficiency is not high yet.
The utility model content
The utility model technical problem to be solved is: a kind of IDF type large matrix SOP14 lead frame structure is provided, is used to solve the problem that material is too much, efficient is not high that existing SOP14 leadframe matrix bar consumes.
In order to solve above-mentioned technical problem; The utility model proposes a kind of IDF type large matrix SOP14 lead frame structure; Comprise lead frame, lead frame comprises lead-in wire and Ji Dao, and the two ends of lead-in wire are respectively the outer lead pin that exposes plastic-sealed body after the lead pin that is positioned at next door, basic island and the encapsulation; And all there are 7 lead-in wires on the Ji Dao both sides of lead frame, and the outer lead pin of first lead frame in two adjacent lead frames inserts in the gap between the outer lead pin of second lead frame, and their outer lead pin is staggered together.
Preferably: said Ji Dao is of a size of 60*60mil.
Preferably: the spacing of lead pin and Ji Dao is 0.288mm.This distance can reduce the consumption of bonding wire.
Preferably: on the lead pin around the Ji Dao, have coined area.
Preferably: on coined area, also be provided with silver-plated zone.
Preferably: said matrix is 12 rows, 20 row, totally 240 lead frames.
The beneficial effect of the utility model:
Compare prior art, the utility model has adopted the IDF structure, and the utilance that it has improved material has shortened the distance between the lead frame unit, makes them become compact more.Compact structure can be saved material, has also reduced cost simultaneously, on a leadframe matrix bar, can settle more lead frame, therefore also can enhance productivity.This lead frame is the indispensable material of SOP14 integrated circuit encapsulation, and the SOP14 packing forms is widely used in each adhesive integrated circuit, sends integrated circuit etc. like the TX-B signal.
Description of drawings
Fig. 1 is a kind of structure of prior art SOP14.
Fig. 2 is the structure chart of the leadframe matrix of prior art.
Fig. 3 is the structure chart of the utility model lead frame.
Fig. 4 is the structure chart of two adjacent lead frames of the utility model.
Fig. 5 is the part-structure figure of the utility model leadframe matrix.
Embodiment
The utility model provides a kind of IDF type large matrix SOP14 lead frame structure, comprises lead frame, and lead frame comprises lead-in wire and Ji Dao, and the two ends of lead-in wire are respectively the outer lead pin that exposes plastic-sealed body after the lead pin that is positioned at next door, basic island and the encapsulation; And all there are 7 lead-in wires on the Ji Dao both sides of lead frame, and the outer lead pin of first lead frame in two adjacent lead frames inserts in the gap between the outer lead pin of second lead frame, and their outer lead pin is staggered together.
Through embodiment the technical scheme of the utility model is described below, but protection scheme of the present invention is not limited to the protection range of following explanation.
IDF type large matrix is made up of a plurality of SOP14 lead frames.To structure shown in Figure 5, lead frame comprises lead-in wire 4 and basic island 3 referring to Fig. 3, and the two ends of lead-in wire 4 are respectively the outer lead pin 9 that exposes plastic-sealed body after the lead pin 10 that is positioned at next door, basic island and the encapsulation.The outer lead pin (being first outer lead pin 7 and second outer lead pin 8) of two adjacent lead frames (being first lead frame 5 and second lead frame 6) is staggered and is in the same place.First lead frame 5 and second lead frame 6 are and shift to install.
In one embodiment, Ji Dao is of a size of 60*60mil.In an optimal way, the spacing of lead pin and Ji Dao is 0.288mm.This distance can reduce the consumption of bonding wire.In another embodiment, on the lead pin around the Ji Dao, there is coined area, and on coined area, also is provided with silver-plated zone.
In one embodiment, matrix is 12 rows, 20 row, totally 240 lead frames; And at the symmetry axis of the lead frame that does not pass lead-in wire; Distance between the said symmetry axis of two adjacent lead frames (being called for short " axis ") is 6.1mm, and in the prior art, the distance between " axis " of adjacent two lead frames of lead frame of same specification is 8.128mm; It is thus clear that this structure can reduce the spacing between the lead frame unit, and very obvious.
In the face of saving copper material prior art and the utility model are compared down.
General SOP14 lead frame:
Volume is: 50.8*228.31*0.203=2354mm
3=2.354cm
3
Every product possessive volume: 2.354cm
3/ 70=0.033628cm
3/ only;
And the SOP14 lead frame of IDF structure large matrix:
Volume is: 83*269.6*0.203=4542.49mm
3=4.54249cm
3
Every product possessive volume: 4.5429cm
3/ 240=0.018927cm
3/ only;
Save material: 0.033628-0.018927/0.033628*100%=43.7%.