CN202423266U - IDF-type large-matrix SOP14 (small outline package 14) lead frame structure - Google Patents
IDF-type large-matrix SOP14 (small outline package 14) lead frame structure Download PDFInfo
- Publication number
- CN202423266U CN202423266U CN 201120490221 CN201120490221U CN202423266U CN 202423266 U CN202423266 U CN 202423266U CN 201120490221 CN201120490221 CN 201120490221 CN 201120490221 U CN201120490221 U CN 201120490221U CN 202423266 U CN202423266 U CN 202423266U
- Authority
- CN
- China
- Prior art keywords
- lead
- lead frame
- sop14
- matrix
- type large
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011159 matrix material Substances 0.000 title claims abstract description 24
- 238000005538 encapsulation Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract 3
- 230000008054 signal transmission Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 101001028722 Chironex fleckeri Toxin CfTX-B Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model provides an IDF-type large-matrix SOP14 (small outline package14) lead frame structure, which relates to the integrated circuit SOP technology and solves the problem that existing lead frame matrix bars consume too much materials but are low in efficiency. The IDF-type large-matrix SOP14 lead frame structure comprises lead frames, each of the lead frames comprises leads and a substrate, and two ends of each lead respectively serve as an inner lead pin beside the substrate and an outer lead pin which is exposed from a package body after package. Every seven leads are arranged on each of two sides of the substrate of the lead frame. The outer lead pins of the first lead frame of each two adjacent lead frames are inserted among gaps among the outer lead pins of the second lead frame so that the outer lead pins of the two adjacent lead frames are staggered together. The package device of the IDF-type large-matrix SOP14 lead frame structure can be applied to various integrated circuits, such as TX-8 signal transmission integrated circuits.
Description
Technical field
The utility model relates to a kind of lead frame of integrated circuit encapsulation technology, particularly relates to the SOP14 lead frame.
Background technology
The encapsulation of SOP series integrated circuit is that biserial is SMD, and the pin number of plastic-sealed body both sides equates that as shown in Figure 1, respectively there are 7 lead-in wires 2 on the both sides on the basic island 1 of SOP14 lead frame.
As shown in Figure 2, domestic existing SOP14 encapsulation, every wire frame has only 5 rows, 14 row, and promptly every is 70.This SOP14 lead frame is rectangular, and two lead frame products wherein are that a product is close to the another product when the Y direction is arranged, and the centre-to-centre spacing of two product Y directions is 8.128mm.It is many that this structure consumes copper material, and production efficiency is not high yet.
The utility model content
The utility model technical problem to be solved is: a kind of IDF type large matrix SOP14 lead frame structure is provided, is used to solve the problem that material is too much, efficient is not high that existing SOP14 leadframe matrix bar consumes.
In order to solve above-mentioned technical problem; The utility model proposes a kind of IDF type large matrix SOP14 lead frame structure; Comprise lead frame, lead frame comprises lead-in wire and Ji Dao, and the two ends of lead-in wire are respectively the outer lead pin that exposes plastic-sealed body after the lead pin that is positioned at next door, basic island and the encapsulation; And all there are 7 lead-in wires on the Ji Dao both sides of lead frame, and the outer lead pin of first lead frame in two adjacent lead frames inserts in the gap between the outer lead pin of second lead frame, and their outer lead pin is staggered together.
Preferably: said Ji Dao is of a size of 60*60mil.
Preferably: the spacing of lead pin and Ji Dao is 0.288mm.This distance can reduce the consumption of bonding wire.
Preferably: on the lead pin around the Ji Dao, have coined area.
Preferably: on coined area, also be provided with silver-plated zone.
Preferably: said matrix is 12 rows, 20 row, totally 240 lead frames.
The beneficial effect of the utility model:
Compare prior art, the utility model has adopted the IDF structure, and the utilance that it has improved material has shortened the distance between the lead frame unit, makes them become compact more.Compact structure can be saved material, has also reduced cost simultaneously, on a leadframe matrix bar, can settle more lead frame, therefore also can enhance productivity.This lead frame is the indispensable material of SOP14 integrated circuit encapsulation, and the SOP14 packing forms is widely used in each adhesive integrated circuit, sends integrated circuit etc. like the TX-B signal.
Description of drawings
Fig. 1 is a kind of structure of prior art SOP14.
Fig. 2 is the structure chart of the leadframe matrix of prior art.
Fig. 3 is the structure chart of the utility model lead frame.
Fig. 4 is the structure chart of two adjacent lead frames of the utility model.
Fig. 5 is the part-structure figure of the utility model leadframe matrix.
Embodiment
The utility model provides a kind of IDF type large matrix SOP14 lead frame structure, comprises lead frame, and lead frame comprises lead-in wire and Ji Dao, and the two ends of lead-in wire are respectively the outer lead pin that exposes plastic-sealed body after the lead pin that is positioned at next door, basic island and the encapsulation; And all there are 7 lead-in wires on the Ji Dao both sides of lead frame, and the outer lead pin of first lead frame in two adjacent lead frames inserts in the gap between the outer lead pin of second lead frame, and their outer lead pin is staggered together.
Through embodiment the technical scheme of the utility model is described below, but protection scheme of the present invention is not limited to the protection range of following explanation.
IDF type large matrix is made up of a plurality of SOP14 lead frames.To structure shown in Figure 5, lead frame comprises lead-in wire 4 and basic island 3 referring to Fig. 3, and the two ends of lead-in wire 4 are respectively the outer lead pin 9 that exposes plastic-sealed body after the lead pin 10 that is positioned at next door, basic island and the encapsulation.The outer lead pin (being first outer lead pin 7 and second outer lead pin 8) of two adjacent lead frames (being first lead frame 5 and second lead frame 6) is staggered and is in the same place.First lead frame 5 and second lead frame 6 are and shift to install.
In one embodiment, Ji Dao is of a size of 60*60mil.In an optimal way, the spacing of lead pin and Ji Dao is 0.288mm.This distance can reduce the consumption of bonding wire.In another embodiment, on the lead pin around the Ji Dao, there is coined area, and on coined area, also is provided with silver-plated zone.
In one embodiment, matrix is 12 rows, 20 row, totally 240 lead frames; And at the symmetry axis of the lead frame that does not pass lead-in wire; Distance between the said symmetry axis of two adjacent lead frames (being called for short " axis ") is 6.1mm, and in the prior art, the distance between " axis " of adjacent two lead frames of lead frame of same specification is 8.128mm; It is thus clear that this structure can reduce the spacing between the lead frame unit, and very obvious.
In the face of saving copper material prior art and the utility model are compared down.
General SOP14 lead frame:
Volume is: 50.8*228.31*0.203=2354mm
3=2.354cm
3
Every product possessive volume: 2.354cm
3/ 70=0.033628cm
3/ only;
And the SOP14 lead frame of IDF structure large matrix:
Volume is: 83*269.6*0.203=4542.49mm
3=4.54249cm
3
Every product possessive volume: 4.5429cm
3/ 240=0.018927cm
3/ only;
Save material: 0.033628-0.018927/0.033628*100%=43.7%.
Claims (6)
1. an IDF type large matrix SOP14 lead frame structure comprises lead frame, and lead frame comprises lead-in wire and Ji Dao, and the two ends of lead-in wire are respectively the outer lead pin that exposes plastic-sealed body after the lead pin that is positioned at next door, basic island and the encapsulation; It is characterized in that: all there are 7 lead-in wires on the Ji Dao both sides of lead frame, in the gap between the outer lead pin of second lead frame of outer lead pin insertion of first lead frame in two adjacent lead frames, their outer lead pin are staggered together.
2. a kind of IDF type large matrix SOP14 lead frame structure according to claim 1, it is characterized in that: said Ji Dao is of a size of 60*60mil.
3. a kind of IDF type large matrix SOP14 lead frame structure according to claim 1, it is characterized in that: the spacing of lead pin and Ji Dao is 0.288mm.
4. a kind of IDF type large matrix SOP14 lead frame structure according to claim 1 is characterized in that: on the lead pin around the Ji Dao, have coined area.
5. a kind of IDF type large matrix SOP14 lead frame structure according to claim 4 is characterized in that:
On coined area, also be provided with silver-plated zone.
6. a kind of IDF type large matrix SOP14 lead frame structure according to claim 1 is characterized in that: said matrix is 12 rows, 20 row, totally 240 lead frames.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120490221 CN202423266U (en) | 2011-11-29 | 2011-11-29 | IDF-type large-matrix SOP14 (small outline package 14) lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120490221 CN202423266U (en) | 2011-11-29 | 2011-11-29 | IDF-type large-matrix SOP14 (small outline package 14) lead frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202423266U true CN202423266U (en) | 2012-09-05 |
Family
ID=46747998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120490221 Expired - Lifetime CN202423266U (en) | 2011-11-29 | 2011-11-29 | IDF-type large-matrix SOP14 (small outline package 14) lead frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202423266U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104253103A (en) * | 2013-06-26 | 2014-12-31 | 深圳赛意法微电子有限公司 | Base-pin-staggering-mode-based lead frame structure and semiconductor device manufacturing method |
-
2011
- 2011-11-29 CN CN 201120490221 patent/CN202423266U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104253103A (en) * | 2013-06-26 | 2014-12-31 | 深圳赛意法微电子有限公司 | Base-pin-staggering-mode-based lead frame structure and semiconductor device manufacturing method |
| CN104253103B (en) * | 2013-06-26 | 2018-04-03 | 深圳赛意法微电子有限公司 | The staggeredly lead frame structure and method, semi-conductor device manufacturing method of pin |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Longgang District of Shenzhen City, Guangdong province 518111 streets of Pinghu Ping Industrial Zone a new avenue of Hengshun two to the third floor, building fifth room Patentee after: China Chippacking Technology Co.,Ltd. Address before: Longgang District of Shenzhen City, Guangdong province 518111 streets of Pinghu Ping Industrial Zone a new avenue of Hengshun two to the third floor, building fifth room Patentee before: Shenzhen Chippacking Technology Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20120905 |
|
| CX01 | Expiry of patent term | ||
| DD01 | Delivery of document by public notice |
Addressee: Patent of Qipai Technology Co.,Ltd. The person in charge Document name: Notice of expiration and termination of patent right |
|
| DD01 | Delivery of document by public notice |