CN101894822B - Lead frame band construction for semiconductor packaging - Google Patents
Lead frame band construction for semiconductor packaging Download PDFInfo
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- CN101894822B CN101894822B CN 201010187476 CN201010187476A CN101894822B CN 101894822 B CN101894822 B CN 101894822B CN 201010187476 CN201010187476 CN 201010187476 CN 201010187476 A CN201010187476 A CN 201010187476A CN 101894822 B CN101894822 B CN 101894822B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention discloses a lead frame band construction for semiconductor packaging, which is used for manufacturing small or square flat type packaging constructions. The lead frame band comprises at least two lead frame units, and the external lead foot parts of at least two adjacent lead frame units form alternate permutation in the space of the same alternate permutation area; thus, the lead frame band at least can omit a connection bracket in a traditional lead frame band construction, which is favorable for further and relatively improving the space utilization rate of the lead frame band and the arrangement density of the lead frame band unit under the condition of same width and length size of the lead frame band.
Description
[technical field]
The invention relates to a kind of lead frame band construction for semiconductor packaging; Particularly can improve the arranging density of conductive wire frame strip unit and the unit interval quantum of output of encapsulation process (units per hour, lead frame band construction for semiconductor packaging UPH) relevant for a kind of.
[background technology]
Now; The semiconductor packages industry is in order to satisfy various package requirements; Develop the packaging structure that various different types gradually; The silicon (chip) that is wherein formed by semiconductor silicon wafer (wafer) cutting normally utilizes routing (wire bonding) or projection suitable modes such as (bumping) to select to be fixed on lead frame (leadframe) or the substrate (substrate) earlier, then utilizes the packing colloid encapsulation to coat the protection silicon again, so can accomplish the basic framework of semiconductor packaging structure.At present; In order to meet the volume production demand; Normally on a conductive wire frame strip (leadframe strip), several lead frame unit are set; With procedures such as fixing, the electric connection of carrying out several chips simultaneously and sealings, unnecessary framework is removed in cutting more at last, accomplishes several and has the packaging structure of lead frame so that make simultaneously.
For example, please with reference to shown in Figure 1A, 1B and the 1C, it discloses a kind of existing little external form encapsulation, and (small outline package, SOP) conductive wire frame strip of structure is before sealing, after the sealing and the sketch map after the cutting.Shown in Figure 1A, a conductive wire frame strip 1 comprises a housing 10, several link support 11, several runner supports 12 and several lead frame unit 13.Said housing 10, link support 11 and runner support 12 interconnects, said binding support 11 and the 12 mutual square crossings of runner support are arranged, with support, the district at a distance from and define said several lead frame unit 13.Said housing 10 in position is provided with several location holes 101, so that in the following process process, positioning action is provided.Said runner support 12 in position is provided with at least one gum-injecting port 121, so that during follow-up sealing, inject packaging adhesive material.Each said lead frame unit 13 has a chip bearing 131, pin portions 132 in several, several outer pin portions 133, several dam bars (dam bar) 134, several supporting ribs (tie bar) 135 and several cutting grooves 136, and said chip bearing 131 utilizes said supporting ribs 135 to be connected on the said binding support 11 (or housing 10).Pin portion 132 is connected on the said dam bar 134 in said, and simultaneously said outer pin portion 133 is connected between said dam bar 134 and the said binding support 11 (or housing 10).Said cutting groove 136 in order to distinguishing the separated chip bearing 131 that adjoins each other, interior pin portion 132, outer pin portion 133, dam bar 134 and supporting ribs 135, and defines its shape separately in said between pin portion 132 and the outer pin portion 133.
Shown in Figure 1A, before carrying out sealing, earlier several chips 14 are separately fixed on each said chip bearing 131, each said chip 14 several wires capable of using (wire) 15 is electrically connected to said interior pin portion 132.Then; Shown in Figure 1B; When carrying out sealing; Utilize transfer molding (transfer-molding) technology that is shaped to carry out sealing to said conductive wire frame strip 1, form a runner adhesive tape (not illustrating), a side gate adhesive tape (not illustrating) and a packing colloid 16 in regular turn, coat each said chip bearing 131 of protection, interior pin portion 132, chip 14 and lead 15 to utilize said packing colloid 16 to inject packaging adhesive material with said chip 14 and lead 15.Shown in Fig. 1 C, after accomplishing sealing, remove the excessive glue of unnecessary runner adhesive tape, said side gate adhesive tape and said packing colloid 16 peripheries immediately, and excise the dam bar 134 of each lead frame unit 13.At last, go out each lead frame unit 13 by cutting and separating on the said conductive wire frame strip 1 again,, so can obtain the finished product of little external form packaging structure to carry out follow-up bending pins processing.
Yet; In the design of this kind conductive wire frame strip 1; Between the outer pin portion 133 of at least two adjacent said lead frame unit 13 among the same row a said binding support 11 must be set all, connect the outer pin portion 133 of the adjacent said lead frame unit 13 of two-phase at least with media.For example, in 1A figure, each row has all arranged 7 said lead frame unit 13 and 6 said binding supports 11.But; This kind binding support 11 causes many space surface of said conductive wire frame strip 1 all to be used to be provided with said binding support 11 with the arrangement design of lead frame unit 13; Thereby limited said conductive wire frame strip 1 relatively can be in order to the space surface of said lead frame unit 13 to be set, that is reduced total element number of said lead frame unit 13 relatively.The result; Whenever carry out the sealing program one time; Only can on said conductive wire frame strip 1, form the packaging structure of limited quantity, must waste the useless frame material of many said conductive wire frame strips 1 simultaneously, thereby cause being difficult to further improve unit interval quantum of output (the units per hour of said sealing program; UPH), cause the low and relative material cost that improves of production efficiency.
Please with reference to shown in Figure 2; It discloses a kind of existing square flat packaging (quad flat package; QFP) sketch map of conductive wire frame strip before sealing of structure, wherein a conductive wire frame strip 2 comprises a housing 20, several link support 21, several runner supports 22 and several lead frame unit 23.Said housing 20 in position is provided with several location holes 201; Said runner support 22 in position is provided with at least one gum-injecting port 221, and each said lead frame unit 23 has a chip bearing 231, pin portions 232 in several, several outer pin portions 233, several dam bars 234, several supporting ribs 235 and several cutting grooves 236.In the design of this kind conductive wire frame strip 2, between the outer pin portion 233 of at least two adjacent said lead frame unit 23 among the same row a said binding support 21 must be set all, connect the outer pin portion 233 of the adjacent said lead frame unit 13 of two-phase at least with media.Moreover, between the outer pin portion 233 of adjacent two rows' at least two adjacent said lead frame unit 23 a said runner support 22 must be set also, connect the adjacent said lead frame unit 13 of two-phase at least with media.But; This kind binding support 21, runner support 22 cause many space surface of said conductive wire frame strip 2 all to be used to be provided with said binding support 21 and runner support 22 with the arrangement design of lead frame unit 23; Thereby limited said conductive wire frame strip 2 relatively can be in order to the space surface of said lead frame unit 23 to be set, that is reduced total element number of said lead frame unit 23 relatively.The result; Whenever carry out the sealing program one time; Only can on said conductive wire frame strip 2, form the packaging structure of limited quantity; Can waste the useless frame material of many said conductive wire frame strips 2 equally, thereby cause being difficult to further improve the unit interval quantum of output of said sealing program, cause the low and relative material cost that improves of production efficiency.
So, be necessary to provide a kind of lead frame band construction for semiconductor packaging, to solve the existing in prior technology problem.
[summary of the invention]
Main purpose of the present invention is to provide a kind of lead frame band construction for semiconductor packaging; The conductive wire frame strip of its medium and small external form encapsulation (SOP) structure is further with the outer pin portion of same row's at least two adjacent lead frame unit shared same space, district that is staggered that is designed to be staggered; Thereby conductive wire frame strip can omit the existing support that links is set; So help under identical conductive wire frame strip length and width size, further improving relatively the space availability ratio of conductive wire frame strip, the arranging density of conductive wire frame strip unit, the unit interval quantum of output and the encapsulation production efficiency of encapsulation process, and can reduce material cost relatively and reduce waste of material.
Secondary objective of the present invention is to provide a kind of lead frame band construction for semiconductor packaging; Wherein the conductive wire frame strip of square flat packaging (QFP) structure is further with the outer pin portion of same row or adjacent two rows' at least two adjacent lead frame unit shared same space, district that is staggered that is designed to be staggered; Thereby conductive wire frame strip can omit existing support and the runner support of linking is set; So help under identical conductive wire frame strip length and width size, further improving relatively the space availability ratio of conductive wire frame strip, the arranging density of conductive wire frame strip unit, the unit interval quantum of output and the encapsulation production efficiency of encapsulation process, and can reduce material cost relatively and reduce waste of material.
For reaching aforementioned purpose of the present invention; The present invention provides a kind of lead frame band construction for semiconductor packaging; It is characterized in that: a conductive wire frame strip is applied to the packaging structure of little external form class (small outline type) or square flat type (quad flat type), and said conductive wire frame strip comprises: a housing; And at least two lead frame unit are arranged in the space of said housing definition, and each said lead frame unit has several outer pin portions, and said outer pin portion is arranged in the both sides at least of said lead frame unit; Wherein have the district that is staggered between at least two adjacent said lead frame unit, and at least two adjacent said lead frame unit outer pin portion adjacent one another are forms in the scope in the said district that is staggered to be staggered.
In one embodiment of this invention, said lead frame band construction comprises in addition: at least one runner support is connected with said housing; Said several lead frame unit are arranged at least one row in the space of said housing and the definition of runner support, wherein have a said district that is staggered at least between the two adjacent said lead frame unit in each row's the said lead frame unit.
In one embodiment of this invention; Each said lead frame unit has a chip bearing in addition, pin portion, several dam bars, several supporting ribs and several cutting grooves in several; Said chip bearing utilizes said supporting ribs to be connected on said runner support or the housing; Said dam bar be connected said between pin portion and the said outer pin portion, the separated said chip bearing that adjoins each other in said cutting groove district, interior pin portion, outer pin portion, dam bar and supporting ribs.
In one embodiment of this invention; Said conductive wire frame strip is applied to the packaging structure of said little external form class; Said outer pin portion is arranged in the both sides of said lead frame unit; The packaging structure of wherein said little external form class is selected from little external form packaging structure (small outline package; SOP), slim little external form packaging structure (thinsmall outline package, TSOP), the little external form packaging structure of thin space (shrink small outlinepackage, SSOP) structure, the little external form packaging structure of slim thin space (thin shrink small outlinepackage; TSSOP), little external form J-shaped pin package structure (small outline J-leaded package; SOJ), the little external form packaging structure of expanded letter (small outline package (wide-type), SOW) or little external form Transistor packages structure (small outline transistor, SOT).
In one embodiment of this invention; Said lead frame band construction is used to make the packaging structure of flat type of said square; Said outer pin portion is arranged in four sides of said lead frame unit; Wherein have a said district that is staggered between at least two adjacent said lead frame unit, and at least two adjacent said lead frame unit outer pin portion adjacent one another are forms in the scope in the said district that is staggered to be staggered.
In one embodiment of this invention, wantonly two adjacent said lead frame unit outer pin portion adjacent one another are all forms and is staggered.
In one embodiment of this invention; Each said lead frame unit has a chip bearing in addition, pin portion, several dam bars, several supporting ribs and several cutting grooves in several; Said chip bearing utilizes said supporting ribs to be connected on a said housing or the central area; Said dam bar be connected said between pin portion and the said outer pin portion, the separated said chip bearing that adjoins each other in said cutting groove district, interior pin portion, outer pin portion, dam bar and supporting ribs.
In one embodiment of this invention, the said district that is staggered is formed between the two adjacent said lead frame unit dam bar adjacent one another are at least.
In one embodiment of this invention, the end of the outer pin portion of each said lead frame unit is connected to the dam bar of another the said lead frame unit that is adjacent.
In one embodiment of this invention, the end of the outer pin portion of each said lead frame unit is rectangular smooth shape.
[description of drawings]
Figure 1A, 1B and 1C are that the conductive wire frame strip of existing little external form encapsulation (SOP) structure is before sealing, after the sealing and the sketch map after the cutting.
Fig. 2 is the sketch map of conductive wire frame strip before sealing of existing square flat packaging (QFP) structure.
Fig. 3 is the partial schematic diagram of first embodiment of the invention lead frame band construction for semiconductor packaging.
Fig. 3 A is the local enlarged diagram of first embodiment of the invention lead frame band construction for semiconductor packaging.
Fig. 4 is the sketch map of first embodiment of the invention lead frame band construction for semiconductor packaging after cutting.
Fig. 5 is the partial schematic diagram of second embodiment of the invention lead frame band construction for semiconductor packaging.
[embodiment]
For making above-mentioned purpose of the present invention, characteristic and advantage more obviously understandable, hereinafter is special lifts preferred embodiment of the present invention, and conjunction with figs., elaborates as follows:
Please with reference to shown in Fig. 3 and the 3A; It discloses the partial schematic diagram and the local enlarged diagram of first embodiment of the invention lead frame band construction for semiconductor packaging; Wherein first embodiment of the invention provides a kind of lead frame band construction for semiconductor packaging; It is mainly used in the packaging structure of making little external form class (small outline type); For example be selected from little external form packaging structure (small outline package; SOP), slim little external form packaging structure (thin small outline package, TSOP), the little external form packaging structure of thin space (shrinksmall outline package, SSOP) structure, the little external form packaging structure of slim thin space (thin shrinksmall outline package; TSSOP), little external form J-shaped pin package structure (small outline J-leadedpackage; SOJ), the little external form packaging structure of expanded letter (small outline package (wide-type), SOW) or little external form Transistor packages structure (small outline transistor, SOT); This type packaging structure is characterised in that the outer pin portion of each lead frame unit is the both sides that are arranged in said lead frame unit, and the end of the outer pin portion of each said lead frame unit is rectangular smooth shape.
Please with reference to shown in Fig. 3 and the 3A, in first embodiment of the invention, a lead frame band construction 3 comprises: a housing 30, at least one runner support 31 and several lead frame unit 32.Said housing 30 is meant the framework of the outermost of said lead frame band construction 3, and its said housing 30 forms the outside length and width size and the profile of said lead frame band construction 3.Said housing 30 in position is provided with several location holes 301, so that in the following process process, positioning action is provided.Said runner support 31 is meant said lead frame band construction 3 other list structures in the scope of said housing 30, and wherein said runner support 31 in position is provided with at least one gum-injecting port 311, so that during follow-up sealing, inject packaging adhesive material.Moreover; Said housing 30 and runner support 31 interconnect; Said runner support 31 is parallel to each other and equidistantly is arranged in the scope of said housing 30; For supporting, distinguish separated and defining the said lead frame unit 32 of arranging to a row, two rows or number, total row's number of wherein said lead frame unit 32 is to design according to the encapsulating products demand.In the present invention, the term of " a row lead frame unit 32 " can be meant the column wire frame unit 32 that delegation's lead frame unit 32 of arranging along the length direction of said lead frame band construction 3 or broad ways are arranged, in this close chat earlier bright.
Please refer again to shown in Fig. 3 and the 3A; In first embodiment of the invention; Said several lead frame unit 32 are in the space of said housing 30 and 31 definition of runner support, to be arranged at least one row; The scope that each said lead frame unit 32 contains is shown in the dotted line among the figure, and in each row's said lead frame unit 32, the position of at least two adjacent said lead frame unit 32 all forms right being staggered of a first from left.Moreover each said lead frame unit 32 has a chip bearing 321, pin portions 322 in several, several outer pin portions 323, several dam bars 324, several supporting ribs 325 and several cutting grooves 326.Said chip bearing 321 is in order to carry at least one chip 33, and wherein said chip bearing 321 utilizes said supporting ribs 325 to be connected on said runner support 31 or the housing 30.The two ends of said dam bar 324 are connected on said housing 30 and/or the runner support 31; Said dam bar 324 is horizontal be connected said between pin portion 322 and the said outer pin portion 323; Pin portion 322 and said outer pin portion 323 refer to the inboard of same pin position bar 324 on said dam and the part in the outside respectively in wherein said; And said outer pin portion 323 in fact still has sub-fraction length to be positioned at the inboard of said dam bar 324; The inboard of wherein said dam bar 324 is meant its side near said chip bearing 321, and the outside of said dam bar 324 is meant its opposite side away from said chip bearing 321.Pin portion 322 can supply to utilize lead 34 to be electrically connected to the chip 33 on the said chip bearing 321 in said.Pin portion 322 and said outer pin portion 323 have equal number usually in said, and quantity is to design according to the encapsulating products demand.Moreover; Said cutting groove 326 is several slotted eyes of forming of die cut in advance; Wherein in the scope of each said lead frame unit 32, said cutting groove 326 can in order to distinguish at a distance from and the said chip bearing 321 that adjoins each other of definition, interior pin portion 322, outer pin portion 323, dam bar 324 and supporting ribs 325.
Please refer again to shown in Fig. 3 and the 3A; In first embodiment of the invention; Therefore said lead frame unit 32 is the packaging structures that are used to make little external form class, and in the scope of each said lead frame unit 32, said outer pin portion 323 is the both sides that are arranged in said lead frame unit 32.Moreover; In the present invention; In each row's said lead frame unit 32; All have district (the stagger arrangement area) S that is staggered between at least two adjacent said lead frame unit 32, and the adjacent outer pin portion 323 of at least two adjacent said lead frame unit 32 all is in the scope of the said district S that is staggered, to form to be staggered.More detailed, at least two adjacent said lead frame unit 32 are meant on same conductive wire frame strip 3, to have at least two the said lead frame unit 32 of minimum distance in abutting connection with Rankine-Hugoniot relations.The said district S that is staggered is formed between the two adjacent said lead frame unit 32 dam bar 324 adjacent one another are at least.The end of the outer pin portion 323 of each said lead frame unit 32 all is connected on the dam bar 324 of another the said lead frame unit 32 that is adjacent, but also can select not connect.Said dam bar 324 after being cut, will constitute said outside the end of pin portion 323, so the end of each said outer pin portion 323 after being cut with rectangular smooth shape.
Please with reference to shown in Figure 3; Its figure top, figure middle part and figure bottom illustrate the conductive wire frame strip 3 of first embodiment of the invention before routing, behind the routing and the sketch map after the sealing respectively; It is steps before and after three of canned program basically, and this three step can not appear on the same conductive wire frame strip 3, is the difference between the comparison step for ease in this present invention; Therefore it is illustrated on same conductive wire frame strip 3, close earlier in this and indicate.
Please with reference to shown in Fig. 3 and the 3A; The conductive wire frame strip 3 of first embodiment of the invention has several said lead frame unit 32 and is arranged at least one row, and the outer pin portion 323 of same row's at least two adjacent lead frame unit 32 is designed to be staggered and the space of the shared same district S that is staggered.When utilizing said conductive wire frame strip 3 to carry out the routing operation, each said chip bearing 321 is in order to carrying at least one chip 33, and pin portion 322 utilizes lead 34 to be electrically connected to the chip 33 on the said chip bearing 321 in said.Then, when said conductive wire frame strip 3 carried out the sealing operation, a packaging adhesive material (not illustrating) was gum-injecting port 311 injections by said runner support 31, thereby formed a packing colloid 35 at each said lead frame unit 32 place.After accomplishing sealing, remove the unnecessary glue material parts (not illustrating) such as excessive glue of unnecessary runner adhesive tape, side gate adhesive tape and said packing colloid 35 peripheries immediately.Then, please with reference to shown in Figure 4, when said conductive wire frame strip 3 carries out cutting operation, at first excise the dam bar 324 of each lead frame unit 32.At last, go out each lead frame unit 32 by cutting and separating on the said conductive wire frame strip 3 again,, so can obtain the finished product of little external form packaging structure or its similar structure to carry out follow-up bending pins processing.
In above-mentioned encapsulation process; The present invention can cut out the indivedual outer pin portion 323 of two adjacent lead frame unit 32 through the above-mentioned district S that is staggered; And this two adjacent outer pins portion 323 utilizes said cutting groove 326, and suitably the district is separated each other, so can not influence its cutting operation because of arrangement interlaced with each other.Compared to the conductive wire frame strip shown in Figure 1A to 1C 1; The present invention is under the length and width size of identical said conductive wire frame strip 3; Each arranges said lead frame unit 32 all can be expanded to 9 said lead frame unit 32 of arrangement, and does not need any existing binding support to come media to connect the adjacent said lead frame unit 32 of two-phase at least.Therefore; Said conductive wire frame strip 3 can omit the existing support (shown in Figure 1A to 1C) that links is set; So help under identical conductive wire frame strip 3 length and width sizes, further improving relatively the space availability ratio of said conductive wire frame strip 3, the arranging density of said conductive wire frame strip unit 32, the unit interval quantum of output and the encapsulation production efficiency of encapsulation process, and can reduce material cost relatively and reduce waste of material.
Please with reference to shown in Figure 5; The lead frame band construction for semiconductor packaging of second embodiment of the invention is similar in appearance to first embodiment of the invention; And roughly continue to use similar elements title and figure number; But the difference characteristic of second embodiment is: the lead frame band construction for semiconductor packaging of said second embodiment is fit to be applied to make the packaging structure of square flat type (quad flat type); For example (quad flatpackage, QFP), wherein a conductive wire frame strip 4 comprises a housing 40, at least one central area 41 and several lead frame unit 42 for square flat packaging structure.Said housing 40 in position is provided with several location holes 401, so that in the following process process, positioning action is provided.Said several lead frame unit 42 are arranged at least two rows in the space of said housing 30 and 41 definition of said central area; And each said lead frame unit 42 has a chip bearing 421, pin portions 422 in several, several outer pin portions 423, several dam bars 424, several supporting ribs 425 and several cutting grooves 426; Said chip bearing 421 utilizes said supporting ribs 425 to be connected on said housing 40 or the said central area 41; Said dam bar 424 be connected said between pin portion 422 and the said outer pin portion 423, the separated said chip bearing 421 that adjoins each other in said cutting groove 426 districts, interior pin portion 422, outer pin portion 423, dam bar 424 and supporting ribs 425.Particularly because said conductive wire frame strip 4 is used to make square flat packaging structure (QFP), therefore said in pin portion 422 and outer pin portion 423 be arranged in four sides of said lead frame unit 42.
Please refer again to shown in Figure 5ly, in second embodiment of the invention, in each row's said lead frame unit 42, the position of at least two adjacent said lead frame unit 42 all forms right being staggered of a first from left.At this moment; Have between at least two adjacent said lead frame unit 42 in each row's the said lead frame unit 42 one be staggered the district S (stagger arrangement area); And the outer pin portion 423 that at least two adjacent said lead frame unit 42 are adjacent is in the scope of the said district S that is staggered, to form to be staggered; Even the said lead frame unit 42 of each row's first or last wherein; It also can form in the scope of a said district S that is staggered with an adjacent said lead frame unit 42 outer pin portion 423 adjacent one another are and be staggered, and this configuration also belongs to the category of " at least two adjacent said lead frame unit 42 ".On the other hand, the present invention can be designed in addition 42 formation of two adjacent said lead frame unit of the adjacent said lead frame unit 42 of at least two rows being staggered one on the other simultaneously at least.At this moment; Have another district S that is staggered at least between at least two adjacent said lead frame unit 42 of the adjacent said lead frame unit 42 of two rows, and the adjacent outer pin portion 423 of at least two adjacent said lead frame unit 42 is in the scope of the said district S that is staggered, to form to be staggered.Moreover the said district S that is staggered all is formed between the two adjacent said lead frame unit 42 dam bar 424 adjacent one another are at least.The end of the outer pin portion 423 of each said lead frame unit 42 is connected to the dam bar 424 of another the said lead frame unit 42 that is adjacent, and the end of the outer pin portion 423 of each said lead frame unit 42 is rectangular smooth shapes.In addition, second embodiment of the invention can be with reference to the above-mentioned explanation of first embodiment similar in appearance to other structural features of first embodiment, and the present invention gives both similarities of repeat specification no longer in addition, closes earlier in this to indicate.
It should be noted that; The lead frame unit 42 of second embodiment of the invention is for being used to make square flat packaging structure (QFP); Therefore can be as shown in Figure 5; Design makes in same row's the said lead frame unit 42 and all is provided with the said district S that is staggered at least between the said lead frame unit 42 of two adjacent rows, and just the said lead frame unit 42 of " wantonly two is adjacent " outer pin portion 423 adjacent one another are all has in a said scope of distinguishing S that is staggered, to form and is staggered.Therefore; Said conductive wire frame strip 4 can omit existing support and the runner support of linking is set; So help under identical said conductive wire frame strip 4 length and width sizes, further improving relatively the space availability ratio of said conductive wire frame strip 4, the arranging density of said conductive wire frame strip unit 42, the unit interval quantum of output and the encapsulation production efficiency of encapsulation process, and can reduce material cost relatively and reduce waste of material.Moreover, cooperating above-mentioned design, the tedge design that the present invention can select for use China to disclose No. 101477974 " glue sealing method of conductive wire frame strip and the semiconductor packaging structure with lead frame " patent of invention is carried out the sealing operation.
Yet; In another possible implementation; The present invention also can be as as first embodiment, and only design makes and just is provided with said being staggered in same row's the said lead frame unit 42 and distinguishes S, as for then being provided with a runner support (not illustrating) between the said lead frame unit 42 of per two adjacent rows in addition.At this moment; In same row's said lead frame unit 42, the outer pin portion 423 of said lead frame unit 42 4 sides only wherein the outer pin portion 423 of both sides can be staggered with the outer pin portion 423 of adjacent another lead frame unit 42 among the same row and be staggered among the district S in one.So, said conductive wire frame strip 4 can omit equally at least to be provided with and existing link support, and reaches and be same as above-mentioned effect and advantage.
As stated; There are many space surface all to be used to be provided with said binding support 11,21 and runner support 12,22 thereby reduced the shortcomings such as total element number of said lead frame unit 23,32 relatively compared to existing conductive wire frame strip 1,2; The present invention of Fig. 3 to 5 is shared same district's space S, the S of being staggered that be designed to be staggered of the outer pin portion 323,423 with the conductive wire frame strip 3 of little external form encapsulation (SOP) structure or square flat packaging (QFP) structure, 4 same rows' at least two adjacent lead frame unit 32,42; Thereby said conductive wire frame strip 3,4 can omit the existing support (and runner support) that links is set; So help under identical said conductive wire frame strip 3,4 length and width sizes, further improving relatively the space availability ratio of said conductive wire frame strip 3,4, the arranging density of said conductive wire frame strip unit 32,42, the unit interval quantum of output (UPH) and the encapsulation production efficiency of encapsulation process, and can reduce material cost relatively and reduce waste of material.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is merely the example of embodiment of the present invention.Must be pointed out that disclosed embodiment does not limit scope of the present invention.On the contrary, being contained in the spirit of claims and the modification and impartial setting of scope includes in scope of the present invention.
Claims (7)
1. lead frame band construction for semiconductor packaging is characterized in that: a conductive wire frame strip is applied to the packaging structure of flat type of little external form class or square, and said conductive wire frame strip comprises:
One housing;
Several lead frame unit are arranged in the space of said housing definition, and each said lead frame unit has several outer pin portions, and said outer pin portion is arranged in the both sides at least of said lead frame unit; And
At least one runner support is connected with said housing; Said several lead frame unit are arranged at least one row in the space of said housing and the definition of runner support;
Wherein have the district that is staggered at least between the two adjacent said lead frame unit in each row's the said lead frame unit, and at least two adjacent said lead frame unit outer pin portion adjacent one another are forms in the scope in the said district that is staggered to be staggered;
Wherein each said lead frame unit has a chip bearing, several interior pin portions, several dam bars, several supporting ribs and several cutting grooves in addition; Said chip bearing utilizes said supporting ribs to be connected on said runner support or the housing; Said dam bar be connected said between pin portion and the said outer pin portion; Said cutting groove district is at a distance from the said chip bearing that adjoins each other, interior pin portion, outer pin portion, dam bar and supporting ribs, and the said district that is staggered is formed between the two adjacent said lead frame unit dam bar adjacent one another are at least.
2. lead frame band construction for semiconductor packaging as claimed in claim 1; It is characterized in that: said conductive wire frame strip is applied to the packaging structure of said little external form class; Said outer pin portion is arranged in the both sides of said lead frame unit, and the packaging structure of wherein said little external form class is selected from little external form packaging structure, slim little external form packaging structure, the little external form packaging structure structure of thin space, the little external form packaging structure of slim thin space, little external form J-shaped pin package structure, the little external form packaging structure of expanded letter or little external form Transistor packages structure.
3. lead frame band construction for semiconductor packaging as claimed in claim 1 is characterized in that: the end of the outer pin portion of each said lead frame unit is rectangular smooth shape.
4. lead frame band construction for semiconductor packaging is characterized in that: a conductive wire frame strip is applied to the packaging structure of flat type of little external form class or square, and said conductive wire frame strip comprises:
One housing;
Several lead frame unit are arranged in the space of said housing definition, and each said lead frame unit has several outer pin portions, and said outer pin portion is arranged in the both sides at least of said lead frame unit;
Wherein have the district that is staggered between at least two adjacent said lead frame unit, and at least two adjacent said lead frame unit outer pin portion adjacent one another are forms in the scope in the said district that is staggered to be staggered; And
At least one central area, said several lead frame unit are arranged at least two rows in the space of said housing and the definition of said central area;
Wherein each said lead frame unit has a chip bearing, several interior pin portions, several dam bars, several supporting ribs and several cutting grooves in addition; Said chip bearing utilizes said supporting ribs to be connected on said housing or the said central area; Said dam bar be connected said between pin portion and the said outer pin portion; Said cutting groove district is at a distance from the said chip bearing that adjoins each other, interior pin portion, outer pin portion, dam bar and supporting ribs, and the said district that is staggered is formed between the two adjacent said lead frame unit dam bar adjacent one another are at least.
5. lead frame band construction for semiconductor packaging as claimed in claim 4; It is characterized in that: said lead frame band construction is used to make the packaging structure of flat type of said square; Said outer pin portion is arranged in four sides of said lead frame unit; Wherein have a said district that is staggered between at least two adjacent said lead frame unit, and at least two adjacent said lead frame unit outer pin portion adjacent one another are forms in the scope in the said district that is staggered to be staggered.
6. lead frame band construction for semiconductor packaging as claimed in claim 5 is characterized in that: wantonly two adjacent said lead frame unit outer pin portion adjacent one another are all forms and is staggered.
7. lead frame band construction for semiconductor packaging as claimed in claim 4 is characterized in that: the end of the outer pin portion of each said lead frame unit is rectangular smooth shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010187476 CN101894822B (en) | 2010-05-28 | 2010-05-28 | Lead frame band construction for semiconductor packaging |
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| CN 201010187476 CN101894822B (en) | 2010-05-28 | 2010-05-28 | Lead frame band construction for semiconductor packaging |
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| CN101894822A CN101894822A (en) | 2010-11-24 |
| CN101894822B true CN101894822B (en) | 2012-07-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050472A (en) * | 2012-12-28 | 2013-04-17 | 日月光封装测试(上海)有限公司 | Lead frame bar for semiconductor packaging, and mold and adhesive sealing method thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103066047B (en) * | 2012-12-28 | 2016-09-07 | 日月光封装测试(上海)有限公司 | Semiconductor-sealing-purpose conductive wire frame strip and method for packing |
| CN103715162B (en) * | 2013-12-30 | 2017-09-29 | 日月光封装测试(上海)有限公司 | Lead frame bar for semiconductor packages |
| CN105470234B (en) * | 2016-01-12 | 2017-12-22 | 气派科技股份有限公司 | A kind of SOT23 lead frames and its packaging technology flow |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4563811A (en) * | 1983-10-28 | 1986-01-14 | At&T Technologies, Inc. | Method of making a dual-in-line package |
| CN101165890A (en) * | 2006-10-19 | 2008-04-23 | 卓恩民 | Semiconductor package structure and manufacture method thereof |
| CN101477973A (en) * | 2009-01-23 | 2009-07-08 | 日月光半导体制造股份有限公司 | Conductive wire frame strip, glue sealing method and glue sealing structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08162599A (en) * | 1994-12-07 | 1996-06-21 | Fujitsu Ltd | Manufacture of semiconductor device |
| JP2001060647A (en) * | 1999-08-23 | 2001-03-06 | Fuji Electric Co Ltd | Lead frame |
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2010
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4563811A (en) * | 1983-10-28 | 1986-01-14 | At&T Technologies, Inc. | Method of making a dual-in-line package |
| CN101165890A (en) * | 2006-10-19 | 2008-04-23 | 卓恩民 | Semiconductor package structure and manufacture method thereof |
| CN101477973A (en) * | 2009-01-23 | 2009-07-08 | 日月光半导体制造股份有限公司 | Conductive wire frame strip, glue sealing method and glue sealing structure |
Non-Patent Citations (2)
| Title |
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| JP特开2001-60647A 2001.03.06 |
| JP特开平8-162599A 1996.06.21 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050472A (en) * | 2012-12-28 | 2013-04-17 | 日月光封装测试(上海)有限公司 | Lead frame bar for semiconductor packaging, and mold and adhesive sealing method thereof |
| CN103050472B (en) * | 2012-12-28 | 2016-04-20 | 日月光封装测试(上海)有限公司 | Semiconductor-sealing-purpose conductive wire frame strip and mould thereof and glue sealing method |
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| Publication number | Publication date |
|---|---|
| CN101894822A (en) | 2010-11-24 |
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