CN205303458U - To inserting type TO220F encapsulation lead frame - Google Patents
To inserting type TO220F encapsulation lead frame Download PDFInfo
- Publication number
- CN205303458U CN205303458U CN201620044410.0U CN201620044410U CN205303458U CN 205303458 U CN205303458 U CN 205303458U CN 201620044410 U CN201620044410 U CN 201620044410U CN 205303458 U CN205303458 U CN 205303458U
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- CN
- China
- Prior art keywords
- plate body
- to220f
- lead
- square frame
- projection
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Abstract
The utility model provides a to inserting type TO220F encapsulation lead frame, include: a plate body, a plurality of groups outer lead, a plurality of group arch, a plurality of groups remove flow channel hole, a plurality of locating hole, intraconnection track and solid brilliant board, the outer lead is arranges on the plate body to inserting the type, the arch sets up in the long limit of plate body, gu that brilliant board is provided with is sunken, solid crystalline region and connecting portion, through connecting portion and protruding and outer pin connection, the intraconnection track is through protruding and outer pin connection. The utility model discloses can effectively improve production efficiency, reduce cost makes the product have stronger competitiveness on market.
Description
Technical field
This utility model belongs to semiconductor packages manufacturing technology field, in particular it relates to one is to slotting type TO220F encapsulating lead.
Background technology
The lead frame used in integrated circuit is a kind of primary structural material of integrated antenna package, and it acts primarily as the effect of carrying IC chip in circuit, acts the effect connecting chip with the outside line plate signal of telecommunication simultaneously, and installs fixing mechanism etc. Along with the demand of power device is constantly expanded by consumption market in recent years, to improving constantly that product reliability requires; Bring development opportunity to power device package industry, propose new challenge also to power device package industry simultaneously. So whether the design of the used lead frame of power device rationally serves critical effect to power device package industry. In electronic circuitry design, the rectifying device of TO-220 packing forms is used widely. Traditional TO-220 packaging frame is to be combined by frame and encapsulation unit, and encapsulation unit is connected in series. Framework injection once can only fill 20 products in process of production, uses conventional package framework production efficiency low, and raw materials consumption is big.
To this, domestic at present it is primarily present following patent documentation:
Patent publication No.: CN204189790U, discloses a kind of symmetrical expression TO-220 type frame structure, and including top strength and separate unit, separate unit is symmetrically positioned in strength both sides, described top, separate unit also has top connect muscle, and top strength connects muscle with top and is joined directly together. Also having chip installation area on separate unit, chip installation area also has radiating part, pin is positioned at bottom, chip installation area. By pushing up strength, top connects muscle, middle muscle and end muscle and multiple separate units is coupled together and constitutes packaging frame. This programme makes the frame number entered in production process be former twice, effectively raises production efficiency. But, this frame structure only improves the product quantity once encapsulated, it is impossible to reduce raw material unit consumption cost.
Utility model content
For solving above-mentioned Problems existing, the purpose of this utility model is in that to provide a kind of to slotting type TO220F encapsulating lead. For reaching above-mentioned purpose, the technical solution adopted in the utility model is: a kind of to slotting type TO220F encapsulating lead, it is characterised in that including: a plate body, its surface is arranged at intervals with some square frames along its length;Some groups of outer leads, often group includes 6 outer leads, for strip, it is connected to described square frame along plate body length direction equi-spaced apart, its one end inside contracts, and forms serrated end, and the other end is link, the serrated end of two often adjacent outer leads respectively in be connected to the square frame two ends near plate body length direction, formed square frame two ends respectively in connect the link of 3 outer leads; Some groups protruding, and often group projection is arranged on the long limit of described plate body along plate body length direction equi-spaced apart, the corresponding square frame of every two groups of projections, often group includes 3, it is divided into the first ~ the 3rd projection, arranges along plate body length direction equi-spaced apart, and relative with outer lead link respectively; Some groups are gone to runner hole, and often group includes at least one and goes to runner hole, is opened in the plate body width one end between the adjacent square frame of each two; Hole, some location, is arranged in the middle part of the plate body width between the adjacent square frame of each two; Some leads, one end is protruding with described first projection and the 3rd respectively to be connected, and the other end is conductively connected with chip metal to be packaged lead-in wire respectively; Some die bond plates, it is symmetricly set in described plate body square frame both sides along plate body length direction, a groove is offered along die bond plate length direction in the middle part of the end face of one end, projection a junction in the middle part of other end end face, middle part sets the crystal bonding area for placing chip to be packaged, periphery, crystal bonding area arranges framework, is formed with chip to be packaged and is conductively connected, and described die bond plate is conductively connected by connecting portion and the second projection.
Further, between the described adjacent square frame of plate body each two, spacing is 12mm.
Separately, described die bond plate connecting portion is to a lateral buckling, and bent angle is 120 ��.
Separately having, in the middle part of the both wings of described die bond plate groove, bending is arranged, and overbending direction is identical with described connecting portion overbending direction.
Again, the lead being connected with described 3rd projection is chamfering away from the angle, one end of the 3rd projection.
Further, described end angle is the end angle near second protruding one end.
And, described lead and plate body are generally aligned in the same plane.
Also, described often group is gone to runner hole to include 2 and is gone to runner hole, the width two ends of the plate body being opened between the adjacent square frame of each two respectively, and hole, described location and these 2 go to be placed equidistant between runner hole.
Further, described plate body width two ends offer three semi-cylindrical canyons along plate body width equi-spaced apart respectively, are the first ~ the 3rd depression, and the first depression and the 3rd depression corresponding described two go to runner hole respectively, the second depression hole, corresponding described location.
The beneficial effects of the utility model are in that: compare single lead frame, product monolithic quantity doubles, and the efficiency of later process die bond bonding wire is improve 20%, and final product is cut improved efficiency one times, save the monolithic production time, drastically increase production efficiency; Adopting and slotting type is designed, punching press unit consumption reduces 20%, directly reduces the cost of raw material, considerably reduces the manufacturing cost of the type product so that it is commercially have higher competitiveness.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation to slotting type TO220F encapsulating lead provided by the utility model.
Fig. 2 is a kind of side view to slotting type TO220F encapsulating lead provided by the utility model.
Fig. 3 is the structural representation of a kind of encapsulation unit to slotting type TO220F encapsulating lead provided by the utility model.
Fig. 4 is the structural representation of a kind of crystal bonding area to slotting type TO220F encapsulating lead provided by the utility model.
Fig. 5 is a kind of combination schematic diagram to the plate body of slotting type TO220F encapsulating lead, projection and outer lead provided by the utility model.
Detailed description of the invention
Following example are used for illustrating this utility model, but can not be used for limiting scope of the present utility model.
With reference to Fig. 1 ~ Fig. 5, one provided by the utility model is to slotting type TO220F encapsulating lead, it is characterised in that including: a plate body 1, and its surface is arranged at intervals with some square frames 11 along its length; Some groups of outer leads 2, often group includes 6 outer leads 21, for strip, described square frame 11 it is connected to along plate body 1 length direction equi-spaced apart, its one end inside contracts, and forms serrated end 211, and the other end is link 212, the serrated end 211 of two often adjacent outer leads 21 respectively in be connected to the square frame 11 two ends near plate body 1 length direction, formed square frame 11 two ends respectively in connect the link 212 of 3 outer leads; Some groups of projections 3, often group protruding 3 is arranged on the described long limit of plate body 1 along plate body 1 length direction equi-spaced apart, every two groups of protruding 3 corresponding square frames 11, often group includes 3, it is divided into the first ~ the 3rd projection 31 ~ 33, arrange along plate body 1 length direction equi-spaced apart, and relative with outer lead 2 link 212 respectively; Some groups are gone to runner hole 4, and for the preformed hole ejected for runner after injection moulding, often group includes at least one and goes to runner hole 41, is opened in the plate body 1 width one end between the adjacent square frame 11 of each two; Hole, some location 5, is arranged in the middle part of plate body 1 width between the adjacent square frame 11 of each two; Some leads 6, one end is connected with described first protruding 31 and the 3rd protruding 33 respectively, and the other end is conductively connected with chip to be packaged (not shown) metal lead wire (not shown) respectively; Some die bond plates 7, it is symmetricly set in described plate body 1 square frame 11 both sides along plate body 1 length direction, a groove 71 is offered along die bond plate 7 length direction in the middle part of the end face of one end, projection a junction 72 in the middle part of other end end face, middle part sets the crystal bonding area 73 for placing chip to be packaged, periphery, crystal bonding area 73 arranges framework 731, is formed with chip to be packaged and is conductively connected, and described die bond plate 7 is conductively connected by connecting portion 72 and the second projection 32.
Further, between the described adjacent square frame 11 of plate body 1 each two, spacing is 12mm.
Separately, described die bond plate 7 connecting portion 72 is to a lateral buckling, and bent angle is 120 ��.
Separately having, in the middle part of the both wings 711 of described die bond plate 7 groove 71, bending is arranged, and overbending direction is identical with described connecting portion 72 overbending direction.
Again, the lead 6 being connected with described 3rd projection 33 is chamfering away from the angle, one end 61 of the 3rd projection 33.
Further, described end angle 61 is the end angle near second protruding 32 one end.
And, described lead 6 is generally aligned in the same plane with plate body 1.
Also, described often group is gone to runner hole 4 to include 2 and is gone to runner hole 41,41 ', the width two ends of the plate body 1 being opened between the adjacent square frame 11 of each two respectively, and hole, described location 5 and these 2 go to be placed equidistant between runner hole 41,41 '.
Also have, described plate body 1 width two ends offer three semi-cylindrical canyons along plate body 1 width equi-spaced apart respectively, being the first ~ the 3rd depression 81 ~ 83, the first depression 81 and the 3rd depression 83 corresponding described two go to runner hole 41,41 ' respectively, the second depression 82 holes, corresponding described location 5.
A kind of method for packing to slotting type TO220F encapsulating lead provided by the utility model is as follows: by die bond operation, chip crystal to be packaged is fixed on crystal bonding area 42, by the metal lead wire two ends specifying specification are carried out bonding wire at chip plane of crystal and lead 13 surface respectively, formation is conductively connected, thus electric current is passed through lead 2 by chip through plain conductor drain, it is conducted to outer lead 13 again through lead 2, described outer lead 13 links conducting with extraneous PC plate, completes encapsulation.
By described, slotting type TO220F encapsulating lead is radially split along go runner hole 4 and the fixing hole 5 between the adjacent square frame 11 of each two respectively after having encapsulated, form some encapsulation units, 6 outer leads 21 are included in each encapsulation unit, every 3 outer leads 21 are as the pin of encapsulation chip in 1 crystal bonding area 73, formed two chip pins to slotting type structure, during use, two chip pins are separated, obtains two molding encapsulated core sheets.
A kind of having the beneficial effects that slotting type TO220F encapsulating lead provided by the utility model: compare single lead frame, product monolithic quantity doubles, and the efficiency of later process die bond bonding wire is improve 20%, final product is cut improved efficiency one times, save the monolithic production time, drastically increase production efficiency; Adopting and slotting type is designed, punching press unit consumption reduces 20%, directly reduces the cost of raw material, considerably reduces the manufacturing cost of the type product so that it is commercially have higher competitiveness.
It should be noted that above example is only in order to illustrate the technical solution of the utility model and unrestricted. Although this utility model being described in detail with reference to preferred embodiment, it will be understood by those within the art that, the technical scheme of utility model can be modified or equivalent replacement, without deviating from the scope of technical solutions of the utility model, it all should be encompassed in right of the present utility model.
Claims (9)
1. one kind to slotting type TO220F encapsulating lead, it is characterised in that including: a plate body, its surface is arranged at intervals with some square frames along its length;
Some groups of outer leads, often group includes 6 outer leads, for strip, it is connected to described square frame along plate body length direction equi-spaced apart, its one end inside contracts, and forms serrated end, and the other end is link, the serrated end of two often adjacent outer leads respectively in be connected to the square frame two ends near plate body length direction, formed square frame two ends respectively in connect the link of 3 outer leads;
Some groups protruding, and often group projection is arranged on the long limit of described plate body along plate body length direction equi-spaced apart, the corresponding square frame of every two groups of projections, often group includes 3, it is divided into the first ~ the 3rd projection, arranges along plate body length direction equi-spaced apart, and relative with outer lead link respectively;
Some groups are gone to runner hole, and often group includes at least one and goes to runner hole, is opened in the plate body width one end between the adjacent square frame of each two;
Hole, some location, is arranged in the middle part of the plate body width between the adjacent square frame of each two;
Some leads, one end is protruding with described first projection and the 3rd respectively to be connected, and the other end is conductively connected with chip metal to be packaged lead-in wire respectively;
Some die bond plates, it is symmetricly set in described plate body square frame both sides along plate body length direction, a groove is offered along die bond plate length direction in the middle part of the end face of one end, projection a junction in the middle part of other end end face, middle part sets the crystal bonding area for placing chip to be packaged, periphery, crystal bonding area arranges framework, is formed with chip to be packaged and is conductively connected, and described die bond plate is conductively connected by connecting portion and the second projection.
2. one according to claim 1 is to slotting type TO220F encapsulating lead, it is characterised in that between the described adjacent square frame of plate body each two, spacing is 12mm.
3. one according to claim 1 is to slotting type TO220F encapsulating lead, it is characterised in that described die bond plate connecting portion is to a lateral buckling, and bent angle is 120 ��.
4. one according to claim 3 is to slotting type TO220F encapsulating lead, it is characterised in that in the middle part of the both wings of described die bond plate groove, bending is arranged, and overbending direction is identical with described connecting portion overbending direction.
5. one according to claim 1 is to slotting type TO220F encapsulating lead, it is characterised in that the lead being connected with described 3rd projection is chamfering away from the angle, one end of the 3rd projection.
6. one according to claim 5 is to slotting type TO220F encapsulating lead, it is characterised in that described end angle is the end angle near second protruding one end.
7. one according to claim 1 is to slotting type TO220F encapsulating lead, it is characterised in that described lead and plate body are generally aligned in the same plane.
8. one according to claim 1 is to slotting type TO220F encapsulating lead, it is characterized in that, described often group is gone to runner hole to include 2 and is gone to runner hole, the width two ends of the plate body being opened between the adjacent square frame of each two respectively, hole, described location and these 2 go to be placed equidistant between runner hole.
9. one according to claim 8 is to slotting type TO220F encapsulating lead, it is characterized in that, described plate body width two ends offer three semi-cylindrical canyons along plate body width equi-spaced apart respectively, it it is the first ~ the 3rd depression, first depression and the 3rd depression corresponding described two go to runner hole respectively, the second depression hole, corresponding described location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620044410.0U CN205303458U (en) | 2016-01-18 | 2016-01-18 | To inserting type TO220F encapsulation lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620044410.0U CN205303458U (en) | 2016-01-18 | 2016-01-18 | To inserting type TO220F encapsulation lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205303458U true CN205303458U (en) | 2016-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620044410.0U Expired - Fee Related CN205303458U (en) | 2016-01-18 | 2016-01-18 | To inserting type TO220F encapsulation lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205303458U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109698182A (en) * | 2018-12-28 | 2019-04-30 | 珠海锦泰电子科技有限公司 | A kind of power rectifier diode packaging frame |
| CN109860139A (en) * | 2018-12-27 | 2019-06-07 | 长电科技（宿迁）有限公司 | A kind of lead frame structure |
-
2016
- 2016-01-18 CN CN201620044410.0U patent/CN205303458U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109860139A (en) * | 2018-12-27 | 2019-06-07 | 长电科技（宿迁）有限公司 | A kind of lead frame structure |
| CN109698182A (en) * | 2018-12-28 | 2019-04-30 | 珠海锦泰电子科技有限公司 | A kind of power rectifier diode packaging frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160608 Termination date: 20180118 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |