CN107731775A - Suitable for the row lead frame of TO251 types eight of continuous filling technique - Google Patents
Suitable for the row lead frame of TO251 types eight of continuous filling technique Download PDFInfo
- Publication number
- CN107731775A CN107731775A CN201710878461.2A CN201710878461A CN107731775A CN 107731775 A CN107731775 A CN 107731775A CN 201710878461 A CN201710878461 A CN 201710878461A CN 107731775 A CN107731775 A CN 107731775A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- encapsulation
- flow passage
- row
- types
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000005538 encapsulation Methods 0.000 claims abstract description 44
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000009826 distribution Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of row lead frame of TO251 types eight suitable for continuous filling technique, include lead frame body, the multiple encapsulation units in array-like distribution being connected are set respectively in lead frame body, each encapsulation unit includes product fin inserting frame and pins of products inserting frame respectively, the fin inserting frame of two laterally adjacent encapsulation units is connected by dowel, dowel is provided with product fin cutting mouth, and pins of products cut-off port is respectively equipped with the pins of products inserting frame of each encapsulation unit；A flow passage unit is formed between every two row encapsulation unit, the upper and lower end of lead frame body is respectively equipped with positioning hole in the upper and lower of each flow passage unit, and each flow passage unit includes divide cast gate between the main cast gate for being arranged at lead frame body lower end and the fin inserting frame for being connected to two longitudinally adjacent encapsulation units respectively.The present invention coordinates the mode of MGP moulds or AUTO moulds to produce, easy to use.
Description
Technical field
The present invention relates to TO251 type leadframe worlds, specifically a kind of TO251 types eight suitable for continuous filling technique
Row lead frame.
Background technology
TO251 is a kind of power transistor and the paster type encapsulation of voltage stabilizing chip, is a kind of in the market using relatively broad
Electronic component, the type product is still flourishing long time after the development in more than 10 years, and in the market shows demand increasingly
Vigorous sign, and limited by IC chip and TO251 product packaging appearances, it carries the carrier of chip, that is,
The structure of lead frame changes less for many years, and widest structure in the market is four row's polymorphic structures, and every is drawn
Wire frame can encapsulate 112 products, and packing forms extrude epoxy resin for traditional center, by runner and cast gate to encapsulation
Position is fed, curing molding, is limited because the thickness by this kind of structural leadthroughs framework is thicker, Degate after encapsulation（Beat
Cast gate）When, the cohesive force of runner position and lead frame is big, causes lead frame to deform, big, the serious meeting of cast gate residual
Layering is produced, simultaneously as using runner feeding structure, 40% or so epoxy resin is there are about and is wasted on runner so that be single
The cost increase of product, furthermore the lead frame both ends of four row's structures are open, the part that centre interconnects is less, is welding
After connecting chip, lead frame length direction shows the uneven phenomenon of stress release, causes whole lead frame to deform,
Occur when encapsulation on mould into scenes such as the not smooth, beadings in position, in some instances it may even be possible to mould can be damaged by pressure.
The content of the invention
It is an object of the invention to provide a kind of row lead frame of TO251 types eight suitable for continuous filling technique, to improve
The production efficiency of TO251 products, product cost is reduced, reduce product fraction defective.
Technical scheme is as follows：
A kind of row lead frame of TO251 types eight suitable for continuous filling technique, include lead frame body, its feature exists
In：The multiple encapsulation units in array-like distribution being connected, each encapsulation unit point are set respectively in the lead frame body
Do not include product fin inserting frame and pins of products inserting frame, the fin inserting frame of laterally adjacent two encapsulation units
It is connected by dowel, dowel is provided with product fin cutting mouth, and the pins of products of each encapsulation unit is inserted on frame
It is respectively equipped with pins of products cut-off port；A flow passage unit is formed between every two row encapsulation unit, the lead frame body
Upper and lower end is respectively equipped with positioning hole in the upper and lower of each flow passage unit, each flow passage unit include respectively be arranged at it is described
Point between the main cast gate of lead frame body lower end and the fin inserting frame for being connected to two longitudinally adjacent encapsulation units
Cast gate.
The described row lead frame of TO251 types eight suitable for continuous filling technique, it is characterised in that：The lead frame
The material of body is copper, size 255mm*75mm*0.5mm.
The described row lead frame of TO251 types eight suitable for continuous filling technique, it is characterised in that：Described multiple envelopes
Dress unit has eight rows 20 row totally 160 encapsulation units.
The described row lead frame of TO251 types eight suitable for continuous filling technique, it is characterised in that：The flow passage unit
There are 20, the spacing between adjacent two flow passage units is 25.5mm.
The described row lead frame of TO251 types eight suitable for continuous filling technique, it is characterised in that：Adjacent two encapsulation
Longitudinal pitch between unit is 8.1mm.
The present invention can use on MGP moulds, can also be used on AUTO moulds.
Beneficial effects of the present invention：
Of the invention and existing TO251 lead frame ratio, single wire framework encapsulates 48 products more, and is greatly reduced
The consumption of epoxy resin, while decrease and weld later frame deformation, because gate shape is rectangle, position is at two
Among adjacent product, cast gate residual is few after degate, and plastic packaging body is not easy breakage, is improved while production cost is reduced
Production efficiency and yield rate.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention.
Fig. 2 is the structural representation of encapsulation unit in the present invention.
Fig. 3 is the structural representation of flow passage unit in the present invention.
Fig. 4 is Fig. 3 partial structurtes enlarged diagram.
Embodiment
Referring to accompanying drawing, a kind of row lead frame of TO251 types eight suitable for continuous filling technique, include lead frame sheet
Body 1, the multiple encapsulation units 2 in array-like distribution being connected, each encapsulation unit difference are set in lead frame body 1 respectively
Include product fin inserting frame 2-1 and pins of products inserting frame 2-2, the fin of laterally adjacent two encapsulation units is inserted
Frame up and be connected by dowel, dowel is provided with product fin cutting mouth 2-3, and the pins of products of each encapsulation unit is inserted
Pins of products cut-off port 2-4 is respectively equipped with framing up；A flow passage unit 3, lead frame are formed between every two row encapsulation unit
The upper and lower end of body 1 is respectively equipped with positioning hole 4 in the upper and lower of each flow passage unit, and each flow passage unit includes respectively to be set
The main cast gate 3-1 for being placed in the lower end of lead frame body 1 and the fin inserting frame for being connected to two longitudinally adjacent encapsulation units
Between divide cast gate 3-2.
In the present invention, the material of lead frame body 1 is copper, size 255mm*75mm*0.5mm.
Multiple encapsulation units 2 have eight rows 20 row totally 160 encapsulation units.
Flow passage unit 3 has 20, and the spacing between adjacent two flow passage units is 25.5mm.
Longitudinal pitch between adjacent two encapsulation units is 8.1mm.
Below in conjunction with accompanying drawing, the present invention is further illustrated：
Referring to Fig. 1,2,3, the size of lead frame body 1 is 255mm*75mm*0.5mm, is both adapted to the MGP of four groups of mould box structures
Encapsulation, AUTO moldings dress is also suitable for, flow passage unit 3 there are 20, and the spacing between adjacent two flow passage units is 25.5mm, more
Individual encapsulation unit 2 has eight rows 20 row totally 160 encapsulation units, and the longitudinal pitch between adjacent two encapsulation units is 8.1mm,
Product fin inserts frame 2-1 and pins of products inserting frame 2-2 consistency of thickness, is 0.5mm, pins of products inserting frame 2-2
The pin number that can be inserted is 3, and spacing and profile are reasonable, can rationally utilize copper material, and and can provides enough intensity, just
In the design and processing of mould.
Referring to Fig. 2, after encapsulation, the fin of product is cut off at product fin cutting mouth 2-3, due to TO251
It is direct insertion for three legs, it is not necessary to bend, after encapsulation, the pin of product is cut off at pins of products cut-off port 2-4.
Referring to Fig. 3,4, lead frame of the invention using continuous filling encapsulation technology, epoxy resin along the direction of arrow,
Filled since main cast gate 3-1 position, after first product, then by dividing cast gate 3-2 to be filled toward next product, according to
It is secondary until eight scheduling product be completely filled with.
In summary, using lead frame of the invention and using MGP moulds or the packaged type of AUTO moulds, using continuous
Filling technique fills to product, eliminates the part of sprue, it is only necessary to which central feeding and cast gate can be completed to fill, and subtract
The length of flow and pressure loss of resin are lacked, have substantially increased the utilization rate of resin, about 40% is saved on epoxy resin
Cost, while every group of diaphragm capsule produces 96 products more, improves production efficiency, furthermore, this lead frame welding of the invention
Stress is small, is unlikely to deform.
Claims (5)
1. a kind of row lead frame of TO251 types eight suitable for continuous filling technique, include lead frame body, its feature exists
In：The multiple encapsulation units in array-like distribution being connected, each encapsulation unit point are set respectively in the lead frame body
Do not include product fin inserting frame and pins of products inserting frame, the fin inserting frame of laterally adjacent two encapsulation units
It is connected by dowel, dowel is provided with product fin cutting mouth, and the pins of products of each encapsulation unit is inserted on frame
It is respectively equipped with pins of products cut-off port；A flow passage unit is formed between every two row encapsulation unit, the lead frame body
Upper and lower end is respectively equipped with positioning hole in the upper and lower of each flow passage unit, each flow passage unit include respectively be arranged at it is described
Point between the main cast gate of lead frame body lower end and the fin inserting frame for being connected to two longitudinally adjacent encapsulation units
Cast gate.
2. TO251 types eight row lead frame according to claim 1 suitable for continuous filling technique, it is characterised in that：
The material of the lead frame body is copper, size 255mm*75mm*0.5mm.
3. TO251 types eight row lead frame according to claim 1 suitable for continuous filling technique, it is characterised in that：
Described multiple encapsulation units have eight rows 20 row totally 160 encapsulation units.
4. the row lead frame of TO251 types eight suitable for continuous filling technique according to claim 1-3, its feature exist
In：The flow passage unit has 20, and the spacing between adjacent two flow passage units is 25.5mm.
5. the row lead frame of TO251 types eight suitable for continuous filling technique according to claim 1-3, its feature exist
In：Longitudinal pitch between adjacent two encapsulation units is 8.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710878461.2A CN107731775A (en) | 2017-09-26 | 2017-09-26 | Suitable for the row lead frame of TO251 types eight of continuous filling technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710878461.2A CN107731775A (en) | 2017-09-26 | 2017-09-26 | Suitable for the row lead frame of TO251 types eight of continuous filling technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107731775A true CN107731775A (en) | 2018-02-23 |
Family
ID=61207414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710878461.2A Pending CN107731775A (en) | 2017-09-26 | 2017-09-26 | Suitable for the row lead frame of TO251 types eight of continuous filling technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107731775A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300873A (en) * | 2018-11-28 | 2019-02-01 | 铜陵中锐电子科技有限公司 | Pin staggered type multi-row lead frame frame suitable for TO252 |
| CN109904077A (en) * | 2019-01-21 | 2019-06-18 | 深圳赛意法微电子有限公司 | The packaging method of multi-pipe pin semiconductor product |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4556896A (en) * | 1982-08-30 | 1985-12-03 | International Rectifier Corporation | Lead frame structure |
| US5886398A (en) * | 1997-09-26 | 1999-03-23 | Lsi Logic Corporation | Molded laminate package with integral mold gate |
| JP2002252319A (en) * | 2001-02-23 | 2002-09-06 | Nippon Inter Electronics Corp | Semiconductor device and its manufacturing method and lead frame |
| JP2004087883A (en) * | 2002-08-28 | 2004-03-18 | Sanyo Electric Co Ltd | Lead frame and method for manufacturing semiconductor device using the same |
| JP2007129113A (en) * | 2005-11-05 | 2007-05-24 | Towa Corp | Method for cutting gate for molded matrix-type lead frame |
| JP2007220875A (en) * | 2006-02-16 | 2007-08-30 | Daiichi Seiko Kk | Method for breaking gate for resin-sealed molded form and gate breaking device used for it |
| CN201584406U (en) * | 2009-12-22 | 2010-09-15 | 宁波华龙电子股份有限公司 | Densely arranged microelectronic transistor lead frame assembly |
| CN101930933A (en) * | 2008-09-30 | 2010-12-29 | 三洋电机株式会社 | Method for manufacturing semiconductor device |
| CN202888164U (en) * | 2012-10-30 | 2013-04-17 | 天水华天科技股份有限公司 | Novel TO (Triode)-series matrix type lead frame |
| CN207503966U (en) * | 2017-09-26 | 2018-06-15 | 铜陵中锐电子科技有限公司 | Suitable for eight row lead frame of TO251 types of continuous filling technique |
| CN109300873A (en) * | 2018-11-28 | 2019-02-01 | 铜陵中锐电子科技有限公司 | Pin staggered type multi-row lead frame frame suitable for TO252 |
-
2017
- 2017-09-26 CN CN201710878461.2A patent/CN107731775A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4556896A (en) * | 1982-08-30 | 1985-12-03 | International Rectifier Corporation | Lead frame structure |
| US5886398A (en) * | 1997-09-26 | 1999-03-23 | Lsi Logic Corporation | Molded laminate package with integral mold gate |
| JP2002252319A (en) * | 2001-02-23 | 2002-09-06 | Nippon Inter Electronics Corp | Semiconductor device and its manufacturing method and lead frame |
| JP2004087883A (en) * | 2002-08-28 | 2004-03-18 | Sanyo Electric Co Ltd | Lead frame and method for manufacturing semiconductor device using the same |
| JP2007129113A (en) * | 2005-11-05 | 2007-05-24 | Towa Corp | Method for cutting gate for molded matrix-type lead frame |
| JP2007220875A (en) * | 2006-02-16 | 2007-08-30 | Daiichi Seiko Kk | Method for breaking gate for resin-sealed molded form and gate breaking device used for it |
| CN101930933A (en) * | 2008-09-30 | 2010-12-29 | 三洋电机株式会社 | Method for manufacturing semiconductor device |
| CN201584406U (en) * | 2009-12-22 | 2010-09-15 | 宁波华龙电子股份有限公司 | Densely arranged microelectronic transistor lead frame assembly |
| CN202888164U (en) * | 2012-10-30 | 2013-04-17 | 天水华天科技股份有限公司 | Novel TO (Triode)-series matrix type lead frame |
| CN207503966U (en) * | 2017-09-26 | 2018-06-15 | 铜陵中锐电子科技有限公司 | Suitable for eight row lead frame of TO251 types of continuous filling technique |
| CN109300873A (en) * | 2018-11-28 | 2019-02-01 | 铜陵中锐电子科技有限公司 | Pin staggered type multi-row lead frame frame suitable for TO252 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300873A (en) * | 2018-11-28 | 2019-02-01 | 铜陵中锐电子科技有限公司 | Pin staggered type multi-row lead frame frame suitable for TO252 |
| CN109904077A (en) * | 2019-01-21 | 2019-06-18 | 深圳赛意法微电子有限公司 | The packaging method of multi-pipe pin semiconductor product |
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