CN208368496U - Pre-formed body structure of lead frame - Google Patents
Pre-formed body structure of lead frame Download PDFInfo
- Publication number
- CN208368496U CN208368496U CN201820620917.5U CN201820620917U CN208368496U CN 208368496 U CN208368496 U CN 208368496U CN 201820620917 U CN201820620917 U CN 201820620917U CN 208368496 U CN208368496 U CN 208368496U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- those
- body structure
- formed body
- pins
- Prior art date
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- 239000002184 metal Substances 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000000945 filler Substances 0.000 claims abstract description 18
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
A pre-formed body structure of lead frame includes: a lead frame and a filler. The lead frame is provided with a metal frame, the metal frame is provided with a plurality of connecting rods, the connecting rods are connected with a chip seat in a linking mode, a plurality of pins are arranged between the metal frame and the chip seat, one ends of the pins are respectively connected with a connecting part, the connecting parts are connected with the metal frame, a plurality of intervals are formed between one ends of the pins and the metal frame, and gaps are formed among the pins and between the other ends of the pins and the chip seat through the connecting parts. The filler is arranged in the gap and the interval of the lead frame, so that the metal frame, the connecting rods, the chip seat and the pins on the front side of the preformed body structure of the lead frame are exposed, and the metal frame, the connecting parts and the chip seat on the back side are exposed.
Description
Technical field
The utility model is in relation to a kind of lead frame, the pre-formed body structure of espespecially a kind of lead frame with filler.
Background technique
It is known that current IC semiconductor chip packaging technique, is all that a metal material is first utilized etching or stamping technology
It is formed with a lead frame, which includes: a metal edge frame, multiple pins and a chip carrier.When packaged, first by chip
Die bond is after lead frame, then carries out beating gold thread and make the route electrical connection of chip and pin, in utilizing resin after having beaten gold thread
In forming a packaging body on the chip and the lead frame, then cut the semiconductor element as many.
Since the integral support and pin of the above-mentioned lead frame are excessively elongated, the back side has half-etching technology to be formed by again
Structure, therefore in following process production, can usually be affected by the external environment causes those pins to generate shift phenomenon, causes to beat
Line mass is unstable, and reduces production yield.
Utility model content
Therefore, the main purpose of the utility model is to solve traditional missing, and the utility model provides a new structure,
Lead frame etching after the completion of, using project or hot-pressing technique by plastic shaping in the gap of the lead frame, recessed portion and
Away from upper, make the lead frame in subsequent processing technology, pin will not all be made to generate shift phenomenon, allow following process routing more preferably
Stablize, also promotes manufacturing yield.
In order to achieve the above object, the utility model provides a kind of pre-formed body structure of lead frame, includes: a lead frame and
One filler.There is a metal edge frame, which has multiple connecting rods, those, which are coupled pole interlinking, one on the lead frame
Chip carrier has multiple pins between the metal edge frame and the chip carrier, those pin one end are respectively linked with a linking part, with this
A little linking parts and the metal edge frame link, and make to be formed with multiple spacing between one end of those pins and the metal edge frame, the company
Knot to be formed with naked shape between those pins and those pins and between the other end of those pins and the chip carrier
Gap.The filler is to be set between the gap and those pin one end and the metal edge frame of the naked shape of the lead frame
In spacing.Wherein, it is set to those spacing, those gaps of the lead frame in the filler, makes the pre-formed body structure of the lead frame
The positive metal edge frame, those connecting rods, the chip carrier and those pins exposed, the pre-formed body structure of the lead frame is presented
The metal edge frame at the back side, those linking parts and the chip carrier present it is exposed.
In an embodiment of the utility model, which is linked to the metal edge frame and four sides of the chip carrier
Angle.
In an embodiment of the utility model, those connecting rod back sides of the lead frame have a recessed portion admittedly.
In an embodiment of the utility model, which is copper metal material.
In an embodiment of the utility model, which is plastics.
In an embodiment of the utility model, which is epoxy resin encapsulating material.
In an embodiment of the utility model, the exposed chip carrier in front of the pre-formed body structure of the lead frame and those
A metal layer is respectively provided on the surface of pin.
In an embodiment of the utility model, which is ag material.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the lead frame of the utility model；
Fig. 2 is the schematic rear view of Fig. 1 lead frame；
Fig. 3 is the side schematic cross-sectional view of Fig. 1；
Fig. 4 is the lead frame and filler combination schematic diagram of the utility model；
Fig. 5 is the schematic rear view of Fig. 4；
Fig. 6 is the side schematic cross-sectional view of Fig. 4；
Fig. 7 is that the front of the pre-formed body of lead frame is electroplate with one layer of metal layer schematic diagram.
Wherein, appended drawing reference:
The pre-formed body structure 10 of lead frame
Lead frame 1
Metal edge frame 11
Connecting rod 12
Concave portion 121
Chip carrier 13
Pin 14
Linking part 15
Spacing 16
Gap 17
Specific embodiment
Hereby in relation to the technical content and a detailed description of the utility model, schema is cooperated to be described as follows now:
Please refer to the side of the stereoscopic of lead frame and the back side of Fig. 1 lead frame and Fig. 1 that Fig. 1,2,3 are the utility model
Schematic cross-sectional view.As shown in the figure: the pre-formed body structure 10 of the lead frame of the utility model is by a metal plate first with etching skill
Art forms a lead frame 1, has a metal edge frame 11 in each lead frame 1, four corners of the metal edge frame 11 respectively have
There is a connecting rod (Tie bar) 12, those 12 chains of connecting rod are connected to a chip carrier 13, the metal edge frame 11 and the chip carrier 13
Between there are multiple pins 14, one end systems of those pins 14 and be formed by linking part 15 and the metal through half-etching technology
Frame 11 links, and makes to be formed with multiple a spacing 16 between one end of those pins 14 and the metal edge frame 11, while the connection
Portion 15 to be formed between those pins 14 and those pins 14 and between the other end of those pins 14 and the chip carrier 13
The gap 17 of naked shape.And in the lead frame 1 in etching process, those 12 back sides of connecting rod of the lead frame 1 are also by half
The formed recessed portion 121 of etching technique.In this schema, which is copper metal material.
Please refer to that Fig. 4,5,6 are the utility model lead frame is in conjunction with filler and the back side of Fig. 4 and the side of Fig. 4 are cutd open
Depending on schematic diagram.It is as shown in the figure: after the completion of the lead frame 1 of Fig. 1,2 etch, using injection or hot-pressing technique by plastic shaping in this
The gap 17 of the naked shape of lead frame 1, the recessed portion 121 at 12 back side of connecting rod and those 14 one end of pin and the metal
In spacing 16 between frame 11, become the filler 2 of the lead frame 1 after plastic shaping.
After the filler 2 is filled in those spacing 16, those gaps 17 and those recessed portions 121 of the lead frame 1, make
The positive metal edge frame 11, those connecting rods 12, the chip carrier 13 and those pins of the pre-formed body structure 10 of the lead frame
14 are presented exposed, the metal edge frame 11, those link portions 15 and the chip carrier at the back side of the pre-formed body structure 10 of the lead frame
13 presentations are exposed.
And after the lead frame 1 is filled with the filler 2, it generate those pins 14 of the lead frame 1 will not any inclined
Routing unstable state will not be generated when in order to following process routing by moving phenomenon.In this schema, which is
Plastics, plastics are epoxy resin encapsulating material (Epoxy Molding Compound, EMC).
Please refer to the one layer of metal layer schematic diagram of front plating for the pre-formed body of lead frame that Fig. 7 is the utility model.Such as figure
It is shown: after the filler 2 of the lead frame 1 completes, in the exposed chip in the front of the pre-formed body structure 10 of the lead frame
One layer of metal layer 3 is electroplated by electroplating technology on the surface of seat 13 and the surface of those pins 14, the metal layer 3 is to provide
When the stability and routing of 13 following process die bond of chip carrier, can by gold thread (not shown) it is stable be welded in those
On pin 14.In this schema, which is ag material.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
Various corresponding changes and modifications, but these corresponding changes and modifications can be made according to the present invention by knowing those skilled in the art
It all should belong to the protection scope of the claims in the present invention.
Claims (8)
1. a kind of pre-formed body structure of lead frame, which is characterized in that include:
One lead frame has a metal edge frame thereon, which has multiple connecting rods, those, which are coupled pole interlinking, a core
Bar has multiple pins between the metal edge frame and the chip carrier, those pin one end are respectively linked with a linking part, with those
Linking part and the metal edge frame link, and make to be formed with multiple spacing between one end of those pins and the metal edge frame, the connection
Portion to be formed between naked shape between those pins and those pins and between the other end of those pins and the chip carrier
Gap；
One filler is between the gap and those pin one end and the metal edge frame of the naked shape of the lead frame
In spacing；
Wherein, it is set to those spacing, those gaps of the lead frame in the filler, makes the pre-formed body structure of the lead frame just
Exposed, the back of the pre-formed body structure of the lead frame is presented in the metal edge frame, those connecting rods, the chip carrier and those pins in face
The metal edge frame, those linking parts and the chip carrier in face present exposed.
2. the pre-formed body structure of lead frame according to claim 1, which is characterized in that the connecting rod is linked to the metal edges
Four corners of frame and the chip carrier.
3. the pre-formed body structure of lead frame according to claim 1, which is characterized in that those connecting rods of the lead frame are carried on the back
Face has a recessed portion admittedly.
4. the pre-formed body structure of lead frame according to claim 1, which is characterized in that the lead frame is copper metal conducting wire
Frame.
5. the pre-formed body structure of lead frame according to claim 1, which is characterized in that the filler is plastic filler.
6. the pre-formed body structure of lead frame according to claim 5, which is characterized in that the plastic filler is epoxy resin
Encapsulate filler.
7. the pre-formed body structure of lead frame according to claim 1, which is characterized in that the pre-formed body structure of the lead frame
A metal layer is respectively provided on the surface of front exposed chip carrier and those pins.
8. the pre-formed body structure of lead frame according to claim 7, which is characterized in that the metal layer is silver metal layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107204971 | 2018-04-17 | ||
| TW107204971U TWM567479U (en) | 2018-04-17 | 2018-04-17 | Lead frame preform structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208368496U true CN208368496U (en) | 2019-01-11 |
Family
ID=64399599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820620917.5U Active CN208368496U (en) | 2018-04-17 | 2018-04-27 | Pre-formed body structure of lead frame |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3219940U (en) |
| CN (1) | CN208368496U (en) |
| TW (1) | TWM567479U (en) |
-
2018
- 2018-04-17 TW TW107204971U patent/TWM567479U/en unknown
- 2018-04-27 CN CN201820620917.5U patent/CN208368496U/en active Active
- 2018-11-19 JP JP2018004474U patent/JP3219940U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM567479U (en) | 2018-09-21 |
| JP3219940U (en) | 2019-01-31 |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |