CN208189578U - Improved structure of lead frame with circuit - Google Patents
Improved structure of lead frame with circuit Download PDFInfo
- Publication number
- CN208189578U CN208189578U CN201820613524.1U CN201820613524U CN208189578U CN 208189578 U CN208189578 U CN 208189578U CN 201820613524 U CN201820613524 U CN 201820613524U CN 208189578 U CN208189578 U CN 208189578U
- Authority
- CN
- China
- Prior art keywords
- platform
- lead frame
- pass
- zone
- improved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002184 metal Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical group [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005234 chemical deposition Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
An improved structure of lead frame with circuit includes: a lead frame, a platform and a circuit layer. The lead frame is provided with a metal frame, a plurality of connecting rods, a chip seat and a penetrating area, the connecting rods are connected with the metal frame and the chip seat, and the platform is arranged in the penetrating area of the lead frame; the platform is provided with a plurality of grooves, one ends of the grooves are adjacent to the metal frame, the other ends of the grooves are adjacent to the chip seat, the grooves are respectively provided with a through hole, and the through holes penetrate through the front surface and the back surface of the platform so as to enable the grooves on the front surface and the back surface of the platform to be communicated. The circuit layer is arranged in the grooves and the through holes on the front surface and the back surface of the platform. When the circuit layer is arranged in the grooves, one ends of the conductive wires positioned at the outer ends of the grooves are not electrically connected with the metal frame.
Description
Technical field
The utility model is espespecially a kind of without electrical junction connection metal edge frame and a plurality of conduction in relation to a kind of lead frame
The lead frame structure-improved of line.
Background technique
It is known that current IC semiconductor chip first makes a lead frame 100 (such as Fig. 1 a, 1b), this is led when encapsulating production
Coil holder 100 has a metal edge frame 101, multiple connecting rods 102, a chip carrier 103 and a pass-through zone 104, those connecting rods
It is connect with the metal edge frame 101 and the chip carrier 103.Run through area in the first pass-through zone 1041, second of the pass-through zone 104
Plastic material is filled up in domain 1042 and third pass-through zone 1043, to form a platform.It is have on the front of the platform 200
There are multiple grooves 201, respectively there is pass through aperture (not shown), those through holes are through the platform 200 on those grooves 201
The front and the back side.The line layer 300 is set in those grooves 201 and those through holes, multiple conductions of the line layer 300
301 one end of line is electrically connected by electrical junction 302 and the metal edge frame 101, keeps those conductor wires 301 electrically conductive, with
Carry out subsequent processing change it is silver-plated after, the technique of re-plating copper.
Since above-mentioned line layer 300 is when chemical deposition is electroplated, it is necessary to spend more those 302 chemical depositions of electrical junction
Time, will lead to the overlong time in chemical deposition plating, the production time of production lead frame caused also opposite to extend.
Utility model content
Therefore, the main purpose of the utility model is to solve traditional missing, and the utility model mentions one in lead frame
After line layer completes, it is electrically connected multiple conductor wires with the metal edge frame, without carrying out subsequent electroplating technology,
Keep production more preferably simple, cost of manufacture also is greatly reduced, makes Yield lmproved.
The another object of the utility model is to make line layer on platform, and the design flexibility of the lead frame can be made big,
Allow the line layer can do that the line spacing between design alteration and line layer can contract at any time is smaller outer.
In order to achieve the above object, the utility model provides a kind of lead frame structure-improved for having route, includes: a conducting wire
Frame, a platform and a line layer.There is a metal edge frame, multiple connecting rods, a chip carrier and pass-through zone on the lead frame, it should
A little connecting rods are connect with the metal edge frame and the chip carrier, which includes one first pass-through zone, this first runs through
Region is located at four sides of the chip carrier.The platform is set in the first pass-through zone of the pass-through zone of the lead frame；The platform
Front and the back side be equipped with multiple grooves, those grooves have an outer end and an inner end, the outer end and the metal edges
Frame is adjacent, and the inner end is adjacent with the chip carrier, respectively has pass through aperture on the outer end of those grooves, those through holes are to pass through
The front and the back side for wearing the platform communicate those grooves at platform front and the back side.The line layer is set to platform front
And in those grooves and those through holes at the back side.Wherein, when the line layer is set to those grooves, positioned at the outer of those grooves
Those conductor wire one end of end are not electrically connected with the metal edge frame.
In one of the utility model embodiment, the material of the lead frame is copper metal material.
In one of the utility model embodiment, the material of the platform plastics.
In one of the utility model embodiment, which is epoxy resin encapsulating material.
In one of the utility model embodiment, which has a plurality of conductor wire, multiple conductive parts and multiple weld pads
Portion.
In one of the utility model embodiment, those conducting positions in those through holes, those conductive part one end with
Those positive conductor wires of the platform are electrically connected, and one end of those conductive parts and those weld pad portions at the platform back side electrically connect
It connects.
In one of the utility model embodiment, which has further included one second pass-through zone and a third runs through
Region；Second pass-through zone is located on the chip carrier, which is located on four corners of the metal edge frame.
Detailed description of the invention
Fig. 1 a is traditional lead frame appearance diagram；
Fig. 1 b is the partial enlargement diagram of Fig. 1 a；
Fig. 2 is the metal framework appearance diagram of the lead frame of the tool route of the utility model；
Fig. 3 is the schematic rear view of Fig. 2；
Fig. 4 is the front schematic view of formation platform on the lead frame of the tool route of the utility model；
Fig. 5 is the schematic rear view of Fig. 4；
Fig. 6 is that groove and through hole schematic diagram are made on the front of the platform of the utility model；
Fig. 7 is the groove partial enlargement diagram of Fig. 6；
Fig. 8 is that the groove and through hole on the platform of the utility model make conspectus；
Fig. 9 is the schematic rear view of Fig. 8；
Figure 10 is the side schematic cross-sectional view of Fig. 8.
Wherein appended drawing reference are as follows:
Lead frame 100
Metal edge frame 101
Connecting rod 102
Chip carrier 103
Pass-through zone 104
First pass-through zone 1041
Second pass-through zone 1042
Third pass-through zone 1043
Platform 200
Groove 201
Line layer 300
Conductor wire 301
Electrical junction 302
Conducting wire frame structure 10
Lead frame 1
Metal edge frame 11
Connecting rod 12
Chip carrier 13
Pass-through zone 14
First pass-through zone 141
Second pass-through zone 142
Third pass-through zone 143
Platform 2
Groove 21
Outer end 211
Inner end 212
Through hole 22
Line layer 3
Conductor wire 31
Conductive part 32
Weld pad portion 33
Specific embodiment
Hereby in relation to the technical content and a detailed description of the utility model, schema is cooperated to be described as follows now:
Fig. 2,3 are please referred to, is the metal edge frame appearance and the back side signal of Fig. 2 of the lead frame of the tool route of the utility model
Figure.It is as shown in the figure: the lead frame structure-improved of the tool route of the utility model, by one lead frame knot of metal plate elder generation punch forming
Structure 10, has a lead frame 1 on the conducting wire frame structure 10, and lead frame 1 has a metal edge frame 11, multiple connecting rod (Tie
Bar) 12, one chip carrier 13 and a pass-through zone 14, those connecting rods 12 are connect with the metal edge frame 11 and the chip carrier 13, should
Pass-through zone 14 includes one first pass-through zone 141, one second pass-through zone 142 and a third pass-through zone 143.This first
Pass-through zone 141 is located at four sides of the chip carrier 13, which is located on the chip carrier 13, which runs through
Region 143 is located on four corners of the metal edge frame 11.In this schema, which is copper metal material.
Fig. 4,5 are please referred to, is shown for the front of formation platform on the lead frame of the tool route of the utility model and the back side of Fig. 4
It is intended to.It is as shown in the figure: plastic shaping being run through into area in this using injection or hot-pressing technique on the above-mentioned lead frame 1 to complete
The flat of a plastics is formed in first pass-through zone 141 in domain 14, second pass-through zone 142 and the third pass-through zone 143
Platform 2.In this schema, which is epoxy resin encapsulating material (Epoxy Molding Compound, EMC).
Fig. 6,7 are please referred to, is the groove part for making groove and through hole and Fig. 6 on the front of the platform of the utility model
Enlarged diagram.It is as shown in the figure: after the platform 2 takes shape in the metal edge frame 11, using laser light carving machine (not shown) in
It is etched by light on the front and the back side of the platform 2, in being formed with multiple ditches on the front and the back side of the platform 2 after photoetch
Slot 21, those grooves 21 have an outer end 211 and an inner end 212, and the outer end 211 is adjacent with the metal edge frame 11, should
Inner end 212 is adjacent with the chip carrier 13, respectively has pass through aperture 22 on the outer end 211 of those grooves 21.Those through holes
22 through the front and the back side of the platform 2 communicate, those grooves 21 in 2 front of platform and the back side.
Fig. 8,9,10 are please referred to, are that the groove and through hole on the platform of the utility model make route and the back side of Fig. 8
With the side schematic cross-sectional view of Fig. 8.It is as shown in the figure: to complete in those grooves 21 of the above-mentioned platform 2 and those through holes 22
Afterwards, film deposition techniques are carried out in those grooves 21 and those through holes 22, makes metal material heavy in film deposition process
Product forms a line layer 3 in those grooves 21 and those through holes 22, which includes that a plurality of conductor wire (is equivalent to
Traditional pin) 31, multiple conductive parts 32 and multiple weld pad portions 33.Those conductive parts 32 are located in those through holes 22, those
32 one end of conductive part and those positive conductor wires 31 of the platform 2 are electrically connected, and one end of those conductive parts 32 and the platform 2 are carried on the back
Those weld pad portions 33 in face are electrically connected.
Line layer 3 is made on the platform 2, in addition to 1 design flexibility of lead frame can be made big, allows the line layer 3 can be with
That does that the line spacing between design alteration and line layer 3 can contract at any time is smaller outer.After being that the line layer 3 completes, position
It is not electrically connected with the metal edge frame 11 in those conductor wires 31 on the outer end of those grooves 21 211, after progress
Continuous electroplating technology, makes to make simpler, and cost of manufacture also is greatly reduced, and makes Yield lmproved.
Only the above is only the preferred embodiment of the present invention, is not intended to the patent protection model of limitation the utility model
It encloses, therefore uses the equivalence changes carried out by the utility model specification or schema content such as, it is practical new to be similarly all contained in this
In the rights protection scope of type.
Claims (7)
1. a kind of lead frame structure-improved for having route, includes:
One lead frame has a metal edge frame, multiple connecting rods, a chip carrier and pass-through zone, the multiple connecting rod thereon
It is connect with the metal edge frame and the chip carrier, which includes one first pass-through zone, which is located at
Four sides of the chip carrier；
One platform, in the first pass-through zone of the pass-through zone of the lead frame；The front and the back side of the platform are equipped with
Multiple grooves, the multiple groove have an outer end and an inner end, and the outer end is adjacent with the metal edge frame, the inner end
It is adjacent with the chip carrier, respectively there is pass through aperture, the through hole is through the platform on the outer end of the multiple groove
Front and the back side communicate the multiple groove at platform front and the back side；
One line layer, in the multiple groove and the through hole at platform front and the back side；
Wherein, multiple conductor wires one when the line layer is set to the multiple groove, positioned at the outer end of the multiple groove
End is not electrically connected with the metal edge frame.
2. the lead frame structure-improved of tool route as described in claim 1, which is characterized in that the material of the lead frame is copper gold
Belong to material.
3. the lead frame structure-improved of tool route as described in claim 1, which is characterized in that the material of the platform is plastics.
4. the lead frame structure-improved of tool route as claimed in claim 3, which is characterized in that the plastics are epoxy resin encapsulation
Material.
5. the lead frame structure-improved of tool route as described in claim 1, which is characterized in that the line layer has a plurality of conduction
Line, multiple conductive parts and multiple weld pad portions.
6. the lead frame structure-improved of tool route as claimed in claim 5, which is characterized in that the multiple conducting position is in more
In a through hole, the multiple conductive part one end and the positive a plurality of conductor wire of the platform are electrically connected, described more
The multiple weld pad portion at one end of a conductive part and the platform back side is electrically connected.
7. the lead frame structure-improved of tool route as described in claim 1, which is characterized in that the pass-through zone has further included one
Second pass-through zone and a third pass-through zone；Second pass-through zone is located on the chip carrier, which is located at
On four corners of the metal edge frame.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107205174 | 2018-04-20 | ||
| TW107205174U TWM567476U (en) | 2018-04-20 | 2018-04-20 | Improved structure of lead frame with lines |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208189578U true CN208189578U (en) | 2018-12-04 |
Family
ID=64399679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820613524.1U Active CN208189578U (en) | 2018-04-20 | 2018-04-26 | Improved structure of lead frame with circuit |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3219942U (en) |
| CN (1) | CN208189578U (en) |
| TW (1) | TWM567476U (en) |
-
2018
- 2018-04-20 TW TW107205174U patent/TWM567476U/en unknown
- 2018-04-26 CN CN201820613524.1U patent/CN208189578U/en active Active
- 2018-11-19 JP JP2018004476U patent/JP3219942U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP3219942U (en) | 2019-01-31 |
| TWM567476U (en) | 2018-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102299082B (en) | Producing method of semiconductor bearing element and producing method of package using the semiconductor bearing element | |
| CN101335217B (en) | Semiconductor package and manufacturing method thereof | |
| CN102569242B (en) | Semiconductor packaging part of integrated screened film and manufacture method thereof | |
| CN105280834A (en) | Packaging structure and manufacturing method thereof | |
| CN104659007B (en) | Semiconductor package assembly and a manufacturing method thereof | |
| CN106298743A (en) | Encapsulating structure with shield effectiveness and preparation method thereof | |
| CN208189578U (en) | Improved structure of lead frame with circuit | |
| CN107342354B (en) | A kind of IC package technique | |
| CN101090077A (en) | Semiconductor package and its manufacturing method | |
| CN103165560B (en) | Substrate and apply its semiconductor structure | |
| CN104332465B (en) | 3D packaging structure and technological method thereof | |
| CN208954970U (en) | A kind of RFID chip | |
| CN208368496U (en) | Pre-formed body structure of lead frame | |
| CN103474358A (en) | Multi-circle QFN package lead frame manufacturing method | |
| CN108010852B (en) | Method for manufacturing lead frame | |
| CN208111435U (en) | Lead frame structure with chip holder | |
| CN207834351U (en) | Light emitting package component | |
| CN101488486B (en) | Circuit substrate capable of opening slots | |
| CN207966971U (en) | General-purpose built-up circuit layer for semiconductor package | |
| CN208298818U (en) | Flat-plate type wire frame structure with circuit | |
| CN208521926U (en) | Improved structure of lead frame with circuit | |
| CN108962862A (en) | Method for manufacturing lead frame with circuit and structure thereof | |
| CN206040633U (en) | Encapsulation lead frame in advance takes shape | |
| CN208521925U (en) | Improved structure of lead frame with circuit | |
| CN210516713U (en) | Ceramic substrate structure capable of realizing surface electroplating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |