CN205282500U - Improvement structure of dull and stereotyped plain conductor frame - Google Patents

Improvement structure of dull and stereotyped plain conductor frame Download PDF

Info

Publication number
CN205282500U
CN205282500U CN201520774159.9U CN201520774159U CN205282500U CN 205282500 U CN205282500 U CN 205282500U CN 201520774159 U CN201520774159 U CN 201520774159U CN 205282500 U CN205282500 U CN 205282500U
Authority
CN
China
Prior art keywords
lead
lead frame
pad
frame
foot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201520774159.9U
Other languages
Chinese (zh)
Inventor
黄嘉能
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chang Wah Technology Co Ltd
Original Assignee
Chang Wah Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chang Wah Technology Co Ltd filed Critical Chang Wah Technology Co Ltd
Priority to CN201520774159.9U priority Critical patent/CN205282500U/en
Application granted granted Critical
Publication of CN205282500U publication Critical patent/CN205282500U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model discloses an improvement structure of dull and stereotyped plain conductor frame divide into the dull and stereotyped plain conductor frame of slimming LED, includes and leads foot and weld pad, and enclose the portion of enclosing that protects that is equipped with on the connective bar of adjacent lead frame and the regional slot hole, the dull and stereotyped plain conductor frame of slimming IC includes and leads foot and weld pad more than two, the weld pad divide into the ring or the form of ring with having with not having, and lead frame adjacent again is equipped with regional stick, and the support stick has been erect on weld pad or ground ring sum region stick and limit to enclose the portion of enclosing that protects that is equipped with on leading foot and support stick. The utility model discloses a portion of enclosing that protects that insulating material formed the cell type form is filled with integrated into one piece to characteristics for fill insulating material and oversimplify, improve technology yield and structural strength, and then simplify packaging technology and improve the packaging technology yield.

Description

The improved structure of flat metal lead frame
Technical field
The utility model relates to a kind of structure being applicable to LED and IC conductive metal frames, it it is the pad portion forming plate morphology and grooved form with one-body molded fill insulant, make packaging process simplify and improve the structural strength of lead frame, and effectively improve the good rate of packaging process.
Background technology
As shown in Figure 1, for TaiWan, China notification number is No. M475699 " LED flat plate conductive metal frames " utility model patent in Fig. 1, described patent is applicable to thickness thicker copper/iron material, for reaching the requirement of slimming, then must use the copper/iron material of thinner thickness, but structural strength can reduce after slimming copper/iron material forms conductive metal frames via etch process, easily produce the situation of fracture, after fill insulant, contribute to improving structural strength, only, the Technology of fill insulant, along with the thinner difficulty further of thickness, the good rate of technique is caused to reduce, simultaneously in packaging process operation also along with the thinner difficulty further of thickness, defective products is caused to increase.
The content of described patent is as described later, mainly there is a LED metal substrate, described LED metal substrate is made up of the adjacent weldering pad 110 ' established and lead foot 120 ', and between described weldering pad 110 ' and lead foot 120 ', there is a spacing 130 ', described weldering pad 110 ' and lead foot 120 ' have offered hollow portion 160 ' respectively, upper depression portion 140 ' and lower concave portion 150 ', and the upper depression portion 140 ' of weldering pad 110 ' can be connected the hollow portion 160 ' of weldering pad with lower concave portion 150 ', and depression portion 140 ' also can be connected the hollow portion 160 ' of lead foot with lower concave portion 150 ' in the part of lead foot 120 ', wherein, in described spacing 130 ', weldering pad 110 ' and lead foot 120 ' are around, and the upper depression portion 140 ' that arranges respectively of weldering pad 110 ' and lead foot 120 ' and lower concave portion 150 ' are provided with mutual thermosetting/plastic material then.
Practical novel content
In view of this, main purpose of the present utility model is to provide the improved structure of a kind of flat metal lead frame, can be applicable to the LED conducting wire frame structure of slimming and IC conducting wire frame structure, make fill insulant simplify, put forward advantages of high process yield and structural strength, and then simplify packaging process and improve the good rate of packaging process.
For achieving the above object, the technical solution of the utility model is achieved in that
The improved structure of a kind of flat metal lead frame, with regard to LED conducting wire frame structure, including lead frame and the frame side of two or more, described frame side is located in around the lead frame of two or more, is provided with the long hole of connective bar and region between described frame side and each described lead frame and between adjacent lead frame.
Continue, described lead frame by weldering pad and lead foot formed, and described weldering pad and lead foot between form gap, described weldering pad and lead foot have offered depression portion and lower concave portion respectively, and described weldering pad upper depression portion and lower concave portion confluce formation hollow portion.
Then, the utility model be with one-body molded mode by filling insulating material in gap, upper depression portion, lower concave portion, the long hole in hollow portion and region, wherein, being filled in gap is form insulation division, and be form then portion in upper depression portion, hollow portion, the long hole of lower concave portion and region, make insulation division and then portion and lead frame combine closely, avoid manufacturing processed produces fracture, reach and improve structural strength and good rate.
Feature of the present utility model is with one-body molded, filling insulating material is formed on the long hole of the connective bar being connected with frame side and region the pad portion of flute profile form, or the connective bar being filled in around lead frame and region long hole shape become the pad portion of flute profile form, structural strength is improved once again, and effectively improves the good rate of packaging process.
In addition, for reaching aforesaid object, the utility model, with regard to IC conducting wire frame structure, includes lead frame and the frame side of two or more, and described frame side is located in around the lead frame of two or more, and is provided with region rod between adjacent wires frame.
Continuing, described lead frame is made up of the lead foot of weldering pad and two or more, forms a gap, form spacing between lead foot and lead foot between described weldering pad and each described lead foot point; Or the surrounding of described weldering pad is provided with ground ring, and being provided with long hole and the connective bar of two or more between described weldering pad and ground ring, ring and each described lead foot pointed one-tenth one gap, form spacing between lead foot and lead foot again describedly.
Continuous, the surrounding corner of described ground ring and region is excellent and frame side is provided with support stick, described weldering pad is provided with depression portion, lower concave portion and hollow portion, and described hollow portion is arranged at depression portion and lower concave portion confluce; Each described lead foot and each described support stick are provided with depression portion and lower concave portion, and the upper depression portion of each described lead foot end and each described support stick end is connected to region rod and frame side.
Of the present utility model is with one-body molded, by filling insulating material in gap, spacing, upper depression portion, lower concave portion and hollow portion, wherein, being filled in gap is form an insulation division, and be form then portion in spacing, upper depression portion, hollow portion and lower concave portion, make insulation division and then portion and lead frame combine closely, avoid manufacturing processed produces fracture, reach and improve structural strength and good rate.
Finally, feature of the present utility model is with the one-body molded pad portion that filling insulating material is formed flute profile form in the upper depression portion of the lead foot connected with frame side and support stick, or it is filled in the pad portion forming flute profile form in the upper depression portion of each lead foot and each support stick end, make fill insulant simplify, put forward advantages of high process yield and structural strength, and then simplify packaging process and improve the good rate of packaging process.
Accompanying drawing explanation
Fig. 1 is existing flat metal conducting wire frame structure schematic diagram;
Fig. 2 is the structure improved first embodiment schematic diagram of flat metal lead frame of the present utility model;
Fig. 3 A is the part sectioned view of the utility model first embodiment;
Fig. 3 B is the partial schematic diagram of the utility model first embodiment;
Fig. 4 is another form schematic diagram (one) of the utility model first embodiment;
Fig. 5 is another form schematic diagram (two) of the utility model first embodiment;
Fig. 6 is the pad portion schematic diagram of the utility model first embodiment;
Fig. 7 is the structure improved 2nd embodiment schematic diagram of flat metal lead frame of the present utility model;
Fig. 8 is the part sectioned view of the utility model the 2nd embodiment;
Fig. 9 A is the local schematic views of the utility model the 2nd embodiment;
Fig. 9 B is the electrolytic coating schematic diagram of the utility model the 2nd embodiment;
Figure 10 is another form schematic diagram (one) of the utility model the 2nd embodiment;
Figure 11 is another form schematic diagram (two) of the utility model the 2nd embodiment;
Figure 12 is the pad portion schematic diagram of the utility model the 2nd embodiment;
Figure 13 is the structure improved 3rd embodiment schematic diagram of flat metal lead frame of the present utility model;
Figure 14 is the part sectioned view of the utility model the 3rd embodiment;
Figure 15 A is the partial schematic diagram of the utility model the 3rd embodiment;
Figure 15 B is the electrolytic coating schematic diagram of the utility model the 3rd embodiment;
Figure 16 is another form schematic diagram (one) of the utility model the 3rd embodiment;
Figure 17 is another form schematic diagram (two) of the utility model the 3rd embodiment;
Figure 18 is the pad portion schematic diagram of the utility model the 3rd embodiment;
Figure 19 is the representative figure of flat metal lead frame described in the utility model.
[main element numbers explanation]
110 ' weldering pad
120 ' lead foot
130 ' gap
140 ' upper depression portion
150 ' lower concave portion
160 ' hollow portion
1 flat metal lead frame
100 lead frames
110 weldering pads
111 long holes
120 lead foots
130 gaps
Depression portion on 140
150 lower concave portion
160 hollow portions
170 electrolytic coatings
180 spacing
190 ground rings
200 frame side
300 connective bars
400 long hole, regions
500 insulation divisions
600 then portions
700 pad portions
800 region rods
900 support sticks.
Embodiment
Below in conjunction with accompanying drawing and embodiment of the present utility model, the improved structure of this novel flat-plate conductive metal frames is described in further detail.
The improved structure of flat metal lead frame described in the utility model, is divided into the structure of LED flat plate conductive metal frames and the structure of IC flat metal lead frame, its detailed construction as follows described in:
The improved structure of flat metal lead frame described in the utility model has multiple different structural form, of the present utility model first be implemented as follows described in:
First, refer to Fig. 2; Fig. 2 is schematic diagram of the present utility model, as seen from the figure, the improved structure of flat metal lead frame disclosed in the utility model, comprise lead frame 100 and the frame side 200 of two or more, described frame side 200 be located in two or more flat metal lead frame 1 around, be provided with the long hole 400 of connective bar 300 and region between described frame side 200 and each described lead frame 100 and between adjacent lead frame 100.
Continue and refer to Fig. 3 A; Fig. 3 A is part sectioned view of the present utility model, as seen from the figure, described lead frame 100 is made up of weldering pad 110 and lead foot 120, a gap 130 is formed between described weldering pad 110 and lead foot 120, described weldering pad 110 and lead foot 120 are respectively equipped with depression portion 140 and lower concave portion 150 again, wherein, hollow portion 160 set up by described weldering pad 110, and described hollow portion 160 is formed by upper depression portion 140 and lower concave portion 150 intersection.
Continue and refer to Fig. 3 B and consult Fig. 3 A simultaneously, Fig. 3 B is partial schematic diagram of the present utility model, as seen from the figure, the utility model be in one-body molded mode by filling insulating material in gap 130, upper depression portion 140, lower concave portion 150, in the long hole 400 in hollow portion 160 and region, wherein, being filled in gap 130 is form an insulation division 500, and upper depression portion 140, lower concave portion 150, it is form then portion 600 (as shown in Figure 3 B) in the long hole 400 in hollow portion 160 and region, make insulation division 500, then portion 600 and lead frame 100 are combined closely, avoid manufacturing processed produces fracture, reach and improve structural strength and good rate
Continue and refer to Fig. 4, and consult Fig. 2 simultaneously; Fig. 4 is another form schematic diagram of the present utility model, as seen from the figure, the utility model be with one-body molded by filling insulating material on the long hole 400 of the connective bar 300 being connected with frame side 200 and region, form the pad portion 700 of flute profile form, make fill insulant simplify, put forward advantages of high process yield and structural strength, and then simplify packaging process and improve the good rate of packaging process.
Continue and refer to Fig. 5 and Fig. 6; Fig. 5,6 is another form schematic diagram of the present utility model and pad portion schematic diagram, as seen from the figure, the utility model is by the long hole 400 of connective bar 300 and region of filling insulating material around lead frame 100 with one-body molded, form the pad portion 700 of flute profile form, make fill insulant simplify, put forward advantages of high process yield and structural strength, and then simplify packaging process and improve the good rate of packaging process.
2nd embodiment of the present utility model as follows described in:
First, refer to Fig. 7; Fig. 7 is the utility model the 2nd embodiment schematic diagram, as seen from the figure, the improved structure of flat metal lead frame disclosed in the utility model, include lead frame 100 and the frame side 200 of two or more, described frame side 200 be located in two or more flat metal lead frame 1 around, be provided with region rod 800 between adjacent lead frame 100.
Continue and refer to Fig. 8, and consult Fig. 7 simultaneously; Fig. 8 is the part sectioned view of the utility model the 2nd embodiment, as seen from the figure, described lead frame 100 is made up of the lead foot 120 of weldering pad 110 and two or more, a gap 130 is formed between described weldering pad 110 and each described lead foot 120 point, and form spacing 180 between lead foot 120 and lead foot 120, described weldering pad 110 surrounding corner and region rod 800 and frame side 200 be provided with support stick 900; Described weldering pad 110 is provided with depression portion 140, lower concave portion 150 and hollow portion 160, and described hollow portion 160 is arranged at depression portion 140 and lower concave portion 150 confluce; Described lead foot 120, support stick 900 and region rod 800 are provided with depression portion 140 and lower concave portion 150, and the upper depression portion 140 of described lead foot 120 end and described support stick 900 end is connected to region rod 800 and frame side 200.
Continue and refer to Fig. 9 A, and consult Fig. 8 simultaneously, Fig. 9 A is the partial schematic diagram of the utility model the 2nd embodiment, as seen from the figure, the utility model be in one-body molded mode by filling insulating material in gap 130, spacing 180, upper depression portion 140, in lower concave portion 150 and hollow portion 160, wherein, being filled in gap 130 is form an insulation division 500, and spacing 180, upper depression portion 140, it is form then portion 600 (as shown in Figure 9 A) in lower concave portion 150 and hollow portion 160, make insulation division 500 and then portion 600 and lead frame 100 are combined closely, avoid manufacturing processed produces fracture, reach and improve structural strength and good rate.
Continue and refer to Fig. 9 B, and consult Fig. 8 simultaneously; Fig. 9 B is the electrolytic coating schematic diagram of the utility model the 2nd embodiment, as seen from the figure, it is plated on weldering pad 110 and lead foot 120 to form an electrolytic coating 170 by metallic substance (such as silver, gold, nickel or palladium etc.), wherein, described electrolytic coating 170 establishes the front or positive and negative that can be plated on lead frame 100.
Continue and refer to Figure 10, and consult Fig. 8 simultaneously; Figure 10 is another form schematic diagram of the utility model the 2nd embodiment, as seen from the figure, this wound be with one-body molded by filling insulating material in the upper depression portion 140 of the lead foot 120 connected with frame side 200 and support stick 900, form the pad portion 700 of flute profile form, make fill insulant simplify, put forward advantages of high process yield and structural strength, and then simplify packaging process and improve the good rate of packaging process.
Continue and refer to Figure 11, and consult Figure 12 simultaneously; Figure 11,12 is another form schematic diagram and the pad portion schematic diagram of the utility model the 2nd embodiment, as seen from the figure, this wound be with one-body molded by filling insulating material in the upper depression portion 140 of each lead foot 120 and each support stick 900 end, form the pad portion 700 of flute profile form, make fill insulant simplify, put forward advantages of high process yield and structural strength, and then simplify packaging process and improve the good rate of packaging process.
3rd embodiment of the present utility model as follows described in:
First, refer to Figure 13; Figure 13 is the utility model the 3rd embodiment schematic diagram, as seen from the figure, the improved structure of flat metal lead frame disclosed in the utility model, include lead frame 100 and the frame side 200 of two or more, described frame side 200 be located in two or more flat metal lead frame 1 around, be provided with region rod 800 between adjacent flat metal lead frame 1.
Continue and refer to Figure 14, Figure 14 is part sectioned view of the present utility model, as seen from the figure, described lead frame 100 forms weldering pad 110 with etching mode, the lead foot 120 of ground ring 190 and two or more, the long hole 111 and the connective bar 300 that are provided with two or more between 110 and ground ring 190 are padded in described weldering, a gap 130 is formed between described ground ring 190 and each described lead foot 120 point, and form a spacing 180 between lead foot 120 and lead foot 120, the surrounding corner of described ground ring 190 and region rod 800 and frame side 200 be provided with support stick 900, described weldering pad 110 is provided with depression portion 140, lower concave portion 150 and hollow portion 160, and described hollow portion 160 is arranged at depression portion 140 and lower concave portion 150 confluce, described lead foot 120, support stick 900 and region rod 800 are provided with depression portion 140 and lower concave portion 150, and the upper depression portion 140 of each described lead foot 120 end and each described support stick 900 end is connected to region rod 800 and frame side 200.
Continue and refer to Figure 15 A, and consult Figure 14 simultaneously, Figure 15 A is the partial schematic diagram of the utility model the 3rd embodiment, as seen from the figure, the utility model be in one-body molded mode by filling insulating material in gap 130, spacing 180, long hole 111, upper depression portion 140, in lower concave portion 150 and hollow portion 160, wherein, being filled in gap 130 is form an insulation division 500, and spacing 180, long hole 111, upper depression portion 140, it is form then portion 600 (as shown in 15A figure) in lower concave portion 150 and hollow portion 160, make insulation division 500 and then portion 600 and lead frame 100 are combined closely, avoid manufacturing processed produces fracture, reach and improve structural strength and good rate.
Continue and refer to Figure 15 B, and consult Figure 14 simultaneously; Figure 15 B is the electrolytic coating schematic diagram of the utility model the 3rd embodiment, as seen from the figure, by metallic substance (such as silver, gold, nickel or palladium etc.) be plated on weldering pad 110 and lead foot 120 forms electrolytic coating 170, wherein, described electrolytic coating 170 establishes the front or positive and negative that can be plated on lead frame 100.
Continue and refer to Figure 16, and consult Figure 14 simultaneously; Figure 16 is another form schematic diagram of the utility model the 3rd embodiment, as seen from the figure, the utility model be with one-body molded by filling insulating material in the upper depression portion 140 of the lead foot 120 connected with frame side 200 and support stick 900, form the pad portion 700 of flute profile form, make fill insulant simplify, put forward advantages of high process yield and structural strength, and then simplify packaging process and improve the good rate of packaging process.
Continue and refer to Figure 17 and Figure 18; Figure 17,18 is another form schematic diagram and the pad portion schematic diagram of the utility model the 3rd embodiment, as seen from the figure, the utility model be with one-body molded by filling insulating material in the upper depression portion 140 of each lead foot 120 and each support stick 900 end, form the pad portion 700 of flute profile form, make fill insulant simplify, put forward advantages of high process yield and structural strength, and then simplify packaging process and improve the good rate of packaging process.
Finally, Figure 19 is referred to; The improved structure of flat metal lead frame described in the utility model, is divided into the structure of LED flat plate conductive metal frames and the structure (only taking above-mentioned wherein two kinds of forms as signal in figure) of IC flat metal lead frame.
Hold above-mentioned known, LED flat plate conductive metal frames is made up of weldering pad 110 and lead foot 120, connective bar 300 it is provided with between adjacent wires frame 100, and described weldering pad 110 and lead foot 120 between form a gap 130, and form an insulation division 500 via one-body molded fill insulant, then portion 600 and pad portion 700, IC flat metal lead frame is by weldering pad 110 again, the lead foot 120 of ground ring 190 and two or more forms, the long hole 111 and the connective bar 300 that are provided with two or more between 110 and ground ring 190 are padded in described weldering, a gap 130 is formed between described ground ring 190 and each described lead foot 120 point, and form spacing 180 between lead foot 120 and lead foot 120, the surrounding corner of described ground ring 190 is provided with support stick 900, and form an insulation division 500 via one-body molded filling insulation material, then portion 600 and pad portion 700.
The above, be only better embodiment of the present utility model, it does not mean to limit protection domain of the present utility model.

Claims (16)

1. the improved structure of a flat metal lead frame, it is characterized in that, include lead frame and the frame side of two or more, described frame side is located in around the flat metal lead frame of two or more, is provided with the long hole of connective bar and region between described frame side and each described lead frame and between adjacent lead frame;
Described lead frame is made up of weldering pad and lead foot, and described weldering is padded and forms a gap between lead foot; Described weldering pad and lead foot have offered depression portion and lower concave portion respectively, and described weldering pad upper depression portion and lower concave portion confluce be formed hollow portion, it is that fill insulant forms an insulation division in described gap, and be that fill insulant forms then portion in described upper depression portion, hollow portion, the long hole of lower concave portion and region, it is characterized in that, and the long hole of connective bar and region of frame side connection is arranged with pad portion.
2. the improved structure of flat metal lead frame as claimed in claim 1, it is characterised in that, wherein, described insulation division, then portion and pad portion are one of the forming.
3. the improved structure of a flat metal lead frame, it is characterized in that, include lead frame and the frame side of two or more, described frame side is located in around the flat metal lead frame of two or more, is provided with the long hole of connective bar and region between described frame side and each described lead frame and between adjacent lead frame;
Described lead frame is made up of weldering pad and lead foot, and described weldering is padded and forms a gap between lead foot; Described weldering pad and lead foot have offered depression portion and lower concave portion respectively, and described weldering pad upper depression portion and lower concave portion confluce be formed hollow portion, it is that fill insulant forms an insulation division in described gap, and be that fill insulant forms then portion in described upper depression portion, hollow portion, the long hole of lower concave portion and region, it is characterized in that, described connective bar and long hole, region is arranged with pad portion.
4. the improved structure of flat metal lead frame as claimed in claim 3, it is characterised in that, wherein, described insulation division, then portion and pad portion are one of the forming.
5. the improved structure of a flat metal lead frame, it is characterised in that, include lead frame and the frame side of two or more, described frame side is located in around the flat metal lead frame of two or more, and is provided with region rod between adjacent lead frame;
Described lead frame is made up of weldering pad and the lead foot of two or more, and described weldering is padded and formed a gap between each described lead foot point, and forms spacing between lead foot and lead foot, the surrounding corner of described weldering pad and region is excellent and frame side is provided with support stick; Described weldering pad is provided with depression portion, lower concave portion and hollow portion, and described hollow portion is arranged at depression portion and lower concave portion confluce; Described lead foot, support stick and region rod are provided with depression portion and lower concave portion, the upper depression portion of described lead foot end and support stick end is connected to region rod and frame side, it is that fill insulant forms an insulation division in described gap, and be that fill insulant forms then portion in described spacing, upper depression portion, hollow portion and lower concave portion, it is characterized in that, and the upper depression portion of the lead foot of frame side connection and support stick is arranged with pad portion.
6. the improved structure of flat metal lead frame as claimed in claim 5, it is characterised in that, wherein, described weldering pad and each described lead foot are provided with electrolytic coating, and described electrolytic coating can be plated on front or the positive and negative of lead frame.
7. the improved structure of flat metal lead frame as claimed in claim 5, it is characterised in that, wherein, described insulation division, then portion and pad portion are one of the forming.
8. the improved structure of a flat metal lead frame, it is characterised in that, include lead frame and the frame side of two or more, described frame side is located in around the flat metal lead frame of two or more, and is provided with region rod between adjacent lead frame;
Described lead frame is made up of weldering pad and the lead foot of two or more, and described weldering is padded and formed a gap between each described lead foot point, and forms spacing between lead foot and lead foot, the surrounding corner of described weldering pad and region is excellent and frame side is provided with support stick; Described weldering pad is provided with depression portion, lower concave portion and hollow portion, and described hollow portion is arranged at depression portion and lower concave portion confluce; Described lead foot, support stick and region rod are provided with depression portion and lower concave portion, the upper depression portion of described lead foot end and support stick end is connected to region rod and frame side, it is that fill insulant forms an insulation division in described gap, and be that fill insulant forms then portion in described spacing, upper depression portion, hollow portion and lower concave portion, it is characterized in that, the upper depression portion of each lead foot and each support stick is arranged with pad portion.
9. the improved structure of flat metal lead frame as claimed in claim 8, it is characterised in that, wherein, described weldering pad and each described lead foot are provided with electrolytic coating, and described electrolytic coating can be plated on front or the positive and negative of lead frame.
10. the improved structure of flat metal lead frame as claimed in claim 8, it is characterised in that, wherein, described insulation division, then portion and pad portion are one of the forming.
The improved structure of 11. 1 kinds of flat metal lead frames, it is characterised in that, include lead frame and the frame side of two or more, described frame side is located in around the flat metal lead frame of two or more, and is provided with region rod between adjacent lead frame;
Described lead frame include weldering pad, the lead foot of ring and two or more, described weldering is padded and is provided with long hole and the connective bar of two or more between ground ring, a gap is formed between described ground ring and each described lead foot point, and form spacing between lead foot and lead foot, the surrounding corner of described ground ring and region rod and frame side be provided with support stick; Described weldering pad is provided with depression portion, lower concave portion and hollow portion, and described hollow portion is arranged at depression portion and lower concave portion confluce; Described lead foot, support stick and region rod are provided with depression portion and lower concave portion, the upper depression portion of described lead foot end and support stick end is connected to region rod and frame side, it is equipped with lower concave portion again describedly, it is that fill insulant forms an insulation division in described gap, and be that fill insulant forms then portion in described upper depression portion, hollow portion, lower concave portion and long hole, it is characterized in that, and the upper depression portion of the lead foot of frame side connection and support stick is arranged with pad portion.
The improved structure of 12. flat metal lead frames as claimed in claim 11, it is characterised in that, wherein, described ground ring and each described lead foot are provided with electrolytic coating, and described electrolytic coating can be plated on front or the positive and negative of lead frame.
The improved structure of 13. flat metal lead frames as claimed in claim 11, it is characterised in that, wherein, described insulation division, then portion and pad portion are one of the forming.
The improved structure of 14. 1 kinds of flat metal lead frames, it is characterised in that, include lead frame and the frame side of two or more, described frame side is located in around the flat metal lead frame of two or more, and is provided with region rod between adjacent lead frame;
Described lead frame include weldering pad, the lead foot of ring and two or more, described weldering is padded and is provided with long hole and the connective bar of two or more between ground ring, a gap is formed between described ground ring and each described lead foot point, and form spacing between lead foot and lead foot, the surrounding corner of described ground ring and region rod and frame side be provided with support stick; Described weldering pad is provided with depression portion, lower concave portion and hollow portion, and described hollow portion is arranged at depression portion and lower concave portion confluce; Described lead foot, support stick and region rod are provided with depression portion and lower concave portion, the upper depression portion of described lead foot end and support stick end is connected to region rod and frame side, it is equipped with lower concave portion again describedly, it is that fill insulant forms an insulation division in described gap, and be that fill insulant forms then portion in described upper depression portion, hollow portion, lower concave portion and long hole, it is characterized in that, the upper depression portion of each lead foot and each support stick is arranged with pad portion.
The improved structure of 15. flat metal lead frames as claimed in claim 14, it is characterised in that, wherein, described ground ring and each described lead foot are provided with electrolytic coating, and described electrolytic coating can be plated on front or the positive and negative of lead frame.
The improved structure of 16. flat metal lead frames as claimed in claim 14, it is characterised in that, wherein, described insulation division, then portion and pad portion are one of the forming.
CN201520774159.9U 2015-10-08 2015-10-08 Improvement structure of dull and stereotyped plain conductor frame Active CN205282500U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520774159.9U CN205282500U (en) 2015-10-08 2015-10-08 Improvement structure of dull and stereotyped plain conductor frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520774159.9U CN205282500U (en) 2015-10-08 2015-10-08 Improvement structure of dull and stereotyped plain conductor frame

Publications (1)

Publication Number Publication Date
CN205282500U true CN205282500U (en) 2016-06-01

Family

ID=56067042

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520774159.9U Active CN205282500U (en) 2015-10-08 2015-10-08 Improvement structure of dull and stereotyped plain conductor frame

Country Status (1)

Country Link
CN (1) CN205282500U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107561782A (en) * 2017-09-27 2018-01-09 惠科股份有限公司 Backlight module and display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107561782A (en) * 2017-09-27 2018-01-09 惠科股份有限公司 Backlight module and display device
CN107561782B (en) * 2017-09-27 2024-03-29 惠科股份有限公司 Backlight module and display device

Similar Documents

Publication Publication Date Title
SG140574A1 (en) Method of producing a semiconductor package
CN104659007B (en) Semiconductor package assembly and a manufacturing method thereof
CN102569242B (en) Semiconductor packaging part of integrated screened film and manufacture method thereof
CN205282500U (en) Improvement structure of dull and stereotyped plain conductor frame
CN205069624U (en) Array high density lead frame
CN104157638B (en) 360 degree of formal dress flip-chip is luminous can arbitrarily around LED filament and preparation method thereof
CN205542415U (en) Mode of opening a way multicore combination ceramic capacitor
CN110349920A (en) A kind of diode chip package structure and its packaging method
CN202816923U (en) Lead-wire frame used for integrated circuit ceramic package housing
CN205789528U (en) A kind of multiple bottom-side electrodes lead frame of chip solid electrolyte matter tantalum capacitor
CN201450004U (en) Six-lead high density integrated circuit frame
CN203707117U (en) High-density integrated lead frame
CN203553212U (en) Composable wafer direct packaging COB support
CN206412343U (en) A kind of fixed thimble interior insulation encapsulating structure
CN103219245B (en) A kind of manufacture method of palladium-plated bonded copper wire
CN202434503U (en) DIP10 integrated circuit device and lead frame, and lead frame matrix
CN206194738U (en) Integrated inductor structure
CN104485323B (en) Lead frame and semiconductor package body
CN103219247A (en) Manufacturing method of silver-plated bonding copper wire
CN204905243U (en) Circuit component
CN207441373U (en) Suitable for 35kV and the arrester of above
CN103617984A (en) Plastic package lead frame
CN210640378U (en) Outer cone type stress evacuation type bus connector
CN103219248B (en) A kind of manufacture method of gold plating linking copper wire
CN206685380U (en) A kind of high reliability novel lead frame

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant