CN206685380U - A kind of high reliability novel lead frame - Google Patents
A kind of high reliability novel lead frame Download PDFInfo
- Publication number
- CN206685380U CN206685380U CN201720518737.1U CN201720518737U CN206685380U CN 206685380 U CN206685380 U CN 206685380U CN 201720518737 U CN201720518737 U CN 201720518737U CN 206685380 U CN206685380 U CN 206685380U
- Authority
- CN
- China
- Prior art keywords
- fin
- radiating part
- upper radiating
- elementary cell
- terminal pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
The utility model discloses a kind of high reliability novel lead frame, include the elementary cell of at least two transversely arranged connections, the elementary cell includes upper radiating part and terminal pin unit, the upper radiating part is fixedly connected with terminal pin unit, the upper radiating part includes fin, positioning hole and technique pressing lever, the rectangular sheet of fin, fin top both sides are provided with the technique pressing lever of connection elementary cell, the fin medium position is provided with positioning hole, the terminal pin unit includes leading wire bonding area and process bar, the leading wire bonding area is arranged in process bar.The utility model can increase the adhesion of plastic packaging resinite and upper radiating part, on the other hand effectively prevent that plating solution infiltration enters the failure that inside parts cause part in electroplating process, substantially increases yield rate and reliability, and simple in construction.
Description
Technical field
The technical field of semiconductor electronic component is the utility model is related to, particularly a kind of high reliability novel lead wire frame
The technical field of frame.
Background technology
In recent years, domestic semiconductor is quickly grown, and the encapsulation amount of particularly discrete device is very big, and technical requirements are got over
Come it is higher, but existing equipment all there is it is certain the defects of, such as upper adhesion between radiating part and plastic packaging resinite
Not enough, and plating solution infiltration enters the failure that inside parts cause part in electroplating process, has had a strong impact on yield rate, reduces
The reliability of equipment.
Utility model content
The purpose of this utility model is exactly to solve the problems of the prior art, proposes a kind of high reliability novel lead wire frame
Frame, by increasing capacitance it is possible to increase the adhesion of plastic packaging resinite and upper radiating part, on the other hand effectively prevent plating solution infiltration in electroplating process
Enter the failure that inside parts cause part, substantially increase yield rate and reliability, and it is simple in construction.
To achieve the above object, the utility model proposes a kind of high reliability novel lead frame, including at least two
The elementary cell of transversely arranged connection, the elementary cell include upper radiating part and terminal pin unit, the upper radiating part and draw
Stitch unit is fixedly connected, the upper radiating part include fin, positioning hole, technique pressing lever, the rectangular sheet of fin,
Fin top both sides are provided with the technique pressing lever of connection elementary cell, and the fin medium position is provided with positioning
Hole, the terminal pin unit include leading wire bonding area and process bar, and the leading wire bonding area is arranged in process bar.
Preferably, the capillary groove of rectangular shape is provided with the fin.
Preferably, being provided with rectangular shape heat emission hole in the process bar, the quantity of the heat emission hole is 4.
The beneficial effects of the utility model：The utility model is by the way that upper radiating part and terminal pin unit to be separately positioned on and draw
In elementary cell in wire frame, by increasing capacitance it is possible to increase the adhesion of plastic packaging resinite and upper radiating part, on the other hand effectively prevent electricity
Plating solution infiltration enters the failure that inside parts cause part during plating, substantially increases yield rate and reliability, and structure letter
It is single.
Feature and advantage of the present utility model will be described in detail by embodiment combination accompanying drawing.
Brief description of the drawings
Fig. 1 is a kind of front view of high reliability novel lead frame of the utility model；
Fig. 2 is the front view of elementary cell；
Fig. 3 is the right view of elementary cell.
In figure：The upper radiating part of 2- elementary cells, 21-, 211- fin, 212- positioning holes, 213- techniques pressing lever, 2141-
Capillary groove, 22- terminal pins unit, 221- leading wire bondings area, 222- process bars, 2221- heat emission holes.
Embodiment
Refering to Fig. 1-Fig. 3, a kind of high reliability novel lead frame of the utility model, including at least two transversely arranged companies
The elementary cell 2 connect, the elementary cell 2 include upper radiating part 21 and terminal pin unit 22, the upper radiating part 21 and lead
Pin unit 22 is fixedly connected, and the upper radiating part 21 includes fin 211, positioning hole 212, technique pressing lever 213, the fin
211 rectangular sheets, the top both sides of fin 211 are provided with the technique pressing lever 213 of connection elementary cell 2, technique pressing lever
213 are used to connect each elementary cell, and the medium position of fin 211 is provided with positioning hole 212, and the positioning hole 212 is used
Fixed in assembling positioning and product installation, the terminal pin unit 22 includes leading wire bonding area 221 and process bar 222, described
Leading wire bonding area 221 is arranged in process bar 222, and process bar 222 is to ensure that lead frame has enough intensity, be easy to group
Dress, silk is beaten by leading wire bonding area 221 and chip (bonding wire such as aluminium wire, copper wire), realizes connection inside circuit and outside.
The capillary groove 2141 of rectangular shape is provided with the fin 211, capillary groove 2141 isolates the invasion and attack circuit chip such as moisture.Institute
State and rectangular shape heat emission hole 2221 is provided with process bar 222, the quantity of the heat emission hole 2221 is 4.
A kind of high reliability novel lead frame of the utility model, by the way that upper radiating part and terminal pin unit are set respectively
In elementary cell in lead frame, by increasing capacitance it is possible to increase the adhesion of plastic packaging resinite and upper radiating part, it is on the other hand effectively anti-
Only plating solution infiltration enters the failure that inside parts cause part in electroplating process, substantially increases yield rate and reliability, and tie
Structure is simple, has high reliability, solves the problems, such as that the adhesion between radiating part and plastic packaging resinite is inadequate.By this production
Product load component or IC chip on special framework or shell, protects chip not by ectocine, can stably can
Worked by ground, compared with presently commercially available like product, this product outstanding advantage is with high reliability, in wire frame cell surface
Dovetail groove is provided with, not only increases the adhesion of plastic packaging resinite and upper radiating part, and is effectively prevented electric in electroplating process
Plating solution penetrates into the failure that inside parts cause part, substantially increases yield rate and reliability, by lead frame with
Exit region corresponding to priming outlet in forming process increases electrodeposited coating, effectively to remove hair present in subsequent technique
Thorn, the handling process of connecting portion.Connecting portion is etched partially, and plastic packaging layer is formed in the half-etched areas of connecting portion.
Preferred embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model,
Every equivalent structure made using the utility model specification and accompanying drawing content or equivalent flow conversion, or directly or indirectly fortune
Used in other related technical areas, similarly it is included in scope of patent protection of the present utility model.
Claims (3)
- A kind of 1. high reliability novel lead frame, it is characterised in that：Include the elementary cell of at least two transversely arranged connections (2), the elementary cell (2) includes upper radiating part (21) and terminal pin unit (22), the upper radiating part (21) and terminal pin Unit (22) is fixedly connected, and the upper radiating part (21) includes fin (211), positioning hole (212), technique pressing lever (213), institute Fin (211) rectangular sheet is stated, fin (211) the top both sides are provided with the technique top of connection elementary cell (2) Muscle (213), fin (211) medium position are provided with positioning hole (212), and the terminal pin unit (22) includes lead Bonding region (221) and process bar (222), the leading wire bonding area (221) are arranged in process bar (222).
- A kind of 2. high reliability novel lead frame as claimed in claim 1, it is characterised in that：On the fin (211) It is provided with the capillary groove (2141) of rectangular shape.
- A kind of 3. high reliability novel lead frame as claimed in claim 1, it is characterised in that：On the process bar (222) Rectangular shape heat emission hole (2221) is provided with, the quantity of the heat emission hole (2221) is 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720518737.1U CN206685380U (en) | 2017-05-10 | 2017-05-10 | A kind of high reliability novel lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720518737.1U CN206685380U (en) | 2017-05-10 | 2017-05-10 | A kind of high reliability novel lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206685380U true CN206685380U (en) | 2017-11-28 |
Family
ID=60406742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720518737.1U Expired - Fee Related CN206685380U (en) | 2017-05-10 | 2017-05-10 | A kind of high reliability novel lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206685380U (en) |
-
2017
- 2017-05-10 CN CN201720518737.1U patent/CN206685380U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171128 Termination date: 20190510 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |