CN210040259U - Lead frame for high-power Hall device and packaging structure thereof - Google Patents
Lead frame for high-power Hall device and packaging structure thereof Download PDFInfo
- Publication number
- CN210040259U CN210040259U CN201920640338.1U CN201920640338U CN210040259U CN 210040259 U CN210040259 U CN 210040259U CN 201920640338 U CN201920640338 U CN 201920640338U CN 210040259 U CN210040259 U CN 210040259U
- Authority
- CN
- China
- Prior art keywords
- base island
- lead frame
- chip
- pin
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a high-power hall lead frame for device and packaging structure thereof, include the lead frame body and set up in the base island of lead frame body upper end, the base island is even muscle and pin fixed connection through the base island of both sides. On pasting the chip to the base island through using conducting resin, guaranteed under the radiating effect's the condition, separate pin and base island through the base island even muscle that sets up, avoid the chip to lead to the fact the condition of puncturing through base island and pin intercommunication.
Description
Technical Field
The utility model belongs to the technical field of water conservancy construction equipment, concretely relates to high-power lead frame for hall device and packaging structure thereof.
Background
In recent years, the IC design and manufacturing industries have been rapidly developed, and the packaging technology has been greatly improved. Packaging is an important part of the whole integrated circuit manufacturing process, and has heat dissipation and protection functions. The packaging process can seal the chip to isolate the damage of external pollution and external force to the chip, the lead frame is a metal substrate for supporting the semiconductor chip, the lead frame is widely used for packaging semiconductor devices in the field of electronic components, and the design of the frame directly influences the use of the chip on a PVC circuit board.
In the packaging of the high-power hall device, because the bottom of the high-power hall device is not GND (ground) for example, the chip needs TO be pasted on the base island of the lead frame through insulating glue in order TO avoid the direct conduction of the chip and the pin through the base island, and the silver content of the insulating glue is very low, so that the heat dissipation is not facilitated, and the service life of the chip is shortened, a novel lead frame for the high-power hall device and a packaging structure thereof need TO be designed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel high-power for hall device lead frame and packaging structure come into operation to solve the problem of proposing among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the lead frame for the high-power Hall device comprises a lead frame body and a base island arranged at the upper end of the lead frame body, wherein the base island is fixedly connected with pins through base island connecting ribs on two sides.
Preferably, the base island connecting rib is made of copper, and the other end of the base island connecting rib is welded with the upper part of the pin.
The utility model provides a packaging structure, include the plastic envelope casing and set up in the inboard lead frame body of plastic envelope casing, paste through the conducting resin on the base island of lead frame body upper end and have the chip, the chip passes through the cooperation ground connection of base island and lead wire, the chip passes through lead wire and each pin electric connection, the fixed base island that is provided with in base island both sides links the muscle.
Preferably, the edge position of the plastic package shell adopts an inverted horn connection mode.
Preferably, the base island connecting ribs are L-shaped copper sheets, and the length of the cross bars of the base island connecting ribs is slightly larger than that of the plastic package shell.
The utility model discloses a technological effect and advantage: this lead frame for high-power hall device, high-power hall device has the bottom not have GND's characteristic, so need use the insulating cement with pasting the chip at the plastic envelope, so the utility model discloses in, the conducting resin has been used in order to guarantee heat dispersion, and set up base island even muscle and separate base island and pin, avoid the chip to switch on the condition that influences the normal use of product through between base island and the pin, and cut off base island even muscle between base island and the pin when the plastic envelope, make the chip pass through base island and lead wire cooperation ground connection simultaneously, rethread lead wire and each pin intercommunication, under the circumstances of the radiating effect of guaranteeing high-power hall device, guaranteed that the device can normal use, the thermal diffusivity is better, chip life is longer.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram after plastic packaging.
In the figure: 1. a lead frame body; 2. a base island; 3. connecting ribs of the base island; 4. a pin; 5. plastic packaging the shell; 6. and (3) a chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a lead frame for high-power hall device as shown in figure 1, include lead frame body 1 and set up in base island 2 of lead frame body 1 upper end, base island 2 is through the base island 3 of linking of both sides and pin 4 fixed connection, and the base island 3 of linking through setting up separates pin 4 and base island 2, avoids pin 4 direct welding to the side of base island 2, avoids base island 2 and pin 4 direct intercommunication.
The base island connecting rib 3 is made of copper, the other end of the base island connecting rib 3 is welded with the upper portion of the pin 4, and the stability of connection between the pin 4 and the lead frame is guaranteed through the arranged base island connecting rib 3.
The utility model provides a packaging structure as shown in figure 2, which comprises a plastic package casing 5 and a lead frame body 1 arranged at the inner side of the plastic package casing 5, a chip 6 is stuck on the base island 2 at the upper end of the lead frame body 1 through conductive adhesive, the chip 6 is grounded through the matching of the base island 2 and the lead, the chip 6 is electrically connected with each pin 4 through a lead, base island connecting ribs 3 are fixedly arranged on two sides of the base island 2, when the chip 6 is adhered to the base island 2 through the conductive adhesive, the chip 6 is communicated with the base island 2 due to the conductive characteristic of the conductive adhesive, and the bottom of the high-power Hall product is not provided with GND, therefore, the base island 2 needs to be grounded through a lead, and the pin 4 and the base island 2 are separated through the base island connecting rib 3, so that the situation that a product cannot be used due to the fact that the chip 6 is directly communicated with the pin 4 through the base island 2 is avoided.
The edge position of plastic envelope casing 5 adopts the mode of falling loudspeaker connection, guarantees that the lower part of plastic envelope casing 5 can act as the lower sword of cutting the muscle when cutting island even muscle 3, and the design of falling loudspeaker can alleviate the atress of plastic envelope casing 5, makes things convenient for island even muscle 3 to cut off.
The base island connecting ribs 3 are L-shaped copper sheets, the length of the cross bar of each base island connecting rib 3 is slightly larger than that of the plastic package shell 5, the base island connecting ribs 3 between the base island 2 and the pins 4 can be disconnected after the base island connecting ribs 3 extending out of the plastic package shell 5 are cut off, and the base island 2 is prevented from being conducted with the pins 4 through the base island connecting ribs 3.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (5)
1. The utility model provides a high-power hall lead frame for device, includes the lead frame body and sets up in the base island of lead frame body upper end, its characterized in that: the base island is fixedly connected with the pins through base island connecting ribs on two sides.
2. The lead frame for the high-power Hall device according to claim 1, characterized in that: the base island connecting rib is made of copper, and the other end of the base island connecting rib is welded with the upper portion of the pin.
3. The utility model provides a packaging structure, includes plastic envelope casing, its characterized in that: the packaging structure is formed by carrying out plastic package processing on the lead frame according to claim 1, a chip is adhered to the base island at the upper end of the lead frame body through conductive adhesive, the chip is grounded through the matching of the base island and the lead, the chip is electrically connected with each pin through the lead, base island connecting ribs are fixedly arranged on two sides of the base island, and the lead frame is arranged inside the plastic package shell.
4. A package structure according to claim 3, wherein: the edge position of the plastic package shell adopts an inverted horn connection mode.
5. The package structure of claim 4, wherein: the base island connecting ribs are L-shaped copper sheets, and the length of the cross rods of the base island connecting ribs is slightly larger than that of the plastic package shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920640338.1U CN210040259U (en) | 2019-05-07 | 2019-05-07 | Lead frame for high-power Hall device and packaging structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920640338.1U CN210040259U (en) | 2019-05-07 | 2019-05-07 | Lead frame for high-power Hall device and packaging structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210040259U true CN210040259U (en) | 2020-02-07 |
Family
ID=69363805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920640338.1U Expired - Fee Related CN210040259U (en) | 2019-05-07 | 2019-05-07 | Lead frame for high-power Hall device and packaging structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210040259U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137342A (en) * | 2019-05-07 | 2019-08-16 | 合肥久昌半导体有限公司 | A kind of high-power hall device lead frame, encapsulating structure and its packaging technology |
-
2019
- 2019-05-07 CN CN201920640338.1U patent/CN210040259U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137342A (en) * | 2019-05-07 | 2019-08-16 | 合肥久昌半导体有限公司 | A kind of high-power hall device lead frame, encapsulating structure and its packaging technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200207 Termination date: 20210507 |