CN218939657U - Patch diode connected through conductive adhesive - Google Patents
Patch diode connected through conductive adhesive Download PDFInfo
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- CN218939657U CN218939657U CN202220670444.6U CN202220670444U CN218939657U CN 218939657 U CN218939657 U CN 218939657U CN 202220670444 U CN202220670444 U CN 202220670444U CN 218939657 U CN218939657 U CN 218939657U
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- conductive adhesive
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Abstract
The utility model provides a patch diode connected through conductive adhesive, which comprises a plastic package shell and a diode chip positioned at the inner side of the plastic package shell, wherein the two ends of a cathode and an anode of the diode chip are respectively connected with a first conductive column and a second conductive column, the two sides of the plastic package shell are respectively provided with a cathode pin and an anode pin, the first conductive adhesive is connected between the first conductive column and the cathode pin, the second conductive adhesive is connected between the second conductive column and the anode pin, the lower end of the cathode pin is connected with a first C-shaped welding pin, and the lower end of the anode pin is connected with a second C-shaped welding pin. When the cathode pin or the anode pin is damaged, the patch diode can scrape the first conductive adhesive or the second conductive adhesive, replace the first conductive adhesive or the second conductive adhesive again and utilize the new conductive adhesive.
Description
Technical Field
The utility model relates to the technical field of diodes, in particular to a patch diode connected through conductive adhesive.
Background
The patch diode is one of the diodes, the structure of the patch diode consists of a packaging shell, a diode chip, a cathode pin and an anode pin, the cathode pin, the anode pin and the packaging shell are generally integrated into an injection molding mode by the conventional patch diode, and when the cathode pin and the anode pin are damaged in the installation or use process, the replacement cannot be performed.
Disclosure of Invention
In order to solve the problems, the utility model provides a patch diode connected by conductive adhesive, wherein a first conductive post and a second conductive post are respectively connected at two ends of a cathode and an anode of a diode chip, the first conductive post is connected with a cathode pin by the first conductive adhesive, the second conductive post is connected with an anode pin by the second conductive adhesive, when the cathode pin or the anode pin is damaged, the first conductive adhesive or the second conductive adhesive can be scraped off, and the patch diode is replaced again and is bonded by a new conductive adhesive.
In order to achieve the above purpose, the present utility model solves the problems by the following technical scheme:
the utility model provides a paster diode through conductive adhesive connection, includes plastic envelope shell, is located the inboard diode chip of plastic envelope shell, diode chip's negative and positive pole both ends are connected with first conductive pillar, second conductive pillar respectively, plastic envelope shell both sides are equipped with negative pole pin, positive pole pin respectively, first conductive pillar with be connected with first conductive adhesive between the negative pole pin, the second conductive pillar with be connected with the second conductive adhesive between the positive pole pin, negative pole pin lower extreme is connected with first C shape welded leg, positive pole pin lower extreme is connected with second C shape welded leg.
Specifically, the plastic envelope shell lower extreme is equipped with first elastic cushion, first elastic cushion is located first C shape leg upside.
Specifically, the plastic envelope shell lower extreme is equipped with the second elastic cushion, the second elastic cushion is located second C shape leg upside.
Specifically, the first conductive column and the upper side of the first conductive adhesive are covered with a first waterproof adhesive.
Specifically, the second conductive posts and the upper sides of the second conductive glue are covered with second waterproof glue.
Specifically, the upper end of the plastic package shell is provided with radiating fins, and the radiating fins are of a zigzag structure.
The beneficial effects of the utility model are as follows:
1. the patch diode is characterized in that two ends of a cathode and an anode of a diode chip are respectively connected with a first conductive post and a second conductive post, the first conductive post is connected with a cathode pin through first conductive glue, the second conductive post is connected with an anode pin through second conductive glue, when the cathode pin or the anode pin is damaged, the first conductive glue or the second conductive glue can be scraped off, and the patch diode is replaced again and is made of new conductive glue;
2. the cathode pin lower end is connected with a first C-shaped welding pin, the anode pin lower end is connected with a second C-shaped welding pin, a first elastic cushion block is arranged between the plastic package shell and the first C-shaped welding pin, and a second elastic cushion block is arranged between the plastic package shell and the second C-shaped welding pin, so that the heat dissipation performance of the patch diode is improved.
Drawings
Fig. 1 is a schematic structural diagram of a patch diode connected by conductive adhesive according to the present utility model.
The reference numerals are: the LED chip comprises a plastic package shell 1, a diode chip 2, a first conductive post 3, a second conductive post 4, a cathode pin 5, an anode pin 6, a first conductive adhesive 7, a second conductive adhesive 8, a first C-shaped welding leg 9, a second C-shaped welding leg 10, a first elastic cushion block 11, a second elastic cushion block 12, a first waterproof adhesive 13, a second waterproof adhesive 14 and a radiating fin 15.
Detailed Description
The present utility model will be described in further detail with reference to examples and drawings, but embodiments of the present utility model are not limited thereto.
As shown in fig. 1:
the utility model provides a through paster diode that conducting resin connects, including plastic envelope 1, be located the inboard diode chip 2 of plastic envelope 1, the negative and positive pole both ends of diode chip 2 are connected with first conductive post 3 respectively, second conductive post 4, plastic envelope 1 both sides are equipped with negative pole pin 5 respectively, positive pole pin 6, be connected with first conductive adhesive 7 between first conductive post 3 and the negative pole pin 5, be connected with second conductive adhesive 8 between second conductive post 4 and the positive pole pin 6, when negative pole pin 5 or positive pole pin 6 appear damaging, can strike off first conductive adhesive 3 or second conductive adhesive 7, change the pin again and utilize new conductive adhesive to tie can, in order to make paster diode welded after the circuit board have good shock resistance, negative pole pin 5 lower extreme is connected with first C shape foot 9, positive pole pin 6 lower extreme is connected with second C shape welded leg 10, plastic envelope 1 lower extreme is equipped with first elastic pad 11, first elastic pad 11 is located first C shape welded leg 9 upside, plastic envelope 1 lower extreme is equipped with second elastic pad 12, second elastic pad 12 is located second C shape welded leg 10 upside.
Preferably, in order to improve the waterproof capability of the upper end of the first conductive adhesive 7, the first conductive posts 3 and the upper side of the first conductive adhesive 7 are covered with a first waterproof adhesive 13.
Preferably, in order to improve the waterproof capability of the upper end of the second conductive adhesive 8, the second conductive post 4 and the upper side of the second conductive adhesive 8 are covered with the second waterproof adhesive 14.
Preferably, in order to improve the heat dissipation performance of the patch diode, the upper end of the plastic package housing 1 is provided with a heat dissipation fin 15, and the heat dissipation fin 15 is in a zigzag structure.
The above examples only represent 1 embodiment of the present utility model, which is described in more detail and is not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (6)
1. The utility model provides a paster diode through conducting resin connection, its characterized in that, includes plastic envelope shell (1), is located diode chip (2) of plastic envelope shell (1) inboard, the negative and positive pole both ends of diode chip (2) are connected with first conductive pillar (3), second conductive pillar (4) respectively, plastic envelope shell (1) both sides are equipped with negative pole pin (5) respectively, positive pole pin (6), first conductive pillar (3) with be connected with first conductive adhesive (7) between negative pole pin (5), second conductive pillar (4) with be connected with second conductive adhesive (8) between positive pole pin (6), negative pole pin (5) lower extreme is connected with first C shape leg (9), positive pole pin (6) lower extreme is connected with second C shape leg (10).
2. The patch diode connected by conductive adhesive according to claim 1, wherein a first elastic pad (11) is disposed at the lower end of the plastic package housing (1), and the first elastic pad (11) is located at the upper side of the first C-shaped solder leg (9).
3. The patch diode connected by conductive adhesive according to claim 1, wherein a second elastic pad (12) is disposed at the lower end of the plastic package (1), and the second elastic pad (12) is located at the upper side of the second C-shaped solder leg (10).
4. A patch diode connected by a conductive glue according to claim 1, characterized in that the upper sides of the first conductive pillars (3) and the first conductive glue (7) are covered with a first waterproof glue (13).
5. A patch diode connected by a conductive glue according to claim 1, characterized in that the second conductive pillars (4) and the upper side of the second conductive glue (8) are covered with a second waterproof glue (14).
6. The patch diode connected by conductive adhesive according to claim 1, wherein a heat sink (15) is disposed at the upper end of the plastic package (1), and the heat sink (15) has a zigzag structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220670444.6U CN218939657U (en) | 2022-03-22 | 2022-03-22 | Patch diode connected through conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220670444.6U CN218939657U (en) | 2022-03-22 | 2022-03-22 | Patch diode connected through conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218939657U true CN218939657U (en) | 2023-04-28 |
Family
ID=86063482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220670444.6U Active CN218939657U (en) | 2022-03-22 | 2022-03-22 | Patch diode connected through conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218939657U (en) |
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2022
- 2022-03-22 CN CN202220670444.6U patent/CN218939657U/en active Active
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