CN218677143U - Novel fast recovery diode - Google Patents
Novel fast recovery diode Download PDFInfo
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- CN218677143U CN218677143U CN202222982432.XU CN202222982432U CN218677143U CN 218677143 U CN218677143 U CN 218677143U CN 202222982432 U CN202222982432 U CN 202222982432U CN 218677143 U CN218677143 U CN 218677143U
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Abstract
The utility model discloses a novel fast recovery diode, the frame screw hole has been seted up on the bottom plate, through frame screw hole fixed frame body when the equipment, add the elliptical aperture in the middle of frame screw hole and the chip bonding pad, can reduce the mechanical stress transmission to the chip that produces when frame body secondary equipment, and traditional diode lead frame does not have this elliptical aperture for can lead to mechanical stress to increase when the secondary equipment, make the chip of welding on the chip bonding pad, the electrical property is inefficacy, and then diode scrap phenomenon appears, can lead to whole circuit board trouble when serious, the utility model discloses an elliptical aperture that is equipped with reduces stress transmission, can greatly increased chip yield, and very simple and convenient.
Description
Technical Field
The utility model belongs to the technical field of the diode processing, concretely relates to novel fast recovery diode.
Background
The diode is a device with two electrodes in an electronic element, only current is allowed to flow in a single direction, a lead frame is needed when the diode is welded, the lead frame is used as a chip carrier of an integrated circuit, the lead frame is a key structure body which realizes the electrical connection between a circuit leading-out end inside a chip and a lead by means of bonding materials to form an electrical circuit, the key structure body serves as a bridge Liang Zuoyong connected with an external lead, when the conventional diode lead frame is assembled for the second time and fixed by screws, the mechanical stress transmission to a diode chip is easy to generate, the mechanical stress is increased, the chip welded on a welding base island can be caused to be electrically failed, the phenomenon of scrapping of the diode can be further generated, and the fault of the whole circuit board can be caused when the mechanical stress is increased, so that the use is influenced.
Therefore, the novel fast recovery diode is provided, wherein the elliptical small hole is additionally formed between the screw hole of the frame and the welding base island of the chip, and the mechanical stress transmission to the chip can be reduced when the lead frame is assembled for the second time.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel fast recovery diode to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a novel fast recovery diode, includes the frame body, the frame body includes bottom plate, chip welding base island and locates first pin, second pin and the third pin of welding base island bottom in proper order, connect respectively through two fillets between welding base island and first pin, the third pin, the bottom plate passes through the connecting plate and is connected with welding base island, the elliptical hole has been seted up on the connecting plate, adjacent two be connected through a muscle between the frame body, the front end and the rear end of first pin, second pin and third pin are connected through well muscle and end muscle respectively.
Preferably, the bottom plate is provided with frame screw holes, and the lead frame is fixed through the frame screw holes during assembly.
The utility model discloses a technological effect and advantage: this novel fast recovery diode, the frame screw hole has been seted up on the bottom plate, through frame screw hole fixed frame body when the equipment, add the elliptical aperture in the middle of frame screw hole and the chip welding basement, can reduce the mechanical stress transmission to the chip that produces when frame body secondary equipment, and traditional diode lead frame does not have this elliptical aperture, make can lead to mechanical stress to increase when secondary equipment, make the chip of welding on the chip welding basement, the electrical property inefficacy, and then the diode scrap phenomenon appears, can lead to whole circuit board trouble when serious, the utility model discloses an elliptical aperture that is equipped with reduces stress transmission, can greatly increased chip yield, and very simple and convenient.
Drawings
FIG. 1 is a schematic diagram of a conventional diode lead frame structure;
fig. 2 is a schematic structural diagram of the present invention.
In the figure: 1. a frame body; 2. a base plate; 3. welding a chip with a base island; 4. a first pin; 5. a second pin; 6. a third pin; 7. welding feet; 8. a connecting plate; 9. an elliptical hole; 10. jacking ribs; 11. a middle rib; 12. a bottom rib; 13. frame screw holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a as shown in fig. 2 a novel fast recovery diode, including frame body 1, frame body 1 includes bottom plate 2, chip welding base island 3 and locates first pin 4, second pin 5 and the third pin 6 of chip welding base island 3 bottom in proper order, connect respectively through two fillets 7 between chip welding base island 3 and first pin 4, the third pin 6, bottom plate 2 is connected with chip welding base island 3 through connecting plate 8, elliptical hole 9 has been seted up on connecting plate 8, adjacent two be connected through a muscle 10 between the frame body 1, the front end and the rear end of first pin 4, second pin 5 and third pin 6 are connected through well muscle 11 and end muscle 12 respectively, pass through frame screw hole 13 fixed lead frame when the equipment, can lead to mechanical stress to increase, and add elliptical hole 9 in the middle of frame screw hole 13 and chip welding base island 3, can reduce when the lead frame secondary assembly, produce the mechanical stress transmission to the chip for can greatly increased the chip when the equipment, the simple of yield that very makes things convenient for.
Please refer to fig. 1, fig. 1 is a traditional diode lead frame, traditional diode lead frame and the utility model discloses structurally contrast, traditional diode lacks the elliptical aperture for when secondary equipment lead frame, produce the mechanical stress transmission to the chip easily, can lead to the welding chip on the welding base island, the electrical property inefficacy, and then the diode phenomenon of scrapping appears, can lead to whole circuit board trouble when serious, so the utility model discloses the elliptical aperture has been increased on traditional equipment's basis, when secondary equipment lead frame has been reduced, the mechanical stress transmission to the chip is produced, makes the yield greatly increased of diode.
And a frame screw hole 13 is formed in the bottom plate 2, and the lead frame is fixed through the frame screw hole 13 during assembly.
This novel fast recovery diode, frame screw hole 13 has been seted up on bottom plate 2, through frame screw hole 13 fixed frame body 1 when the equipment, add elliptical hole 9 in the middle of frame screw hole 13 and chip bonding pad 3, can reduce the mechanical stress transmission to the chip that produces when 1 secondary equipment of frame body, and traditional diode lead frame does not be equipped with this elliptical hole 9, make can lead to mechanical stress to increase when the secondary equipment, make the chip of welding on chip bonding pad 3, the electrical property is inefficacy, and then diode scrap phenomenon appears, can lead to whole circuit board trouble when serious, the utility model discloses an elliptical hole 9 that is equipped with reduces stress transmission, can greatly increased chip yield, and very simple and convenient.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (2)
1. A novel fast recovery diode, includes frame body (1), its characterized in that: frame body (1) includes bottom plate (2), chip bonding pad (3) and locates first pin (4), second pin (5) and third pin (6) of chip bonding pad (3) bottom in proper order, connect respectively through two weld leg (7) between chip bonding pad (3) and first pin (4), third pin (6), bottom plate (2) are connected with chip bonding pad (3) through connecting plate (8), elliptical hole (9) have been seted up on connecting plate (8), adjacent two be connected through top muscle (10) between the frame body (1), the front end and the rear end of first pin (4), second pin (5) and third pin (6) are connected through well muscle (11) and end muscle (12) respectively.
2. A novel fast recovery diode as claimed in claim 1, wherein: and a frame screw hole (13) is formed in the bottom plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222982432.XU CN218677143U (en) | 2022-11-09 | 2022-11-09 | Novel fast recovery diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222982432.XU CN218677143U (en) | 2022-11-09 | 2022-11-09 | Novel fast recovery diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218677143U true CN218677143U (en) | 2023-03-21 |
Family
ID=85536539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222982432.XU Active CN218677143U (en) | 2022-11-09 | 2022-11-09 | Novel fast recovery diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218677143U (en) |
-
2022
- 2022-11-09 CN CN202222982432.XU patent/CN218677143U/en active Active
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