CN207690793U - A kind of high-power rectifier bridge - Google Patents
A kind of high-power rectifier bridge Download PDFInfo
- Publication number
- CN207690793U CN207690793U CN201721880103.7U CN201721880103U CN207690793U CN 207690793 U CN207690793 U CN 207690793U CN 201721880103 U CN201721880103 U CN 201721880103U CN 207690793 U CN207690793 U CN 207690793U
- Authority
- CN
- China
- Prior art keywords
- frame
- connecting lead
- rectification chip
- rectification
- rectifier bridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005474 detonation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Rectifiers (AREA)
Abstract
The utility model discloses a kind of high-power rectifier bridges, including the first frame, the second frame, third frame, the 4th frame, four rectification chips, four connecting lead wires, packaging mechanisms；First frame, the second frame, third frame are C-shaped configuration, and the 4th frame is inverted l-shaped structure；The positive or negative pole of described each rectification chip one end respectively with corresponding second frame, third frame, the 4th frame welding, lead to corresponding connecting lead wire and connect with the first frame by the rectification chip other end on second frame, third frame；Rectification chip other end on 4th frame is separately connected the second frame, third frame by corresponding connecting lead wire；The utility model has the advantages that simple in structure, good heat dissipation effect, rectification chip the operation is stable, rectification chip long working life, and has extensive production and application value in rectifier bridge technical field.
Description
Technical field
The utility model is related to rectifier bridge technical field more particularly to a kind of high-power rectifier bridges.
Background technology
Four chips are set inside existing rectifier bridge stack, pass through Dual-layer copper lead, and four different location cores of setting
The positive negative side of piece, is connected directly, and forms the bridge architecture of rectification, and the heat that when work generates is by the double-deck copper leading conductive to outer
Epoxy resin is sealed, heat is distributed,
Existing encapsulation interior design is simply direct, though product function can be realized, because inside only passes through two-layer epitaxial copper
Lead connects, and with epoxy encapsulation, the heat that the product chips after encapsulation generate is conducted to extension copper lead complementary space, is led to
The contact area of copper lead and epoxy resin is crossed to radiate, this heat dissipation area contact surface is relatively small, if electric current increases in circuit,
Its temperature rises rapid raising, keeps internal temperature excessively high, greatly reduces the chip service life
Utility model content
For the above existing defect, the utility model provides one kind simple in structure, good heat dissipation effect, rectification chip work
Stable, rectification chip long working life and the rectifier bridge with high-efficient radiating function.
The technical solution of the utility model is as follows：A kind of high-power rectifier bridge, including the first frame, the second frame,
Three frames, the 4th frame, four rectification chips, four connecting lead wires, packaging mechanisms；First frame, the second frame, third
Frame is C-shaped configuration, and the 4th frame is inverted l-shaped structure；The positive or negative pole of described each rectification chip one end is distinguished
With corresponding second frame, third frame, the 4th frame welding, the rectification chip on second frame, third frame is in addition
One end leads to corresponding connecting lead wire and is connect with the first frame；Rectification chip other end on 4th frame passes through corresponding
Connecting lead wire is separately connected the second frame, third frame；The packaging mechanism is for encapsulating the first frame, the second frame, third
Frame, the 4th frame, and the first frame, the second frame, third frame stretch out a pin from packaging mechanism；Each rectification
Chip is interconnected to a rectifier bridge with the first frame, the second frame, third frame, each connecting lead wire respectively.
Preferably, second frame, a rectification chip is equipped on third frame, welding two is whole on the 4th frame
Flow chip；First frame, the second frame, third frame, the 4th frame are that copper product is made, and each pin is length
Strip structure.
Preferably, four connecting lead wires are that oxygenless copper material is made, and each connecting lead wire is strip knot
Structure.
Preferably, the packaging mechanism is made of epoxy sealing resin, and is square structure.
Using the above scheme, the utility model advantageous effect is：
(1), first frame of the utility model, the second frame, third frame are C-shaped configuration, and the 4th frame is
Inverted l-shaped structure；The positive or negative pole of described each rectification chip one end respectively with corresponding second frame, third frame, the 4th
Frame welding, the rectification chip other end on second frame, third frame lead to corresponding connecting lead wire and the first frame
Connection；Rectification chip other end on 4th frame is separately connected the second frame, third by corresponding connecting lead wire
Frame；The packaging mechanism is for encapsulating the first frame, the second frame, third frame, the 4th frame, and the first frame, second
Frame, third frame stretch out a pin from packaging mechanism；Each rectification chip respectively with the first frame, the second frame,
Third frame, each connecting lead wire are interconnected to a rectifier bridge；Such design structure is simple, each rectangular weld tabs is convenient
The heat on rectification chip is absorbed, and heat is transmitted by pin；
(2), second frame of the utility model, be equipped with a rectification chip on third frame, welded on the 4th frame
Connect two rectification chips；First frame, the second frame, third frame, the 4th frame are that copper product is made, and each pin
It is string configuration；Such design facilitates the generated heat of rectification chip work will be hot by corresponding frame and pin
Amount sheds；Four connecting lead wires are that oxygenless copper material is made, and each connecting lead wire is string configuration；The envelope
Mounting mechanism is made of epoxy sealing resin, and is square structure；The convenient further heat dissipation of such design, and increase rectification chip
Stability and improve the service life；Therefore the utility model has simple in structure, good heat dissipation effect, rectification chip the operation is stable, whole
Flow the advantageous effect of chip operation long lifespan.
Description of the drawings
Fig. 1 is that the detonation configuration of the utility model is intended to；
Fig. 2 is that cuing open for the utility model shows structural schematic diagram.
Specific implementation mode
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail；
As shown in Figure 1 and Figure 2：Present embodiments provide a kind of high-power rectifier bridge, including the first frame 1, the second frame
2, third frame 6, the 4th frame 3, four rectification chip 4, four connecting lead wire 5, packaging mechanism 7；First frame 1,
Two frames 2, third frame 6 are C-shaped configuration, and the 4th frame 3 is inverted l-shaped structure；Described 4 one end of each rectification chip
Positive or negative pole is welded with corresponding second frame 2, third frame 6, the 4th frame 3 respectively, second frame 2, third frame
4 other end of rectification chip on frame 6 is led to corresponding connecting lead wire 5 and is connect with the first frame 1；It is whole on 4th frame 3
Stream 4 other end of chip is separately connected the second frame 2, third frame 6 by corresponding connecting lead wire 5；The packaging mechanism 7 is used
In the first frame 1 of encapsulation, the second frame 2, third frame 6, the 4th frame 3, and the first frame 1, the second frame 2, third frame
6 stretch out a pin 8 from packaging mechanism 7；Each rectification chip 4 respectively with the first frame 1, the second frame 2, third frame
6, the 4th frame 3, each connecting lead wire 5 are interconnected to a rectifier bridge.
It is equipped with a rectification chip 4 on second frame 2, third frame 6, two rectifications are welded on the 4th frame 3
Chip 4；First frame 1, the second frame 3, third frame 6, the 4th frame 3 are that copper product is made, and each pin 8 is equal
For string configuration.
Four connecting lead wires 5 are that oxygenless copper material is made, and each connecting lead wire 5 is string configuration.
The packaging mechanism 7 is made of epoxy sealing resin, and is square structure.
Embodiment：
As shown in Figure 1 and Figure 2：A rectification chip 4 is equipped on second frame 2, third frame 6, on the 4th frame 3
Weld two rectification chips 4；First frame 1, the second frame 2, third frame 6, the 4th frame 3 are that copper product is made, and
Each pin 8 is string configuration；It is corresponding each that such design facilitates heat caused by rectification chip work to pass through
Frame and pin 8 shed heat；Four connecting lead wires 5 are that oxygenless copper material is made, and each connecting lead wire 5 is
String configuration；The packaging mechanism 7 is made of epoxy sealing resin, and is square structure；Such design facilitates further
Heat dissipation, and increase the stability of rectification chip 4 and improve the service life.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all in this practicality
All any modification, equivalent and improvement etc., should be included in the guarantor of the utility model made by within novel spirit and principle
Within the scope of shield.
Claims (4)
1. a kind of high-power rectifier bridge, which is characterized in that including the first frame, the second frame, third frame, the 4th frame,
Four rectification chips, four connecting lead wires, packaging mechanisms；First frame, the second frame, third frame are C-shaped configuration,
4th frame is inverted l-shaped structure；The positive or negative pole of each rectification chip one end respectively with corresponding second frame, third
Frame, the 4th frame welding, the rectification chip other end on second frame, third frame lead to corresponding connecting lead wire with
First frame connects；Rectification chip other end on 4th frame is separately connected the second frame by corresponding connecting lead wire
Frame, third frame；The packaging mechanism is for encapsulating the first frame, the second frame, third frame, the 4th frame, and the first frame
Frame, the second frame, third frame stretch out a pin from packaging mechanism；Each rectification chip respectively with the first frame, the second frame
Frame, third frame, each connecting lead wire are interconnected to a rectifier bridge.
2. high-power rectifier bridge according to claim 1, it is characterised in that：On second frame, third frame
Equipped with a rectification chip, two rectification chips are welded on the 4th frame；First frame, the second frame, third frame,
Four frames are that copper product is made, and each pin is string configuration.
3. high-power rectifier bridge according to claim 2, it is characterised in that：Four connecting lead wires are oxygen-free copper
Material is made, and each connecting lead wire is string configuration.
4. high-power rectifier bridge according to claim 3, it is characterised in that：The packaging mechanism is epoxy sealing resin
It is made, and is square structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721880103.7U CN207690793U (en) | 2017-12-28 | 2017-12-28 | A kind of high-power rectifier bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721880103.7U CN207690793U (en) | 2017-12-28 | 2017-12-28 | A kind of high-power rectifier bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207690793U true CN207690793U (en) | 2018-08-03 |
Family
ID=62992489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721880103.7U Active CN207690793U (en) | 2017-12-28 | 2017-12-28 | A kind of high-power rectifier bridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207690793U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112002688A (en) * | 2020-07-31 | 2020-11-27 | 湖北力芯半导体有限公司 | Novel dual-purpose rectifier bridge stack |
-
2017
- 2017-12-28 CN CN201721880103.7U patent/CN207690793U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112002688A (en) * | 2020-07-31 | 2020-11-27 | 湖北力芯半导体有限公司 | Novel dual-purpose rectifier bridge stack |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518000 South District, Block A, 3801, World Trade Plaza, No. 9 Fuhong Road, Futian Street, Futian District, Shenzhen City, Guangdong Province Patentee after: Qiangyuan Core Electronics (Guangdong) Co., Ltd. Address before: 518000 Room 2312, Dingcheng International Building, Zhonghangyuan, Zhenhua Road, Futian District, Shenzhen City, Guangdong Province Patentee before: Shenzhen strong yuan core Electronics Co., Ltd. |