CN204118124U - The integrated disjunctor support of COB - Google Patents
The integrated disjunctor support of COB Download PDFInfo
- Publication number
- CN204118124U CN204118124U CN201420599885.7U CN201420599885U CN204118124U CN 204118124 U CN204118124 U CN 204118124U CN 201420599885 U CN201420599885 U CN 201420599885U CN 204118124 U CN204118124 U CN 204118124U
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- China
- Prior art keywords
- connecting portion
- heat
- radiating substrate
- circuit board
- cob
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses the integrated disjunctor support of a kind of COB, comprising: heat-radiating substrate material strip, comprise multiple heat-radiating substrate; Circuit board material strip, comprise multiple circuit board, circuit board is corresponding with heat-radiating substrate, and circuit board comprises positive pole connecting portion and negative pole connecting portion, and positive pole connecting portion and negative polarity connecting portion are not provided with positive pole pin and negative pole pin; Plastic lamp holder, be fixed on above heat-radiating substrate by injection moulding, circuit board is fixed on plastic lamp holder inside and separates with heat-radiating substrate, plastic lamp holder centre LED chip fixed part, heat-radiating substrate is exposed in LED chip fixed part, be arranged with link slot outside LED chip fixed part, positive pole connecting portion and negative polarity connecting portion not exposed with in link slot.Adopt the integrated disjunctor support of the COB of above technical scheme, can obtain after machining and be linked to be overall multiple COB supports, not only substantially increase production efficiency, and can the multiple COB support of time processing when later stage packaging LED chips, very convenient.
Description
Technical field
The utility model relates to COB and manufactures field, the particularly integrated disjunctor support of COB.
Background technology
COB (Chip On Board) be also chip on board, is the integrated area source technology of the specular removal be directly attached to by LED chip on the mirror metal substrate of high reflecting rate.This technology eliminates support concept, electroless plating, without Reflow Soldering, without paster operation, and therefore operation reduces nearly 1/3rd, and cost also saves 1/3rd.
First COB technical process is cover silicon chip at substrate surface heat-conduction epoxy resin (generally with the epoxy resin mixing Argent grain) to lay a little, then silicon chip is directly placed in substrate surface, be heat-treated to till silicon chip is securely fixed in substrate, between silicon chip and substrate, directly set up electrical connection by the method for wire bond more subsequently.
China Patent No. be 201220472094.1 utility model patent disclose a kind of COB-LED light source, described COB-LED light source is made up of heat-radiating substrate (aluminium base) and the LED chip be located on aluminium base.The open slot that the wherein pair of horns end of aluminium base sets to the concave respectively, for fixing for screw.The aluminium base edge being positioned at described aluminium base open slot side is provided with the socket composition connected to complete electric component for the docking of heart yearn interface.During use, it is by electric interfaces support and screw lamp socket.
When current industry produces COB-LED, cover dielectric isolation layer at chip rest area periphery, conductive layer is covered again in the conductive welding region of specifying, to make conductive welding region and heat-radiating substrate electrical isolation, during encapsulation, first LED chip is set in chip rest area, with gold thread, the extraction of the positive and negative electrode of LED chip is bonded to conductive welding region, then with the technology mode of a glue, fluorescent colloid is clicked and entered this around in the chip rest area of LED chip, to guarantee reliability.
Due to the restriction of structure, there is multiple deficiency, be mainly reflected in production cost too high in above-mentioned COB-LED: using aluminium base as the main body of light source, and for heat radiation, aluminium base is thick and heavy, and cost of material is high; Need when producing in addition to arrange the sandwich constructions such as circuit layer, separator, protective layer on aluminium base surface, processed complex, increases artificial cost, material cost and processing cost.
Utility model content
The purpose of this utility model is to provide the integrated disjunctor support of a kind of COB.
According to an aspect of the present utility model, provide the integrated disjunctor support of COB, comprising:
Heat-radiating substrate material strip, comprises multiple heat-radiating substrate, is connected to form a heat-radiating substrate material strip between multiple heat-radiating substrate by the first connecting portion;
Circuit board material strip, comprise multiple circuit board, circuit board is corresponding with heat-radiating substrate, a circuit board material strip is connected to form by the second connecting portion between multiple circuit board, circuit board comprises positive pole connecting portion and negative pole connecting portion, and positive pole connecting portion and negative polarity connecting portion are not provided with positive pole pin and negative pole pin;
Plastic lamp holder, be fixed on above heat-radiating substrate by injection moulding, circuit board is fixed on plastic lamp holder inside and separates with heat-radiating substrate, plastic lamp holder centre LED chip fixed part, heat-radiating substrate is exposed in LED chip fixed part, be arranged with link slot outside LED chip fixed part, positive pole connecting portion and negative polarity connecting portion not exposed with in link slot, a heat-radiating substrate, a circuit board and a plastic lamp holder form a COB support.
Adopt the integrated disjunctor support of the COB of above technical scheme, can obtain after machining and be linked to be overall multiple COB supports, not only substantially increase production efficiency, and can the multiple COB support of time processing when later stage packaging LED chips, very convenient.Encapsulate complete after, by fracture the first connecting portion and the second connecting portion, multiple COB support can be taken out from the integrated disjunctor support of COB, thus not only there is fabulous heat dispersion, and use also very convenient.
In some embodiments, circuit board is also provided with positive pole tie point and negative pole tie point.Positive pole tie point and negative pole tie point both can be used for grafting, also can be used as pad for subsequent use.Thus, the COB support in the integrated disjunctor support of this COB can be applicable to available for different connection modes, meets different demand.
In some embodiments, heat-radiating substrate is also provided with installing hole.The LED light source of the COB support using the utility model to provide has larger heat-radiating substrate, directly can be fixed on heat abstractor by LED light source when mounted, not only have fabulous heat dispersion thus by installing hole, and installation is also very convenient.
In some embodiments, heat-radiating substrate material strip and circuit board material strip all adopt copper sheet material punching to form.Thereby enhance heat dispersion, extend the useful life of LED light source.
In some embodiments, plastic lamp holder also has the card edge for installing clamshell, and card is along being located at link slot periphery, and the oral area of its exterior contour and clamshell matches.Just clamshell can need not be arranged on COB support by mounting shell cover connector system in addition thus.
In some embodiments, the first connecting portion and the second connecting portion all have fracture port.Only need, by very little power, the first connecting portion and the second connecting portion just can be made to disconnect along fracture port place.
In some embodiments, positive pole connecting portion and negative pole connecting portion symmetrical.This structure is more reasonable, is conducive to the useful life increasing LED.
Accompanying drawing explanation
Fig. 1 is the structural representation of the integrated disjunctor support of COB of a kind of execution mode of utility model.
Fig. 2 is the structural representation of the heat-radiating substrate material strip of the integrated disjunctor support of COB shown in Fig. 1.
Fig. 3 is the structural representation of the circuit board material strip of the integrated disjunctor support of COB shown in Fig. 1.
Fig. 4 is the structural representation of the plastic lamp holder of the integrated disjunctor support of COB shown in Fig. 1.
Fig. 5 is the structural representation of the COB support of the integrated disjunctor support of COB shown in Fig. 1.
Fig. 6 is for the support of COB shown in Fig. 6 is along the cutaway view in A-A direction.
Fig. 7 is the enlarged drawing of part shown in B in Fig. 7.
The schematic diagram that Fig. 8 is the support of COB shown in Fig. 6 and clamshell.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Fig. 1 to Fig. 8 show schematically show according to the integrated disjunctor support of the COB of a kind of execution mode of the present utility model.As shown in the figure, this device comprises heat-radiating substrate material strip 1, circuit board material strip 2 and plastic lamp holder 3.
Heat-radiating substrate material strip 1 comprises multiple heat-radiating substrate 11.A heat-radiating substrate material strip 1 is connected to form by the first connecting portion 12 between multiple heat-radiating substrate 11.Position relative on heat-radiating substrate 11 is provided with two installing holes 13.
Circuit board material strip 2 comprises multiple circuit board 21.Circuit board 21 is corresponding with heat-radiating substrate 11, is connected to form a circuit board material strip 2 between multiple circuit board 21 by the second connecting portion 22.Circuit board 21 comprises positive pole connecting portion 211 and negative pole connecting portion 212.Positive pole connecting portion 211 and negative pole connecting portion 212 symmetrical.Positive pole connecting portion 211 and negative pole connecting portion 212 are respectively equipped with positive pole pin 213 and negative pole pin 214.
First connecting portion 12 and the second connecting portion 22 all have fracture port 8.
Plastic lamp holder 3 is fixed on above heat-radiating substrate 11 by injection moulding.Circuit board 21 is fixed on plastic lamp holder 3 inside and separates with heat-radiating substrate 11.Plastic lamp holder 3 centre is provided with LED chip fixed part 31.Heat-radiating substrate 11 is exposed in LED chip fixed part 31.Be arranged with link slot 32 outside LED chip fixed part 31, positive pole connecting portion 211 and negative pole connecting portion 212 are exposed with in link slot 32 respectively.A heat-radiating substrate 11, circuit board 21 and a plastic lamp holder 3 form a COB support.
Circuit board 21 is also provided with positive pole tie point 215 and negative pole tie point 216.Positive pole tie point 215 and negative pole tie point 216 both can be used for grafting, also can be used as pad for subsequent use.
Heat-radiating substrate material strip 1 and circuit board material strip 2 all adopt copper sheet material punching to form.
Plastic lamp holder 3 also has card for installing clamshell 4 along 33, and block and be located at link slot 32 periphery along 33, the oral area of its exterior contour and clamshell 4 matches.Just clamshell 4 can need not be arranged on COB support by mounting shell cover connector system in addition.
Adopt the integrated disjunctor support of the COB of above technical scheme, can obtain after machining and be linked to be overall multiple COB supports, not only substantially increase production efficiency, and can the multiple COB support of time processing when later stage packaged LED wafer, very convenient.Encapsulate complete after, by fracture the first connecting portion 12 and the second connecting portion 22, multiple COB support can be taken out from the integrated disjunctor support of COB.The LED light source of the COB support using the utility model to provide has larger heat-radiating substrate 11, directly can be fixed on heat abstractor by LED light source when mounted, not only have fabulous heat dispersion thus by installing hole 13, and installation is also very convenient.
Above-described is only execution modes more of the present utility model.For the person of ordinary skill of the art, under the prerequisite not departing from the utility model creation design, can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (7)
- The integrated disjunctor support of 1.COB, is characterized in that, comprising:Heat-radiating substrate material strip, comprises multiple heat-radiating substrate, is connected to form a heat-radiating substrate material strip between described multiple heat-radiating substrate by the first connecting portion;Circuit board material strip, comprise multiple circuit board, described circuit board is corresponding with described heat-radiating substrate, a circuit board material strip is connected to form by the second connecting portion between described multiple circuit board, described circuit board comprises positive pole connecting portion and negative pole connecting portion, and described positive pole connecting portion and negative polarity connecting portion are not provided with positive pole pin and negative pole pin;Plastic lamp holder, be fixed on above described heat-radiating substrate by injection moulding, described circuit board is fixed on described plastic lamp holder inside and separates with described heat-radiating substrate, described plastic lamp holder centre LED chip fixed part, described heat-radiating substrate is exposed in described LED chip fixed part, link slot is arranged with outside described LED chip fixed part, in described positive pole connecting portion and the not exposed and described link slot of negative polarity connecting portion, a described heat-radiating substrate, a described circuit board and a described plastic lamp holder form a COB support.
- 2. the integrated disjunctor support of COB according to claim 1, is characterized in that, described circuit board is also provided with positive pole tie point and negative pole tie point.
- 3. the integrated disjunctor support of COB according to claim 2, it is characterized in that, described heat-radiating substrate is also provided with installing hole.
- 4. the integrated disjunctor support of the COB according to claim 1,2 or 3, is characterized in that, described heat-radiating substrate material strip and circuit board material strip all adopt copper sheet material punching to form.
- 5. the integrated disjunctor support of the COB according to claim 1,2 or 3, is characterized in that, described plastic lamp holder also has the card edge for installing clamshell, and described card is along being located at described link slot periphery, and the oral area of its exterior contour and described clamshell matches.
- 6. the integrated disjunctor support of COB according to claim 1, is characterized in that, described first connecting portion and the second connecting portion all have fracture port.
- 7. the integrated disjunctor support of COB according to claim 1, is characterized in that, described positive pole connecting portion and negative pole connecting portion symmetrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420599885.7U CN204118124U (en) | 2014-10-16 | 2014-10-16 | The integrated disjunctor support of COB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420599885.7U CN204118124U (en) | 2014-10-16 | 2014-10-16 | The integrated disjunctor support of COB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204118124U true CN204118124U (en) | 2015-01-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420599885.7U Expired - Fee Related CN204118124U (en) | 2014-10-16 | 2014-10-16 | The integrated disjunctor support of COB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204118124U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111790838A (en) * | 2020-06-05 | 2020-10-20 | 东莞市新美洋技术有限公司 | Automatic blanking device and method for small stamped metal parts |
| CN112709937A (en) * | 2020-12-30 | 2021-04-27 | 深圳市新亿光光电有限公司 | COB lamp pearl |
-
2014
- 2014-10-16 CN CN201420599885.7U patent/CN204118124U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111790838A (en) * | 2020-06-05 | 2020-10-20 | 东莞市新美洋技术有限公司 | Automatic blanking device and method for small stamped metal parts |
| CN112709937A (en) * | 2020-12-30 | 2021-04-27 | 深圳市新亿光光电有限公司 | COB lamp pearl |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 528400 Guangdong city of Zhongshan province Henglan Town Le Feng eight road No. 8 Patentee after: Guangdong Mei Mei Electronic Technology Co., Ltd. Address before: 528400 Guangdong city of Zhongshan province Henglan Town Le Feng eight road No. 8 Patentee before: ZHONGSHAN PINMEI ELECTRONICS TECHNOLOGY CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150121 Termination date: 20181016 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |